TWI561929B - - Google Patents
Info
- Publication number
- TWI561929B TWI561929B TW101135212A TW101135212A TWI561929B TW I561929 B TWI561929 B TW I561929B TW 101135212 A TW101135212 A TW 101135212A TW 101135212 A TW101135212 A TW 101135212A TW I561929 B TWI561929 B TW I561929B
- Authority
- TW
- Taiwan
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101135212A TW201413387A (zh) | 2012-09-26 | 2012-09-26 | 正型感光性樹脂組成物 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101135212A TW201413387A (zh) | 2012-09-26 | 2012-09-26 | 正型感光性樹脂組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201413387A TW201413387A (zh) | 2014-04-01 |
TWI561929B true TWI561929B (fr) | 2016-12-11 |
Family
ID=55181771
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101135212A TW201413387A (zh) | 2012-09-26 | 2012-09-26 | 正型感光性樹脂組成物 |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW201413387A (fr) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200916959A (en) * | 2007-06-06 | 2009-04-16 | Hitachi Chemical Co Ltd | Photosensitive adhesive composition, film-like adhesive, adhesive sheet, method for forming adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device and method for manufacturing semiconductor device |
TW201012850A (en) * | 2008-09-30 | 2010-04-01 | Sony Chem & Inf Device Corp | Photosensitive siloxane polyimide resin composition |
TW201100494A (en) * | 2009-03-12 | 2011-01-01 | Shinetsu Chemical Co | Novel polyimide silicone and photosensitive resin composition containing the same, and patterning process |
TW201214048A (en) * | 2010-07-02 | 2012-04-01 | Toray Industries | Photosensitive resin composition, photosensitive resin composition film and semiconductor device using those |
-
2012
- 2012-09-26 TW TW101135212A patent/TW201413387A/zh unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200916959A (en) * | 2007-06-06 | 2009-04-16 | Hitachi Chemical Co Ltd | Photosensitive adhesive composition, film-like adhesive, adhesive sheet, method for forming adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device and method for manufacturing semiconductor device |
TW201012850A (en) * | 2008-09-30 | 2010-04-01 | Sony Chem & Inf Device Corp | Photosensitive siloxane polyimide resin composition |
TW201100494A (en) * | 2009-03-12 | 2011-01-01 | Shinetsu Chemical Co | Novel polyimide silicone and photosensitive resin composition containing the same, and patterning process |
TW201214048A (en) * | 2010-07-02 | 2012-04-01 | Toray Industries | Photosensitive resin composition, photosensitive resin composition film and semiconductor device using those |
Also Published As
Publication number | Publication date |
---|---|
TW201413387A (zh) | 2014-04-01 |