TWI550683B - Fluid supply pipe device using for wet bench tank - Google Patents

Description

Inlet line device for wet process tank

BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to an infusion line device, and more particularly to an infusion line device for a wet process tank.

In the wet process of semiconductor, since a plurality of wafers (such as 9 to 50 sheets) are placed together in a wet process tank by a batch production method, the flow field design of the internal pipeline of the wet process tank is The key to affecting semiconductor wet processes.

Referring to FIG. 1 , a perspective view of a conventional wet processing tank 100 and an inlet line assembly 140 is shown. The wet processing tank 100 includes a tank body 110 and a cassette 120 disposed inside the tank body 110 for carrying a plurality of wafers 130. The liquid inlet line device 140 is in communication with the wet processing tank 100, and includes two pipelines 142 disposed at the bottom of the tank body 110. Each of the pipelines 142 has a plurality of openings 1422 facing the cassette 120 for The process liquid is introduced into the interior of the tank 110. However, since the pipelines 142 are disposed on opposite sides of the bottom of the tank body 110, there is a distance from the cassette 120, so that the pipelines 142 are close to the flow field at the outermost position of the two ends of the tank body 110. The flow field is the strongest, and the flow field at the center of the cassette 120 of the wafer 130 in which the waiting process is placed is the weakest, thereby causing the wafers 130 to have a faster outermost etching reaction rate at both ends of the groove body 110, at the center. The etching reaction rate is slower.

In view of this, it is necessary to propose a new type of liquid inlet pipe device, by which When the liquid inlet conduit device transfers the process liquid into the wet processing tank, it can increase the flow field flow rate in the wet processing tank corresponding to the position where the wafer is placed, so that the wafer has uniformity in the wet processing tank. Process response rate.

In order to solve the above problems of the prior art, an object of the present invention is to provide a liquid inlet line device for a wet process tank, wherein a plurality of wafers are correspondingly disposed by placing a liquid inlet pipe in the wet process tank. Position to increase the flow field flow rate in the wet process tank corresponding to the location at which the wafers are placed. Furthermore, by adding at least one shunt box to improve the uniformity of the flow field distribution of the process liquid in the wet processing tank, the process reaction of the plurality of wafers can be more uniform to improve the uniformity of the wafer after etching. .

In order to achieve the above object, the present invention provides a liquid inlet pipe device for a wet process tank, the wet process tank comprising a tank body and a cassette, the cassette being disposed inside the tank body, and comprising a plurality of a card slot arranged in a direction for placing a plurality of wafers, the liquid inlet line device comprising at least one first pipe, the at least one first pipe having a plurality of openings facing the cassette, wherein the at least one The first conduit is disposed at the bottom of the tank and below the cassette, and the at least one first conduit passes under each of the slots of the cartridge.

In a preferred embodiment of the present invention, the extending direction of the at least one first conduit is parallel to the first direction.

In a preferred embodiment of the present invention, the liquid inlet conduit device further comprises at least one shunt box disposed below the cassette and enclosing the at least one first tube therein, the at least one shunt The box forms a plurality of through holes on one side facing the cassette.

In one of the preferred embodiments of the present invention, on the at least one first conduit At least one of the openings is formed at a first position corresponding to the two adjacent slots of the cassette.

In a preferred embodiment of the present invention, the first position is the center of the two adjacent card slots of the cassette.

In a preferred embodiment of the present invention, the inlet conduit means further includes a pair of second conduits disposed at the bottom of the tank and located on opposite sides of the cassette.

In a preferred embodiment of the invention, the pair of second conduits extend in a direction parallel to the direction of extension of the at least one first conduit.

In a preferred embodiment of the present invention, at least one of the through holes is formed in the first position of the at least one shunt box corresponding to the two adjacent card slots of the cassette.

In a preferred embodiment of the present invention, the first position is the center of the two adjacent card slots of the cassette.

In a preferred embodiment of the invention, the inlet conduit means further includes a pair of second conduits disposed at the bottom of the housing and located on opposite sides of the cartridge.

In a preferred embodiment of the invention, the pair of second conduits extend in a direction parallel to the direction of extension of the at least one first conduit.

100, 200, 300, 400‧‧‧ Wet groove

110, 210, 310, 410‧‧‧

120, 220, 320, 420‧‧‧ Carl

130, 230, 330, 430‧‧‧ wafers

140, 240, 340, 440 ‧ ‧ inlet piping

142‧‧‧ pipeline

222, 322, 422‧‧‧ card slots

242, 342, 442‧‧‧ first pipeline

1422, 2422, 3422‧‧ hole

344, 444‧‧ ‧ shunt box

3442‧‧‧through hole

446‧‧‧Second line

X‧‧‧ first direction

A‧‧‧ corresponds to the part of Figure 2C

B‧‧‧ corresponds to the part of Figure 3C

P‧‧‧ first position

Figure 1 shows a perspective view of a conventional wet process tank and inlet line arrangement.

Fig. 2A is a perspective perspective view showing a wet process tank and a liquid inlet line device according to a first embodiment of the present invention.

Fig. 2B is a top perspective view showing the wet process tank and the inlet piping apparatus according to the first embodiment of the present invention.

Fig. 2C is an enlarged view showing a portion A in Fig. 2B.

Fig. 3A is a perspective perspective view showing a wet process tank and a liquid inlet line device according to a second embodiment of the present invention.

Fig. 3B is a top perspective view showing a wet process tank and a liquid inlet line device according to a second embodiment of the present invention.

Fig. 3C shows an enlarged view of a portion B in Fig. 3B.

Fig. 4 is a perspective perspective view showing a wet process tank and a liquid inlet line device according to a third embodiment of the present invention.

The above and other objects, features and advantages of the present invention will become more <RTIgt;

Referring to Fig. 2A, there is shown a perspective perspective view of a wet process tank 200 and a feed line assembly 240 in accordance with a first embodiment of the present invention. The wet processing tank 200 includes a tank body 210 and a cassette 220. The cassette 220 is disposed inside the trough body 210 and includes a plurality of card slots 222 arranged in a first direction X (refer to FIG. 2B). Each card slot 222 is used for placing a wafer 230. The liquid inlet line device 240 is configured to communicate with the wet processing tank 200, and includes a pair of first conduits 242 disposed and extending through the bottom of the tank body 210, wherein in the embodiment the first conduit 242 is The number is only an example and is not limited to this. Each of the first conduits 242 has a plurality of openings 2422 oriented toward the latch 220 and aligned along the first direction X for respectively inputting process liquid into the interior of the housing 210.

As shown in FIG. 2A, the pair of first conduits 242 pass under each of the slots 222 of the cassette 220, so that the pair of first conduits 240 of the inlet conduit assembly 240 will process the liquid When the opening 2422 is injected into the wet processing tank, the flow field flow rate corresponding to the position where the wafers 230 are placed in the wet processing tank 240 can be increased, thereby increasing the process reaction rate of the wafers 230.

Please refer to FIG. 2B and FIG. 2C. FIG. 2B shows a top perspective view of the wet processing tank 200 and the liquid inlet line device 240 according to the first embodiment of the present invention, and FIG. 2C shows the second portion. A magnified view of Part A of the figure. As shown in FIG. 2B, the cassette 220 includes a plurality of sets of left and right symmetrical card slots 222, each set of card slots 222 for placing a wafer 230 (as shown in FIG. 2A), and the card slots 222 are arranged. The first direction X is parallel to the direction in which the pair of first conduits 240 extend. Furthermore, in the portion A shown in FIG. 2C, at least a first position P between the pair of adjacent card slots 222 of the pair of first tubes 240 corresponding to the cassette 220 is formed. One of the openings 2422. Preferably, the first position P is located between the two adjacent slots 222 of the cassette 220. Therefore, when a wafer is placed on each of the card slots 222, the opening 2422 at the first position P corresponds to the space between the two wafers, thereby ensuring that the process liquid can be effectively distributed between any two wafers. The gap.

Referring to Fig. 3A, there is shown a perspective perspective view of a wet processing tank 300 and a liquid inlet line unit 340 according to a second embodiment of the present invention. The wet process tank 300 includes a tank body 310 and a cassette 320. The cassette 320 is disposed inside the tank 310 and includes a plurality of card slots 322 arranged in a first direction X (refer to FIG. 3B). Each card slot 322 is used for placing a wafer 330. The inlet line device 340 is configured to communicate with the wet process tank 300 and includes a pair of first lines 342 and a splitter box 344. The pair of first conduits 342 are disposed and extend through the bottom of the tank 310, and the number of the first conduits 342 in this embodiment is by way of example only, and is not limited thereto. Similarly, the number of the shunt boxes 344 in this embodiment is merely an example, and is not limited thereto. The shunt box 344 is set Below the cassette 320 and the pair of first tubes 342 are wrapped therein.

As shown in FIG. 3A, each of the first conduits 342 has a plurality of openings 3422 oriented toward the cassette 320 and aligned along the first direction X, and the shunt box 344 forms a plurality of faces facing the cassette 320. Through holes 3442. In the second embodiment of the present invention, the liquid inlet conduit means 340 respectively inputs the process liquid into the splitter box 344 by the openings 3422 of the pair of first conduits 342, and then by the splitting The through holes 3442 of the cartridge 344 respectively circulate the process liquid into the interior of the tank 310.

Please refer to FIG. 3B and FIG. 3C. FIG. 3B shows a top perspective view of the wet processing tank 300 and the liquid inlet line device 340 according to the second embodiment of the present invention, and FIG. 3C shows the third portion. An enlarged view of part B of the figure. As shown in FIG. 3B, the cassette 320 includes a plurality of sets of left and right symmetrical card slots 322, each set of card slots 322 for placing a wafer 330 (as shown in FIG. 3A), and the card slots 322 are arranged. The first direction X is parallel to the direction in which the pair of first conduits 340 extend. Moreover, since the shunt box 344 covers the pair of first tubes 342 therein, the shunt box 344 can only be visually observed when viewed from above the wet processing tank 300. In addition, in the portion B shown in FIG. 3C, a row is formed at a first position P between the two adjacent card slots 322 of the pair of shunt boxes 344 corresponding to the cassette 320. Hole 3442. Preferably, the first position P is located between the adjacent card slots 322 of the cassette 320. For example, when the wet processing tank 300 is a wet process for a 12-inch wafer, one of the rows of through-holes 3442 located at the first position P is adjacent to the other row and is also at the first position P. The through holes 3442 are 10 mm apart. Alternatively, when the wet processing tank 300 is a wet process for an 8-inch wafer, one of the rows of through holes 3442 at the first position P is adjacent to the other row and is also a through hole at the first position P. 3442 is 6.35 mm apart. Therefore, by the above design, when a wafer is placed on each of the card slots 322, the row of through holes 3442 located at the first position P It corresponds to the space between the two wafers, thereby ensuring that the process liquid can be effectively distributed in the gap between any two wafers. Moreover, since the shunt box 344 is added, the uniformity of the flow field distribution of the process liquid in the wet processing tank 300 is improved, and the process response of the plurality of wafers 330 is more uniform to improve the etching of the plurality of wafers 330. Uniformity.

Referring to Fig. 4, there is shown a perspective perspective view of a wet processing bath 400 and a liquid inlet line assembly 440 according to a third embodiment of the present invention. The wet process tank 400 includes a tank body 410 and a cassette 420. The cassette 420 is disposed inside the slot 410 and includes a plurality of card slots 422 arranged in a first direction X. Each card slot 422 is used to place a wafer 430. The liquid inlet line device 440 is configured to communicate with the wet processing tank 400, and includes a pair of first tubes 442, a shunt box 444, and a pair of second tubes 446, wherein the pair of first tubes 442 and The configuration and function of the shunt box 444 are similar to the pair of first lines 342 and the shunt box 344 of the liquid inlet line device 340 of the second embodiment of the present invention, and details are not described herein.

As shown in FIG. 4, the pair of second conduits 446 of the inlet conduit means 440 are disposed at the bottom of the tank 410 and are respectively located on opposite sides of the cassette 420, and the pair of second conduits 446 The direction of extension is parallel to the direction of extension of the pair of first conduits 442. The process liquid is introduced into the two corner regions of the wet processing tank 400 by the pair of second conduits 446, so that the liquid flow rate of the process liquid in the wet processing tank 400 is more uniform, and the plurality of wafers 430 are made. The process response is more uniform.

In summary, the position of the plurality of wafers is correspondingly placed in the wet processing tank by placing the liquid inlet line of the liquid inlet line device to raise the position corresponding to the wafers in the wet processing tank. Flow field flow rate. Furthermore, by adding at least one shunt box to improve the uniformity of the flow field distribution of the process liquid in the wet processing tank, the process reaction of the plurality of wafers can be further improved. Uniformity is added to improve the uniformity of the wafers after etching.

While the invention has been described above in terms of the preferred embodiments, the invention is not intended to limit the invention, and the invention may be practiced without departing from the spirit and scope of the invention. The scope of protection of the present invention is therefore defined by the scope of the appended claims.

200‧‧‧ Wet process slot

210‧‧‧

220‧‧‧Carmen

230‧‧‧ wafer

240‧‧‧Inlet line installation

242‧‧‧First line

2422‧‧‧Opening

Claims (11)

An inlet pipe device for a wet process tank, the wet process tank comprising a tank body and a cassette, the cassette being disposed inside the tank body and comprising a plurality of card slots arranged in a first direction, Depositing a plurality of wafers, the inlet conduit means comprising at least one first conduit, the at least one first conduit having a plurality of openings facing the cassette, wherein the at least one first conduit is disposed in the slot The bottom of the body is located below the inside of the cassette, and the at least one first line passes under each of the slots of the cassette. The liquid inlet line device of claim 1, wherein the at least one first pipe extends in a direction parallel to the first direction. The liquid inlet line device of claim 1, wherein the liquid inlet line device further comprises at least one shunt box disposed below the cassette and enclosing the at least one first line therein The at least one shunt box forms a plurality of through holes on one side facing the cassette. The liquid inlet line device according to any one of the preceding claims, wherein the at least one first line corresponds to a first position of the two adjacent card slots of the cassette At least one of the openings is formed. The liquid inlet line device of claim 4, wherein the first position is the center of the two adjacent card slots of the cassette. The liquid inlet line device of claim 4, wherein the liquid inlet line device further comprises a pair of second tubes disposed at the bottom of the tank body and respectively located on opposite sides of the cassette. The liquid inlet piping device of claim 6, wherein the pair of second conduits extend in a direction parallel to an extending direction of the at least one first conduit. The liquid inlet line device according to any one of claims 1 to 3, wherein at the first position of the at least one shunt box corresponding to the two adjacent card slots of the cassette At least one through hole is formed. The liquid inlet line device of claim 8, wherein the first position is the center of the two adjacent card slots of the cassette. The liquid inlet line device of claim 8, wherein the liquid inlet line device further comprises a pair of second tubes disposed at the bottom of the tank body and located on opposite sides of the cassette. The liquid inlet piping device of claim 10, wherein the pair of second conduits extend in a direction parallel to an extending direction of the at least one first conduit.