TWI553284B - Electronic device having heat transferring passage, heat dissipating member and heat dissipation method therefor - Google Patents

Description

Electronic device with heat convection channel, heat dissipating component and heat dissipation method thereof

The invention relates to an electronic device with a heat convection channel, a heat dissipating component and a heat dissipating method thereof, in particular to a heat convection efficiency by forming a chimney effect by a vertical heat convection channel to form a chimney effect.

As electronic devices are currently trending toward lighter weight and thinner, how to make heat transfer components more quickly and efficiently cool the heat generated by electronic devices under the condition of smaller volume has been a technology to be overcome by related companies. problem.

At present, most common heat dissipating components utilize a copper metal or aluminum metal substrate with good thermal conductivity, and a plurality of heat dissipating fins are disposed on the copper metal or aluminum metal substrate to utilize the heat dissipating fins to utilize the cooling electronic device. The heat is transmitted to the outside, but the heat dissipation fins and the copper metal or aluminum metal substrate itself can provide a limited heat dissipation area, which makes it difficult to further improve the heat dissipation efficiency.

To this end, there are currently companies developing R&D such as the Republic of China Patent No. M256585 "Power Semiconductor Heat Dissipation Structure", Republic of China Patent No. M315807 "Lighting Device with Heat Dissipation Structure", Republic of China Patent No. I256873 "Dissipation Structure for Electronic Devices", and Heat Dissipation The component comprises a heat conducting plate having a plurality of parallel channels parallel to each other, each of the holes extending through the heat conducting plate to enhance the heat convection effect by the plurality of holes to guide the airflow discharge passage.

However, the channel of the above case can provide a small amount of intake air, so that after the hot air is exhausted, sufficient amount of cold air is not compensated, and it is difficult to further improve the heat convection efficiency.

Therefore, in order to further improve the thermal convection efficiency of the heat dissipating component, the inventors have made research and proposed a heat dissipating component having a heat convection passage having a first surface for contacting a heat source, and the heat dissipating component has a heat dissipating component The upper end surface and the lower end surface are connected to the first surface, and at least one heat convection passage penetrates the upper end surface and the lower end surface, and the height position of the upper end surface is relatively higher than the lower end surface, and the upper end surface and the lower end surface are An intermediate position is defined in the middle; the heat dissipating component is further connected to the second surface of the upper end surface and the lower end surface, and the heat dissipating component has at least one through hole, the at least one through hole has a first opening and a second opening, the first opening An opening communicates with the at least one heat convection passage, the second opening of the at least one through hole is located between the lower end surface and the intermediate position, and the second end of the through hole is not between the upper end surface and the intermediate position Opening.

Further, the heat dissipating component is continuously spaced apart from the plurality of heat convection passages, and each of the heat convection passages penetrates the upper end surface and the lower end surface.

Further, the number of the through holes is 10,000 to 20,000 pieces per square meter.

Further, the heat convection passage is a groove formed by recessing the first surface toward the second surface.

Further, the heat dissipating component is coated on a inner surface of the recess with a heat absorbing coating to absorb thermal energy of the heat source.

The invention also relates to an electronic device having a heat convection passage, which uses the aforementioned heat dissipating component with a heat convection passage.

The invention also relates to a method for dissipating heat of an electronic device, which uses the aforementioned heat dissipating component having a heat convection passage, comprising the steps of: contacting a first surface of the heat dissipating component with the electronic device, and heightening an upper end surface of the heat dissipating component The position is relatively higher than the lower end surface, and the at least one heat convection passage of the heat dissipating component has an angle with a horizontal plane; when the electronic device generates thermal energy, the heat dissipating component has the lower end surface and the at least one through hole Introducing a fluid into the at least one heat convection passage, and The fluid discharges the heat energy of one of the heat sources through the upper end surface to the heat dissipating member, thereby generating a chimney effect and dissipating heat. Preferably, the angle is 90 degrees.

