TWI557650B - 用於識別材料中之缺陷之系統及方法 - Google Patents

用於識別材料中之缺陷之系統及方法 Download PDF

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Publication number
TWI557650B
TWI557650B TW101128312A TW101128312A TWI557650B TW I557650 B TWI557650 B TW I557650B TW 101128312 A TW101128312 A TW 101128312A TW 101128312 A TW101128312 A TW 101128312A TW I557650 B TWI557650 B TW I557650B
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Taiwan
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feature
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image
features
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TW101128312A
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English (en)
Chinese (zh)
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TW201310359A (zh
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王曉光
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康耐視股份有限公司
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/10—Segmentation; Edge detection
    • G06T7/13—Edge detection
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/10—Segmentation; Edge detection
    • G06T7/136—Segmentation; Edge detection involving thresholding
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/10—Segmentation; Edge detection
    • G06T7/181—Segmentation; Edge detection involving edge growing; involving edge linking
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

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  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Image Analysis (AREA)
  • Image Processing (AREA)
TW101128312A 2011-08-19 2012-08-06 用於識別材料中之缺陷之系統及方法 TWI557650B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/213,993 US8750596B2 (en) 2011-08-19 2011-08-19 System and method for identifying defects in a material

Publications (2)

Publication Number Publication Date
TW201310359A TW201310359A (zh) 2013-03-01
TWI557650B true TWI557650B (zh) 2016-11-11

Family

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Family Applications (1)

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TW101128312A TWI557650B (zh) 2011-08-19 2012-08-06 用於識別材料中之缺陷之系統及方法

Country Status (4)

Country Link
US (2) US8750596B2 (de)
CN (1) CN103134807B (de)
DE (1) DE102012107287B4 (de)
TW (1) TWI557650B (de)

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TWI511084B (zh) * 2012-01-20 2015-12-01 Asml Netherlands Bv 可自組聚合物及用於微影之方法
DE102013005489B4 (de) 2013-04-02 2019-06-27 Capex Invest GmbH Verfahren und Vorrichtung zur automatischen Fehlerstellenerkennung bei biegeschlaffen Körpern
CN103345743B (zh) * 2013-06-18 2016-05-25 宁波成电泰克电子信息技术发展有限公司 一种用于电池尾端智能探伤的图像分割方法
TWI514883B (zh) * 2013-07-31 2015-12-21 Coretronic Corp 投影裝置及其投影畫面的亮度控制方法
US9528945B2 (en) * 2014-08-28 2016-12-27 The Boeing Company Systems and methods for detecting crack growth
JP2016090548A (ja) * 2014-11-11 2016-05-23 株式会社東芝 ひび割れ情報収集方法及びひび割れ情報収集プログラム
JP2016090547A (ja) * 2014-11-11 2016-05-23 株式会社東芝 ひび割れ情報収集装置及びひび割れ情報を収集するためのサーバ装置
JP6568672B2 (ja) * 2015-11-13 2019-08-28 コグネックス・コーポレイション ビジョンシステムで鏡面上の欠陥を検出するためのシステム及び方法
JP6702097B2 (ja) * 2016-09-02 2020-05-27 富士通株式会社 画像処理プログラム、画像処理方法および画像処理装置
CN108198766A (zh) * 2017-12-29 2018-06-22 英特尔产品（成都）有限公司 芯片封装缺陷自动识别和处理方法、系统及存储设备
EP3748283A4 (de) * 2018-01-31 2020-12-30 Fujifilm Corporation Reparaturlängenbestimmungsverfahren und reparaturlängenbestimmungsvorrichtung
CN108492291B (zh) * 2018-03-12 2022-07-22 苏州天准科技股份有限公司 一种基于cnn分割的太阳能光伏硅片瑕疵检测系统及方法
WO2021072059A1 (en) * 2019-10-08 2021-04-15 Schlumberger Technology Corporation Methods and systems for controlling operation of wireline cable spooling equipment
CN111784667B (zh) * 2020-06-30 2023-09-26 京东科技信息技术有限公司 一种裂纹识别方法及装置
US11919754B2 (en) 2020-11-10 2024-03-05 Schlumberger Technology Corporation Automated spooling control system using stochastic inference
CN112785594B (zh) * 2021-03-16 2022-08-30 合肥工业大学 基于图像二维幅值估计的桥梁自动结构裂缝识别方法
CN113252682B (zh) * 2021-04-15 2022-12-16 首钢集团有限公司 提高表面质量检测系统识别带钢表面缺陷准确率的方法
CN116934746B (zh) * 2023-09-14 2023-12-01 常州微亿智造科技有限公司 划伤缺陷检测方法、系统、设备及其介质
CN117368210B (zh) * 2023-12-08 2024-02-27 荣旗工业科技(苏州)股份有限公司 一种基于多维复合成像技术的缺陷检测方法

