TWI549881B - Substrate storage container and its manufacturing method - Google Patents
Substrate storage container and its manufacturing method Download PDFInfo
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- TWI549881B TWI549881B TW103139487A TW103139487A TWI549881B TW I549881 B TWI549881 B TW I549881B TW 103139487 A TW103139487 A TW 103139487A TW 103139487 A TW103139487 A TW 103139487A TW I549881 B TWI549881 B TW I549881B
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Description
本發明係有關於一種基板收納容器及其製作方法,特別係指一種藉由環繞其盒體內周緣所設之C型齒肋部,配合其特殊之縱、橫向比的結構設計,令收納於其內之薄化基板能夠更平坦,不會因重力而產生過大之向下、向外垂量或翹曲量的基板收納容器。 The present invention relates to a substrate storage container and a method of fabricating the same, and particularly to a C-shaped rib portion provided around a circumference of a casing thereof, and a special longitudinal and lateral ratio of the structural design thereof, so as to be accommodated therein The thinned substrate inside can be made flatter, and there is no substrate storage container that is excessively downward, outwardly or warped due to gravity.
近年來,電子相關產業的高度發展以及人們對電子產品輕薄短小的要求日益增加,故而作為積體電路基礎的半導體製程也越趨重要。一般半導體晶圓片在成為可用之積體電路(IC)之前,必須經過如擴散、印刻、蝕刻、光罩、或讀取晶圓片刻號等近百道製程,且目前積體電路製程已進入深次微米的階段,故環境潔度的要求更為嚴苛,但若要將整個工作環境的潔淨度提昇到較高的等級,則投入的成本將會暴增且效益不高。因此,一般係於製程設備週圍設一潔淨度較高之生產空間,而整體之工作環境則採用一般潔淨度即可。故必須使用內部可承載複數個晶圓片(wafer)之晶圓盒(即SMIF Pod、FOSB或 FOUP)來進行晶圓片在各生產區塊之工作站、儲存櫃或晶圓製程所需之高潔淨度與一般工作環境之一般潔淨度之間移動、儲存與傳送的工作,以進行各晶圓片在半導體各製作步驟所需之相關製程。 In recent years, the high development of electronic related industries and the increasing demand for light and thin electronic products have become increasingly important. Therefore, the semiconductor process as the basis of integrated circuits has become more and more important. Generally, semiconductor wafers must pass through nearly 100 processes such as diffusion, imprinting, etching, reticle, or wafer lithography before they become usable integrated circuits (ICs), and the current integrated circuit process has entered deep. In the sub-micron stage, the requirements for environmental cleanliness are more stringent, but if the cleanliness of the entire working environment is to be upgraded to a higher level, the cost of input will increase and the benefits will not be high. Therefore, it is generally necessary to set a clean production space around the process equipment, and the overall working environment can be generally clean. Therefore, it is necessary to use a wafer cassette that can carry a plurality of wafers (ie SMIF Pod, FOSB or FOUP) to move, store and transfer wafers between the high cleanliness required for workstations, storage cabinets or wafer processes in each production block and the general cleanliness of the general working environment for wafers The film is related to the process required for each fabrication step of the semiconductor.
按,一般習用之前開式晶圓盒,請參閱第1圖所示之剖面,其盒體10係由兩側壁11、12,連結該兩側壁的一後壁13,與一上壁及一下壁(未標示)所構成者,以形成一容置空間而收納基板20(以虛線表示者),且在該盒體10之前方設有一開口(未標示)以供基板進出該盒體10,並在對應該盒體10之開口設有一門板17以閉合該盒體10之開口並使該盒體10內部保持適當之氣密性,且在該側壁11、12內表面分別設有複數片相互平行且對向之側向齒肋片110、120,而在後壁13的兩側分別設有複數片相互平行之後向齒肋片131、132,藉由四個位置之齒肋片以供每塊基板20可穩固置放於該晶圓盒體內部。 According to the conventional open-type wafer cassette, please refer to the cross-section shown in Fig. 1. The casing 10 is composed of two side walls 11, 12, a rear wall 13 connecting the two side walls, and an upper wall and a lower wall. (not shown), the substrate 20 is formed to form an accommodation space (indicated by a broken line), and an opening (not shown) is provided in front of the casing 10 for the substrate to enter and exit the casing 10, and A door panel 17 is provided in the opening corresponding to the casing 10 to close the opening of the casing 10 and maintain proper airtightness inside the casing 10. The inner surfaces of the side walls 11 and 12 are respectively provided with a plurality of parallel plates. And facing the lateral tooth ribs 110, 120, and on the two sides of the rear wall 13 are respectively provided with a plurality of mutually parallel rearward tooth ribs 131, 132, with four positions of the tooth ribs for each block The substrate 20 can be stably placed inside the wafer cassette.