The effect of the invention is:

1. The heat convection passage of the heat dissipating component of the invention has an angle between the horizontal and the horizontal, so that the rising buoyancy of the hot air drives the air flow, in particular, the surrounding cold air is replenished into the heat field, so that the heat dissipating component generates a chimney effect and natural convection. Heat dissipation, thereby improving the heat convection heat dissipation of the heat dissipating component.

2. The heat dissipating component of the present invention is provided with a through hole communicating with the heat convection passage below the intermediate position of the surface, and no through hole is provided above the intermediate position, thereby allowing the heat dissipating component to be quickly replenished during natural convection Sufficient cold air and the gas can flow smoothly upwards.

(1)‧‧‧Heat components

(12) ‧‧‧ upper end

(13) ‧‧‧ lower end

(14) ‧‧‧Hot convection channel

(141) ‧ ‧ heat absorbing coating

(15)‧‧‧Second surface

(16)‧‧‧through holes

(161) ‧ ‧ first opening

(162) ‧‧‧second opening

(11) ‧‧‧ first surface

(A)‧‧‧Electronic devices

(P) ‧‧‧ intermediate position

(S) ‧ ‧ gas

[First figure] is a schematic perspective view of an embodiment of the present invention.

[Second figure] is a perspective exploded view of an embodiment of the present invention.

[Third view] is a schematic top view of an embodiment of the present invention.

[Fourth figure] is a schematic view showing a state of a partial cross-sectional view and an air intake heat convection passage according to an embodiment of the present invention.

In summary of the above technical features, the main effects of the electronic device having the heat convection channel, the heat dissipating component and the heat dissipating method thereof will be clearly shown in the following embodiments.

Referring to the first and second figures, the heat dissipating component (1) of the embodiment of the present invention has a first surface (11) for contacting a heat source, such as but not limited to an electronic device (A). The heat generated by the operation.

The heat dissipating component (1) has an upper end surface (12) and a lower end surface (13) connected to the first surface (11), and at least one heat convection passage (14) penetrates the upper end surface (12) and the lower end surface (13). Preferably, the heat dissipating component is continuously spaced with a plurality of thermal convection channels (14), each of the heat convection passages (14) extends through the upper end surface (12) and the lower end surface (13), and the heat convection passage (14) is a groove, and the groove is formed by the foregoing A surface (11) is formed by recessing in a direction of a second surface (15). Preferably, an inner face of the recess is covered with a heat absorbing coating (141) (as shown in the third figure) to absorb the thermal energy of the heat source.

An intermediate position (P) is defined between the upper end surface (12) and the lower end surface (13). The heat dissipating component (1) further has a plurality of through holes (16), preferably between 10,000 and 20,000. The through holes (16) each have a first opening (161) and a second opening (162). The first opening (161) communicates with the at least one heat convection passage (14), and the second opening (162) of the through hole (16) is located between the lower end surface (13) and the intermediate position (P) There is no second opening (162) of the aforementioned through hole (16) between the upper end surface (12) and the intermediate position (P).

In the case of use, please refer to the first figure and the fourth figure. In use, the first surface (11) of the heat dissipating component (1) is in contact with the electronic device (A), and the upper end surface of the heat dissipating component (1) is The height position of 12) is relatively higher than the lower end surface (13), so that the heat convection passage (14) of the heat dissipating member (1) has an angle with a horizontal plane, and the angle is preferably 90°.

Therefore, when the electronic device (A) generates thermal energy, the gas in the heat convection passage (14) of the heat dissipating component (1) is heated and naturally rises, and the heat dissipating component (1) is at the lower end surface (13). And a gas (S) is introduced into the through hole (16) to enter the heat convection passage (14), thereby generating a natural convection of the chimney effect and dissipating heat. And the heat dissipating element (1) is provided with a through hole (16) communicating with the heat convection passage (14) below the intermediate position (P) of the surface (ie, the second surface (15)), and the intermediate position (P) or more Then, no through hole (16) is provided, so that the intermediate position (P) of the heat dissipating component (1) is connected to the outside only by the at least one heat convection passage (14), thereby allowing the heat dissipating component (1) In the natural convection, it can quickly add enough cold air, and the gas can flow smoothly upwards.

