TWI547742B - Backlight module - Google Patents

Backlight module Download PDF

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Publication number
TWI547742B
TWI547742B TW104117654A TW104117654A TWI547742B TW I547742 B TWI547742 B TW I547742B TW 104117654 A TW104117654 A TW 104117654A TW 104117654 A TW104117654 A TW 104117654A TW I547742 B TWI547742 B TW I547742B
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TW
Taiwan
Prior art keywords
light
conductive layer
patterned conductive
backlight module
reflective sheet
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TW104117654A
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Chinese (zh)
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TW201643525A (en
Inventor
劉瀚元
李俊葦
周暄
陳靖瑋
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揚昇照明股份有限公司
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Priority to TW104117654A priority Critical patent/TWI547742B/en
Application granted granted Critical
Publication of TWI547742B publication Critical patent/TWI547742B/en
Publication of TW201643525A publication Critical patent/TW201643525A/en

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    • GPHYSICS
    • G02OPTICS
    • G02FDEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH IS MODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THE DEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY, COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g. SWITCHING, GATING, MODULATING OR DEMODULATING; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336Illuminating devices
    • G02F1/133602Direct backlight
    • G02F1/133605Direct backlight including specially adapted reflectors
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
    • G02B6/00Light guides
    • G02B6/0001Light guides specially adapted for lighting devices or systems
    • G02B6/0011Light guides specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0033Means for improving the coupling-out of light from the light guide
    • G02B6/005Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
    • G02B6/0055Reflecting element, sheet or layer
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
    • G02B6/00Light guides
    • G02B6/0001Light guides specially adapted for lighting devices or systems
    • G02B6/0011Light guides specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0086Positioning aspects
    • G02B6/009Positioning aspects of the light source in the package
    • GPHYSICS
    • G02OPTICS
    • G02FDEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH IS MODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THE DEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY, COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g. SWITCHING, GATING, MODULATING OR DEMODULATING; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336Illuminating devices
    • G02F1/133602Direct backlight
    • G02F1/133608Direct backlight including particular frames or supporting means
    • GPHYSICS
    • G02OPTICS
    • G02FDEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH IS MODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THE DEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY, COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g. SWITCHING, GATING, MODULATING OR DEMODULATING; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336Illuminating devices
    • G02F1/133602Direct backlight
    • G02F1/133612Electrical details

Description

背光模組 Backlight module
本發明是有關於一種背光模組,且特別是有關於一種應用於液晶顯示器的背光模組。 The present invention relates to a backlight module, and more particularly to a backlight module applied to a liquid crystal display.
目前的電子裝置均朝多功能、美觀且輕薄的方向發展。由於液晶顯示器具有輕薄等優點,因此液晶顯示器被大量地使用於各種行動電子裝置(例如智慧型手機及平板電腦等)。由於液晶顯示面板(Liquid crystal display panel)不具有主動發光的功能,所以在液晶顯示面板的下方必須配置背光模組以作為一面光源,使得液晶顯示面板得以達到顯示的目的。 Current electronic devices are moving toward versatility, aesthetics, and thinness. Since liquid crystal displays have advantages such as being thin and light, liquid crystal displays are widely used in various mobile electronic devices (for example, smart phones and tablets). Since the liquid crystal display panel does not have the function of active illumination, a backlight module must be disposed under the liquid crystal display panel as a side light source, so that the liquid crystal display panel can achieve the purpose of display.
圖1是一種習知背光模組的剖面示意圖。請參考圖1,習知背光模組20包括導光板21、反射片22、光源23、背蓋25以及膠框26。導光板21、反射片22以及光源23配置於背蓋25與膠框26所構成的容置空間內。導光板21具有入光面213、底面212以及出光面211,其中底面212連接於入光面213,出光面211相對於底面212並連接入光面213。光源23包括電路基板235以及 發光元件232,其中發光元件232配置於電路基板235上且鄰近入光面213以提供光線L1進入導光板21。反射片22配置於底面212上,且反射片22透過固定膠帶27與導光板21以及電路基板235相互黏合。 1 is a schematic cross-sectional view of a conventional backlight module. Referring to FIG. 1 , the conventional backlight module 20 includes a light guide plate 21 , a reflective sheet 22 , a light source 23 , a back cover 25 , and a plastic frame 26 . The light guide plate 21, the reflection sheet 22, and the light source 23 are disposed in an accommodation space formed by the back cover 25 and the plastic frame 26. The light guide plate 21 has a light incident surface 213, a bottom surface 212, and a light exit surface 211. The bottom surface 212 is connected to the light incident surface 213, and the light exit surface 211 is connected to the light surface 213 with respect to the bottom surface 212. The light source 23 includes a circuit substrate 235 and The light-emitting element 232 is disposed on the circuit substrate 235 and adjacent to the light-incident surface 213 to provide light L1 into the light guide plate 21. The reflection sheet 22 is disposed on the bottom surface 212, and the reflection sheet 22 is bonded to the light guide plate 21 and the circuit board 235 via the fixing tape 27.
然而習知背光模組20中,固定膠帶27通常為不透明的雙面膠以防止漏光,但這樣的設計會降低光源23所發出的光線L1的利用率。此外,在目前行動電子裝置不斷追求輕薄化的趨勢之下,如何使得行動電子裝置內的各種構件(如液晶顯示器的背光模組)更加地輕薄化已成為重要的課題。以習知背光模組20而言,電路基板235與固定膠帶27本身都具有一定厚度,因此習知背光模組20難以達到輕薄化的目的。 However, in the conventional backlight module 20, the fixing tape 27 is usually an opaque double-sided tape to prevent light leakage, but such a design reduces the utilization of the light L1 emitted from the light source 23. In addition, under the current trend of the pursuit of thinness and thinning of mobile electronic devices, how to make various components in the mobile electronic device (such as the backlight module of the liquid crystal display) more lightweight and thin has become an important issue. In the conventional backlight module 20, the circuit board 235 and the fixing tape 27 themselves have a certain thickness, so that the conventional backlight module 20 is difficult to achieve the purpose of slimming.
本“先前技術”段落只是用來幫助了解本發明內容,因此在“先前技術”段落所揭露的內容可能包含一些沒有構成所屬技術領域中具有通常知識者所知道的習知技術。在“先前技術”段落所揭露的內容,不代表該內容或者本發明一個或多個實施例所要解決的問題,在本發明申請前已被所屬技術領域中具有通常知識者所知曉或認知。 This "Prior Art" section is only intended to aid in understanding the present invention, and thus the disclosure of the "prior art" section may contain some conventional techniques that are not known to those of ordinary skill in the art. The matters disclosed in the "Prior Art" section, which do not represent the subject matter or the problems to be solved by one or more embodiments of the present invention, are known or recognized by those of ordinary skill in the art prior to the present application.
本發明提供一種背光模組,其具有較薄的厚度。 The invention provides a backlight module having a relatively thin thickness.
本發明的其他目的和優點可以從本發明所揭露的技術特徵中得到進一步的了解。 Other objects and advantages of the present invention will become apparent from the technical features disclosed herein.
為達上述之一或部份或全部目的或是其他目的,本發明之一實施例提供一種背光模組包括導光板、第一反射片以及光源。導光板具有入光面、底面以及出光面。底面連接入光面,且出光面相對於底面並連接入光面。第一反射片具有第一面、第二面及至少一穿孔。第二面相對於第一面,第一面的一部分配置在底面上,且穿孔連接第一面及第二面。光源包括電路基板以及至少一發光元件。電路基板具有第一圖案化導電層。第一反射片的第二面的一部份配置在第一圖案化導電層上。發光元件適於提供光線由入光面進入導光板。每一發光元件穿設於第一反射片的至少一穿孔且配置於電路基板的圖案化導電層上。 To achieve one or a part or all of the above or other purposes, an embodiment of the present invention provides a backlight module including a light guide plate, a first reflective sheet, and a light source. The light guide plate has a light incident surface, a bottom surface, and a light exit surface. The bottom surface is connected to the light surface, and the light exit surface is connected to the light surface with respect to the bottom surface. The first reflective sheet has a first surface, a second surface, and at least one through hole. The second surface is disposed on the bottom surface with respect to the first surface, and the first surface and the second surface are connected by the through holes. The light source includes a circuit substrate and at least one light emitting element. The circuit substrate has a first patterned conductive layer. A portion of the second side of the first reflective sheet is disposed on the first patterned conductive layer. The illuminating element is adapted to provide light into the light guide plate from the light incident surface. Each of the light emitting elements is disposed on the at least one through hole of the first reflective sheet and disposed on the patterned conductive layer of the circuit substrate.
在本發明的一實施例中,電路基板具有絕緣層、第二圖案化導電層以及保護層。絕緣層、第二圖案化導電層以及保護層依序疊置於第一圖案化導電層上。絕緣層位於第一圖案化導電層與第二圖案化導電層之間。 In an embodiment of the invention, the circuit substrate has an insulating layer, a second patterned conductive layer, and a protective layer. The insulating layer, the second patterned conductive layer and the protective layer are sequentially stacked on the first patterned conductive layer. The insulating layer is between the first patterned conductive layer and the second patterned conductive layer.
