TWI561133B - Circuit board with electroplated type and manufacturing method thereof - Google Patents

Circuit board with electroplated type and manufacturing method thereof

Info

Publication number
TWI561133B
TWI561133B TW103138892A TW103138892A TWI561133B TW I561133 B TWI561133 B TW I561133B TW 103138892 A TW103138892 A TW 103138892A TW 103138892 A TW103138892 A TW 103138892A TW I561133 B TWI561133 B TW I561133B
Authority
TW
Taiwan
Prior art keywords
manufacturing
circuit board
electroplated
type
electroplated type
Prior art date
Application number
TW103138892A
Other languages
Chinese (zh)
Other versions
TW201618624A (en
Inventor
Chien Cheng Lee
Original Assignee
Boardtek Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Boardtek Electronics Corp filed Critical Boardtek Electronics Corp
Priority to TW103138892A priority Critical patent/TWI561133B/en
Priority to DE102015118908.9A priority patent/DE102015118908A1/en
Publication of TW201618624A publication Critical patent/TW201618624A/en
Application granted granted Critical
Publication of TWI561133B publication Critical patent/TWI561133B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
TW103138892A 2014-11-10 2014-11-10 Circuit board with electroplated type and manufacturing method thereof TWI561133B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW103138892A TWI561133B (en) 2014-11-10 2014-11-10 Circuit board with electroplated type and manufacturing method thereof
DE102015118908.9A DE102015118908A1 (en) 2014-11-10 2015-11-04 Galvanized board and manufacturing process for it

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW103138892A TWI561133B (en) 2014-11-10 2014-11-10 Circuit board with electroplated type and manufacturing method thereof

Publications (2)

Publication Number Publication Date
TW201618624A TW201618624A (en) 2016-05-16
TWI561133B true TWI561133B (en) 2016-12-01

Family

ID=55803065

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103138892A TWI561133B (en) 2014-11-10 2014-11-10 Circuit board with electroplated type and manufacturing method thereof

Country Status (2)

Country Link
DE (1) DE102015118908A1 (en)
TW (1) TWI561133B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI626870B (en) * 2016-12-05 2018-06-11 中華精測科技股份有限公司 Vertical connection interface structure, circuit board having interface structure and manufacturing method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201004526A (en) * 2008-07-02 2010-01-16 Subtron Technology Co Ltd Fabricating process for circuit board
TW201134335A (en) * 2010-03-19 2011-10-01 Via Tech Inc Process for fabricating circuit substrate, and circuit substrate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201004526A (en) * 2008-07-02 2010-01-16 Subtron Technology Co Ltd Fabricating process for circuit board
TW201134335A (en) * 2010-03-19 2011-10-01 Via Tech Inc Process for fabricating circuit substrate, and circuit substrate

Also Published As

Publication number Publication date
TW201618624A (en) 2016-05-16
DE102015118908A1 (en) 2016-05-12

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