The following experiments were carried out using a thermocouple and a temperature recorder. The electronic device LED lighting module (LED light source, LED lamp backplane), microplate and ambient temperature were measured in units of 20 seconds for a total of 30 minutes. . After 30 minutes, the system temperature tends to balance, and the thermal conductivity k is analyzed with the LED lamp backplane and ambient temperature.

The above thermal conductivity is mainly used to calculate the heat conduction of convection, or the heat transfer of the phase transition between fluid and solid, and the formula is as follows: k = (Q / t) × L / (A × T). The thermal conductivity k unit is W/(m*K); Q: heat, t: time, L: length, A: area, T: temperature difference.

The above thermal convection coefficient h is the efficiency of evaluating thermal convection, and its unit is W/m ² K, which is related to fluid density, viscosity and rate. The formula is q _convection =-hA × (T _surface -T _∞ ). Where A is the surface area of the heat dissipating component, T _surface is the surface temperature, and T _∞ is room temperature or fluid temperature.

In view of the foregoing description of the embodiments, the operation and the use of the present invention and the effects of the present invention are fully understood, but the above described embodiments are merely preferred embodiments of the present invention, and the invention may not be limited thereto. Included within the scope of the present invention are the scope of the present invention.

(1)‧‧‧Heat components

(11) ‧‧‧ first surface

(12) ‧‧‧ upper end

(13) ‧‧‧ lower end

(14) ‧‧‧Hot convection channel

(15)‧‧‧Second surface

(16)‧‧‧through holes

(A)‧‧‧Electronic devices

(P) ‧‧‧ intermediate position

Claims (8)

a heat dissipating component having a heat convection passage, the heat dissipating component having a first surface for contacting a heat source, the heat dissipating component having an upper end surface and a lower end surface connected to the first surface, and having at least one heat convection passage therethrough An upper end surface and the lower end surface define an intermediate position between the upper end surface and the lower end surface; the heat dissipating component is further connected to the second surface of the upper end surface and the lower end surface, and at least one through hole is formed in the heat dissipating component The at least one through hole has a first opening and a second opening, the first opening communicates with the at least one heat convection passage, and the second opening of the at least one through hole is located between the lower end surface and the intermediate position, and the upper portion There is no second opening of the through hole between the end surface and the intermediate position, so that the at least one heat convection passage communicates with the outside between the upper end surface and the intermediate position, thereby allowing the heat dissipating component to convect naturally It can quickly replenish enough cold air and the gas can flow smoothly upwards. The heat dissipating component having a heat convection passage according to claim 1, wherein the heat dissipating component is continuously spaced apart from the plurality of heat convection passages, and each of the heat convection passages penetrates the upper end surface and the lower end surface. The heat dissipating component having a heat convection passage according to claim 1, wherein the number of the through holes is 10,000 to 20,000 pieces per square meter. The heat dissipating component having a heat convection passage according to any one of claims 1 to 3, wherein the heat convection passage is a groove, and the groove is from the first surface to the foregoing The two surface directions are formed by recesses. The heat dissipating component having a heat convection passage according to claim 4, wherein the heat dissipating component is covered with a heat absorbing coating on an inner surface of the recess to absorb thermal energy of the heat source. An electronic device having a heat convection passage, which is a heat dissipating member having a heat convection passage according to any one of claims 1 to 5, wherein the electronic device has the heat dissipating member. A heat dissipation method for an electronic device, which uses the heat dissipation element having a heat convection passage according to any one of claims 1 to 5, comprising the following steps: The first surface of the heat dissipating component contacts the electronic device, and the height position of the upper end surface of the heat dissipating component is relatively higher than the lower end surface, so that the at least one heat convection passage of the heat dissipating component has an angle with a horizontal plane When the electronic device generates thermal energy, the heat dissipating component introduces a fluid into the at least one heat convection passage from the lower end surface and the at least one through hole, and the fluid discharges the heat energy of the heat source through the upper end surface. The component, thereby generating a chimney effect and dissipating heat. The method of dissipating heat of an electronic device according to claim 7, wherein the included angle is 90°.