TWI546880B - - Google Patents

Info

Publication number
TWI546880B
TWI546880B TW103123871A TW103123871A TWI546880B TW I546880 B TWI546880 B TW I546880B TW 103123871 A TW103123871 A TW 103123871A TW 103123871 A TW103123871 A TW 103123871A TW I546880 B TWI546880 B TW I546880B
Authority
TW
Taiwan
Application number
TW103123871A
Other languages
Chinese (zh)
Other versions
TW201521136A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of TW201521136A publication Critical patent/TW201521136A/en
Application granted granted Critical
Publication of TWI546880B publication Critical patent/TWI546880B/zh

Links

TW103123871A 2013-11-28 2014-07-10 Semiconductor processing apparatus and gas distribution board applicable to semiconductor processing apparatus TW201521136A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310627145.XA CN104674190B (en) 2013-11-28 2013-11-28 A kind of semiconductor processing device and the gas distribution grid applied to semiconductor processing device

Publications (2)

Publication Number Publication Date
TW201521136A TW201521136A (en) 2015-06-01
TWI546880B true TWI546880B (en) 2016-08-21

Family

ID=53309761

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103123871A TW201521136A (en) 2013-11-28 2014-07-10 Semiconductor processing apparatus and gas distribution board applicable to semiconductor processing apparatus

Country Status (2)

Country Link
CN (1) CN104674190B (en)
TW (1) TW201521136A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI579404B (en) * 2015-08-14 2017-04-21 精曜有限公司 Gas distribution plate
JP6240695B2 (en) * 2016-03-02 2017-11-29 株式会社日立国際電気 Substrate processing apparatus, semiconductor device manufacturing method, and program
CN106591805B (en) * 2016-11-23 2019-01-15 佛山市中山大学研究院 A kind of MOCVD device spray head and MOCVD device and intake method comprising it
CN110195215A (en) * 2019-06-28 2019-09-03 云谷(固安)科技有限公司 Gas spray and film forming chamber
CN117612977B (en) * 2024-01-23 2024-04-05 上海邦芯半导体科技有限公司 Air inlet device and air inlet method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101110635B1 (en) * 2005-03-10 2012-02-15 삼성전자주식회사 Device for making semiconductor
US7976631B2 (en) * 2007-10-16 2011-07-12 Applied Materials, Inc. Multi-gas straight channel showerhead
CN101339895B (en) * 2008-08-22 2010-06-02 北京北方微电子基地设备工艺研究中心有限责任公司 Gas distribution device and plasma processing apparatus applying the same
CN100568453C (en) * 2008-08-22 2009-12-09 北京北方微电子基地设备工艺研究中心有限责任公司 Apparatus for processing plasma, gas distributing device and gas delivery method
CN201785486U (en) * 2010-08-17 2011-04-06 彭继忠 Novel spray header device of MOCVD equipment

Also Published As

Publication number Publication date
TW201521136A (en) 2015-06-01
CN104674190B (en) 2017-10-20
CN104674190A (en) 2015-06-03

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