TWI549290B - Foldable package structure - Google Patents

Description

Folding package structure

The present disclosure relates to a folded package structure, to a folded package structure including an ultra-thin glass plate, and to a folded package structure for an environmentally sensitive electronic component.

Due to the rapid development of technology, all kinds of light and short portable or handheld electronic products are booming. Among them, the advent of folding displays has promoted the popularization of portable or handheld electronic products.

The packaging structure of environmentally sensitive electronic components, the general method needs to achieve a state of blocking the sealing of moisture and oxygen, to protect the environmentally sensitive electronic components (especially organic light-emitting diodes) from the external environment temperature and humidity, so as to avoid Failure or performance degradation, which in turn damages environmentally sensitive electronic components. However, the folding packaging technology required for the folding display, in addition to the original resistance to moisture, has the ability to withstand multiple folds and is less prone to wrinkles or cracks to ensure products. Quality and service life.

The disclosed embodiments provide a folded package structure including a first stacked substrate, a second laminated substrate, a plurality of adhesive layers, and at least one environmentally sensitive electronic component. The first substrate, the first adhesive layer and the first ultra-thin glass plate are sequentially included from bottom to top. The second stacked substrate is disposed on the first stacked substrate. The folded package structure includes a second adhesive layer disposed on the first laminated substrate, and at least one environmentally sensitive electronic component disposed on the second adhesive layer and located between the first and second stacked substrates. The pleated package structure includes a third adhesive layer disposed between the at least one environmentally sensitive electronic component and the second stacked substrate. Further, the foldable package structure includes at least one predetermined folded area, and the first ultra-thin glass sheet includes at least two second ultra-thin glass sheets disposed on both sides of at least one predetermined folded area to avoid the at least one predetermined folded area.

The disclosed embodiment provides a folded package structure including a first stacked substrate, a second laminated substrate, a plurality of adhesive layers, a first electronic component and a second electronic component. The first substrate, the first adhesive layer and the first ultra-thin glass plate are sequentially included from bottom to top. The second stacked substrate is disposed on the first stacked substrate. The folded package structure includes a second adhesive layer disposed on the first stacked substrate. The first electronic component is disposed on the second adhesive layer and located between the first and second stacked substrates. The second electronic component is disposed on the second adhesive layer and located between the first and second stacked substrates. The folded package structure includes a third adhesive layer disposed between the first and second electronic components and the second stacked substrate. The first electronic component is an environmentally sensitive electronic component and the second electronic component can be the same or a different electronic component as the first electronic component. The folded package structure includes at least one predetermined folded area, and the first electronic component is disposed at Having one side of the predetermined folded area and the second electronic component disposed on the other side of the at least one predetermined folded area, the first ultra-thin glass plate configuration corresponding to one side of at least one predetermined folded area where the first electronic component is located, and Avoiding at least one predetermined folded area and avoiding the other side of the at least one predetermined folded area corresponding to the second electronic component.

In order to make the disclosure more apparent, the following embodiments are described in detail with reference to the accompanying drawings.

100, 200, 400A, 400B, 400C, 500A, 500B, 600A, 600B, 600C, 700A, 700B, 700C, 700D, 700E, 700F, 800‧‧‧ foldable package structure

110‧‧‧Environmentally sensitive electronic components

112‧‧‧Another electronic component

113‧‧‧First electronic components

114‧‧‧Second electronic components

120a‧‧‧second adhesive layer

120b‧‧‧ third adhesive layer

130a‧‧‧The first ultra-thin glass plate

130b‧‧‧Second ultra-thin glass plate

140a‧‧‧First adhesive layer

140b‧‧‧4th adhesive layer

150a‧‧‧first substrate

150b‧‧‧second substrate

151‧‧‧ lower surface

152‧‧‧ upper surface

160a, 160b‧‧‧ sidewall barrier structure

162, 162A, 162B‧‧‧ flexural stress dispersion structure

164‧‧‧Barrier layer

166‧‧‧ cladding

170a, 170b‧‧‧ Strengthening barrier layer

180‧‧‧Intermediate barrier layer

FIG. 1A is a schematic diagram of a folded package structure according to an embodiment of the present disclosure.

FIG. 1B is a schematic cross-sectional view of a folded package structure according to an embodiment of the present disclosure.

1C is a cross-sectional view of a folded package structure according to an embodiment of the present disclosure.

FIG. 1D is a partial schematic view showing a possible side wall barrier structure in a folded package structure according to an embodiment of the present disclosure.

FIG. 1E is a partial schematic view showing a possible sidewall barrier structure in a folded package structure according to an embodiment of the present disclosure.

2 is a schematic view of a folded package structure according to another embodiment of the present disclosure.

FIG. 3A is a schematic diagram of a folded package structure according to another embodiment of the present disclosure.

3B is a cross-sectional view of a folded package structure according to another embodiment of the present disclosure.

3C-3G are schematic cross-sectional views showing a magnified structure of a marginal portion of a predetermined folded region of a folded package structure according to an embodiment of the present disclosure. 4A is a top plan view of a predetermined folding area of a folded package structure according to another embodiment of the present disclosure.

4B is a partial cross-sectional view of the package structure of FIG. 4A.

4C-4D are schematic cross-sectional views of a portion of a folded package structure of various embodiments of the present disclosure.

FIG. 5A is a schematic diagram of a folded package structure according to another embodiment of the present disclosure.

FIG. 5B is a schematic diagram of a folded package structure according to another embodiment of the present disclosure.

FIG. 5C is a schematic diagram of a folded package structure according to another embodiment of the present disclosure.

FIG. 6 is a schematic diagram of a folded package structure according to another embodiment of the disclosure.

FIG. 7 is a schematic diagram of a folded package structure according to another embodiment of the disclosure.

FIG. 8 is a schematic diagram of a folded package structure according to another embodiment of the disclosure.

FIG. 9 is a schematic diagram of a folded package structure according to another embodiment of the disclosure.

FIG. 10 is a schematic diagram of a folded package structure according to another embodiment of the disclosure.

FIG. 11 is a schematic diagram of a folded package structure according to another embodiment of the disclosure.

FIG. 12 is a schematic diagram of a folded package structure according to another embodiment of the disclosure.

FIG. 13 is a schematic diagram of a folded package structure according to another embodiment of the disclosure.

FIG. 14 is a schematic diagram of a folded package structure according to another embodiment of the disclosure.

FIG. 15 is a schematic diagram of a folded package structure according to another embodiment of the disclosure.

FIG. 16 is a schematic diagram of a folded package structure according to another embodiment of the disclosure.

FIG. 17 is a schematic diagram of a folded package structure according to still another embodiment of the present disclosure.

The following examples are presented to illustrate a folded package structure for environmentally sensitive electronic components. The environmentally sensitive electronic component in the embodiment is an organic light emitting diode (organic light) As an example, an environmentally sensitive electronic component can also be a liquid crystal display, an organic sensing component, a solar panel, or other environmentally sensitive electronic component, and is not limited to the example of the embodiment, but The component dimensions are drawn for convenience of description and do not represent their actual component size ratio.

FIG. 1A is a schematic diagram of a folded package structure according to an embodiment of the present disclosure. The structure of Fig. 1A is an exploded view of the folded package structure in which the electronic component and the laminate are separated from each other before being combined. FIG. 1B is a schematic cross-sectional view of a folded package structure according to an embodiment of the present disclosure. The structure of FIG. 1B is a schematic cross-sectional view of a partially enlarged structure of a structure in which the package structure is relatively folded on opposite sides and a non-predetermined folded area thereof. Referring to FIG. 1A, in the embodiment, the folded package structure 100 (from the outside to the inside) includes first and second substrates 150a, 150b, first and fourth adhesive layers 140a, 140b, first and second ultra-thin The glass sheets 130a, 130b, the second and third adhesive layers 120a, 120b and the at least one environmentally sensitive electronic component 110. The second and third adhesive layers 120a and 120b are respectively disposed on the upper and lower sides of the environmentally sensitive electronic component 110. The first and second ultra-thin glass plates 130a and 130b are respectively disposed on the second and third adhesive layers 120a and 120b, and the first and fourth adhesive layers 140a and 140b are respectively disposed on the first and second ultra-thin glass. Above the plates 130a, 130b. That is, the first and second ultra-thin glass sheets 130a, 130b are sandwiched between the first/second adhesive layers 140a/120a and the third/fourth adhesive layer 120b/140b, respectively. The first and second substrates 150a, 150b are bonded to the first and second ultra-thin glass sheets 130a, 130b through the first and fourth adhesive layers 140a, 140b, and pass through the second and third adhesive layers 120a, 120b. The environmentally sensitive electronic component 110 is sandwiched in the middle. Centered by the environmentally sensitive electronic component 110, the first substrate 150a, the first adhesive layer 140a and the first An ultra-thin glass plate 130a can be considered as an upper laminated substrate (upper cover), and the second ultra-thin glass plate 130b, the fourth adhesive layer 140b and the second substrate 150b can be combined to be regarded as a lower stack. Substrate (lower cover). The upper and lower stacked substrates can be regarded as the first and second stacked substrates, and the vertical direction is not limited by the first and second portions.

