TWI562937B - Package and method of manufacturing the same - Google Patents

Package and method of manufacturing the same

Info

Publication number
TWI562937B
TWI562937B TW104106204A TW104106204A TWI562937B TW I562937 B TWI562937 B TW I562937B TW 104106204 A TW104106204 A TW 104106204A TW 104106204 A TW104106204 A TW 104106204A TW I562937 B TWI562937 B TW I562937B
Authority
TW
Taiwan
Prior art keywords
package
manufacturing
same
Prior art date
Application number
TW104106204A
Other languages
Chinese (zh)
Other versions
TW201630789A (en
Inventor
Yasushi Kokubun
Original Assignee
Japan Tobacco Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Tobacco Inc filed Critical Japan Tobacco Inc
Priority to TW104106204A priority Critical patent/TWI562937B/en
Publication of TW201630789A publication Critical patent/TW201630789A/en
Application granted granted Critical
Publication of TWI562937B publication Critical patent/TWI562937B/en

Links

TW104106204A 2015-02-26 2015-02-26 Package and method of manufacturing the same TWI562937B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW104106204A TWI562937B (en) 2015-02-26 2015-02-26 Package and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW104106204A TWI562937B (en) 2015-02-26 2015-02-26 Package and method of manufacturing the same

Publications (2)

Publication Number Publication Date
TW201630789A TW201630789A (en) 2016-09-01
TWI562937B true TWI562937B (en) 2016-12-21

Family

ID=57442931

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104106204A TWI562937B (en) 2015-02-26 2015-02-26 Package and method of manufacturing the same

Country Status (1)

Country Link
TW (1) TWI562937B (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6405869B1 (en) * 1999-07-01 2002-06-18 2Wit, Llc Shrink wrap gift bag and method of manufacturing the same
JP2002264949A (en) * 2001-03-12 2002-09-18 Masato Kaizuka Bag body

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6405869B1 (en) * 1999-07-01 2002-06-18 2Wit, Llc Shrink wrap gift bag and method of manufacturing the same
JP2002264949A (en) * 2001-03-12 2002-09-18 Masato Kaizuka Bag body

Also Published As

Publication number Publication date
TW201630789A (en) 2016-09-01

Similar Documents

Publication Publication Date Title
SG10201913388VA (en) Semiconductor package and method of forming the same
TWI563643B (en) Semiconductor structure and manufacturing method thereof
SG10201913140RA (en) Semiconductor package and method of forming the same
EP3345215A4 (en) Semiconductor apparatus and method of manufacturing the same
PL3036748T3 (en) Inductor and method of manufacturing the same
ZA201808411B (en) Container and method of manufacturing the same
SG10201505824YA (en) Semiconductor device and method of manufacturing the same
TWI562323B (en) Semiconductor device package and method of manufacturing the same
HK1221204A1 (en) Package and method for manufacturing same
TWI562318B (en) Electronic package and fabrication method thereof
TWI560828B (en) Chip package and method for forming the same
SG10201607486YA (en) Improved packaging and method of manufacturing same
HK1253387A1 (en) Microemulsion-type cosmetic and method for manufacturing same
TWI563665B (en) Semiconductor device and method of manufacturing the same
PL3093358T3 (en) Steel and method of manufacturing the same
KR101822784B9 (en) -- NeuroVascular UnitNVU-On-a-Chip And Method Of Fabricating The Same
HK1253781A1 (en) Spout-equipped container and method for manufacturing same
EP3243217A4 (en) Semiconductor package and method of manufacturing the same
GB201609584D0 (en) A de-oiler and a method of using the same
TWI562309B (en) Semiconductor structure and method for fabricating the same
TWI562336B (en) Semiconductor structure and method for manufacturing the same
TWI562311B (en) Package structure and manufactruing method thereof
TWI563656B (en) Semiconductor structure and manufacturing method thereof
PL3484782T3 (en) Shelf-ready package and method for manufacturing the same
GB2555289B (en) Semiconductor device and method of manufacturing the same

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees