TWI562311B - Package structure and manufactruing method thereof - Google Patents

Package structure and manufactruing method thereof

Info

Publication number
TWI562311B
TWI562311B TW104115051A TW104115051A TWI562311B TW I562311 B TWI562311 B TW I562311B TW 104115051 A TW104115051 A TW 104115051A TW 104115051 A TW104115051 A TW 104115051A TW I562311 B TWI562311 B TW I562311B
Authority
TW
Taiwan
Prior art keywords
package structure
manufactruing method
manufactruing
package
Prior art date
Application number
TW104115051A
Other languages
English (en)
Other versions
TW201640635A (zh
Inventor
Yu Tang Pan
Shih Feng Chiu
Original Assignee
Chipmos Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipmos Technologies Inc filed Critical Chipmos Technologies Inc
Priority to TW104115051A priority Critical patent/TWI562311B/zh
Priority to CN201510437673.8A priority patent/CN106298729B/zh
Publication of TW201640635A publication Critical patent/TW201640635A/zh
Application granted granted Critical
Publication of TWI562311B publication Critical patent/TWI562311B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
TW104115051A 2015-05-12 2015-05-12 Package structure and manufactruing method thereof TWI562311B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW104115051A TWI562311B (en) 2015-05-12 2015-05-12 Package structure and manufactruing method thereof
CN201510437673.8A CN106298729B (zh) 2015-05-12 2015-07-23 封装结构及其制作方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW104115051A TWI562311B (en) 2015-05-12 2015-05-12 Package structure and manufactruing method thereof

Publications (2)

Publication Number Publication Date
TW201640635A TW201640635A (zh) 2016-11-16
TWI562311B true TWI562311B (en) 2016-12-11

Family

ID=57651192

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104115051A TWI562311B (en) 2015-05-12 2015-05-12 Package structure and manufactruing method thereof

Country Status (2)

Country Link
CN (1) CN106298729B (zh)
TW (1) TWI562311B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10937713B2 (en) * 2018-06-12 2021-03-02 Novatek Microelectronics Corp. Chip on film package
US11581261B2 (en) 2018-06-12 2023-02-14 Novatek Microelectronics Corp. Chip on film package
TWI720796B (zh) * 2020-01-21 2021-03-01 南茂科技股份有限公司 半導體封裝結構及其製造方法
CN111584435B (zh) * 2020-05-14 2023-11-24 南通通富微电子有限公司 基板、芯片封装结构及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050167802A1 (en) * 2004-01-30 2005-08-04 Denso Corporation Semiconductor device
TW201133738A (en) * 2009-12-28 2011-10-01 Mediatek Inc Integrated circuit chip

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3649881A (en) * 1970-08-31 1972-03-14 Rca Corp High-power semiconductor device assembly
US6703707B1 (en) * 1999-11-24 2004-03-09 Denso Corporation Semiconductor device having radiation structure
US7145254B2 (en) * 2001-07-26 2006-12-05 Denso Corporation Transfer-molded power device and method for manufacturing transfer-molded power device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050167802A1 (en) * 2004-01-30 2005-08-04 Denso Corporation Semiconductor device
TW201133738A (en) * 2009-12-28 2011-10-01 Mediatek Inc Integrated circuit chip

Also Published As

Publication number Publication date
TW201640635A (zh) 2016-11-16
CN106298729A (zh) 2017-01-04
CN106298729B (zh) 2019-03-05

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