TWI560448B - - Google Patents

Info

Publication number
TWI560448B
TWI560448B TW104122802A TW104122802A TWI560448B TW I560448 B TWI560448 B TW I560448B TW 104122802 A TW104122802 A TW 104122802A TW 104122802 A TW104122802 A TW 104122802A TW I560448 B TWI560448 B TW I560448B
Authority
TW
Taiwan
Application number
TW104122802A
Other languages
Chinese (zh)
Other versions
TW201604546A (en
Inventor
Masami Maeda
Fuyumi Takata
Toshioki Shimojima
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of TW201604546A publication Critical patent/TW201604546A/en
Application granted granted Critical
Publication of TWI560448B publication Critical patent/TWI560448B/zh

Links

TW104122802A 2014-07-17 2015-07-14 Electronic component conveying device and electronic component inspection device TW201604546A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014146842A JP2016023971A (en) 2014-07-17 2014-07-17 Electronic component transfer device and electronic component inspection device

Publications (2)

Publication Number Publication Date
TW201604546A TW201604546A (en) 2016-02-01
TWI560448B true TWI560448B (en) 2016-12-01

Family

ID=55270858

Family Applications (2)

Application Number Title Priority Date Filing Date
TW105131462A TWI626447B (en) 2014-07-17 2015-07-14 Electronic component conveying device and electronic component inspection device
TW104122802A TW201604546A (en) 2014-07-17 2015-07-14 Electronic component conveying device and electronic component inspection device

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW105131462A TWI626447B (en) 2014-07-17 2015-07-14 Electronic component conveying device and electronic component inspection device

Country Status (2)

Country Link
JP (1) JP2016023971A (en)
TW (2) TWI626447B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018004449A (en) * 2016-07-01 2018-01-11 三菱電機株式会社 Measurement device
JP2018141700A (en) * 2017-02-28 2018-09-13 セイコーエプソン株式会社 Electronic component conveyance device and electronic component inspection device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001228206A (en) * 2000-02-17 2001-08-24 Advantest Corp Parts testing device and parts holder used therein
TW200707865A (en) * 2005-06-07 2007-02-16 Advantest Corp Adapter, interface device with the adapter, and electronic component test apparatus
US20070119371A1 (en) * 2005-11-04 2007-05-31 Paul Ma Apparatus and process for plasma-enhanced atomic layer deposition
TW200731043A (en) * 2005-09-09 2007-08-16 Seiko Epson Corp Temperature controller of electronic components and handling apparatus
TW201210813A (en) * 2010-08-20 2012-03-16 Nichigo Morton Co Ltd Laminating apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001228206A (en) * 2000-02-17 2001-08-24 Advantest Corp Parts testing device and parts holder used therein
TW200707865A (en) * 2005-06-07 2007-02-16 Advantest Corp Adapter, interface device with the adapter, and electronic component test apparatus
TW200731043A (en) * 2005-09-09 2007-08-16 Seiko Epson Corp Temperature controller of electronic components and handling apparatus
US20070119371A1 (en) * 2005-11-04 2007-05-31 Paul Ma Apparatus and process for plasma-enhanced atomic layer deposition
TW201210813A (en) * 2010-08-20 2012-03-16 Nichigo Morton Co Ltd Laminating apparatus

Also Published As

Publication number Publication date
TWI626447B (en) 2018-06-11
TW201702604A (en) 2017-01-16
JP2016023971A (en) 2016-02-08
TW201604546A (en) 2016-02-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees