TWI546184B - Three dimensional printing carrier and three dimensional printing method - Google Patents

Description

Three-dimensional printing carrier board and three-dimensional printing method

The present invention relates to a carrier plate and a molding method, and more particularly to a three-dimensional printing carrier and a three-dimensional printing method.

With the development of technology, 3D printing technology and Additive Manufacturing (AM) technology have become one of the most important development technologies. These technologies are one of the rapid prototyping technologies. They can directly produce the desired finished product directly by the user-designed digital model file, and the finished product is almost a three-dimensional entity of any shape. In the past, in the field of mold manufacturing, industrial design, etc., 3D printing technology is often used to make models, and now it is gradually used in jewelry, footwear, industrial design, construction, engineering, automotive, aerospace, dental and medical industries, education. , civil engineering and other fields.

The existing three-dimensional printing technology has various molding mechanisms according to various models and materials, among which Selective Laser Sintering (SLS) and Selective Laser Melting (SLM) are Lasers are used to define the shape of a three-dimensional solid, so that a three-dimensional object that can be formed can be formed of a ceramic material or a metal material, and has high precision and good surface quality, and is widely used in various fields mentioned above.

However, when the three-dimensional printing technique described above is used to fabricate a three-dimensional object of a ceramic material, the ceramic carrier for carrying a three-dimensional object may be cracked due to a large temperature change, thereby affecting the formation of a three-dimensional object. On the other hand, when a three-dimensional object is formed on a ceramic carrier, it is easy to break the three-dimensional object itself when separating the three-dimensional object from the ceramic carrier, thereby greatly reducing the yield of the three-dimensional object.

The present invention provides a three-dimensional printing carrier on which a ceramic three-dimensional object can be formed well.

The present invention provides a three-dimensional printing method which can form a ceramic three-dimensional object well.

The three-dimensional printing carrier of an embodiment of the present invention is adapted to provide a molding surface for forming a three-dimensional object. The three-dimensional printing carrier includes a composite substrate, a metal sacrificial layer, and a ceramic seed layer. The composite substrate includes a metal plate and a ceramic coating covering the metal plate. The metal sacrificial layer connects the ceramic cladding layer of the composite substrate and the ceramic seed layer, and the molding surface is located on the surface of the ceramic seed layer facing away from the metal sacrificial layer, and the metal sacrificial layer is adapted to be removed by a removal liquid.

The three-dimensional printing method of an embodiment of the present invention is suitable for forming a three-dimensional object. The three-dimensional printing method comprises providing a three-dimensional printing carrier, wherein the three-dimensional printing carrier comprises a composite substrate, a metal sacrificial layer and a ceramic seed layer; forming a three-dimensional object on the ceramic seed by selective laser sintering or selective laser sintering a molding surface of the layer; removing the metal coating layer connecting the ceramic cladding layer of the composite substrate and the ceramic seed layer with a removal liquid. The composite substrate described above includes a metal plate and a ceramic coating layer covering the metal plate, and the molding surface is located on a surface of the ceramic seed layer facing away from the metal sacrificial layer.

In an embodiment of the invention, the thickness of the ceramic seed layer in the direction parallel to the normal vector of the forming surface falls between 0.1 mm and 1 mm.

In an embodiment of the invention, the material for forming the removal liquid includes hydrofluoric acid, sulfuric acid, hydrogen peroxide or nitric acid, and the ceramic seed layer and the ceramic coating layer are adapted to resist corrosion of the removal liquid.

In an embodiment of the invention, the material of the metal plate comprises titanium.

In an embodiment of the invention, the metal plate has a thickness in a first direction that is greater than 5 mm, and the first direction is parallel to a normal vector of the molding surface.

In an embodiment of the invention, the ceramic cladding layer and the ceramic seed layer are made of zirconium dioxide.

In an embodiment of the invention, the material of the metal sacrificial layer comprises titanium, nickel, steel or iron.

In an embodiment of the invention, the ceramic coating layer is formed on the metal plate by evaporation or sputtering, and the ceramic seed layer is formed on the metal sacrificial layer by evaporation or sputtering.

Based on the above, since the three-dimensional printing carrier of the embodiment of the present invention includes a composite substrate, and the composite substrate has a metal plate, it can withstand a large temperature change. On the other hand, the three-dimensional printing carrier of the embodiment of the present invention has a metal sacrificial layer under the ceramic seed layer, so that when a three-dimensional object is formed in the ceramic seed layer, the three-dimensional object can be easily removed from the composite substrate. Since the three-dimensional printing method of the embodiment of the present invention applies the above-described three-dimensional printing carrier, the molding surface can avoid cracking during the formation of the three-dimensional object, and can easily remove the three-dimensional object from the composite substrate.

The above described features and advantages of the invention will be apparent from the following description.