在本發明的一實施例中,第一反射片與絕緣層分別配置於第一圖案化導電層的相對兩表面。 In an embodiment of the invention, the first reflective sheet and the insulating layer are respectively disposed on opposite surfaces of the first patterned conductive layer.
在本發明的一實施例中,電路基板具有可撓曲性。 In an embodiment of the invention, the circuit substrate has flexibility.
在本發明的一實施例中,背光模組更包括膠框以及背蓋。背蓋與膠框構成容置空間,以容置導光板、第一反射片以及光源。 In an embodiment of the invention, the backlight module further includes a plastic frame and a back cover. The back cover and the plastic frame form an accommodation space for accommodating the light guide plate, the first reflection sheet and the light source.
在本發明的一實施例中,背光模組更包括第二反射片。第二反射片配置於導光板的出光面的邊緣與背蓋之間。 In an embodiment of the invention, the backlight module further includes a second reflective sheet. The second reflective sheet is disposed between the edge of the light emitting surface of the light guide plate and the back cover.
在本發明的一實施例中,第一圖案化導電層不與膠框以及背蓋直接接觸。 In an embodiment of the invention, the first patterned conductive layer is not in direct contact with the bezel and the back cover.
在本發明的一實施例中,第一反射片與電路基板相互平行。 In an embodiment of the invention, the first reflective sheet and the circuit substrate are parallel to each other.
在本發明的一實施例中,導光板具有多個光學微結構,且光學微結構配置於底面。 In an embodiment of the invention, the light guide plate has a plurality of optical microstructures, and the optical microstructures are disposed on the bottom surface.
基於上述,本發明的實施例至少具有以下其中一個優點,在本發明的上述實施例中,第一反射片可直接配置於第一圖案化導電層上,並且第一反射片具有多個穿孔。此外,發光元件可直接經由第一反射片的穿孔穿設於第一圖案化線路層上。因此,本發明的背光模組可直接以配置於第一圖案化線路層上的第一反射片取代保護層,以減低電路基板的厚度,使行動電子裝置符合目前薄型化的發展趨勢。 Based on the above, the embodiment of the present invention has at least one of the following advantages. In the above embodiment of the present invention, the first reflective sheet may be directly disposed on the first patterned conductive layer, and the first reflective sheet has a plurality of through holes. In addition, the light emitting element may be directly disposed on the first patterned circuit layer via the through hole of the first reflective sheet. Therefore, the backlight module of the present invention can directly replace the protective layer with the first reflective sheet disposed on the first patterned circuit layer to reduce the thickness of the circuit substrate, so that the mobile electronic device conforms to the current trend of thinning.
為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。 The above described features and advantages of the invention will be apparent from the following description.
100‧‧‧背光模組 100‧‧‧Backlight module
110、21‧‧‧導光板 110, 21‧‧‧ light guide
111、211‧‧‧出光面 111, 211‧‧ ‧ light surface
112、212‧‧‧底面 112, 212‧‧‧ bottom
113、213‧‧‧入光面 113, 213‧‧‧ into the glossy surface
120‧‧‧第一反射片 120‧‧‧First reflection sheet
121‧‧‧第一面 121‧‧‧ first side
122‧‧‧第二面 122‧‧‧ second side
123‧‧‧穿孔 123‧‧‧Perforation
125‧‧‧第一膠層 125‧‧‧First layer
130、23‧‧‧光源 130, 23‧‧‧ Light source
132、232‧‧‧發光元件 132, 232‧‧‧Lighting elements
135、235‧‧‧電路基板 135, 235‧‧‧ circuit board
135a‧‧‧第一圖案化導電層 135a‧‧‧First patterned conductive layer
135a1‧‧‧表面 135a1‧‧‧ surface
135a2‧‧‧表面 135a2‧‧‧ surface
135b‧‧‧第二圖案化導電層 135b‧‧‧Second patterned conductive layer
135c‧‧‧保護層 135c‧‧‧protective layer
135d‧‧‧絕緣層 135d‧‧‧Insulation
140‧‧‧第二反射片 140‧‧‧Second reflector
150、25‧‧‧背蓋 150, 25‧‧‧ back cover
152‧‧‧卡槽 152‧‧‧ card slot
160、26‧‧‧膠框 160, 26‧‧‧ plastic frame
162‧‧‧卡勾 162‧‧‧ hook
165‧‧‧第二膠層 165‧‧‧Second layer
170‧‧‧光學微結構 170‧‧‧Optical microstructure
20‧‧‧習知背光模組 20‧‧‧Study backlight module
22‧‧‧反射片 22‧‧‧reflector
27‧‧‧固定膠帶 27‧‧‧Fixed tape
L、L1‧‧‧光線 L, L1‧‧‧ rays
圖1是一種習知背光模組的剖面示意圖。 1 is a schematic cross-sectional view of a conventional backlight module.
圖2是本發明一實施例的背光模組的示意圖。 2 is a schematic diagram of a backlight module according to an embodiment of the invention.
圖3是圖1的背光模組沿線A-A’的剖面放大示意圖。 Figure 3 is an enlarged cross-sectional view of the backlight module of Figure 1 taken along line A-A'.
有關本發明之前述及其他技術內容、特點與功效,在以下配合參考圖式之多個實施例的詳細說明中,將可清楚的呈現。以下實施例中所提到的方向用語,例如「上」、「下」、「前」、「後」、「左」、「右」等,僅是參考附加圖式的方向。因此,使用的方向用語是用來說明,而非用來限制本發明。 The foregoing and other objects, features, and advantages of the invention will be apparent from the Detailed Description The directional terms mentioned in the following embodiments, such as "upper", "lower", "front", "back", "left", "right", etc., are only directions referring to the additional schema. Therefore, the directional terminology used is for the purpose of illustration and not limitation.
圖2是本發明一實施例的背光模組的示意圖。圖3是圖2的背光模組沿線A-A’的剖面放大示意圖。請參考圖2及圖3,在本實施例中,背光模組100包括導光板110、第一反射片120以及光源130。導光板110具有入光面113、底面112以及出光面111。底面112連接於入光面113,並且出光面111相對於底面112並且連接入光面113,其中導光板110的材質例如是玻璃、PMMA(聚甲基丙烯酸甲酯,Polymethylmethacrylate)、PC(聚碳酸酯,Polycarbonate)或其他適當的透明材質。第一反射片120例如是白反射片、銀反射片或其他適當的反射材料,第一反射片120具有第一面121、第二面122以及穿孔123。在本實施例中,第一反射片120的第二面122相對於第一面121,並且部分的第一面121配置於導光板110的底面112上。再者,第一反射片120的穿孔123連接其第一面121及第二面122。在本實施例中,光源130包括電路基板135以及發光元件132,其中發光元件132例如是發光二極體(Light emitting diode,LED)或其他適當種類的光源。如圖3所示,發光元件132鄰近入光面113,可提供光線L由入光面 113進入導光板110。 2 is a schematic diagram of a backlight module according to an embodiment of the invention. Figure 3 is an enlarged cross-sectional view of the backlight module of Figure 2 taken along line A-A'. Referring to FIG. 2 and FIG. 3 , in the embodiment, the backlight module 100 includes a light guide plate 110 , a first reflective sheet 120 , and a light source 130 . The light guide plate 110 has a light incident surface 113, a bottom surface 112, and a light exit surface 111. The bottom surface 112 is connected to the light incident surface 113, and the light emitting surface 111 is connected to the light surface 113, and the material of the light guide plate 110 is, for example, glass, PMMA (polymethylmethacrylate), PC (polycarbonate). Ester, Polycarbonate) or other suitable transparent material. The first reflective sheet 120 is, for example, a white reflective sheet, a silver reflective sheet, or other suitable reflective material. The first reflective sheet 120 has a first surface 121, a second surface 122, and a through hole 123. In this embodiment, the second surface 122 of the first reflective sheet 120 is opposite to the first surface 121 , and a portion of the first surface 121 is disposed on the bottom surface 112 of the light guide plate 110 . Furthermore, the through holes 123 of the first reflection sheet 120 are connected to the first surface 121 and the second surface 122 thereof. In this embodiment, the light source 130 includes a circuit substrate 135 and a light emitting element 132, wherein the light emitting element 132 is, for example, a light emitting diode (LED) or other suitable kind of light source. As shown in FIG. 3, the light-emitting element 132 is adjacent to the light-incident surface 113, and can provide light L from the light-incident surface. 113 enters the light guide plate 110.
除此之外,光源130的發光元件132配置於電路基板135的第一圖案化導電層135a上。發光元件132可穿設於第一反射片120的穿孔123中,並且使得發光元件132可直接連接於第一圖案化導電層135a上。由於本實施例中,部分的第一反射片120配置於第一圖案化導電層135a上,相較於圖1的習知背光模組20,可以省去習知電路基板235上的保護層(未示出),並藉由第一反射片120以達到防止第一圖案化導電層135a劣化以及絕緣的保護效果。因此,本實施例的背光模組100的厚度相較於習知的背光模組20的厚度可進一步減少,以符合目前顯示裝置薄型化的發展趨勢。 In addition, the light emitting element 132 of the light source 130 is disposed on the first patterned conductive layer 135a of the circuit substrate 135. The light emitting element 132 can be disposed in the through hole 123 of the first reflective sheet 120, and the light emitting element 132 can be directly connected to the first patterned conductive layer 135a. In this embodiment, a portion of the first reflective sheet 120 is disposed on the first patterned conductive layer 135a. Compared with the conventional backlight module 20 of FIG. 1, the protective layer on the conventional circuit substrate 235 can be omitted. Not shown), and by the first reflective sheet 120 to achieve a protective effect of preventing deterioration of the first patterned conductive layer 135a and insulation. Therefore, the thickness of the backlight module 100 of the present embodiment can be further reduced compared with the thickness of the conventional backlight module 20 to conform to the current trend of thinning the display device.
光源130例如是發光二極體條狀光源,並且光源130的發光元件132為多個在電路基板135上依序排列的發光二極體。此外,請再參考圖3,本實施例的電路基板135除第一圖案化導電層135a之外,還包括絕緣層135d、第二圖案化導電層135b以及保護層135c。在本實施例中,絕緣層135d、第二圖案化導電層135b以及保護層135c依序疊置於第一圖案化導電層135a上,並且絕緣層135d位於第一圖案化導電層135a與第二圖案化導電層135b之間。換言之,電路基板135的疊層結構中,在電路基板135的厚度方向上由上至下的排列順序依序是第一圖案化導電層135a、絕緣層135d、第二圖案化導電層135b以及保護層135c。此外,在本實施例中,還可藉由絕緣層135d的配置以使第一圖案化導電 層135a與第二圖案化導電層135b的導電通路相互絕緣,避免電路基板135發生短路的情形。其中,第一圖案化導電層135a與第二圖案化導電層135b例如是由金屬材料製成,其例如為銅箔導電層。 The light source 130 is, for example, a light-emitting diode strip light source, and the light-emitting elements 132 of the light source 130 are a plurality of light-emitting diodes sequentially arranged on the circuit board 135. In addition, referring to FIG. 3, the circuit substrate 135 of the present embodiment further includes an insulating layer 135d, a second patterned conductive layer 135b, and a protective layer 135c in addition to the first patterned conductive layer 135a. In this embodiment, the insulating layer 135d, the second patterned conductive layer 135b, and the protective layer 135c are sequentially stacked on the first patterned conductive layer 135a, and the insulating layer 135d is located on the first patterned conductive layer 135a and the second. Between the patterned conductive layers 135b. In other words, in the laminated structure of the circuit substrate 135, the first patterned conductive layer 135a, the insulating layer 135d, the second patterned conductive layer 135b, and the protection are sequentially arranged from the top to the bottom in the thickness direction of the circuit substrate 135. Layer 135c. In addition, in the embodiment, the first patterned conductive layer can also be configured by the insulating layer 135d. The conductive paths of the layer 135a and the second patterned conductive layer 135b are insulated from each other to avoid a short circuit of the circuit substrate 135. The first patterned conductive layer 135a and the second patterned conductive layer 135b are made of, for example, a metal material, which is, for example, a copper foil conductive layer.
請再參考圖3,本實施例部分的第一反射片120是配置於第一圖案化導電層135a上。因此,部分的第一反射片120與絕緣層135d是分別配置於第一圖案化導電層135a的相對兩表面135a1及135a2上。除此之外,本實施例的電路基板135與第一反射片120是以彼此互相平行的方式配置,其中電路基板135例如是將印刷電路基板或是可撓曲性軟性電路基板(Flexible Printed Circuit Board,簡稱FPCB)的保護層加以削除而成,本發明對此並不加以限制。 Referring to FIG. 3 again, the first reflective sheet 120 of the embodiment is disposed on the first patterned conductive layer 135a. Therefore, a portion of the first reflective sheet 120 and the insulating layer 135d are disposed on the opposite surfaces 135a1 and 135a2 of the first patterned conductive layer 135a, respectively. In addition, the circuit board 135 and the first reflection sheet 120 of the present embodiment are disposed in parallel with each other, and the circuit board 135 is, for example, a printed circuit board or a flexible printed circuit board (Flexible Printed Circuit). The protective layer of the Board (FPCB) is removed, and the present invention does not limit this.
