TWI560017B - Method and apparatus for dividing thin film device into separate cells - Google Patents
Method and apparatus for dividing thin film device into separate cellsInfo
- Publication number
- TWI560017B TWI560017B TW100133681A TW100133681A TWI560017B TW I560017 B TWI560017 B TW I560017B TW 100133681 A TW100133681 A TW 100133681A TW 100133681 A TW100133681 A TW 100133681A TW I560017 B TWI560017 B TW I560017B
- Authority
- TW
- Taiwan
- Prior art keywords
- thin film
- film device
- separate cells
- dividing thin
- dividing
- Prior art date
Links
- 239000010409 thin film Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/0445—PV modules or arrays of single PV cells including thin film solar cells, e.g. single thin film a-Si, CIS or CdTe solar cells
- H01L31/046—PV modules composed of a plurality of thin film solar cells deposited on the same substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
- H01L21/76879—Filling of holes, grooves or trenches, e.g. vias, with conductive material by selective deposition of conductive material in the vias, e.g. selective C.V.D. on semiconductor material, plating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/02016—Circuit arrangements of general character for the devices
- H01L31/02019—Circuit arrangements of general character for the devices for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02021—Circuit arrangements of general character for the devices for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/0445—PV modules or arrays of single PV cells including thin film solar cells, e.g. single thin film a-Si, CIS or CdTe solar cells
- H01L31/046—PV modules composed of a plurality of thin film solar cells deposited on the same substrate
- H01L31/0463—PV modules composed of a plurality of thin film solar cells deposited on the same substrate characterised by special patterning methods to connect the PV cells in a module, e.g. laser cutting of the conductive or active layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
- B23K2103/166—Multilayered materials
- B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Sustainable Energy (AREA)
- Manufacturing & Machinery (AREA)
- Photovoltaic Devices (AREA)
- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1016172.7A GB2483922B (en) | 2010-09-25 | 2010-09-25 | Method and apparatus for dividing thin film device into separate cells |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201233483A TW201233483A (en) | 2012-08-16 |
TWI560017B true TWI560017B (en) | 2016-12-01 |
Family
ID=43127985
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW100133681A TWI560017B (en) | 2010-09-25 | 2011-09-20 | Method and apparatus for dividing thin film device into separate cells |
Country Status (8)
Country | Link |
---|---|
US (1) | US9130094B2 (zh) |
EP (1) | EP2619804A1 (zh) |
JP (1) | JP5988980B2 (zh) |
KR (1) | KR101786854B1 (zh) |
CN (1) | CN103119731B (zh) |
GB (1) | GB2483922B (zh) |
TW (1) | TWI560017B (zh) |
WO (1) | WO2012038689A1 (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102012205978A1 (de) * | 2012-04-12 | 2013-10-17 | Robert Bosch Gmbh | Photovoltaische Dünnschichtsolarmodule sowie Verfahren zur Herstellung solcher Dünnschichtsolarmodule |
TW201414561A (zh) * | 2012-06-20 | 2014-04-16 | Tel Solar Ag | 雷射劃線系統 |
CN116154032A (zh) * | 2021-11-19 | 2023-05-23 | 宁德时代新能源科技股份有限公司 | 用于制造太阳能电池的设备及制造太阳能电池的方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW572804B (en) * | 2001-08-10 | 2004-01-21 | First Solar Llc | Method and apparatus for laser scribing glass sheet substrate coatings |
WO2008157807A2 (en) * | 2007-06-20 | 2008-12-24 | Ascent Solar Technologies, Inc. | Array of monolithically integrated thin film photovoltaic cells and associated methods |
CN101496273A (zh) * | 2005-10-07 | 2009-07-29 | 应用材料股份有限公司 | 用于改进薄膜太阳能电池互连的系统和方法 |
GB2458986A (en) * | 2008-04-08 | 2009-10-14 | Philip Thomas Rumsby | Apparatus for patterning thin films on continuous flexible substrates |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3604917A1 (de) * | 1986-02-17 | 1987-08-27 | Messerschmitt Boelkow Blohm | Verfahren zur herstellung eines integrierten verbandes in reihe geschalteter duennschicht-solarzellen |
JP3091151B2 (ja) | 1997-01-27 | 2000-09-25 | 三洋電機株式会社 | 集積型光起電力装置の製造方法 |
JPH11163499A (ja) * | 1997-11-28 | 1999-06-18 | Nitto Boseki Co Ltd | プリント配線板の製造方法及びこの製造方法によるプリント配線板 |
JP4741045B2 (ja) * | 1998-03-25 | 2011-08-03 | セイコーエプソン株式会社 | 電気回路、その製造方法および電気回路製造装置 |