1 is a cross-sectional view of a three-dimensional print carrier in accordance with an embodiment of the present invention. Referring to FIG. 1, in an embodiment of the invention, a three-dimensional printing carrier 100 is used to provide a molding surface 101 for forming a three-dimensional object thereon. The three-dimensional print carrier 100 includes a composite substrate 110, a metal sacrificial layer 120, and a ceramic seed layer 130. The metal sacrificial layer 120 is disposed on the composite substrate 110. The ceramic seed layer 130 is disposed on the metal sacrificial layer 120. The metal sacrificial layer 120 is disposed between the composite substrate 110 and the ceramic seed layer 130. The molding surface 101 is located on the ceramic seed layer 130 facing away from the metal. The surface of the sacrificial layer 120, that is, the surface of the ceramic seed layer 130, is adapted to form a three-dimensional object.

In the present embodiment, the composite substrate 110 includes a metal plate 112 and a ceramic cladding layer 114 covering the metal plate 112, that is, the surface of the composite substrate 110 is formed by the ceramic cladding layer 114. The metal sacrificial layer 120 connects the ceramic cladding layer 114 of the composite substrate 110 and the ceramic seed layer 130, so that the ceramic seed layer 130 can form the molding surface 101 on the composite substrate 110.

2A is a schematic cross-sectional view showing the formation of a three-dimensional object by a three-dimensional printing carrier according to an embodiment of the invention. 2B is a schematic cross-sectional view of a three-dimensional printed carrier removing metal sacrificial layer in accordance with an embodiment of the present invention. Referring to FIG. 2A and FIG. 2B, in the embodiment, the metal sacrificial layer 120 is adapted to be removed by a removal liquid. Therefore, after a three-dimensional object 200 is formed on the molding surface 101 of the present embodiment, the three-dimensional object 200 and the ceramic seed layer 130 can be easily removed from the composite substrate 110 by removing the metal sacrificial layer 120.

Since the composite substrate 110 of the present embodiment has the metal plate 112, when the three-dimensional object 200 is formed on the molding surface 101 by a three-dimensional printing technique such as selective laser sintering or selective laser sintering, it is improved by laser irradiation. The temperature of the metal plate 112 can also be absorbed by the metal plate 112, and the metal material characteristics of the metal plate 112 can also prevent the crack of the composite substrate 110.

On the other hand, the three-dimensional print carrier 100 of the present embodiment has the metal sacrificial layer 120 disposed between the ceramic seed layer 130 and the ceramic cladding layer 114 of the composite substrate 110, so that when the three-dimensional object 200 is formed on the ceramic seed layer 130 Thereafter, the metal sacrificial layer 120, which can be removed by the removal liquid, allows the three-dimensional object 200 to be easily and completely removed from the composite substrate 110.

In detail, in the present embodiment, the material of the metal sacrificial layer 120 described above includes iron, and the above-mentioned removal liquid is, for example, hydrofluoric acid, but the invention is not limited thereto. In other embodiments, the material of the metal sacrificial layer 120 may further comprise titanium, nickel, steel, iron or an alloy of the above metals, and the liquid removing material may further comprise hydrofluoric acid, sulfuric acid, hydrogen peroxide or nitric acid, and the invention is not limited thereto. this.

On the other hand, since the ceramic cladding layer 114 covers the metal plate 112, the surface of the composite substrate 110 is formed of the ceramic cladding layer 114. The ceramic seed layer 130 and the ceramic cladding layer 114 formed of a ceramic material such as zirconium dioxide can resist corrosion of the removal liquid, thereby providing a good protection effect of the composite substrate 110 and the three-dimensional object 200 when the metal sacrificial layer 120 is removed. . Further, the composite substrate 110 can be reused by completely covering the metal plate 112 in the ceramic cladding layer 114.

The thickness h2 of the ceramic seed layer 130 of the present embodiment in the direction d1 is not less than 0.1 mm, and preferably the thickness h2 of the ceramic seed layer 130 is in the range of 0.1 mm to 1 mm. When the thickness of the ceramic seed layer in the direction d1 is less than 0.1 mm, the metal sacrificial layer 120 under the heated ceramic seed layer 130 is melted by absorbing too much heat, and the molten metal sacrificial layer 120 is further diffused to the ceramic. The seed layer 130 or even the three-dimensional object 200 affects the material quality of the three-dimensional object 200.

In the composite substrate of the present embodiment, the thickness h1 of the metal plate 112 in the direction d1 parallel to the molding surface 101 is greater than 5 cm (millimeter, mm ), and thus when the composite substrate 110 is in a three-dimensional column such as selective laser sintering When locally heated during printing, the metal plate 112 in the composite substrate 110 can properly absorb thermal energy, and the metal plate 112 can provide good ductility to avoid chipping of the composite substrate 110. In detail, the material of the metal plate 112 of the present embodiment includes, for example, titanium, which can provide good material properties.

Referring to FIG. 2A and FIG. 2B, in the three-dimensional printing method for forming a three-dimensional object 200 according to an embodiment of the present invention, the three-dimensional printing carrier 100 is applied. Therefore, for the relative relationship between the components in the three-dimensional printing carrier 100, please refer to The above description will not be repeated here.