Referring to FIG. 1A, the first ultra-thin glass plate 130a or the second ultra-thin glass plate 130b are respectively designed as two discontinuous and separate glass plates, which are arranged in a predetermined folding area of the folded package structure 100 (the broken line indicates a predetermined folding). The two sides of the area (i.e., the two sides of the dotted line are non-predetermined folded areas), but avoid the predetermined folding area of the folded package structure 100. Therefore, when the package structure is folded along the predetermined folding area, it is not folded to the first ultra-thin glass plate 130a or the second ultra-thin glass plate 130b. Therefore, in the embodiment, the rigidity of the first ultra-thin glass plate 130a or the second ultra-thin glass plate 130b can be utilized to support the package structure and increase the resistance to water and oxygen, but not because of the ultra-thin glass plate. It hinders the folding of the folded package structure. Although the ultra-thin glass plate in this embodiment is set as two separate glass plates in accordance with the design of the predetermined folding zone, it should be understood by those skilled in the art that the design of the predetermined folding zone can design the glass plate into two or more pieces. sheet. Corresponding to the two thin glass plates which are designed as separate thin glass plates, the first and fourth adhesive layers 140a, 140b can also be designed as two separate adhesive layers. Here, replacing the single piece design with two separate pieces not only facilitates the folding structure, but also saves materials and reduces manufacturing costs.

Referring to FIG. 1A and FIG. 1B again, in this embodiment, the materials of the first and second substrates 150a, 150b may be plastic materials or polymer materials, such as polyamidamine (PI), polyamidamine and inorganic mixtures ( Hybrid PI), polyethylene terephthalate (Polyethylene terephthalate, PET), Polyethersulfone (PES), Polyethylene naphthalatc (PEN), Cycloolefin polymer (COP), Glass fiber reinforced plastic substrate ( Fiberglass Reinforced Plastic Substrate). The thickness of the first and second substrates 150a, 150b may be substantially the same or similar, for example, between 1 μm and 500 μm; preferably between 5 μm and 30 μm. The thickness of the ultra-thin glass plate is at least less than or equal to 100 μm. The material of the first and fourth adhesive layers 140a, 140b or the second and third adhesive layers 120a, 120b may be optically clear adhesive, pressure sensitive adhesive, thermosetting adhesive or ultraviolet curing adhesive. The materials of the first and fourth adhesive layers 140a, 140b and the second and third adhesive layers 120a, 120b may be the same or different. If the material of the first and second substrates 150a, 150b is a semi-dry film of PI, it may be considered to omit the use of the first and fourth adhesive layers 140a, 140b. The environmentally sensitive electronic component 110 is, for example, an OLED component, a liquid crystal display component, a solar cell, or an electro-optical display (EPD) component such as electronic paper.

Referring to FIGS. 1A, 1B and 1C, sidewall blocking structures 160a, 160b are formed on opposite surfaces of the first and second substrates 150a, 150b, respectively. That is, the lower surface 151 of the first substrate 150a has a sidewall barrier structure 160a, and the upper surface 152 of the second substrate 150b has a sidewall barrier structure 160b. The sidewall barrier structures 160a, 160b are generally located in the non-display area of the display or the panel or the non-touch area of the touch panel, for example, in the peripheral regions of the first and second substrates 150a, 150b; when the package structure is pressed, the sidewall resistance The barrier structures 160a, 160b are located between the first and second substrates 150a, 150b and the environmentally sensitive electronic component 110, respectively. At the same time, the sidewall barrier structure 160a, 160b ring Around or around at least one side of the environmentally sensitive electronic component 110 (see FIG. 1A). Referring to FIG. 1B, sidewall barrier structures 160a, 160b may surround the periphery of the first and second ultra-thin glass sheets 130a, 130b and surround the ambient sensitive electronic component 110. In this embodiment, the first and second substrates 150a, 150b each have sidewall barrier structures 160a, 160b, but may also depend on the isolation requirements of the package structure for moisture, but only the first substrate 150a or the second. A sidewall barrier structure is disposed on the surface of the substrate 150b.

In this embodiment, the sidewall barrier structures 160a, 160b are located on the first and second substrates 150a, 150b, and may be connected or only partially connected to the first and second substrates 150a, 150b, wherein the sidewall barriers The structures 160a, 160b are, for example, a continuous annular structure surrounding a particular region and having a particular bottom surface shape, the so-called bottom surface being the cross-section of the sidewall barrier structure perpendicular to the substrate. The shape of the bottom surface of the sidewall barrier structure can be seen in FIG. 1D, for example, a square zigzag line type, a trapezoidal zigzag line type, a curved wave line type, a square wave line type, having the same or different thickness lines and intersecting or not intersecting each other; see also FIG. 1E. The shape of the bottom surface of the sidewall barrier structure is, for example, a hexagonal grid structure, a circular grid structure, a cross grid structure, a ladder grid structure or a heart grid structure, wherein the grid may be Grid lines of equal or unequal thickness are constructed. Of course, the number of sidewall barrier structures may be one or more to form a single loop or a multi-ring loop structure. In other embodiments not shown, the sidewall barrier structure may also be a discontinuous three-dimensional structure, such as a linear structure disposed only on either side of the environmentally sensitive electronic component, or a U-shaped surrounding environmentally sensitive electronic components. Structure or L-shaped structure, or other non-continuous structure surrounding environmentally sensitive electronic components, The disclosure is not limited here.

The above embodiment is exemplified by a single environmentally sensitive electronic component 110, but it will be understood that the package structure may also include a plurality of identical or different environmentally sensitive electronic components. 2 is a schematic view of a folded package structure according to another embodiment of the present disclosure. Referring to FIG. 2, in the embodiment, the folded package structure 100 (from the outside to the inside) includes first and second substrates 150a, 150b, first and fourth adhesive layers 140a, 140b, first and second ultra-thin Glass sheets 130a, 130b, second and third adhesive layers 120a, 120b and two environmentally sensitive electronic components 110. The second and third adhesive layers 120a, 120b are respectively disposed on the upper and lower sides of the two environmentally sensitive electronic components 110. The first and second ultra-thin glass plates 130a and 130b are respectively disposed on the second and third adhesive layers 120a and 120b, and the first and fourth adhesive layers 140a and 140b are respectively disposed on the first and second ultra-thin glass. Above the plates 130a, 130b. That is, the first and second ultra-thin glass sheets 130a, 130b are sandwiched between the first/second adhesive layers 140a/120a and the third/fourth adhesive layer 120b/140b, respectively. The first and second substrates 150a, 150b are bonded to the first and second ultra-thin glass sheets 130a, 130b through the first and fourth adhesive layers 140a, 140b, and pass through the second and third adhesive layers 120a, 120b. The two environmentally sensitive electronic components 110 are sandwiched in the middle.