如圖3所示,背光模組100可包括膠框160以及背蓋150,其中背蓋150的材質例如是金屬,膠框160的材質例如是塑膠,本發明並不以此為限。背蓋150與膠框160共同構成一個可用來容置導光板110、第一反射片120以及光源130的容置空間。背蓋150與膠框160除可容置並且保護前述的構件之外,還可遮蔽及吸收部份由光源130出射的光線L,以減少背光模組100漏光現象的產生。 As shown in FIG. 3, the backlight module 100 may include a plastic frame 160 and a back cover 150. The material of the back cover 150 is, for example, metal. The material of the plastic frame 160 is, for example, plastic. The invention is not limited thereto. The back cover 150 and the plastic frame 160 together form an accommodating space for accommodating the light guide plate 110, the first reflection sheet 120, and the light source 130. The back cover 150 and the plastic frame 160 can shield and absorb some of the light L emitted from the light source 130 in addition to the above-mentioned components, so as to reduce the light leakage phenomenon of the backlight module 100.
此外,背光模組100可包括第二反射片140。如圖3所示,本實施例的背蓋150的剖面形狀例如是U字形,其缺口朝向導光板110。因此,本實施例還可選擇性地配置第二反射片140於導光 板110的出光面111的邊緣與背蓋150的上方板體之間。第二反射片140可用於反射來自發光元件132的光線L進入導光板110中,以進一步提升光源130的光線利用效率,並可避免光線L從出光面111的邊緣與背蓋150之間出光。此外,本實施例的導光板110還具有多個光學微結構170,這些光學微結構170排列配置於導光板110的底面112上,以增加光源130的出光效率以及對於背光模組100的出光路徑的控制性。這些光學微結構170例如是均勻分布於導光板110的底面112上,然而本發明並不以此為限,光學微結構170的排列密度亦可以是隨著與光源130的距離愈遠而逐漸增加以提高導光板110的出光均勻度。 In addition, the backlight module 100 may include a second reflective sheet 140. As shown in FIG. 3, the cross-sectional shape of the back cover 150 of the present embodiment is, for example, a U-shape, and the notch faces the light guide plate 110. Therefore, the embodiment can also selectively configure the second reflective sheet 140 to guide the light. The edge of the light-emitting surface 111 of the plate 110 is between the upper plate of the back cover 150. The second reflective sheet 140 can be used to reflect the light L from the light-emitting element 132 into the light guide plate 110 to further improve the light utilization efficiency of the light source 130, and can prevent the light L from being emitted from the edge of the light-emitting surface 111 and the back cover 150. In addition, the light guide plate 110 of the present embodiment further has a plurality of optical microstructures 170 arranged on the bottom surface 112 of the light guide plate 110 to increase the light extraction efficiency of the light source 130 and the light exit path for the backlight module 100. Controllability. The optical microstructures 170 are uniformly distributed on the bottom surface 112 of the light guide plate 110. However, the present invention is not limited thereto, and the arrangement density of the optical microstructures 170 may be gradually increased as the distance from the light source 130 is further increased. In order to improve the light uniformity of the light guide plate 110.
本發明對於第一反射片120與第一圖案化導電層135a之間的接合方式並不加以限制。第一反射片120可直接配置於第一圖案化導電層135a上。或者,如圖3所示,第一反射片120也可透過第一膠層125黏合於第一圖案化導電層135a上,增加第一反射片120與電路基板135之間的定位效果,以防止這些構件之間的摩擦造成的損壞。此外,亦可藉由第一膠層125的設置避免第一圖案化導電層135a與背蓋150及膠框160之間直接接觸的情形而造成短路。 The present invention does not limit the manner of bonding between the first reflective sheet 120 and the first patterned conductive layer 135a. The first reflective sheet 120 may be directly disposed on the first patterned conductive layer 135a. Alternatively, as shown in FIG. 3, the first reflective sheet 120 is also adhered to the first patterned conductive layer 135a through the first adhesive layer 125, thereby increasing the positioning effect between the first reflective sheet 120 and the circuit substrate 135 to prevent Damage caused by friction between these components. In addition, the short circuit can be caused by the arrangement of the first adhesive layer 125 avoiding the direct contact between the first patterned conductive layer 135a and the back cover 150 and the plastic frame 160.
為使本實施例的膠框160與背蓋150更穩固的接合,本實施例的膠框160具有卡鉤162,背蓋150上還配置可與卡鉤162互相卡合的卡槽152,使膠框160以卡合方式固定於背蓋150上。再者,本實施例的第一反射片120可直接配置於膠框160上,或 者如圖3所示,第一反射片120與膠框160之間可選擇性地配置第二膠層165使第一反射片120黏著於膠框160上,以防止第一反射片120與膠框160之間相互摩擦而造成損壞。 In order to make the plastic frame 160 and the back cover 150 of the embodiment more securely coupled, the plastic frame 160 of the embodiment has a hook 162, and the back cover 150 is further provided with a card slot 152 that can engage with the hook 162. The plastic frame 160 is fixed to the back cover 150 in a snapping manner. Furthermore, the first reflective sheet 120 of the embodiment may be directly disposed on the plastic frame 160, or As shown in FIG. 3, the second adhesive layer 165 is selectively disposed between the first reflective sheet 120 and the plastic frame 160 to adhere the first reflective sheet 120 to the plastic frame 160 to prevent the first reflective sheet 120 from being glued. The frames 160 rub against each other to cause damage.
綜上所述,本發明的實施例至少具有以下其中一個優點,在本發明的上述實施例中,第一反射片可直接配置於第一圖案化導電層上,並且第一反射片具有多個穿孔。多個發光元件可分別直接經由第一反射片的穿孔穿設於第一圖案化線路層上。因此,本發明的背光模組在第一圖案化線路層上與發光元件之間無須額外地配置保護層,以減低整體背光模組的電路基板的厚度,並且有利於行動電子裝置符合薄型化的發展趨勢。此外,第一反射片亦可透過第一膠層黏合於第一圖案化導電層上,以防止這些構件之間的摩擦造成的損壞,亦可藉由第一膠層的設置避免第一圖案化導電層與背蓋及膠框之間的直接接觸而造成短路。 In summary, the embodiment of the present invention has at least one of the following advantages. In the above embodiment of the present invention, the first reflective sheet can be directly disposed on the first patterned conductive layer, and the first reflective sheet has multiple perforation. The plurality of light emitting elements may be respectively disposed on the first patterned circuit layer via the through holes of the first reflective sheet. Therefore, the backlight module of the present invention does not need to additionally provide a protective layer between the first patterned circuit layer and the light-emitting element, so as to reduce the thickness of the circuit substrate of the overall backlight module, and is advantageous for the mobile electronic device to be thinned. development trend. In addition, the first reflective sheet may also be adhered to the first patterned conductive layer through the first adhesive layer to prevent damage caused by friction between the components, and the first patterned layer may be avoided by the setting of the first adhesive layer. The direct contact between the conductive layer and the back cover and the plastic frame causes a short circuit.
惟以上所述者,僅為本發明之較佳實施例而已,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。另外,本發明的任一實施例或申請專利範圍不須達成本發明所揭露之全部目的或優點或特點。此外,摘要部分和標題僅是用來輔助專利文件搜尋之用,並非用來限制本發明之權利範圍。另外,本說明書或申請專利範圍中提及的“第一”、“第二”等用語僅用以命名元件(element)的名稱或區別不同實施例或範圍,而並非用來限制元件數量上的上限或下限。 The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent. In addition, any of the objects or advantages or features of the present invention are not required to be achieved by any embodiment or application of the invention. In addition, the abstract sections and headings are only used to assist in the search of patent documents and are not intended to limit the scope of the invention. In addition, the terms "first", "second" and the like mentioned in the specification or the scope of the claims are only used to name the elements or distinguish different embodiments or ranges, and are not intended to limit the number of elements. Upper or lower limit.
100‧‧‧背光模組 100‧‧‧Backlight module
110‧‧‧導光板 110‧‧‧Light guide plate
111‧‧‧出光面 111‧‧‧Glossy surface
112‧‧‧底面 112‧‧‧ bottom
113‧‧‧入光面 113‧‧‧Into the glossy surface
120‧‧‧第一反射片 120‧‧‧First reflection sheet
121‧‧‧第一面 121‧‧‧ first side
122‧‧‧第二面 122‧‧‧ second side
123‧‧‧穿孔 123‧‧‧Perforation
125‧‧‧膠層 125‧‧‧ glue layer
130‧‧‧光源 130‧‧‧Light source
132‧‧‧發光元件 132‧‧‧Lighting elements
135‧‧‧電路基板 135‧‧‧ circuit board
135a‧‧‧第一圖案化導電層 135a‧‧‧First patterned conductive layer
135a1‧‧‧表面 135a1‧‧‧ surface
135a2‧‧‧表面 135a2‧‧‧ surface
135b‧‧‧第二圖案化導電層 135b‧‧‧Second patterned conductive layer
135c‧‧‧保護層 135c‧‧‧protective layer
135d‧‧‧絕緣層 135d‧‧‧Insulation
140‧‧‧第二反射片 140‧‧‧Second reflector
150‧‧‧背蓋 150‧‧‧Back cover
152‧‧‧卡槽 152‧‧‧ card slot
160‧‧‧膠框 160‧‧‧ plastic frame
162‧‧‧卡勾 162‧‧‧ hook
165‧‧‧膠層 165‧‧ ‧ glue layer
170‧‧‧光學微結構 170‧‧‧Optical microstructure
L‧‧‧光線 L‧‧‧Light

Claims (9)

  1. 一種背光模組,包括:一導光板,具有一入光面、一底面及一出光面,其中該底面連接於該入光面,且該出光面相對於該底面並連接該入光面;一第一反射片,具有一第一面、一第二面及至少一穿孔,其中該第二面相對於該第一面,該第一面的一部分配置在該底面上,且該至少一穿孔連接該第一面及該第二面;以及一光源,包括:一電路基板,具有一第一圖案化導電層,且該第一圖案化導電層為該電路基板的最上層,其中該第一反射片的該第二面的一部分配置在該第一圖案化導電層上;以及至少一發光元件,適於提供一光線由該入光面進入該導光板,其中每一該發光元件穿設於該第一反射片的該至少一穿孔且配置於該電路基板的該第一圖案化導電層上。 A backlight module includes: a light guide plate having a light incident surface, a bottom surface, and a light exiting surface, wherein the bottom surface is connected to the light incident surface, and the light emitting surface is connected to the light incident surface relative to the bottom surface; a reflective sheet having a first surface, a second surface, and at least one through hole, wherein the second surface is opposite to the first surface, a portion of the first surface is disposed on the bottom surface, and the at least one perforation is connected to the first surface And a light source comprising: a circuit substrate having a first patterned conductive layer, wherein the first patterned conductive layer is an uppermost layer of the circuit substrate, wherein the first reflective sheet a portion of the second surface is disposed on the first patterned conductive layer; and at least one light emitting element is adapted to provide a light from the light incident surface into the light guide plate, wherein each of the light emitting elements is disposed in the first The at least one through hole of the reflective sheet is disposed on the first patterned conductive layer of the circuit substrate.
  2. 如申請專利範圍第1項所述的背光模組,其中該電路基板更具有一絕緣層、一第二圖案化導電層及一保護層,該絕緣層、該第二圖案化導電層以及該保護層依序疊置於該第一圖案化導電層上,且該絕緣層位於該第一圖案化導電層與該第二圖案化導電層之間。 The backlight module of claim 1, wherein the circuit substrate further comprises an insulating layer, a second patterned conductive layer and a protective layer, the insulating layer, the second patterned conductive layer and the protection The layers are sequentially stacked on the first patterned conductive layer, and the insulating layer is located between the first patterned conductive layer and the second patterned conductive layer.
  3. 如申請專利範圍第2項所述的背光模組,其中該第一反射片與該絕緣層分別配置於該第一圖案化導電層的相對兩表面。 The backlight module of claim 2, wherein the first reflective sheet and the insulating layer are respectively disposed on opposite surfaces of the first patterned conductive layer.
  4. 如申請專利範圍第1項所述的背光模組,其中該電路基板 具有可撓曲性。 The backlight module of claim 1, wherein the circuit substrate Flexible.
  5. 如申請專利範圍第1項所述的背光模組,更包括:一膠框;以及一背蓋,與該膠框構成一容置空間,以容置該導光板、該第一反射片及該光源。 The backlight module of claim 1, further comprising: a plastic frame; and a back cover, and the plastic frame forms an accommodating space for accommodating the light guide plate, the first reflective sheet and the light source.
  6. 如申請專利範圍第5項所述的背光模組,更包括:一第二反射片,配置在該導光板的該出光面的邊緣與該背蓋之間。 The backlight module of claim 5, further comprising: a second reflective sheet disposed between an edge of the light emitting surface of the light guide plate and the back cover.
  7. 如申請專利範圍第5項所述的背光模組,其中該第一圖案化導電層不與該膠框以及該背蓋直接接觸。 The backlight module of claim 5, wherein the first patterned conductive layer is not in direct contact with the plastic frame and the back cover.
  8. 如申請專利範圍第1項所述的背光模組,其中該第一反射片與該電路基板相互平行。 The backlight module of claim 1, wherein the first reflective sheet and the circuit substrate are parallel to each other.
  9. 如申請專利範圍第1項所述的背光模組,其中該導光板具有多個光學微結構,且該些光學微結構配置於該底面。 The backlight module of claim 1, wherein the light guide plate has a plurality of optical microstructures, and the optical microstructures are disposed on the bottom surface.
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