然,IC的矽晶圓基板至今往逐漸薄型化之趨勢發展,其厚度由0.7厘米逐漸縮小至200微米或甚至更小,而在晶圓盒內卡設薄化基板20的齒肋片間之溝槽間距(約5mm)不變下,請再參閱第1圖所示,薄化基板20會因該等齒肋片110、120、131、132的結構,而使該薄化基板20產生向下或向外之垂量或翹曲量過大,導致在製程中取放基板20之機械手臂,容易碰撞到該基板20,而造成該基板20破損,亦即薄化晶圓片容易因垂量過大而被機械手臂取放行程所干涉,進而使破片的風險大 增。 However, the silicon wafer substrate of the IC has been gradually thinned, and its thickness has been gradually reduced from 0.7 cm to 200 μm or even smaller, and the thin ribs of the thinned substrate 20 are interposed between the wafer cassettes. When the groove pitch (about 5 mm) is constant, please refer to FIG. 1 again, the thinned substrate 20 is caused to have the thinned substrate 20 due to the structure of the tooth ribs 110, 120, 131, and 132. The amount of downward or outward sag or warpage is too large, causing the robot arm of the substrate 20 to be picked up and dropped during the process, and the substrate 20 is easily collided, and the substrate 20 is damaged, that is, the thinned wafer is easily broken. Excessively interfered by the robot arm's pick and place stroke, which makes the risk of fragmentation large increase.
由此可見,上述業界習用前開式晶圓盒之齒肋結構仍有諸多缺失,實非一良善之設計者,而亟待加以改良。 It can be seen that there are still many missing rib structures in the above-mentioned industry-prepared open wafer cassettes, which is not a good designer and needs to be improved.
有鑑於此,本案發明人本於多年從事相關產品之製造開發與設計經驗,針對上述之目標,詳加設計與審慎評估後,終得一確具實用性之本發明。 In view of this, the inventor of the present invention has been engaged in the manufacturing development and design experience of related products for many years. After detailed design and careful evaluation of the above objectives, the present invention has finally become practical.
本發明之主要目的,在於提供一種基板收納容器及其製作方法,係藉由環繞其盒體內周緣之多個垂直排列之C型齒肋部的設置,並配合此每一C型齒肋部具有特殊之縱、橫向比的結構設計,令收納於其內之薄化基板能夠更平坦,且所產生之向下或向外的垂量或翹曲量不超過C型齒肋部間的間距,據此大幅降低薄化基板破片的風險。 The main object of the present invention is to provide a substrate storage container and a manufacturing method thereof, which are provided by a plurality of vertically arranged C-shaped ribs surrounding a circumference of a casing, and each of the C-shaped ribs is provided The special longitudinal and lateral ratio structural design enables the thinned substrate contained therein to be flatter, and the downward or outward amount of sag or warpage generated does not exceed the spacing between the C-shaped ribs. Accordingly, the risk of thinning the substrate fragments is greatly reduced.
為達上述目的,本發明所揭示之基板收納容器及其製作方法,主要包括有:一本體、一門體及複數齒肋部;其中,該本體具有一容置空間與一開口,該容置空間用以收納多個薄化基板,而此薄化基板之厚度至多達200微米;該門體係用以蓋合該本體之該開口,藉以在該容置空間內形成一適當之氣密性;該些齒肋部係環繞該本體之內周緣而呈現C型開口且齒肋部之間係大致以垂直間隔相互對齊而設立者,藉以水平支撐該些薄化基板,而該每一齒肋部在靠近該C型開口的兩側端 各設有一往該容置空間內突伸之延伸部,該每一齒肋部具有一自該延伸部最外緣至該齒肋部最內緣的縱向延伸長;且該每一齒肋部具有一較窄之橫向開口寬;其中,該每一齒肋部具有一縱向比介於0.85與1.0之間,而該縱向比係定義為該齒肋部之縱向延伸長與該薄化基板之直徑的比值,藉此確保該薄化基板向外之翹曲量不超過該些齒肋部之間垂直間隔的間距;其中,該每一齒肋部具有一橫向比介於0.6與0.7之間,而該橫向比係定義為該齒肋部之較窄之橫向開口寬與該薄化基板之直徑的比值,藉此確保該薄化基板向內(或向下)之翹曲量不超過該些齒肋部之間垂直間隔的間距。 In order to achieve the above object, the substrate storage container and the manufacturing method thereof include: a body, a door body and a plurality of tooth ribs; wherein the body has an accommodating space and an opening, the accommodating space For accommodating a plurality of thinned substrates, wherein the thickness of the thinned substrate is up to 200 micrometers; the door system is configured to cover the opening of the body, thereby forming a proper airtightness in the accommodating space; The ribs are formed around the inner circumference of the body to present a C-shaped opening and the ribs are substantially aligned with each other at a vertical interval, thereby horizontally supporting the thinned substrates, and each of the ribs is Near the two ends of the C-shaped opening Each of the tooth ribs has a longitudinal extension from an outermost edge of the extending portion to an innermost edge of the tooth rib; and each of the tooth ribs has a length extending into the accommodating space. a narrow lateral opening width; wherein each of the tooth ribs has a longitudinal ratio between 0.85 and 1.0, and the longitudinal ratio is defined as a longitudinal extension of the tooth rib and a diameter of the thinned substrate a ratio, thereby ensuring that the outwardly warped amount of the thinned substrate does not exceed a vertical spacing between the rib portions; wherein each of the rib portions has a lateral ratio between 0.6 and 0.7, The lateral ratio is defined as the ratio of the narrow lateral opening width of the tooth rib to the diameter of the thinned substrate, thereby ensuring that the amount of warpage of the thinned substrate inward (or downward) does not exceed The spacing between the ribs is vertically spaced.
