TWI561133B - Circuit board with electroplated type and manufacturing method thereof - Google Patents
Circuit board with electroplated type and manufacturing method thereofInfo
- Publication number
- TWI561133B TWI561133B TW103138892A TW103138892A TWI561133B TW I561133 B TWI561133 B TW I561133B TW 103138892 A TW103138892 A TW 103138892A TW 103138892 A TW103138892 A TW 103138892A TW I561133 B TWI561133 B TW I561133B
- Authority
- TW
- Taiwan
- Prior art keywords
- manufacturing
- circuit board
- electroplated
- type
- electroplated type
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW103138892A TWI561133B (en) | 2014-11-10 | 2014-11-10 | Circuit board with electroplated type and manufacturing method thereof |
DE102015118908.9A DE102015118908A1 (en) | 2014-11-10 | 2015-11-04 | Galvanized board and manufacturing process for it |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW103138892A TWI561133B (en) | 2014-11-10 | 2014-11-10 | Circuit board with electroplated type and manufacturing method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201618624A TW201618624A (en) | 2016-05-16 |
TWI561133B true TWI561133B (en) | 2016-12-01 |
Family
ID=55803065
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103138892A TWI561133B (en) | 2014-11-10 | 2014-11-10 | Circuit board with electroplated type and manufacturing method thereof |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE102015118908A1 (en) |
TW (1) | TWI561133B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI626870B (en) * | 2016-12-05 | 2018-06-11 | 中華精測科技股份有限公司 | Vertical connection interface structure, circuit board having interface structure and manufacturing method thereof |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201004526A (en) * | 2008-07-02 | 2010-01-16 | Subtron Technology Co Ltd | Fabricating process for circuit board |
TW201134335A (en) * | 2010-03-19 | 2011-10-01 | Via Tech Inc | Process for fabricating circuit substrate, and circuit substrate |
-
2014
- 2014-11-10 TW TW103138892A patent/TWI561133B/en active
-
2015
- 2015-11-04 DE DE102015118908.9A patent/DE102015118908A1/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201004526A (en) * | 2008-07-02 | 2010-01-16 | Subtron Technology Co Ltd | Fabricating process for circuit board |
TW201134335A (en) * | 2010-03-19 | 2011-10-01 | Via Tech Inc | Process for fabricating circuit substrate, and circuit substrate |
Also Published As
Publication number | Publication date |
---|---|
TW201618624A (en) | 2016-05-16 |
DE102015118908A1 (en) | 2016-05-12 |
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