JP4168413B2 (ja) | 1998-07-27 | 2008-10-22 | シチズンホールディングス株式会社 | 太陽電池の製造方法 |
JP2000124488A (ja) * | 1998-10-15 | 2000-04-28 | Matsushita Electric Ind Co Ltd | 薄膜太陽電池の製造方法 |
US6310281B1 (en) | 2000-03-16 | 2001-10-30 | Global Solar Energy, Inc. | Thin-film, flexible photovoltaic module |
US6491361B1 (en) * | 2000-11-09 | 2002-12-10 | Encad, Inc. | Digital media cutter |
JP2003318133A (ja) * | 2002-04-22 | 2003-11-07 | Seiko Epson Corp | 膜パターンの形成方法、膜パターン形成装置、導電膜配線、半導体チップの実装構造、半導体装置、発光装置、電気光学装置、電子機器、並びに非接触型カード媒体 |
US6690041B2 (en) | 2002-05-14 | 2004-02-10 | Global Solar Energy, Inc. | Monolithically integrated diodes in thin-film photovoltaic devices |
KR101119202B1 (ko) * | 2005-02-07 | 2012-03-20 | 삼성전자주식회사 | 액적 형성 장치 및 방법, 박막 형성 방법 및 표시기판 |
TWI334649B (en) * | 2005-09-27 | 2010-12-11 | Lg Chemical Ltd | Method for forming buried contact electrode of semiconductor device having pn junction and optoelectronic semiconductor device using the same |
GB0622232D0 (en) * | 2006-11-08 | 2006-12-20 | Rumsby Philip T | Method and apparatus for laser beam alignment for solar panel scribing |
DE102007032283A1 (de) * | 2007-07-11 | 2009-01-15 | Stein, Wilhelm, Dr. | Dünnschichtsolarzellen-Modul und Verfahren zu dessen Herstellung |
JP2010538475A (ja) * | 2007-08-31 | 2010-12-09 | アプライド マテリアルズ インコーポレイテッド | 多サイズの光起電デバイスを形成するための生産ラインモジュール |
GB0802289D0 (en) * | 2008-02-07 | 2008-03-12 | Rumsby Philip T | Method and appartus for making a partially transparent solar panel |
WO2010002005A1 (ja) * | 2008-07-04 | 2010-01-07 | 株式会社アルバック | 太陽電池セルの製造方法及び太陽電池セル |
US8563892B2 (en) * | 2008-09-24 | 2013-10-22 | Standex International Corporation | Method and apparatus for laser engraving |
GB2472608B (en) * | 2009-08-12 | 2013-09-04 | M Solv Ltd | Method and Apparatus for making a solar panel that is partially transparent |
US8865569B2 (en) * | 2009-10-22 | 2014-10-21 | M-Solv Ltd. | Method and apparatus for dividing thin film device into separate cells |
GB2474665B (en) | 2009-10-22 | 2011-10-12 | M Solv Ltd | Method and apparatus for dividing thin film device into separate cells |
US20110139755A1 (en) * | 2009-11-03 | 2011-06-16 | Applied Materials, Inc. | Multi-wavelength laser-scribing tool |
EP2442360A3 (de) | 2010-10-15 | 2017-05-03 | Wilhelm Stein | Verfahren zur Herstellung von Verbindungen in einem Dünnschichtfotovoltaikmodul und Dünnschichtfotovoltaikmodul |
DE202011110968U1 (de) | 2010-10-15 | 2017-11-16 | Wilhelm Stein | Dünnschichtfotovoltaikmodul |
EP2761669A1 (de) | 2011-09-27 | 2014-08-06 | Wilhelm Stein | Fotovoltaikmodul, verfahren und herstellungsanlage zur herstellung eines fotovoltaikmoduls |
-
2010
- 2010-09-25 GB GB1016172.7A patent/GB2483922B/en not_active Expired - Fee Related
-
2011
- 2011-09-16 KR KR1020137010504A patent/KR101786854B1/ko active IP Right Grant
- 2011-09-16 EP EP11764595.2A patent/EP2619804A1/en not_active Withdrawn
- 2011-09-16 US US13/825,629 patent/US9130094B2/en not_active Expired - Fee Related
- 2011-09-16 CN CN201180045897.4A patent/CN103119731B/zh not_active Expired - Fee Related
- 2011-09-16 JP JP2013529700A patent/JP5988980B2/ja not_active Expired - Fee Related
- 2011-09-16 WO PCT/GB2011/001352 patent/WO2012038689A1/en active Application Filing
- 2011-09-20 TW TW100133681A patent/TWI560017B/zh not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW572804B (en) * | 2001-08-10 | 2004-01-21 | First Solar Llc | Method and apparatus for laser scribing glass sheet substrate coatings |
CN101496273A (zh) * | 2005-10-07 | 2009-07-29 | 应用材料股份有限公司 | 用于改进薄膜太阳能电池互连的系统和方法 |
WO2008157807A2 (en) * | 2007-06-20 | 2008-12-24 | Ascent Solar Technologies, Inc. | Array of monolithically integrated thin film photovoltaic cells and associated methods |
GB2458986A (en) * | 2008-04-08 | 2009-10-14 | Philip Thomas Rumsby | Apparatus for patterning thin films on continuous flexible substrates |
Also Published As
Publication number | Publication date |
---|---|
EP2619804A1 (en) | 2013-07-31 |
GB2483922A (en) | 2012-03-28 |
TW201233483A (en) | 2012-08-16 |
GB2483922B (en) | 2013-11-20 |
KR101786854B1 (ko) | 2017-10-18 |
US20130210224A1 (en) | 2013-08-15 |
CN103119731A (zh) | 2013-05-22 |
US9130094B2 (en) | 2015-09-08 |
CN103119731B (zh) | 2016-10-26 |
KR20130108593A (ko) | 2013-10-04 |
GB201016172D0 (en) | 2010-11-10 |
JP2013546160A (ja) | 2013-12-26 |
JP5988980B2 (ja) | 2016-09-07 |
WO2012038689A1 (en) | 2012-03-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |