TWI560448B - - Google Patents
Info
- Publication number
- TWI560448B TWI560448B TW104122802A TW104122802A TWI560448B TW I560448 B TWI560448 B TW I560448B TW 104122802 A TW104122802 A TW 104122802A TW 104122802 A TW104122802 A TW 104122802A TW I560448 B TWI560448 B TW I560448B
- Authority
- TW
- Taiwan
Links
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014146842A JP2016023971A (en) | 2014-07-17 | 2014-07-17 | Electronic component transfer device and electronic component inspection device |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201604546A TW201604546A (en) | 2016-02-01 |
TWI560448B true TWI560448B (en) | 2016-12-01 |
Family
ID=55270858
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105131462A TWI626447B (en) | 2014-07-17 | 2015-07-14 | Electronic component conveying device and electronic component inspection device |
TW104122802A TW201604546A (en) | 2014-07-17 | 2015-07-14 | Electronic component conveying device and electronic component inspection device |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105131462A TWI626447B (en) | 2014-07-17 | 2015-07-14 | Electronic component conveying device and electronic component inspection device |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2016023971A (en) |
TW (2) | TWI626447B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018004449A (en) * | 2016-07-01 | 2018-01-11 | 三菱電機株式会社 | Measurement device |
JP2018141700A (en) * | 2017-02-28 | 2018-09-13 | セイコーエプソン株式会社 | Electronic component conveyance device and electronic component inspection device |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001228206A (en) * | 2000-02-17 | 2001-08-24 | Advantest Corp | Parts testing device and parts holder used therein |
TW200707865A (en) * | 2005-06-07 | 2007-02-16 | Advantest Corp | Adapter, interface device with the adapter, and electronic component test apparatus |
US20070119371A1 (en) * | 2005-11-04 | 2007-05-31 | Paul Ma | Apparatus and process for plasma-enhanced atomic layer deposition |
TW200731043A (en) * | 2005-09-09 | 2007-08-16 | Seiko Epson Corp | Temperature controller of electronic components and handling apparatus |
TW201210813A (en) * | 2010-08-20 | 2012-03-16 | Nichigo Morton Co Ltd | Laminating apparatus |
-
2014
- 2014-07-17 JP JP2014146842A patent/JP2016023971A/en active Pending
-
2015
- 2015-07-14 TW TW105131462A patent/TWI626447B/en not_active IP Right Cessation
- 2015-07-14 TW TW104122802A patent/TW201604546A/en not_active IP Right Cessation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001228206A (en) * | 2000-02-17 | 2001-08-24 | Advantest Corp | Parts testing device and parts holder used therein |
TW200707865A (en) * | 2005-06-07 | 2007-02-16 | Advantest Corp | Adapter, interface device with the adapter, and electronic component test apparatus |
TW200731043A (en) * | 2005-09-09 | 2007-08-16 | Seiko Epson Corp | Temperature controller of electronic components and handling apparatus |
US20070119371A1 (en) * | 2005-11-04 | 2007-05-31 | Paul Ma | Apparatus and process for plasma-enhanced atomic layer deposition |
TW201210813A (en) * | 2010-08-20 | 2012-03-16 | Nichigo Morton Co Ltd | Laminating apparatus |
Also Published As
Publication number | Publication date |
---|---|
TWI626447B (en) | 2018-06-11 |
TW201702604A (en) | 2017-01-16 |
JP2016023971A (en) | 2016-02-08 |
TW201604546A (en) | 2016-02-01 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |