TWI560234B - Thermoplastic resin composition, method for making the same, adhesive sheet, and printed circuit board - Google Patents
Thermoplastic resin composition, method for making the same, adhesive sheet, and printed circuit boardInfo
- Publication number
- TWI560234B TWI560234B TW104129465A TW104129465A TWI560234B TW I560234 B TWI560234 B TW I560234B TW 104129465 A TW104129465 A TW 104129465A TW 104129465 A TW104129465 A TW 104129465A TW I560234 B TWI560234 B TW I560234B
- Authority
- TW
- Taiwan
- Prior art keywords
- making
- circuit board
- resin composition
- printed circuit
- thermoplastic resin
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW104129465A TWI560234B (en) | 2015-09-07 | 2015-09-07 | Thermoplastic resin composition, method for making the same, adhesive sheet, and printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW104129465A TWI560234B (en) | 2015-09-07 | 2015-09-07 | Thermoplastic resin composition, method for making the same, adhesive sheet, and printed circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI560234B true TWI560234B (en) | 2016-12-01 |
TW201710363A TW201710363A (zh) | 2017-03-16 |
Family
ID=58227138
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104129465A TWI560234B (en) | 2015-09-07 | 2015-09-07 | Thermoplastic resin composition, method for making the same, adhesive sheet, and printed circuit board |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI560234B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112724640A (zh) * | 2020-12-25 | 2021-04-30 | 广东生益科技股份有限公司 | 一种热固性树脂组合物、使用其的半固化片与覆铜箔层压板 |
CN112745654A (zh) * | 2019-10-31 | 2021-05-04 | 台光电子材料股份有限公司 | 树脂组合物及其制品 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109233705B (zh) * | 2018-04-26 | 2019-11-08 | 庆鼎精密电子(淮安)有限公司 | 均温板及其制造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201231553A (en) * | 2010-12-16 | 2012-08-01 | Asahi Kasei E Materials Corp | Curable resin composition |
TW201412822A (zh) * | 2012-08-29 | 2014-04-01 | Panasonic Corp | 變性聚苯醚、其之製造方法、聚苯醚樹脂組成物、樹脂清漆、預浸體、貼金屬層合板、及印刷配線板 |
TW201506081A (zh) * | 2013-08-09 | 2015-02-16 | Elite Electronic Material Kunshan Co Ltd | 低介電樹脂組合物及應用其之銅箔基板及印刷電路板 |
-
2015
- 2015-09-07 TW TW104129465A patent/TWI560234B/zh not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201231553A (en) * | 2010-12-16 | 2012-08-01 | Asahi Kasei E Materials Corp | Curable resin composition |
TW201412822A (zh) * | 2012-08-29 | 2014-04-01 | Panasonic Corp | 變性聚苯醚、其之製造方法、聚苯醚樹脂組成物、樹脂清漆、預浸體、貼金屬層合板、及印刷配線板 |
TW201506081A (zh) * | 2013-08-09 | 2015-02-16 | Elite Electronic Material Kunshan Co Ltd | 低介電樹脂組合物及應用其之銅箔基板及印刷電路板 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112745654A (zh) * | 2019-10-31 | 2021-05-04 | 台光电子材料股份有限公司 | 树脂组合物及其制品 |
CN112745654B (zh) * | 2019-10-31 | 2023-03-28 | 台光电子材料股份有限公司 | 树脂组合物及其制品 |
CN112724640A (zh) * | 2020-12-25 | 2021-04-30 | 广东生益科技股份有限公司 | 一种热固性树脂组合物、使用其的半固化片与覆铜箔层压板 |
Also Published As
Publication number | Publication date |
---|---|
TW201710363A (zh) | 2017-03-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP3216834A4 (en) | Resin composition, prepreg, metal-foil-clad laminated board, resin composite sheet, and printed circuit board | |
SG11201705674TA (en) | Resin film for flexible printed circuit board, metal foil provided with resin, coverlay film, bonding sheet, and flexible printed circuit board | |
EP3165554A4 (en) | Heat-curable resin composition, polyamide, adhesive sheet, cured article, and printed wiring board | |
EP3321298A4 (en) | RESIN COMPOSITION, PRE-IMPREGNATED, LAMINATE PANEL PLATED WITH METAL SHEET AND CIRCUIT BOARD | |
EP3290480A4 (en) | RESIN COMPOSITION, PREPREG, LAMINATE AND MULTILAYER PRINTED WIRING BOARD | |
SG11201509490PA (en) | Resin composition for printed wiring board material and prepreg, resin sheet, metal foil-clad laminate, and printed wiring board using the same | |
EP3489308A4 (en) | RESIN COMPOSITION, LAMINATE PLATE, AND MULTI-LAYER PRINTED CIRCUIT BOARD | |
EP3395894A4 (en) | RESIN COMPOSITION, HALF-CURED HEAT TRANSFER FILM THEREOF, PCB AND ADHESIVE FOIL | |
EP3366725A4 (en) | POLYPHENYLETHERIC RESIN COMPOSITION AND PREPREG, LAMINATED PLATE AND PCB WITH IT | |
EP3109701A4 (en) | Photosensitive resin composition, solder resist composition, and coated printed wiring board | |
EP3115418A4 (en) | Resin composition, prepreg, resin sheet, metal-foil-clad laminated plate, and printed wiring board | |
SG11201610849XA (en) | Resin composition, prepreg, metallic foil-clad laminate, and printed wiring board | |
EP3422823A4 (en) | SOFT PRINTED CIRCUIT BOARD | |
EP3530696A4 (en) | RESIN COMPOSITION, RESIN FILM FOR CARD WITH THE RESIN COMPOSITION AND MULTILAYER FILM | |
EP3375822A4 (en) | RESIN COMPOSITION, PREPREG, LAMINATED PLATE OF METAL SHEET, RESIN SHEET AND CIRCUIT BOARD | |
EP3321322A4 (en) | Resin composition, prepreg, resin sheet, metal foil-clad laminate sheet, and printed wiring board | |
EP3447090A4 (en) | THERMOCURING RESIN COMPOSITION, HARDENED FILM AND METHOD FOR THEIR PRODUCTION, AND FLEXIBLE CIRCUIT BOARD WITH HARDENED FILM AND METHOD FOR THE PRODUCTION THEREOF | |
EP3392286A4 (en) | EPOXY RESIN COMPOSITION AND PREPREG, STRATIFIED CARD AND PRINTED CIRCUIT BOARD COMPRISING SAME | |
EP3272782A4 (en) | Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board | |
EP3357687A4 (en) | LAMINATE, METHOD FOR THE PRODUCTION THEREOF AND FLEXIBLE CONDUCTOR PLATE | |
EP3459324A4 (en) | PRINTED CIRCUIT BOARD ASSEMBLY | |
EP3103825A4 (en) | Resin composition for printed-circuit board, prepreg, metal foil-clad laminate board, resin composite sheet, and printed-circuit board | |
EP3321326A4 (en) | RESIN COMPOSITION, PREPREG, RESIN FOIL, LAMINATE COATED WITH METAL FOIL AND LADDER PLATE | |
TWI560234B (en) | Thermoplastic resin composition, method for making the same, adhesive sheet, and printed circuit board | |
EP3168263A4 (en) | Resin composition, prepreg, metal-foil-clad laminate, resin composite sheet, and printed wiring board |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |