TWI560858B - Back-illuminated image sensor and fabricating method thereof - Google Patents

Back-illuminated image sensor and fabricating method thereof

Info

Publication number
TWI560858B
TWI560858B TW101121373A TW101121373A TWI560858B TW I560858 B TWI560858 B TW I560858B TW 101121373 A TW101121373 A TW 101121373A TW 101121373 A TW101121373 A TW 101121373A TW I560858 B TWI560858 B TW I560858B
Authority
TW
Taiwan
Prior art keywords
image sensor
fabricating method
illuminated image
illuminated
fabricating
Prior art date
Application number
TW101121373A
Other languages
Chinese (zh)
Other versions
TW201351623A (en
Inventor
Tzeng Fei Wen
Original Assignee
United Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Microelectronics Corp filed Critical United Microelectronics Corp
Priority to TW101121373A priority Critical patent/TWI560858B/en
Publication of TW201351623A publication Critical patent/TW201351623A/en
Application granted granted Critical
Publication of TWI560858B publication Critical patent/TWI560858B/en

Links

TW101121373A 2012-06-14 2012-06-14 Back-illuminated image sensor and fabricating method thereof TWI560858B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW101121373A TWI560858B (en) 2012-06-14 2012-06-14 Back-illuminated image sensor and fabricating method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW101121373A TWI560858B (en) 2012-06-14 2012-06-14 Back-illuminated image sensor and fabricating method thereof

Publications (2)

Publication Number Publication Date
TW201351623A TW201351623A (en) 2013-12-16
TWI560858B true TWI560858B (en) 2016-12-01

Family

ID=50158133

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101121373A TWI560858B (en) 2012-06-14 2012-06-14 Back-illuminated image sensor and fabricating method thereof

Country Status (1)

Country Link
TW (1) TWI560858B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9786710B2 (en) * 2015-09-30 2017-10-10 Taiwan Semiconductor Manufacturing Co., Ltd. Image sensor device with sub-isolation in pixels
TWI707465B (en) * 2019-10-09 2020-10-11 晶相光電股份有限公司 Image sensing device and method of forming the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070210395A1 (en) * 2006-02-24 2007-09-13 Yasushi Maruyama Solid-state imaging device, method for producing same, and camera
US20080061330A1 (en) * 2006-09-13 2008-03-13 Taiwan Semiconductor Manufacturing Co., Ltd. Methods for fabricating image sensor devices
US20090090937A1 (en) * 2007-10-05 2009-04-09 Samsung Electronics Co., Ltd. Unit pixels, image sensor containing unit pixels, and method of fabricating unit pixels
US20110242376A1 (en) * 2010-04-02 2011-10-06 Sony Corporation Solid-state imaging device and method for manufacturing the same, and electronic apparatus and camera module

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070210395A1 (en) * 2006-02-24 2007-09-13 Yasushi Maruyama Solid-state imaging device, method for producing same, and camera
US20080061330A1 (en) * 2006-09-13 2008-03-13 Taiwan Semiconductor Manufacturing Co., Ltd. Methods for fabricating image sensor devices
US20090090937A1 (en) * 2007-10-05 2009-04-09 Samsung Electronics Co., Ltd. Unit pixels, image sensor containing unit pixels, and method of fabricating unit pixels
US20110242376A1 (en) * 2010-04-02 2011-10-06 Sony Corporation Solid-state imaging device and method for manufacturing the same, and electronic apparatus and camera module

Also Published As

Publication number Publication date
TW201351623A (en) 2013-12-16

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