FIG. 3A is a schematic diagram of a folded package structure according to another embodiment of the present disclosure. The structure of FIG. 3A is an exploded view of the folded package structure in which the electronic component and the laminate are separated from each other before being combined. 3B is a cross-sectional view of a folded package structure according to another embodiment of the present disclosure. The structure of FIG. 3B is a schematic cross-sectional view of a partially enlarged structure of a structure in which the package structure is relatively folded on opposite sides and a predetermined folded area thereof. Please refer to 3A, in the present embodiment, the folded package structure 200 (from the outside to the inside) includes first and second substrates 150a, 150b, first and fourth adhesive layers 140a, 140b, first and second ultra-thin glass plates. 130a, 130b, second and third adhesive layers 120a, 120b and at least one environmentally sensitive electronic component 110. In comparison with the folded package structure 100 of the previous embodiment, in this embodiment, the material or approximate arrangement of the laminate structure of the folded package structure 200 is quite similar, and similar layers are denoted by the same reference numerals. The first ultra-thin glass plate 130a or the second ultra-thin glass plate 130b in the folded package structure 200 is designed as two discrete glass plates which are arranged in a predetermined folding area of the folded package structure 200 (the broken line indicates a predetermined folding). The two sides of the area (i.e., the two sides of the dotted line are non-predetermined folded areas), but avoid the predetermined folded area of the folded package structure 200. Therefore, when the package structure is folded along the predetermined folding area, it is not folded to the first ultra-thin glass plate 130a or the second ultra-thin glass plate 130b. Although the ultra-thin glass plate in this embodiment is set as two separate glass plates in response to the design of the predetermined folding zone, the first adhesive layer 140a or the fourth adhesive layer 140b is a single piece design in this example.

The folded package structure 200 in this embodiment further includes a reinforcing barrier layer 170a, 170b disposed at a predetermined folding area. The reinforcing barrier layer 170a is disposed between the two first ultra-thin glass plates 130a and sandwiched between the first adhesive layer 140a and the second adhesive layer 120a. The reinforcing barrier layer 170b is disposed between the two second ultra-thin glass plates 130b and sandwiched between the fourth adhesive layer 140b and the third adhesive layer 120b. The materials for strengthening the barrier layers 170a, 170b include a plastic barrier film, a metal foil barrier film, a glass fiber barrier film, and a composite gas barrier film ( Composite materials barrier Film) and so on.

Referring to FIG. 3B, since the reinforcing barrier layers 170a, 170b are disposed at a predetermined folding area, when folded, the zigzag portion does not have the first ultra-thin glass plate 130a or the second ultra-thin glass plate 130b, and is strengthened. The barrier layers 170a, 170b are located on the outer sides of the second and third adhesive layers 120a, 120b on both sides of the environmentally sensitive electronic component 110. That is, at the folded portion, the environmentally sensitive electronic component 110 and the second and third adhesive layers 120a, 120b on both sides thereof are sandwiched between the reinforcing barrier layers 170a, 170b, so that although there is no first and second ultrathin at this position The glass sheets 130a, 130b, but the enhanced barrier layers 170a, 170b, further provide the function of blocking moisture while preventing the environmentally sensitive electronic component 110 from being damaged by environmental factors.

3C-3G are schematic cross-sectional views showing a magnified structure of a marginal portion of a predetermined folded region of a folded package structure according to an embodiment of the present disclosure. Figures 3C-3G are primarily illustrative of the marginal portions of the predetermined folded region, particularly for the relative position of the ultra-thin glass sheet, the enhanced barrier layer, and the adhesive layer above and below it. Referring to FIG. 3C, the second ultra-thin glass plate 130b and the reinforcing barrier layer 170b in the folded package structure 200 are disposed in a flush manner with respective end points, and the second ultra-thin glass plate 130b and the enhanced barrier in FIG. Layer 170b is configured in a staggered manner with respective endpoints. In FIG. 3E, the second ultra-thin glass plate 130b is extended at one end and alternately overlapped with the end points of the reinforcing barrier layer 170b. In FIG. 3F, one end of the reinforcing barrier layer 170b is extended and overlapped with the end of the second ultra-thin glass plate 130b. In FIG. 3G, the extended end of the strengthened barrier layer 170b and the extended end of the second ultra-thin glass plate 130b are alternately overlapped. This staggered overlap configuration ensures blocking functionality and increases component reliability. The reinforcing barrier layers 170a, 170b can enhance the predetermined folding The barrier effect of the area.

4A is a top plan view of a predetermined folded area of a folded package structure according to another embodiment of the present disclosure, and FIG. 4B is a partial cross-sectional view of the package structure of FIG. 4A.

Referring to FIG. 4A and FIG. 4B, in the embodiment, the sidewall barrier structure 160b is substantially, for example, a ring-shaped structure having a bottom surface area on the substrate 150b, and the number of the sidewall barrier structures 160b is, for example, a plurality of The sidewall barrier structure 160b includes a plurality of flexural stress dispersion structures 162 in a predetermined flexure region (dashed line region), which is formed by a process such as etching. The cross section of the flexural stress dispersion structure 162 may be any polygonal type, circular shape or elliptical type. Specifically, in the present embodiment, the cross section of the flexural stress dispersion structure 162 is exemplified by a ladder shape, and the flexural stress dispersion structure 162 further includes a barrier layer 164 and a cladding layer 166. Any two adjacent flexural stress dispersion structures 162 are interconnected, for example, by a barrier layer 164 to form a continuous structure, but recessed at a particular location to facilitate bending. Of course, in other embodiments not shown, any two adjacent flexural stress dispersion structures 162 may also be non-continuous structures that are not connected to each other, and the disclosure is not limited herein. For the foregoing features, please refer to the TW102119356 patent application.

The sidewall barrier structure 160b of the present embodiment may have annular structures arranged in parallel with each other, and the flexural stress dispersion structures 162 are arranged in parallel in a predetermined deflection region. Therefore, when the folded package structure 200 is bent along a predetermined flexure region (dashed line region), the flexural stress dispersion structure 162 is disposed to avoid the sidewall barrier structure 160b in the predetermined flexure region under long-term deflection. A situation in which force is concentrated to cause deformation or destruction.

In addition, when the folded package structure 200 is also designed such that no adhesive layer is disposed in the sidewall barrier structure region, the sidewall barrier structures 160a and 160b are each designed to have flexural stress dispersion structures 162A and 162B, respectively. 4C-4D are schematic cross-sectional views of a portion of a folded package structure of various embodiments of the present disclosure. As can be seen from FIG. 4C, the flexural stress dispersion structures 162A and 162B abut each other and are in direct contact with the first and second substrates 150a and 150b without an adhesive layer. 4D, the flexural stress dispersion structures 162A and 162B are partially in contact with each other but are not in direct contact with the upper and lower substrates 150a and 150b. However, since the flexural stress dispersion structures 162A and 162B are in contact with each other, an adhesive layer is not required. The purpose of joining the first stacked substrate and the second laminated substrate can also be achieved. For a detailed description of the foregoing features, reference is made to the TW 102133165 patent application.

In the foregoing embodiment, the upper and lower sides of the environmentally sensitive electronic component (that is, the upper and lower stacked substrates) are all provided with an ultra-thin glass plate, but the package material or electronic component matched with the end view can also be configured only on one side of the electronic component. A thin glass sheet, that is, an ultra-thin glass sheet only in the upper laminated substrate or the lower laminated substrate portion.

FIG. 5A is a schematic diagram of a folded package structure according to another embodiment of the present disclosure. The structure of Fig. 5A is an exploded view of the folded package structure in which the electronic component and the laminate are separated from each other before being combined. Referring to FIG. 5A, in this embodiment, the folded package structure 400A (from the outside to the inside) includes first and second substrates 150a, 150b, a first adhesive layer 140a, a first ultra-thin glass plate 130a, and a second adhesive layer 120a. At least one environmentally sensitive electronic component 110. Compared with the folded package structure 100 of the previous embodiment, the material or the approximate configuration of the laminate of the folded package structure 400A of this embodiment is quite similar. Similar layers are denoted by the same reference numerals. In this embodiment, the environmentally sensitive electronic component 110 of the folded package structure 400A is directly formed on the upper surface 152 of the second substrate 150b, so that the use of the ultra-thin glass plate and the adhesive layer under the electronic component is omitted. This embodiment can be considered as an example in which the laminated substrate under the package structure does not contain an ultra-thin glass plate. Because the use of the ultra-thin glass plate is omitted, the second substrate 150b preferably includes a plastic barrier film, a metal foil barrier film, and a glass fiber barrier film. ), composite materials barrier film, etc., to provide sufficient environmental barrier effect. A sidewall barrier structure 160a is disposed on the first substrate 150a. After the package structure is pressed, the sidewall barrier structure 160a can surround the ambient sensitive electronic component 110 or surround the first ultra-thin glass plate 130a.

FIG. 5B is a schematic diagram of a folded package structure according to another embodiment of the present disclosure. The structure of Fig. 5B is an exploded view of the folded package structure in which the electronic component and the laminate are separated from each other before being combined. Referring to FIG. 5B, in this embodiment, the folded package structure 400B (from the outside to the inside) includes first and second substrates 150a, 150b, a first adhesive layer 140a, a first ultra-thin glass plate 130a, a second adhesive layer 120a, The third adhesive layer 120b is coupled to at least one environmentally sensitive electronic component 110. The material or approximate configuration of the laminate of the folded package structure 400B of this embodiment is quite similar to that of the folded package structure 100 of the previous embodiment, and similar layers are denoted by the same reference numerals. In this embodiment, the environmentally sensitive electronic component 110 of the folded package structure 400B is sandwiched between the second adhesive layer 120a and the third adhesive layer 120b, and then attached to the second substrate 150b, so that the lower side of the electronic component is omitted. Use of thin glass plates. Because the use of ultra-thin glass plates is omitted, The second substrate 150b preferably includes a plastic barrier film, a metal foil barrier film, a glass fiber barrier film, and a composite gas barrier film (Composite materials). Barrier film), etc., to provide sufficient environmental barrier effect. A sidewall barrier structure 160a is disposed on the first substrate 150a. After the package structure is pressed, the sidewall barrier structure 160a may surround the circumference of the first ultra-thin glass plate 130a.

FIG. 5C is a schematic diagram of a folded package structure according to another embodiment of the present disclosure. The structure of Fig. 5C is an exploded view of the folded package structure in which the electronic component and the laminate are separated from each other before being combined. Referring to FIG. 5C, in this embodiment, the folded package structure 400C (from the outside to the inside) includes first and second substrates 150a, 150b, a first adhesive layer 140a, a first ultra-thin glass plate 130a, a second adhesive layer 120a, The third adhesive layer 120b is coupled to at least one environmentally sensitive electronic component 110. The material or approximate configuration of the laminate of the folded package structure 400C of this embodiment is quite similar to that of the folded package structure 100 of the previous embodiment, and similar layers are denoted by the same reference numerals. The use of the ultra-thin glass plate on the underside of the electronic component is omitted in this embodiment.

The environmentally sensitive electronic component 110 of the folded package structure 400C is sandwiched between the second adhesive layer 120a and the third adhesive layer 120b, and is then bonded to the second substrate 150b through the third adhesive layer 120b. Because the use of the ultra-thin glass plate is omitted, the second substrate 150b preferably includes a plastic barrier film, a metal foil barrier film, and a glass fiber barrier film. ), composite materials barrier film, etc., to provide sufficient environmental barrier effect.

Still referring to FIG. 5C, the folded package structure 400C includes a location in which the reinforced barrier layer 170a is disposed at a predetermined folded area. The reinforcing barrier layer 170a is disposed between the two first ultra-thin glass plates 130a and sandwiched between the first adhesive layer 140a and the second adhesive layer 120a. When folded, since the first ultra-thin glass plate 130a is not present in the meandering, the reinforcing barrier layer 170a further provides a function of blocking moisture, thereby preventing the environmentally sensitive electronic component 110 from being damaged by environmental factors. Further, a sidewall barrier structure 160a is provided on the first substrate 150a. After the package structure is pressed, the sidewall barrier structure 160a may surround the circumference of the first ultra-thin glass plate 130a. Similarly, the folded package structure 400A of FIG. 5A may also include a position where the reinforcing barrier layer 170a is disposed at a predetermined folding area (not shown). The reinforcing barrier layer 170a is disposed between the two first ultra-thin glass plates 130a and sandwiched between the first adhesive layer 140a and the second adhesive layer 120a.

FIG. 6 is a schematic diagram of a folded package structure according to another embodiment of the present disclosure. The structure of Fig. 6 is an exploded view of the folded package structure in which the electronic component and the laminate are separated from each other before being combined. Referring to FIG. 6, in this embodiment, the folded package structure 500A (from the outside to the inside) includes first and second substrates 150a, 150b, first and fourth adhesive layers 140a, 140b, first and second ultra-thin glass plates. 130a, 130b, second and third adhesive layers 120a, 120b and at least one environmentally sensitive electronic component 110. The material or approximate configuration of the laminate of the folded package structure 500A of this embodiment is quite similar to that of the folded package structure 100 of the previous embodiment, and similar layers are denoted by the same reference numerals. In this embodiment, the environmentally sensitive electronic component 110 of the folded package structure 500A is directly formed on the intermediate barrier layer 180. The intermediate barrier layer 180 is made of, for example, a plastic barrier film or a metal foil gas barrier film. (Metal foil barrier film), glass a glass fiber barrier film, a composite material barrier film, etc., and then adhered to the first and second ultra-thin glass plates 130a, 130b, and through the second and third adhesives The layers 120a, 120b sandwich the environmentally sensitive electronic component 110 and the intermediate barrier layer 180, and the first and second substrates 150a, 150b are pasted through the first and fourth adhesive layers 140a, 140b to the first layer. The second ultra-thin glass plates 130a, 130b. Each of the first and second substrates 150a, 150b has a sidewall barrier structure 160a, 160b on its opposite surface. After the package structure is pressed, the sidewall barrier structures 160a, 160b may surround the ambient sensitive electronic component 110 or surround the first and second ultra-thin glass sheets 130a, 130b. In this embodiment, the intermediate barrier layer 180 and the sidewall barrier structures 160a, 160b can further enhance the insulating effect of the package structure on moisture.

FIG. 7 is a schematic diagram of a folded package structure according to another embodiment of the present disclosure. The structure of Fig. 7 is an exploded view of the folded package structure in which the electronic component and the laminate are separated from each other before being combined. Referring to FIG. 7, in this embodiment, the folded package structure 500B (from the outside to the inside) includes first and second substrates 150a, 150b, a fourth adhesive layer 140b, first and second ultra-thin glass plates 130a, 130b, and Second, a third adhesive layer 120a, 120b and two environmentally sensitive electronic components 110. The material or approximate configuration of the laminate of the folded package structure 500B of this embodiment is quite similar to that of the folded package structure 100 of the previous embodiment, and similar layers are denoted by the same reference numerals. In this embodiment, the environmentally sensitive electronic component 110 of the folded package structure 500B is directly formed on the intermediate barrier layer 180, through the second and third adhesive layers 120a, 120b and the first and second ultra-thin glass plates 130a. , 130b fits, and the environmentally sensitive electronic component 110 and the intermediate barrier The layer 180 is sandwiched in the middle, and the first and second substrates 150a, 150b are bonded to the first and second ultra-thin glass sheets 130a, 130b through the second and fourth adhesive layers 120a, 140b. In this embodiment, the first and second ultra-thin glass plates 130a, 130b, the second and third adhesive layers 120a, 120b, and the fourth adhesive layer 140b are designed as two pieces in response to the two environmentally sensitive electronic components 110. Sidewall barrier structures 160a, 160b are disposed on the surfaces of the second and third adhesive layers 120a, 120b, respectively. After the package structure is pressed, as shown in the previous embodiment, the sidewall barrier structure 160a surrounds the periphery of the first ultra-thin glass plate 130a, and the sidewall barrier structure 160b can surround the ambient sensitive electronic component 110. In this embodiment, the intermediate barrier layer 180 and the sidewall barrier structures 160a, 160b can further enhance the insulating effect of the package structure on moisture.

FIG. 8 is a schematic diagram of a folded package structure according to another embodiment of the present disclosure. The structure of Fig. 8 is an exploded view of the folded package structure in which the electronic component and the laminate are separated from each other before being combined. Referring to FIG. 8, in this embodiment, the folded package structure 600A (from the outside to the inside) includes first and second substrates 150a, 150b, two environmentally sensitive electronic components 110, a fourth adhesive layer 140b, and a second ultra-thin glass plate. 130b and the third adhesive layer 120b. The material or approximate configuration of the laminate of the folded package structure 600A of this embodiment is quite similar to that of the folded package structure 100 of the previous embodiment, and similar layers are denoted by the same reference numerals. In this embodiment, the environmentally sensitive electronic components 110 of the folded package structure 600A may be the same or different electronic components, but are all environmentally sensitive electronic components. The environmentally sensitive electronic components 110 are directly formed on the lower surface 151 of the first substrate 150a, omitting the use of the ultra-thin glass plate and the adhesive layer therebetween. This embodiment can be considered as an example in which the laminated substrate on the package structure does not contain an ultra-thin glass plate. Province For example, the first substrate 150a preferably includes a plastic barrier film, a metal foil barrier film, and a glass fiber barrier film. , composite materials barrier film, etc., to provide sufficient environmental barrier effect. The two separate environmentally sensitive electronic components 110 in the folded package structure 600A are disposed on opposite sides of a predetermined folding area of the folded package structure 600A (the broken line indicates a predetermined folding area) (that is, the two sides of the broken line are non-predetermined folding areas). However, the predetermined folding area of the folded package structure 600A is avoided. Corresponding to two separate environmentally sensitive electronic components 110, the second ultra-thin glass plate 130b is designed as two discontinuous and separate glass plates, and the fourth adhesive layer 140b and the third adhesive layer 120b are also designed as two pieces. Correspondingly, the second ultra-thin glass plate 130b and the two separate environmentally sensitive electronic components 110 are bonded to the first and second substrates 150a, 150b. Each of the two separate third adhesive layers 120b has a sidewall barrier structure 160b on its upper surface. After the package structure is pressed, as shown in the foregoing embodiment, the two sidewall barrier structures 160b can surround the two environmentally sensitive electronic components 110, respectively, to enhance the protection isolation effect of the package structure on the environmentally sensitive electronic components 110.

In the foregoing embodiment, environmentally sensitive electronic components are disposed on both sides of the predetermined folding area of the folded package structure, but the packaged materials or electronic components are matched with the matching, and the environmentally sensitive electrons may be disposed only on one side of the predetermined folding area. Components, while the other side can be configured with non-environmentally sensitive electronic components.

FIG. 9 is a schematic diagram of a folded package structure according to another embodiment of the present disclosure. The structure of FIG. 9 is a folded package structure before the combination of the electronic component and each laminate A schematic diagram of the explosions separated from each other. Referring to FIG. 9, in this embodiment, the pleated package structure 600B (from the outside to the inside) includes first and second substrates 150a, 150b, environmentally sensitive electronic components 110, a fourth adhesive layer 140b, and a second ultra-thin glass plate 130b. And the second and third adhesive layers 120a, 120b. The material or approximate configuration of the laminate of the folded package structure 600B of this embodiment is quite similar to that of the folded package structure 100 of the previous embodiment, and similar layers are denoted by the same reference numerals. In this embodiment, the environmentally sensitive electronic component 110 of the folded package structure 600B is sandwiched between the second adhesive layer 120a and the third adhesive layer 120b, and is then adhered to the lower surface 151 of the first substrate 150a through the second adhesive layer 120a. , omitting the use of ultra-thin glass plates in between. This embodiment can be considered as an example in which the laminated substrate on the package structure does not contain an ultra-thin glass plate. Because the use of the ultra-thin glass plate is omitted, the first substrate 150a preferably includes a plastic barrier film, a metal foil barrier film, and a glass fiber barrier film. ), composite materials barrier film, etc., to provide sufficient environmental barrier effect. The second ultra-thin glass plate 130b and the fourth adhesive layer 140b are both designed in two pieces, and a sidewall barrier structure 160b is disposed on the upper surface of the second substrate 150b. After the package structure is pressed, as shown in the foregoing embodiment, the sidewall barrier structure 160b can surround the two second ultra-thin glass sheets 130b and the two fourth adhesive layers 140b, and surround the environmentally sensitive electronic component 110. The protective encapsulation structure enhances the isolation of the environmentally sensitive electronic component 110.

FIG. 10 is a schematic diagram of a folded package structure according to another embodiment of the present disclosure. The structure of Fig. 10 is an exploded view of the folded package structure in which the electronic component and the laminate are separated from each other before being combined. Referring to FIG. 10, a folded package structure in this embodiment The 600C (from the outside to the inside) includes first and second substrates 150a, 150b, environmentally sensitive electronic components 110, a fourth adhesive layer 140b, a second ultra-thin glass plate 130b, and second and third adhesive layers 120a, 120b. The material or approximate configuration of the laminate of the folded package structure 600C of this embodiment is quite similar to that of the folded package structure 100 of the previous embodiment, and similar layers are denoted by the same reference numerals. In this embodiment, the folded package structure 600C omits the ultra-thin glass plate of the upper laminated substrate, so that the environmentally sensitive electronic component 110 is sandwiched between the second adhesive layer 120a and the third adhesive layer 120b, and then passes through the second adhesive layer. The 120a is attached to the lower surface 151 of the first substrate 150a. Because the use of the ultra-thin glass plate is omitted, the first substrate 150a preferably includes a plastic barrier film, a metal foil barrier film, and a glass fiber barrier film. ), composite materials barrier film, etc., to provide sufficient environmental barrier effect. The second ultra-thin glass plate 130b is designed in two pieces. Therefore, the folded package structure 600C further includes a reinforcing barrier layer 170b disposed between the two second ultra-thin glass plates 130b and located at a predetermined folding area. The strengthened barrier layer 170b is sandwiched between the third adhesive layer 120b and the fourth adhesive layer 140b. When folded, since the second ultra-thin glass plate 130b is not present at the meandering, the reinforcing barrier layer 170b further provides a function of blocking moisture, thereby preventing the environmentally sensitive electronic component 110 from being damaged by environmental factors. Further, sidewall blocking structures 160a, 160b are respectively disposed on the first substrate 150a and the second substrate 150b. After the package structure is pressed, the sidewall barrier structure 160a can surround the ambient sensitive electronic component 110. The sidewall barrier structure 160b can surround the two second ultra-thin glass sheets 130b and the fourth adhesive layer 140b to strengthen the package structure. The protective isolation effect of the environmentally sensitive electronic component 110.

11 is a schematic view of a folded package structure according to another embodiment of the present disclosure. The structure of Fig. 11 is an exploded view of the folded package structure in which the electronic component and the laminate are separated from each other before being combined. Referring to FIG. 11, in this embodiment, the folded package structure 700A (from the outside to the inside) includes first and second substrates 150a, 150b, first and fourth adhesive layers 140a, 140b, first and second ultra-thin glass plates. 130a, 130b, second and third adhesive layers 120a, 120b, environmentally sensitive electronic component 110 and another electronic component 112. The other electronic component 112 is a different electronic component than the environmentally sensitive electronic component 110. The other electronic component 112 may be a non-environmentally sensitive electronic component or another environmentally sensitive electronic component that is less environmentally sensitive than the environmentally sensitive electronic component 110. For example, the environmentally sensitive electronic component 110 is an OLED, for example, requiring a Water Vapor Transmission Rate (WVTR) of less than 10 ^-6 (g/m ² /day), and another electronic component 112 is an electrophoretic display (Electro -Phoretic Display (EPD) components, such as electronic paper, require, for example, a water vapor transmission rate of about 10 ^-2 (g/m ² /day).

The material or approximate configuration of the laminate structure of the folded package structure 700A of FIG. 11 is quite similar to that of the folded package structure 100 of the previous embodiment, and similar layers are denoted by the same reference numerals. In this embodiment, since the environmentally sensitive electronic component 110 of the folded package structure 700A is disposed only on one side of the predetermined folded area and the other electronic component 112 is disposed on the other side of the predetermined folded area, each stack corresponds to the environment. The configuration of the sensitive electronic component 110 is not the same as the configuration of the other electronic component 112. Corresponding to one side of the environmentally sensitive electronic component 110, the environmentally sensitive electronic component 110 is bonded to the first and second ultra-thin glass sheets 130a, 130b through the second and third adhesive layers 120a, 120b, and The environmentally sensitive electronic component 110 is sandwiched therebetween, and the first and second substrates 150a, 150b are pasted to the first and second ultra-thin glass plates 130a, 130b through the first and fourth adhesive layers 140a, 140b. Corresponding to one side of the environmentally sensitive electronic component 110, there are sidewall barrier structures 160a, 160b on opposite surfaces of the first and second substrates 150a, 150b. After the package structure is pressed, the sidewall barrier structures 160a, 160b surround the ambient sensitive electronic component 110 to enhance the insulating effect of the package structure against moisture. However, corresponding to the other side where the other electronic component 112 is located, the other electronic component 112 is sandwiched between the second and third adhesive layers 120a, 120b, and the first and third adhesive layers 120a, 120b and the first The second substrates 150a and 150b are directly bonded to each other. That is, on the other side corresponding to the other electronic component 112, the ultra-thin glass plate and the adhesive layer are omitted, and the sidewall barrier structure is not disposed. Since the use of the ultra-thin glass plate is omitted in some regions, the first and second substrates 150a, 150b may include a plastic barrier film, a metal foil barrier film, and a glass fiber. A glass fiber barrier film, a composite material barrier film, etc., to provide a sufficient environmental barrier effect. In this embodiment, the configuration of the sidewall barrier structures 160a, 160b corresponds only to the location of the environmentally sensitive electronic component 110, but does not extend to correspond to the location of the other electronic component 112.

FIG. 12 is a schematic diagram of a folded package structure according to another embodiment of the present disclosure. The structure of Fig. 12 is an exploded view of the folded package structure in which the electronic component and the laminate are separated from each other before being combined. In this embodiment, since the environmentally sensitive electronic component 110 of the folded package structure 700B is disposed only on one side of the predetermined folded area and the other electronic component 112 is disposed on the other side of the predetermined folded area, each stack corresponds to the environment. Min The configuration of the electronic component 110 is not the same as the configuration of the other electronic component 112. Each of the first and second substrates 150a, 150b has a sidewall barrier structure 160a, 160b on its opposite surface. After the package structure is pressed, the sidewall barrier structures 160a, 160b surround the other electronic component 112 while surrounding the environmentally sensitive electronic component 110. Referring to Figure 12, the sidewall barrier structures 160a, 160b are configured to surround the environmentally sensitive electronic components. And non-environmentally sensitive electronic components. Therefore, the configuration of the sidewall barrier structure depends on the packaging requirements, and the disclosure is not limited thereto.

FIG. 13 is a schematic diagram of a folded package structure according to another embodiment of the present disclosure. The structure of Fig. 13 is an exploded view of the folded package structure in which the electronic component and the laminate are separated from each other before being combined. Referring to FIG. 13, in this embodiment, the folded package structure 700C (from the outside to the inside) includes first and second substrates 150a, 150b, a first adhesive layer 140a, a first ultra-thin glass plate 130a, and a second and a third adhesive. Layers 120a, 120b, environmentally sensitive electronic component 110 and another electronic component 112. The other electronic component 112 is a different electronic component than the environmentally sensitive electronic component 110. The other electronic component 112 may be a non-environmentally sensitive electronic component or another environmentally sensitive electronic component that is less environmentally sensitive than the environmentally sensitive electronic component 110. For example, the environmentally sensitive electronic component 110 is an OLED, for example, requiring a Water Vapor Transmission Rate (WVTR) of less than 10 ^-6 (g/m ² /day), and another electronic component 112 is an electrophoretic display (Electro -Phoretic Display (EPD) components, such as electronic paper, require, for example, a water vapor transmission rate of about 10 ^-2 (g/m ² /day). Since the environmentally sensitive electronic component 110 of the folded package structure 700C is disposed only on one side of the predetermined folded area and the other electronic component 112 is disposed on the other side of the predetermined folded area, each stack corresponds to the environmentally sensitive electronic component 110 and The configuration of the other electronic component 112 is not the same. Corresponding to one side of the environmentally sensitive electronic component 110, the environmentally sensitive electronic component 110 is bonded to the first ultra-thin glass plate 130a and the second substrate 150b through the second and third adhesive layers 120a, 120b, and the first and second substrates are bonded to each other. 150a, 150b sandwiches the environmentally sensitive electronic component 110 through the first adhesive layer 140a and the first ultra-thin glass plate 130a. Corresponding to one side of the environmentally sensitive electronic component 110, there is a sidewall barrier structure 160a on the opposite surface of the first substrate 150a. After the package structure is pressed, the sidewall barrier structure 160a surrounds the ambient sensitive electronic component 110 to enhance the isolation effect of the package structure on moisture. However, corresponding to the other side where the other electronic component 112 is located, the other electronic component 112 is sandwiched between the second and third adhesive layers 120a, 120b, and the first and third adhesive layers 120a, 120b and the first The second substrates 150a and 150b are directly bonded to each other. That is, on the other side corresponding to the other electronic component 112, the ultra-thin glass plate and the adhesive layer are omitted, and the sidewall barrier structure is not disposed. Since the use of the ultra-thin glass plate is omitted in some regions, the first and second substrates 150a, 150b may include a plastic barrier film, a metal foil barrier film, and a glass fiber. A glass fiber barrier film, a composite material barrier film, etc., to provide a sufficient environmental barrier effect. In this embodiment, the configuration of the sidewall barrier structure 160a corresponds only to the location of the environmentally sensitive electronic component 110, but does not extend to correspond to the location of the other electronic component 112.

FIG. 14 is a schematic diagram of a folded package structure according to another embodiment of the present disclosure. The structure of FIG. 14 is a folded package structure before the combination of the electronic component and each laminate A schematic diagram of the explosions separated from each other. In this embodiment, since the environmentally sensitive electronic component 110 of the folded package structure 700D is disposed only on one side of the predetermined folded area and the other electronic component 112 is disposed on the other side of the predetermined folded area, each stack corresponds to the environment. The configuration of the sensitive electronic component 110 is not the same as the configuration of the other electronic component 112. A sidewall barrier structure 160a is disposed on the first substrate 150a. After the package structure is pressed, the sidewall barrier structure 160a surrounds the other electronic component 112 while surrounding the environmentally sensitive electronic component 110. Referring to FIG. 7D, the sidewall barrier structure 160a is configured to surround environmentally sensitive electronic components and non-environment. Sensitive electronic components.

FIG. 15 is a schematic diagram of a folded package structure according to another embodiment of the present disclosure. The structure of Fig. 15 is an exploded view of the folded package structure in which the electronic component and the laminate are separated from each other before being combined. Referring to FIG. 15, in this embodiment, the folded package structure 700E (from the outside to the inside) includes first and second substrates 150a, 150b, a fourth adhesive layer 140b, a second ultra-thin glass plate 130b, and a second and third adhesive. Layers 120a, 120b, environmentally sensitive electronic component 110 and another electronic component 112. The other electronic component 112 is a different electronic component than the environmentally sensitive electronic component 110. The other electronic component 112 may be a non-environmentally sensitive electronic component or another environmentally sensitive electronic component that is less environmentally sensitive than the environmentally sensitive electronic component 110. For example, the environmentally sensitive electronic component 110 is an OLED, for example, requiring a Water Vapor Transmission Rate (WVTR) of less than 10 ^-6 (g/m ² /day), and another electronic component 112 is an electrophoretic display (Electro -Phoretic Display (EPD) components, such as electronic paper, require, for example, a water vapor transmission rate of about 10 ^-2 (g/m ² /day). Since the environmentally sensitive electronic component 110 of the folded package structure 700E is disposed only on one side of the predetermined folded area and the other electronic component 112 is disposed on the other side of the predetermined folded area, each stack corresponds to the environmentally sensitive electronic component 110 and The configuration of the other electronic component 112 is not the same. Corresponding to one side of the environmentally sensitive electronic component 110, the environmentally sensitive electronic component 110 is bonded to the first substrate 150a and the second ultra-thin glass plate 130b through the second and third adhesive layers 120a, 120b, and the first and second substrates are bonded to each other. 150a, 150b sandwiches the environmentally sensitive electronic component 110 through the second ultra-thin glass plate 130b and the fourth adhesive layer 140b. Corresponding to one side of the environmentally sensitive electronic component 110, there is a sidewall barrier structure 160b on the second substrate 150b. After the package structure is pressed, the sidewall barrier structure 160b surrounds the ambient sensitive electronic component 110 to enhance the isolation effect of the package structure on moisture. However, corresponding to the other side where the other electronic component 112 is located, the other electronic component 112 is sandwiched between the second and third adhesive layers 120a, 120b, and the first and third adhesive layers 120a, 120b and the first The second substrates 150a and 150b are directly bonded to each other. That is, on the other side corresponding to the other electronic component 112, the ultra-thin glass plate and the adhesive layer are omitted, and the sidewall barrier structure is not disposed. Since the use of the ultra-thin glass plate is omitted in some regions, the first and second substrates 150a, 150b may include a plastic barrier film, a metal foil barrier film, and a glass fiber. A glass fiber barrier film, a composite material barrier film, etc., to provide a sufficient environmental barrier effect. In this embodiment, the configuration of the sidewall barrier structure 160b corresponds only to the location of the environmentally sensitive electronic component 110, but does not extend to correspond to the location of the other electronic component 112.

FIG. 16 is a schematic diagram of a folded package structure according to another embodiment of the present disclosure. The structure of Fig. 16 is an exploded view of the folded package structure in which the electronic component and the laminate are separated from each other before being combined. In this embodiment, since the environmentally sensitive electronic component 110 of the folded package structure 700F is disposed only on one side of the predetermined folded area and the other electronic component 112 is disposed on the other side of the predetermined folded area, each stack corresponds to the environment. The configuration of the sensitive electronic component 110 is not the same as the configuration of the other electronic component 112. A sidewall barrier structure 160b is disposed on the second substrate 150b. After the package structure is pressed, the sidewall barrier structure 160b surrounds the other electronic component 112 while surrounding the environmentally sensitive electronic component 110. Referring to FIG. 16, the sidewall barrier structure 160b is configured to surround environmentally sensitive electronic components and non-environmentally sensitive. Electronic component.

As described above, the number of electronic components in the embodiment is not necessarily one or two, and may be plural. The predetermined folding area of the folded package structure can be designed in one or more places. In the following embodiments, the predetermined folding area of the folded package structure is designed in two places (that is, a three-fold structure), and electronic components are disposed on both sides of the predetermined folding area, but the electronic components are matched with the environment or the environment. Resisting the requirements, the package material and structure can be adjusted accordingly.

17 is a schematic diagram of a folded package structure according to still another embodiment of the present disclosure. The structure of Fig. 17 is an exploded view of the folded package structure in which the electronic component and the laminate are separated from each other before being combined. Referring to FIG. 17, in this embodiment, the folded package structure 800 (from the outside to the inside) includes first and second substrates 150a, 150b, first and fourth adhesive layers 140a, 140b, and first and second ultra-thin glass plates. 130a, 130b, second and third adhesive layers 120a, 120b, environmentally sensitive electronic component 110, first electronic component 113 and second electronic component 114. The three electronic components are different electronic components. The second electronic component 114 may be a non-environmentally sensitive electronic component, the first electronic component 113 being another environmentally sensitive electronic component but which is less environmentally sensitive than the environmentally sensitive electronic component 110. For example, the environmentally sensitive electronic component 110 is an OLED, for example, requiring a WVTR of less than 10 ^-6 (g/m ² /day), and the first electronic component 113 is an electronic paper, for example, requiring a water vapor transmission rate of 10 ^-2 (g/ m ² /day) may be left and right, and the second electronic component 114 is an organic sensing component, for example, requiring a WVTR to be less than 10 ^-5 (g/m ² /day).

Similar layers of the stacked package structure 800 of FIG. 17 are denoted by the same reference numerals as compared with the folded package structure 100 of the previous embodiment. The three separate electronic components 110, 113, 114 in the folded package structure 800 are disposed on two sides of the predetermined folding area (the dotted lines A1 and A2 represent predetermined folding areas) of the folded package structure 800 (ie, both sides of the dotted line). It is an unintended folding area), but avoids the predetermined folding area position of the folded package structure 800. In this embodiment, since the environmentally sensitive electronic component 110 is disposed only between the predetermined folding areas A1, A2, and the first electronic component 113 is disposed on the other side of the predetermined folding area A1, the second electronic component 114 is disposed in the predetermined folding area. The other side of A2. Therefore, the layout of each of the layers corresponding to the environmentally sensitive electronic component 110 and the first and second electronic components 113, 114 is not the same. Corresponding to one side of the first electronic component 113, the first electronic component 113 is adhered to the first ultra-thin glass plate 130a, the first adhesive layer 140a and the first substrate 150a through the second adhesive layer 120a, and penetrates the third adhesive layer. The 120b is bonded to the second substrate 150b, sandwiches the first electronic component 113, and has a sidewall barrier structure 160a on the first substrate 150a.

In FIG. 17, corresponding to the middle of the environmentally sensitive electronic component 110, the environmentally sensitive electronic component 110 passes through the third adhesive layer 120b and the second ultra-thin glass plate 130b, and the fourth The adhesive layer 140b and the second substrate 150b are bonded together, and are bonded to the first substrate 150a through the second adhesive layer 120a, and the environmentally sensitive electronic component 110 is sandwiched therebetween. However, corresponding to the other side of the second electronic component 114, the second electronic component 114 is sandwiched between the second and third adhesive layers 120a, 120b, and the first and third adhesive layers 120a, 120b and the first The second substrates 150a and 150b are directly bonded to each other. At a position corresponding to the environmentally sensitive electronic component 110 and the second electronic component 114, the second substrate 150b has a sidewall barrier structure 160b thereon. After the package structure is pressed, the sidewall barrier structure 160b surrounds the environment sensitive electronic component 110 and the second electronic component 114 to enhance the isolation effect of the package structure on moisture.

That is to say, at the position corresponding to the position where the second electronic component 114 is located, the use of the ultra-thin glass plate and the first adhesive layer is omitted for the upper and lower laminated substrates. Since the use of the ultra-thin glass plate is omitted in some regions, the first and second substrates 150a, 150b may include a plastic barrier film, a metal foil barrier film, and a glass fiber. A glass fiber barrier film, a composite material barrier film, etc., to provide a sufficient environmental barrier effect.

As shown in the foregoing embodiments, the upper and lower laminated substrates may be designed to be provided with an ultra-thin glass plate or only the upper or lower laminated substrate may be provided with an ultra-thin glass plate, and the adhesive layer used in combination may be designed as a single piece or Multiple pieces. The number and position of the ultra-thin glass plates used can be adjusted for the number or type of electronic components included. The sidewall barrier structure is also an adjustable design that can be placed on top or bottom of the substrate or both, and can be positioned to surround or be located on the side of a particular electronic component or all of the electronic components. Side wall The barrier structure can be designed to be multilateral to the electronic component, and the sidewall barrier structure material that is a continuous structure or a discontinuous structure or a different side can also be different. And depending on the requirements of the package structure, the reinforcing barrier layer may be included at the predetermined fold to avoid the stress during folding, which causes the partial area barrier effect to be destroyed.

In summary, the folded package structure of the embodiment discloses that the upper and lower laminated substrates can be bent by the arrangement of the ultra-thin glass plate. The bend can be further matched with the reinforced barrier layer to maintain the environmental resistance of the folded package structure after multiple folding, maintaining the electrical properties and characteristics of the panel component. Optionally, the folded package structure further includes the selection of the sidewall barrier structure at different locations to further enhance the structure and its effectiveness against the environment.

The present disclosure has been disclosed in the above embodiments, but it is not intended to limit the disclosure, and any person skilled in the art can make some changes and refinements without departing from the spirit and scope of the disclosure. The scope of protection of this disclosure is subject to the definition of the scope of the appended claims.

100‧‧‧Folding package structure

110‧‧‧Environmentally sensitive electronic components

120a‧‧‧second adhesive layer

120b‧‧‧ third adhesive layer

130a‧‧‧The first ultra-thin glass plate

130b‧‧‧Second ultra-thin glass plate

140a‧‧‧First adhesive layer

140b‧‧‧4th adhesive layer

150a‧‧‧first substrate

150b‧‧‧second substrate

151‧‧‧ lower surface

152‧‧‧ upper surface

160a, 160b‧‧‧ sidewall barrier structure

Claims (25)

A folded package structure for packaging at least one environmentally sensitive electronic component, the folded package structure comprising: a first stacked substrate, wherein the first stacked substrate comprises a first substrate, a first adhesive layer and at least two a first ultra-thin glass plate, wherein the first ultra-thin glass plate has a thickness at least less than or equal to 100 μm and greater than 0; and a second laminated substrate disposed on one side of the first stacked substrate, wherein The second laminated substrate includes a second substrate; a second adhesive layer disposed on the first stacked substrate and located between the first and second stacked substrates; the at least one environmentally sensitive electronic component, a second adhesive layer disposed between the first and second stacked substrates; and a third adhesive layer disposed between the at least one environmentally sensitive electronic component and the second stacked substrate, wherein The folded package structure includes at least one predetermined folding area, the at least one predetermined folding area being located at a gap between the at least two first ultra-thin glass sheets, the at least two first ultra-thin glass plate configurations In the to The two sides of the predetermined folding area are less than one of the predetermined folding areas. The folding package structure of claim 1, wherein the first laminated substrate further comprises a reinforcing barrier layer between the at least two first ultra-thin glass sheets and located at the at least one predetermined Inside the folded area. The folding package structure of claim 1, further comprising a sidewall barrier structure disposed between the first and second stacked substrates at the At least one side of an environmentally sensitive electronic component. The folding package structure according to claim 1, wherein the material of the first substrate or the second substrate comprises polyamidamine (PI), polyamidamine and inorganic mixture (hybrid PI), poly pair Polyethylene terephthalate (PET), polyethersulfone (PES), polyethylene naphthalatc (PEN), cycloolefin polymer (COP), glass Fiberglass Reinforced Plastic Substrate. The folding package structure of claim 1, wherein the second laminated substrate comprises the second substrate, the second ultra-thin glass plate and the fourth adhesive layer, wherein the second ultra-thin The thickness of the glass sheet is at least less than or equal to 100 μm and greater than zero. The folding package structure according to claim 1, wherein the material of the first adhesive layer, the second adhesive layer or the third adhesive layer comprises an optical adhesive, a thermosetting adhesive or an ultraviolet curing adhesive. . The foldable package structure of claim 1, wherein the at least one environmentally sensitive electronic component is an organic light emitting diode (OLED), an electrophoretic display element, a liquid crystal display element, an organic sensing element, or a solar panel. The folding package structure of claim 1, wherein the second laminated substrate comprises the second substrate, the fourth adhesive layer and at least two second ultra-thin glass plates from bottom to top. And the at least two second ultra-thin glass plates are disposed on both sides of the at least one predetermined folding area to avoid the at least one predetermined folding area, Wherein the thickness of the second ultra-thin glass plate is at least less than or equal to 100 μm and greater than zero. The folding package structure of claim 8, wherein the second laminated substrate further comprises a reinforcing barrier layer between the at least two second ultra-thin glass sheets and located at the at least one predetermined Inside the folded area. The folded package structure of claim 8, further comprising a sidewall barrier structure disposed between the first and second stacked substrates on at least one side of the at least one environmentally sensitive electronic component. The folding package structure of claim 8, wherein the material of the fourth adhesive layer comprises an optical glue, a thermosetting adhesive or an ultraviolet curing adhesive. The folded package structure of claim 8, further comprising an intermediate barrier layer, wherein the at least one environmentally sensitive electronic component is directly attached to the intermediate barrier layer, the second and third adhesive layers A layer sandwiches the at least one environmentally sensitive electronic component and the intermediate barrier layer. A folded package structure, comprising: a first stacked substrate, wherein the first stacked substrate comprises a first substrate, a first adhesive layer and a first ultra-thin glass plate, wherein the first The thickness of the ultra-thin glass plate is at least 100 μm or less and greater than 0; the second stacked substrate is disposed on an opposite side of the first stacked substrate, wherein the second stacked substrate comprises a second substrate; An adhesive layer disposed on the first laminated substrate; a first electronic component disposed on the second adhesive layer and located in the first and second The first electronic component is disposed between the first and second stacked substrates, wherein the first The environmental blocking of the two electronic components is required to be different from the first electronic component; and the third adhesive layer is disposed between the first and second electronic components and the second stacked substrate, wherein the folded package structure comprises At least one predetermined folded area, the at least one predetermined folded area being located at a gap between the first electronic component and the second electronic component, the first electronic component being disposed in one of the at least one predetermined folded area And the second electronic component is disposed on the other side of the at least one predetermined folding area, the first ultra-thin glass plate configuration corresponding to one of the at least one predetermined folding area where the first electronic component is located Side, avoiding the at least one predetermined folded area and avoiding the other side of the at least one predetermined folded area corresponding to the second electronic component. The foldable package structure of claim 13, wherein the first laminated substrate further comprises a reinforcing barrier layer in the at least one predetermined folded region. The folding package structure of claim 13, further comprising a sidewall barrier structure disposed between the first and second stacked substrates to surround at least one side of the first electronic component. The pleated package structure of claim 13, wherein the material of the first barrier layer comprises polyamidamine (PI), polyamidamine and inorganic mixture (hybrid PI), poly-p-phenylene Ethylene glycol terephthalate (Polyethylene terephthalate, PET), Polyethersulfone (PES), Polyethylene naphthalatc (PEN), Cycloolefin polymer (COP), Fiberglass Reinforced Plastic Substrate ). The folding package structure of claim 13, wherein the second laminated substrate comprises the second substrate, the second ultra-thin glass plate and the fourth adhesive layer, wherein the second ultra-thin The thickness of the glass sheet is at least less than or equal to 100 μm and greater than zero. The folding package structure according to claim 13, wherein the material of the first adhesive layer, the second adhesive layer or the third adhesive layer comprises an optical adhesive, a thermosetting adhesive or an ultraviolet curing adhesive. . The foldable package structure of claim 13, wherein the environmentally sensitive electronic component is an organic light emitting diode (OLED), an electrophoretic display element, a liquid crystal display element, an organic sensing element, or a solar panel. The folding package structure of claim 13, wherein the second laminated substrate comprises the second substrate, the fourth adhesive layer and the second ultra-thin glass plate in order from bottom to top, The second ultra-thin glass plate configuration corresponds to one side of the at least one predetermined folding area where the first electronic component is located, avoiding the at least one predetermined folding area and avoiding corresponding to the second electronic component The other side of the at least one predetermined folded region, wherein the thickness of the second ultra-thin glass plate is at least less than or equal to 100 μm and greater than zero. The folding package structure according to claim 20, wherein The second stacked substrate further includes a strengthening barrier layer located in the at least one predetermined folding region. The folding package structure of claim 20, wherein the second laminated substrate further comprises a sidewall barrier structure disposed between the first and second stacked substrates to surround the first electron element. The folding package structure according to claim 20, wherein the material of the second substrate comprises polyamidamine (PI), polyamidene and inorganic mixture (hybrid PI), polyethylene terephthalate Polyethylene terephthalate (PET), polyethersulfone (PES), polyethylene naphthalatc (PEN), Cycloolefin polymer (COP), glass fiber reinforced plastic (Fiberglass Reinforced Plastic Substrate). The folding package structure according to claim 20, wherein the material of the fourth adhesive layer comprises an optical glue, a thermosetting adhesive or an ultraviolet curing adhesive. The folded package structure of claim 20, further comprising an intermediate barrier layer, wherein the at least one environmentally sensitive electronic component is directly attached to the intermediate barrier layer, the second and third adhesive layers A layer sandwiches the at least one environmentally sensitive electronic component and the intermediate barrier layer.