為便 貴審查委員能對本發明之目的、形狀、構造裝置特徵及其功效,做更進一步之認識與瞭解,茲舉實施例配合圖式,詳細說明如下: For the sake of the examination, the reviewer can make a further understanding and understanding of the purpose, shape, structure and function of the present invention. The embodiment is combined with the diagram and is described in detail as follows:
10‧‧‧盒體 10‧‧‧Box
11、12‧‧‧側壁 11, 12‧‧‧ side wall
13‧‧‧後壁 13‧‧‧ Back wall
14‧‧‧上壁 14‧‧‧上壁
15‧‧‧下壁 15‧‧‧ Lower wall
16‧‧‧開口 16‧‧‧ openings
17‧‧‧門板 17‧‧‧ Door panel
110、120‧‧‧側向齒肋片 110, 120‧‧‧ lateral ribs
131、132‧‧‧後向齒肋片 131, 132‧‧‧ rearward ribs
30‧‧‧本體 30‧‧‧Ontology
40‧‧‧門體 40‧‧‧
50‧‧‧齒肋部 50‧‧‧ tooth ribs
31、32‧‧‧二側壁 31, 32‧‧‧ two side walls
33‧‧‧頂面 33‧‧‧ top surface
34‧‧‧底面 34‧‧‧ bottom
35‧‧‧開口 35‧‧‧ openings
36‧‧‧後壁 36‧‧‧Back wall
37‧‧‧支撐肋 37‧‧‧Support ribs
38‧‧‧容置空間 38‧‧‧ accommodating space
20‧‧‧基板 20‧‧‧Substrate
41‧‧‧扣合機構 41‧‧‧Withholding mechanism
51‧‧‧凹陷段差 51‧‧‧ Depression
52‧‧‧延伸部 52‧‧‧Extension
WR‧‧‧橫向突伸長 W R ‧‧‧lateral elongation
L‧‧‧縱向延伸長 L‧‧‧Longitudinal extension
WN‧‧‧較窄橫向開口寬 W N ‧‧‧ narrower lateral opening width
D‧‧‧薄化基板之直徑 D‧‧‧Thin diameter of thinned substrate
T‧‧‧厚度 T‧‧‧ thickness
301‧‧‧進氣埠 301‧‧‧Intake 埠
302‧‧‧出氣埠 302‧‧‧Exhaust gas
340‧‧‧運動耦合部 340‧‧‧Motion Coupling
341‧‧‧凹接部 341‧‧‧ recessed joint
360‧‧‧導槽 360‧‧‧guide
361‧‧‧提把部 361‧‧ ‧
第1圖為習用基板收納容器之俯視剖面圖。 Fig. 1 is a plan sectional view showing a conventional substrate storage container.
第2圖為本發明基板收納容器及其製作方法之立體外觀圖。 Fig. 2 is a perspective view showing the substrate storage container of the present invention and a method of manufacturing the same.
第3圖為本發明基板收納容器及其製作方法之使用示意圖。 Fig. 3 is a schematic view showing the use of the substrate storage container of the present invention and a method of manufacturing the same.
第4圖為本發明基板收納容器及其製作方法之本體與齒肋部之示意圖。 Fig. 4 is a schematic view showing the main body and the rib portion of the substrate storage container and the manufacturing method thereof according to the present invention.
第5圖為本發明基板收納容器及其製作方法之齒肋部縱向比之示意圖。 Fig. 5 is a schematic view showing the longitudinal ratio of the rib portions of the substrate storage container and the manufacturing method thereof according to the present invention.
第6圖為本發明基板收納容器及其製作方法之齒肋部橫向比之示意圖。 Fig. 6 is a schematic view showing the lateral ratio of the rib portion of the substrate storage container and the manufacturing method thereof according to the present invention.
第7圖為本發明基板收納容器及其製作方法之齒肋部(尚未接合於支撐肋之前)之外觀示意圖。 Fig. 7 is a perspective view showing the appearance of a tooth rib portion (before joining the support rib) of the substrate storage container of the present invention and the manufacturing method thereof.
第8圖為本發明基板收納容器及其製作方法之複數齒肋部(尚未接合於支撐肋之前)之示意圖。 Fig. 8 is a schematic view showing a plurality of tooth ribs (before being joined to the support ribs) of the substrate storage container of the present invention and the method of manufacturing the same.
第9圖為本發明基板收納容器及其製作方法之支撐肋與齒肋部之結合示意圖。 Fig. 9 is a schematic view showing the combination of the support rib and the tooth rib of the substrate storage container and the manufacturing method thereof according to the present invention.
第10A圖為本發明基板收納容器之可拆卸式後壁組裝過程中的示意圖。 Fig. 10A is a schematic view showing the detachable rear wall assembly process of the substrate storage container of the present invention.
第10B圖為第10A圖組裝過程中本體的示意圖。 Figure 10B is a schematic view of the body during assembly of Figure 10A.
第10C圖為兩個基板收納容器堆疊的示意圖。 Figure 10C is a schematic view showing the stacking of two substrate storage containers.
第11圖為本發明基板收納容器底部具有運動耦合部的示意圖。 Fig. 11 is a schematic view showing a motion coupling portion at the bottom of the substrate storage container of the present invention.
根據本發明的第一實施例,乃有關一種「基板收納容器及其製作方法」,請參閱第2、3、4圖所示,此基板收納容器,係用以收納厚度不超過200微米之薄化基板20,其主要包括有:一本體30、一門體40(虛線表示)及複數齒肋部50。 According to a first embodiment of the present invention, there is provided a "substrate storage container and a method of manufacturing the same", as shown in Figures 2, 3 and 4, the substrate storage container is for storing a thickness of not more than 200 μm. The substrate 20 mainly includes a body 30, a door body 40 (indicated by a broken line), and a plurality of tooth ribs 50.
其中,在本實施例中,該本體30可為一底開式或 前開式晶圓盒(Front Opening Unified Pod,簡稱FOUP)之中空盒體,為了說明起見,係以前開式晶圓盒為主,此本體30係由一對左右側壁31、32及相鄰該對側壁31、32之相向一頂面33及一底面34所組成,並於一側邊形成一前向之開口35,而相對該開口35之另一面形成一後壁36以連接該對左右側壁31、32,且在該本體30之兩側壁31、32分別設置彼此垂直對齊之複數對左右支撐肋37(如第9圖所示),該本體30內具有一容置空間38,經由該開口35以將多個一般或薄化基板20(如:矽晶圓)水平置入該容置空間38中,使該容置空間38水平收納多個垂直排列之基板20。 In this embodiment, the body 30 can be a bottom open type or The hollow box of the Front Opening Unified Pod (FOUP) is mainly a front open wafer cassette for the sake of explanation. The body 30 is composed of a pair of left and right side walls 31, 32 and adjacent thereto. The side walls 31, 32 are formed to face a top surface 33 and a bottom surface 34, and a forward opening 35 is formed on one side, and a rear wall 36 is formed on the other side of the opening 35 to connect the pair of left and right side walls. 31, 32, and the two side walls 31, 32 of the body 30 are respectively disposed with a plurality of pairs of left and right support ribs 37 (as shown in FIG. 9) vertically aligned with each other, and the body 30 has an accommodation space 38 through the opening 35, a plurality of general or thinned substrates 20 (eg, germanium wafers) are horizontally placed into the accommodating space 38, and the accommodating space 38 horizontally accommodates a plurality of vertically aligned substrates 20.
請再參閱第2圖,該門體40係用以蓋合該本體30之開口35,並藉由其扣合機構41(虛線表示)之閂鎖機制以將該門體40緊密扣合該開口35,使該容置空間38呈密封狀態,確保外界之微塵不會進入,藉以保持收納薄化基板20之該容置空間38內所需的潔淨度。 Referring to FIG. 2 again, the door body 40 is used to cover the opening 35 of the body 30, and the latching mechanism of the fastening mechanism 41 (shown by a broken line) is used to fasten the door body 40 to the opening. 35. The accommodating space 38 is sealed to ensure that the foreign dust does not enter, thereby maintaining the required cleanliness in the accommodating space 38 of the thinned substrate 20.
請再參閱第3圖,上述各齒肋部50外緣係環繞該本體30之整個內周緣且在其中央部位靠近該開口35而呈現C型開口,且各齒肋部50彼此間大致以垂直間隔相互對齊之,並連接在對應上述各對左右支撐肋37之上,也就是在每一水平位置上之齒肋部50搭配一對相對應之左右支撐肋37,其中在該每一齒肋部50的下表面凹設有一部份之凹陷段差51(如第7、8圖所示),使該每一齒肋部50於其兩側之特定水平位置之凹陷段差51 分別接合對應之該支撐肋37的上表面(如第9圖所示),藉以水平支撐該些薄化基板20。進一步在該每一齒肋部50靠近該C型開口的兩側端前沿各設有一往該容置空間38內突伸之延伸部52,如第4圖所示。該延伸部52最外緣具有一橫向突伸長WR,且該每一齒肋部50在其前沿開口處具有一較窄橫向開口寬WN,如第6圖所示。該每一齒肋部50具有一自該延伸部52最外緣至該齒肋部50最內緣的縱向延伸長L,如第5圖所示。此外,為避免齒肋部50與支撐肋37之間因高溫或撓曲而生斷裂之現象,亦可將兩者採以一體成形之結構設計。 Referring to FIG. 3 again, the outer edge of each of the tooth ribs 50 surrounds the entire inner circumference of the body 30 and presents a C-shaped opening near the opening 35 at a central portion thereof, and the respective tooth ribs 50 are substantially perpendicular to each other. The spacers are aligned with each other and connected to the pair of left and right support ribs 37 corresponding to the above, that is, the tooth ribs 50 at each horizontal position are matched with a pair of corresponding left and right support ribs 37, wherein each of the ribs The lower surface of the portion 50 is concavely provided with a portion of the recessed step 51 (as shown in FIGS. 7 and 8), so that the recessed step 51 of the specific horizontal position of each of the tooth ribs 50 is respectively engaged. The upper surface of the support rib 37 (as shown in FIG. 9) is used to horizontally support the thinned substrates 20. Further, an extension portion 52 projecting into the accommodating space 38 is disposed on each of the front edges of the two rib portions 50 adjacent to the C-shaped opening, as shown in FIG. 4. The outermost edge of the extension 52 has a lateral extension W R and the each tooth rib 50 has a narrower lateral opening width W N at its leading edge opening, as shown in FIG. Each of the tooth ribs 50 has a longitudinal extension L from the outermost edge of the extension 52 to the innermost edge of the tooth rib 50, as shown in FIG. In addition, in order to avoid the phenomenon that the tooth rib 50 and the support rib 37 are broken due to high temperature or deflection, the two may be designed to be integrally formed.
請再參閱第5圖,藉由在該每一齒肋部50左右側之延伸部52往外(即往開口方向)縱向突伸一特定長度(其與薄化基板20之直徑D相互平行),使得該每一齒肋部50具有一縱向比介於0.85與1.0之間,其中該縱向比係定義為該齒肋部50之縱向延伸長L與該薄化基板20之直徑D的比值,據此確保當該薄化基板20置於該齒肋部50時,其往外之翹曲量不超過該些齒肋部50之間垂直間隔的間距,其中該間距至少達20厘米。 Referring to FIG. 5 again, a specific length (which is parallel to the diameter D of the thinned substrate 20) is longitudinally protruded outward (ie, toward the opening direction) on the left and right extension portions 52 of each of the tooth ribs 50. Each of the tooth ribs 50 has a longitudinal ratio of between 0.85 and 1.0, wherein the longitudinal ratio is defined as the ratio of the longitudinal extension L of the tooth rib 50 to the diameter D of the thinned substrate 20, according to which It is ensured that when the thinned substrate 20 is placed on the tooth rib 50, the outward warpage amount does not exceed the pitch of the vertical spacing between the tooth ribs 50, wherein the pitch is at least 20 cm.
請再參閱第6圖,藉由在該每一齒肋部50左右側之延伸部52往內(對垂直於門體之基板中心軸線而言)橫向突伸一特定寬度WR,使得該每一齒肋部50具有一橫向比介於0.6與0.7之間,其中該橫向比係定義為該齒肋部50之較窄橫向開口寬WN與該薄化基板20直徑D的比值,據此確保該薄化基板20往內之翹曲量不超過該些齒肋部50之間垂直間隔的間距,其中該間距 至少達20厘米。 Referring to FIG. 6, the specific width W R is laterally protruded inwardly from the extending portion 52 on the left and right sides of each of the tooth ribs 50 (for the central axis of the substrate perpendicular to the door body), so that each The tooth rib 50 has a lateral ratio of between 0.6 and 0.7, wherein the lateral ratio is defined as the ratio of the narrower lateral opening width W N of the tooth rib 50 to the diameter D of the thinned substrate 20, thereby ensuring The amount of warpage of the thinned substrate 20 inwardly does not exceed the spacing of the vertical spacing between the rib portions 50, wherein the pitch is at least 20 cm.
藉上述構件之組成,使用時,透過該每一齒肋部50具有一縱向比介於0.85與1.0之間或且同時具有一橫向比介於0.6與0.7之間的尺寸設計,令收納於該本體30之該容置空間38內之薄化基板20能夠更平坦,不會產生過大之下垂量,例如:不超過該些齒肋部50之間垂直間距,藉以避免因下垂量過大,導致取放薄化基板20之機械手臂,容易碰撞到該薄化基板20之下垂部分,而造成該薄化基板20之破損。 By using the composition of the above components, in use, each of the tooth ribs 50 has a dimension ratio between 0.85 and 1.0 or a lateral ratio of between 0.6 and 0.7, so as to be accommodated therein. The thinned substrate 20 in the accommodating space 38 of the body 30 can be flatter without excessive sag, for example, does not exceed the vertical spacing between the ribs 50 to avoid excessive sag. The robot arm of the thinned substrate 20 easily collides with the drooping portion of the thinned substrate 20, causing damage to the thinned substrate 20.
請再參閱第7圖所示,該每一齒肋部50之整體內周緣具有大致相同之厚度T,不同於習知齒肋之厚度在其中央部位漸薄的結構,可有效強化其水平支撐剛性。 Referring to FIG. 7 again, the inner circumference of each of the tooth ribs 50 has substantially the same thickness T, which is different from the structure in which the thickness of the conventional tooth rib is gradually thinned at the center portion thereof, and the horizontal support can be effectively strengthened. rigidity.
請參閱第10A-10B圖,該本體30之後壁36係為可拆卸式結構,藉由在該左右側壁31、32之側端設有由一對導軌所構成之導槽360,以供該後壁36可拆卸式置入或移除,進而使該基板收納容器之本體30於清洗烘乾時,藉移除該後壁36而形成相對該本體30之該開口35的另一開口,致清洗液更易排除而不殘留於內,且烘乾之熱氣可於該前開式容器內快速對流。此外,請參閱第10C圖,下方基板收納容器之後壁36上緣設有一提把部361,用以對應上方基板收納容器之底面34所設的一凹接部341,而可將多個基板收納容器以垂直方向堆疊置放。此外,可拆卸式後壁36可使用透明材質,以利操作員在進行清洗烘乾該本體30時,可隨時觀察之。 Referring to FIGS. 10A-10B, the rear wall 36 of the body 30 is of a detachable structure, and a guide groove 360 formed by a pair of guide rails is provided at the side ends of the left and right side walls 31, 32 for the rear. The wall 36 is detachably inserted or removed, so that the body 30 of the substrate storage container is removed from the rear wall 36 to form another opening relative to the opening 35 of the body 30 during cleaning and drying. The liquid is more easily removed without remaining in it, and the hot air that is dried can be quickly convected in the front open container. In addition, referring to FIG. 10C, a lower portion of the lower substrate storage container 36 is provided with a handle portion 361 for receiving a plurality of substrates corresponding to a recessed portion 341 provided on the bottom surface 34 of the upper substrate storage container. The containers are stacked in a vertical orientation. In addition, the detachable rear wall 36 can be made of a transparent material so that the operator can observe it at any time while cleaning and drying the body 30.
請再參閱第2、3、4圖所示,該本體30內可容置該些薄化基板30的數目不超過13,即相較於習知晶圓厚度300厘米且可收納25片之前開式晶圓盒而言,譬如可藉由抽調一半保留一半齒肋數的方式,藉以增大齒肋之間垂直間距,以此為例,則齒肋數為12或13,故可容置薄化基板的數目為12或13。 Referring to FIGS. 2, 3, and 4, the number of the thinned substrates 30 that can be accommodated in the body 30 is not more than 13, that is, compared with the conventional wafer thickness of 300 cm and can accommodate 25 pieces of open crystal. For the round box, for example, the vertical spacing between the ribs can be increased by half of the number of ribs remaining, for example, the number of ribs is 12 or 13, so that the thinned substrate can be accommodated. The number is 12 or 13.
請再參閱第2、3、4圖所示,該等齒肋部50之間垂直間距至少達20厘米,相同於上述薄化基板的數目不超過13的例子,譬如當抽調一半保留一半齒肋數的方式,則原來可水平容納25片之晶圓盒本有10厘米之齒肋間距,將增大為20厘米。 Referring to Figures 2, 3 and 4 again, the vertical spacing between the tooth ribs 50 is at least 20 cm, which is the same as the example in which the number of thinned substrates is not more than 13, for example, when half of the ribs are retained. The number of ways, the original 25-inch wafer cassette can be horizontally accommodated with a 10 cm rib pitch, which will increase to 20 cm.
請再參閱第2圖所示,該本體30內更進一步設有一進氣埠301及一出氣埠302,其中該進氣埠301與該出氣埠302鄰近該本體30之開口35,且分別相鄰該本體30之兩側壁32、31,可使清淨空氣藉由該進氣埠301而進入容置空間38且藉由該出氣埠302而使容置空間38之帶有微塵空氣排出,據此使該容置空間38中的空氣循環,以將該等薄化基板20表面上沾附微塵帶走。 Referring to FIG. 2 again, the body 30 is further provided with an air inlet 301 and an air outlet 302. The air inlet 301 and the air outlet 302 are adjacent to the opening 35 of the body 30, and are respectively adjacent to each other. The two side walls 32 and 31 of the main body 30 allow the clean air to enter the accommodating space 38 by the air intake 301, and the dust ventilating air of the accommodating space 38 is discharged by the air vent 302, thereby The air in the accommodating space 38 circulates to carry away the dust on the surface of the thinned substrate 20.
如上所述,該等齒肋部50所用之材質,具有靜電消散的功效。請參閱第11圖,該基板收納容器在其底面34進一步包含三個具有凹面之運動耦合部340,該基板收納容器係收納複數個第一直徑晶圓(未繪示),藉由該運動耦合部340的三點定位適當調整而使該基板收納容器可耦合至用以處理第二直徑晶圓之機台介面(未繪示),其中第一直徑係小於第二直徑,例如:第一直徑為8吋,而第二直徑為12 吋,可有效解決傳統適合較小尺寸(如8吋)之晶圓盒無法直接用在適合較大尺寸(如12吋)之晶圓加工設備的耦合界接介面。 As described above, the materials used for the tooth ribs 50 have the effect of dissipating static electricity. Referring to FIG. 11 , the substrate storage container further includes three concave movement coupling portions 340 on the bottom surface 34 thereof. The substrate storage container houses a plurality of first diameter wafers (not shown), and the motion coupling is performed. The three-point positioning of portion 340 is suitably adjusted such that the substrate receiving container can be coupled to a machine interface (not shown) for processing the second diameter wafer, wherein the first diameter is less than the second diameter, for example: the first diameter 8 inches, and the second diameter is 12 吋, can effectively solve the traditional suitable for small size (such as 8 晶圆) wafer cassette can not be directly used in the coupling interface of wafer processing equipment for larger size (such as 12 。).
再者,根據本發明的第二實施例,乃有關一種基板收納容器的製作方法,包括下列之步驟:(101)提供一本體30,而使該本體配設有一容置空間38與一開口35,而該容置空間38用以收納多個薄化基板20,且該開口35用以存取該些薄化基板20(如第2、3、4圖所示);(102)提供一門體40,用以蓋合該本體30之該開口35,其中該門體40設有閂鎖機制之扣合機構41(如第2圖所示)以將該門體40緊密扣合該開口35,使該容置空間38呈密封狀態,確保外界之微塵不會進入;(103)於該本體30之兩側壁31、32分別埋設彼此水平相向且垂直間隔排列之複數支撐肋37(如第7、8圖所示);(104)沿該本體30之內周緣環設有複數垂直排列之齒肋部50,在該每一齒肋部50的下表面凹設有一部份之凹陷段差51,使該每一齒肋部50於其特定水平位置之兩側的凹陷段差51分別以黏附、焊接、卡固、鎖固與一體埋入射出等方式之一接合至對應之該支撐肋37上,藉以水平支撐該些薄化基板20(如第9圖所示);其中,該每一齒肋部50具有一縱向比介於0.85與1.0之間;及,該每一齒肋部50具有一橫向比介於0.6與0.7之間, 如此,即形成本發明之基板收納容器的成品。如上述之製作方法,請再參閱第2圖,該本體30內更進一步設有一進氣埠301及一出氣埠302,其中該進氣埠301與該出氣埠302所設之位置相鄰該本體30之開口35,且分別相鄰該本體30之兩側壁31、32,令該進氣埠301可使清淨空氣進入容置空間38且該出氣埠302則使空氣排出該容置空間38,而使清淨空氣在該容置空間38中循環,將該等薄化基板20表面上沾附之微塵帶走。 Furthermore, a second embodiment of the present invention relates to a method of fabricating a substrate storage container, comprising the steps of: (101) providing a body 30, wherein the body is provided with an accommodation space 38 and an opening 35; The accommodating space 38 is used for accommodating a plurality of thinned substrates 20, and the opening 35 is used for accessing the thinned substrates 20 (as shown in FIGS. 2, 3, and 4); 40, the opening 35 for covering the body 30, wherein the door body 40 is provided with a latching mechanism of the latching mechanism 41 (as shown in FIG. 2) to tightly fasten the door body 40 to the opening 35, The accommodating space 38 is sealed to ensure that the external dust does not enter; (103) the plurality of supporting ribs 37 are horizontally and vertically spaced apart from each other on the side walls 31 and 32 of the body 30 (eg, the seventh, 8 is shown); (104) a plurality of vertically arranged ribs 50 are disposed along the inner circumference of the body 30, and a concave portion 51 is concavely formed on the lower surface of each of the ribs 50. The concave section difference 51 of each of the tooth ribs 50 on both sides of the specific horizontal position thereof is adhered, welded, clamped, locked and integrally buried. One of the modes is joined to the corresponding support rib 37 to support the thinned substrate 20 horizontally (as shown in FIG. 9); wherein each of the tooth ribs 50 has a longitudinal ratio of 0.85 and Between 1.0; and, each of the tooth ribs 50 has a lateral ratio between 0.6 and 0.7. Thus, the finished product of the substrate storage container of the present invention is formed. For the manufacturing method described above, please refer to FIG. 2 again. The body 30 is further provided with an intake port 301 and an air outlet 302, wherein the intake port 301 is adjacent to the position of the air outlet 302. The opening 35 of the 30, and adjacent to the two side walls 31, 32 of the body 30, respectively, allows the air intake 301 to allow clean air to enter the accommodating space 38 and the air vent 302 to allow air to exit the accommodating space 38. The clean air is circulated in the accommodating space 38, and the dust adhering to the surface of the thinned substrate 20 is carried away.
如上述之製作方法,請再參閱第10A-10C圖,該本體30之後壁36亦可採一可拆卸式設計,藉由在該左右側壁31、32之側端設有由一對導軌所構成之導槽360,以供該後壁36可拆卸式活動地置入或移除該本體30,進而使該基板收納容器於清洗後烘乾時,藉移除該後壁36而形成相對該門體30之該開口35的另一開口,致清洗液更易排除而不殘留於內,且烘乾之熱氣可於該前開式容器內快速對流。此外,下方基板收納容器之後壁36上緣設有一提把部361,用以對應上方基板收納容器之底面34所設的一凹接部341,而可將多個基板收納容器以垂直方向堆疊置放。此外,可拆卸式後壁36可使用透明材質,以利操作員在進行清洗烘乾該本體30時,隨時觀察之。此外,以一體埋入射出(integrally molded-in)所形成之齒肋部50與支撐肋37的結構,可有效避免因高溫烘乾而生斷裂之現象。 For the manufacturing method described above, please refer to FIG. 10A-10C. The rear wall 36 of the main body 30 can also adopt a detachable design, and the side ends of the left and right side walls 31 and 32 are formed by a pair of guide rails. The guiding groove 360 is configured for the rear wall 36 to be detachably and movably inserted or removed from the body 30, so that when the substrate storage container is dried after washing, the rear wall 36 is removed to form a relative door. The other opening of the opening 35 of the body 30 causes the cleaning liquid to be more easily removed without remaining therein, and the hot air to be dried can be quickly convected in the front opening container. In addition, a lower portion of the lower substrate storage container rear wall 36 is provided with a handle portion 361 for corresponding to a recessed portion 341 provided on the bottom surface 34 of the upper substrate storage container, and a plurality of substrate storage containers can be stacked in a vertical direction. put. In addition, the detachable rear wall 36 can be made of a transparent material so that the operator can observe it at any time while cleaning and drying the body 30. In addition, the structure of the tooth rib 50 and the support rib 37 formed by integrally molded-in can be effectively prevented from being broken due to high temperature drying.
如上述之製作方法,請再參閱第11圖,該基板收納容器在其底面34進一步裝設有一具有凹面之運動耦合 部340,該基板收納容器係收納複數個直徑為8吋之晶圓(未繪示),藉由調整該運動耦合部使該基板收納容器可耦合至用以處理直徑為12吋之晶圓機台介面(未繪示),可有效解決傳統適合較小尺寸(如8吋)之晶圓盒無法直接用在適合較大尺寸(如12吋)之晶圓加工設備的耦合界接介面。 As described above, referring to FIG. 11, the substrate storage container is further provided with a concave movement coupling on the bottom surface 34 thereof. The substrate 340 is configured to receive a plurality of wafers (not shown) having a diameter of 8 Å. The substrate storage container can be coupled to the wafer machine having a diameter of 12 Å by adjusting the motion coupling portion. The interface (not shown) can effectively solve the traditional coupling box suitable for smaller size (such as 8 吋) and can not be directly used in the coupling interface of wafer processing equipment suitable for larger size (such as 12 。).
如上述之製作方法,所使用之結構、元件與材質等特徵皆相同於第一實施例所揭示者。 As described above, the features, components, and materials used are the same as those disclosed in the first embodiment.
由以上詳細說明,可使熟知本項技藝者明瞭本發明的確可達成前述目的,實以符合專利法之規定,爰提出專利申請。惟以上所述之前開式晶圓盒,僅為本發明之較佳實施例而已,換言之,本發明實施之範圍亦可適用於底開式晶圓盒或其他用於半導體領域之基板收納容器及其製作方法;故,凡依本發明申請專利範圍及發明說明書內容所作之簡單的等效變化與修飾,皆應屬本發明專利涵蓋之範圍內。 From the above detailed description, it will be apparent to those skilled in the art that the present invention can achieve the foregoing objects, and in accordance with the provisions of the Patent Law, the patent application is filed. However, the foregoing open wafer cassette is only a preferred embodiment of the present invention. In other words, the scope of the present invention can also be applied to a bottom open wafer cassette or other substrate storage container for the semiconductor field. The method of making the same; therefore, the simple equivalent changes and modifications made by the scope of the invention and the content of the invention are within the scope of the invention.
30‧‧‧本體 30‧‧‧Ontology
31、32‧‧‧二側壁 31, 32‧‧‧ two side walls
33‧‧‧頂面 33‧‧‧ top surface
34‧‧‧底面 34‧‧‧ bottom
36‧‧‧後壁 36‧‧‧Back wall
38‧‧‧容置空間 38‧‧‧ accommodating space
40‧‧‧門體 40‧‧‧
41‧‧‧扣合機構 41‧‧‧Withholding mechanism
37‧‧‧支撐肋 37‧‧‧Support ribs
301‧‧‧進氣埠 301‧‧‧Intake 埠
50‧‧‧齒肋部 50‧‧‧ tooth ribs
302‧‧‧出氣埠 302‧‧‧Exhaust gas
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TW103139487A TWI549881B (en) | 2014-11-14 | 2014-11-14 | Substrate storage container and its manufacturing method |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5749469A (en) * | 1992-05-15 | 1998-05-12 | Fluoroware, Inc. | Wafer carrier |
JP2000332097A (en) * | 1999-05-17 | 2000-11-30 | Fujitsu Ltd | Wafer housing carrier, wafer carrying apparatus and wafer carrying method |
TW200948689A (en) * | 2008-01-13 | 2009-12-01 | Entegris Inc | Wafer container and method of manufacture |
CN101295628B (en) * | 2007-04-24 | 2013-01-16 | 东京毅力科创株式会社 | Vertical heat treatment apparatus and method of transferring substrates to be processed |
-
2014
- 2014-11-14 TW TW103139487A patent/TWI549881B/en not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5749469A (en) * | 1992-05-15 | 1998-05-12 | Fluoroware, Inc. | Wafer carrier |
JP2000332097A (en) * | 1999-05-17 | 2000-11-30 | Fujitsu Ltd | Wafer housing carrier, wafer carrying apparatus and wafer carrying method |
CN101295628B (en) * | 2007-04-24 | 2013-01-16 | 东京毅力科创株式会社 | Vertical heat treatment apparatus and method of transferring substrates to be processed |
TW200948689A (en) * | 2008-01-13 | 2009-12-01 | Entegris Inc | Wafer container and method of manufacture |
Also Published As
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TW201617275A (en) | 2016-05-16 |
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