TWI560875B - Semiconductor device and method of manufacturing the same - Google Patents

Semiconductor device and method of manufacturing the same

Info

Publication number
TWI560875B
TWI560875B TW104138202A TW104138202A TWI560875B TW I560875 B TWI560875 B TW I560875B TW 104138202 A TW104138202 A TW 104138202A TW 104138202 A TW104138202 A TW 104138202A TW I560875 B TWI560875 B TW I560875B
Authority
TW
Taiwan
Prior art keywords
manufacturing
same
semiconductor device
semiconductor
Prior art date
Application number
TW104138202A
Other languages
Chinese (zh)
Other versions
TW201719893A (en
Inventor
Vivek Ningaraju
Po An Chen
Vinay Suresh
Original Assignee
Nuvoton Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nuvoton Technology Corp filed Critical Nuvoton Technology Corp
Priority to TW104138202A priority Critical patent/TWI560875B/en
Priority to CN201610019479.2A priority patent/CN106783629B/en
Application granted granted Critical
Publication of TWI560875B publication Critical patent/TWI560875B/en
Publication of TW201719893A publication Critical patent/TW201719893A/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66477Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0603Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0603Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
    • H01L29/0607Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
    • H01L29/0611Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
TW104138202A 2015-11-19 2015-11-19 Semiconductor device and method of manufacturing the same TWI560875B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW104138202A TWI560875B (en) 2015-11-19 2015-11-19 Semiconductor device and method of manufacturing the same
CN201610019479.2A CN106783629B (en) 2015-11-19 2016-01-13 Semiconductor device and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW104138202A TWI560875B (en) 2015-11-19 2015-11-19 Semiconductor device and method of manufacturing the same

Publications (2)

Publication Number Publication Date
TWI560875B true TWI560875B (en) 2016-12-01
TW201719893A TW201719893A (en) 2017-06-01

Family

ID=58227203

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104138202A TWI560875B (en) 2015-11-19 2015-11-19 Semiconductor device and method of manufacturing the same

Country Status (2)

Country Link
CN (1) CN106783629B (en)
TW (1) TWI560875B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI635611B (en) * 2017-09-25 2018-09-11 新唐科技股份有限公司 High voltage semiconductor device
CN109742020B (en) * 2018-12-26 2021-09-28 芜湖启迪半导体有限公司 Gate oxide structure of silicon carbide device and preparation method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4602266A (en) * 1983-01-28 1986-07-22 U.S. Philips Corporation High voltage guard ring with variable width shallow portion
US20080074165A1 (en) * 2004-04-27 2008-03-27 Fairchild Korea Semiconductor, Ltd. High voltage gate driver integrated circuit including high voltage junction capacitor and high voltage ldmos transistor
US20130341718A1 (en) * 2012-06-26 2013-12-26 Fairchild Korea Semiconductor Ltd. Power semiconductor device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100374627B1 (en) * 2000-08-04 2003-03-04 페어차일드코리아반도체 주식회사 High voltage semiconductor device having a high breakdown voltage isolation region
CN101764153B (en) * 2008-12-26 2013-03-27 新唐科技股份有限公司 Laterally diffused metal oxide semiconductor element

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4602266A (en) * 1983-01-28 1986-07-22 U.S. Philips Corporation High voltage guard ring with variable width shallow portion
US20080074165A1 (en) * 2004-04-27 2008-03-27 Fairchild Korea Semiconductor, Ltd. High voltage gate driver integrated circuit including high voltage junction capacitor and high voltage ldmos transistor
US20130341718A1 (en) * 2012-06-26 2013-12-26 Fairchild Korea Semiconductor Ltd. Power semiconductor device

Also Published As

Publication number Publication date
TW201719893A (en) 2017-06-01
CN106783629A (en) 2017-05-31
CN106783629B (en) 2019-11-01

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