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US5367174A (en) * 1992-01-27 1994-11-22 Aerospatiale Societe Nationale Industrielle Defect detecting device for two-layer parts, in particular for solar cells
US6028948A (en) * 1997-12-29 2000-02-22 Lockheed Martin Corporation Surface anomaly-detection and analysis method
US20100177191A1 (en) * 2007-06-22 2010-07-15 Oliver Stier Method for optical inspection of a matt surface and apparatus for applying this method
TW201108445A (en) * 2008-10-07 2011-03-01 Nisshinbo Holdings Inc Inspecting apparatus, inspecting method, program and inspecting system for photovoltaic devices

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DE3612268A1 (de) 1986-04-11 1987-10-15 Licentia Gmbh Verfahren zum auffinden von in einem vergleichsbild vorhandenen flaechen in einem bild
JPH07201946A (ja) 1993-12-28 1995-08-04 Hitachi Ltd 半導体装置等の製造方法及びその装置並びに検査方法及びその装置
US6122397A (en) 1997-07-03 2000-09-19 Tri Path Imaging, Inc. Method and apparatus for maskless semiconductor and liquid crystal display inspection
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US6941016B1 (en) * 2001-12-31 2005-09-06 Cognex Technology And Investment Method for finding contours in an image of an object
US20050252545A1 (en) 2004-05-12 2005-11-17 Spire Corporation Infrared detection of solar cell defects under forward bias
US7804993B2 (en) 2005-02-28 2010-09-28 Applied Materials South East Asia Pte. Ltd. Method and apparatus for detecting defects in wafers including alignment of the wafer images so as to induce the same smear in all images
TW200940977A (en) 2008-03-19 2009-10-01 Viswell Technology Co Ltd Optical imaging apparatus and method for inspection of solar cells
AU2009230877A1 (en) 2008-03-31 2009-10-08 Bt Imaging Pty Ltd Wafer imaging and processing method and apparatus
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US5367174A (en) * 1992-01-27 1994-11-22 Aerospatiale Societe Nationale Industrielle Defect detecting device for two-layer parts, in particular for solar cells
US6028948A (en) * 1997-12-29 2000-02-22 Lockheed Martin Corporation Surface anomaly-detection and analysis method
US20100177191A1 (en) * 2007-06-22 2010-07-15 Oliver Stier Method for optical inspection of a matt surface and apparatus for applying this method
TW201108445A (en) * 2008-10-07 2011-03-01 Nisshinbo Holdings Inc Inspecting apparatus, inspecting method, program and inspecting system for photovoltaic devices

Also Published As

Publication number Publication date
US8750596B2 (en) 2014-06-10
DE102012107287A9 (de) 2013-10-10
CN103134807A (zh) 2013-06-05
CN103134807B (zh) 2016-03-16
US20140177938A1 (en) 2014-06-26
TW201310359A (zh) 2013-03-01
DE102012107287A1 (de) 2013-02-21
DE102012107287B4 (de) 2019-09-05
US20130044936A1 (en) 2013-02-21

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