The three-dimensional printing method of the present embodiment forms a three-dimensional object 200 on the molding surface 101 of the ceramic seed layer 130 by selective laser sintering or selective laser sintering. Since the ceramic seed layer 130 has a proper thickness to prevent the metal sacrificial layer 120 from melting, and the metal plate 112 occupies a high proportion in the three-dimensional printing carrier 100, the heat energy generated in forming the three-dimensional object 200 can be obtained by the metal plate. The good thermal conductivity and extension properties of 112 are enhanced to increase the yield of the three-dimensional object 200.

The three-dimensional printing method of the present embodiment then removes the ceramic coating layer 114 of the composite substrate 110 and the metal sacrificial layer 120 of the ceramic seed layer 130 with a removal liquid to remove the three-dimensional object 200 from the composite substrate 110. Specifically, by removing the metal sacrificial layer 120 connecting the surface 131 of the ceramic seed layer 130, the surfaces of the three-dimensional object 200 and the ceramic seed layer 130 are not cracked by additional physical processing, thereby ensuring the formation of a three-dimensional object. rate.

In the above embodiment of the present invention, the ceramic coating layer 114 is formed on the metal plate 112 by evaporation or sputtering, for example, and the ceramic seed layer 130 is formed on the metal by evaporation or sputtering, for example. Sacrificial layer 120. Therefore, the ceramic cladding layer 114 and the ceramic seed layer 130 can have a suitable thickness while also having a good covering effect and a coating effect.

In summary, since the composite substrate of the three-dimensional printing carrier of the embodiment of the present invention is formed by a metal plate coated with a ceramic coating layer, has good thermal conductivity and ductility, and thus can withstand large temperature changes. To avoid cracking of the composite substrate during three-dimensional printing. In another aspect, the three-dimensional printing carrier of the embodiment of the present invention has a metal sacrificial layer between the ceramic seed layer and the ceramic coating layer, and the ceramic seed layer and the ceramic coating layer can be released by removing the liquid corrosion metal sacrificial layer. The connection relationship between the two, so that the three-dimensional object formed on the ceramic seed layer can be well removed from the composite substrate. Since the three-dimensional printing method of the embodiment of the present invention applies the above-described three-dimensional printing carrier, the molding surface can avoid cracking during the formation of the three-dimensional object, and the three-dimensional object can be easily removed from the composite substrate.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

D1‧‧‧ direction
H1, h2‧‧‧ thickness
100‧‧‧3D printing carrier
101‧‧‧ molding surface
110‧‧‧Composite substrate
112‧‧‧Metal plates
114‧‧‧Ceramic coating
120‧‧‧metal sacrificial layer
130‧‧‧Ceramic seed layer
131‧‧‧ surface
200‧‧‧3D objects

1 is a cross-sectional view of a three-dimensional print carrier in accordance with an embodiment of the present invention. 2A is a schematic cross-sectional view showing the formation of a three-dimensional object by a three-dimensional printing carrier according to an embodiment of the invention. 2B is a schematic cross-sectional view of a three-dimensional printed carrier removing metal sacrificial layer in accordance with an embodiment of the present invention.

D1‧‧‧ direction

H1, h2‧‧‧ thickness

100‧‧‧3D printing carrier

101‧‧‧ molding surface

110‧‧‧Composite substrate

112‧‧‧Metal plates

114‧‧‧Ceramic coating

120‧‧‧metal sacrificial layer

130‧‧‧Ceramic seed layer

Claims (10)

A three-dimensional printing carrier is adapted to provide a molding surface for forming a three-dimensional object, the three-dimensional printing carrier comprises: a composite substrate comprising: a metal plate; and a ceramic coating layer covering the metal plate; a metal sacrificial layer; and a ceramic seed layer connecting the ceramic cladding layer of the composite substrate and the ceramic seed layer, and the molding surface is located on a surface of the ceramic seed layer facing away from the metal sacrificial layer, wherein the The metal sacrificial layer is adapted to be removed by a removal liquid. The three-dimensional printing carrier according to claim 1, wherein the ceramic seed layer has a thickness in a first direction of not less than 0.1 mm, and the first direction is parallel to a normal vector of the molding surface. The three-dimensional printing carrier according to claim 1, wherein the material forming the removal liquid comprises hydrofluoric acid, sulfuric acid, hydrogen peroxide or nitric acid. The three-dimensional printing carrier according to claim 1, wherein the material of the metal plate comprises titanium. The three-dimensional printing carrier according to claim 1, wherein the metal plate has a thickness in a first direction greater than 5 mm, the first direction being parallel to a normal vector of the molding surface. The three-dimensional printing carrier according to claim 1, wherein the ceramic coating layer and the ceramic seed layer comprise zirconium dioxide. The three-dimensional printing carrier according to claim 1, wherein the metal sacrificial layer comprises titanium, nickel, steel or iron. The three-dimensional printing carrier according to claim 1, wherein the ceramic coating is formed on the metal plate by evaporation or sputtering, and the ceramic seed layer is evaporated or splashed. A plating method is formed on the metal sacrificial layer. A three-dimensional printing method is suitable for forming a three-dimensional object, the three-dimensional printing method comprising: providing a three-dimensional printing carrier, comprising a composite substrate, a metal sacrificial layer and a ceramic seed layer, and the composite substrate comprises a a metal plate and a ceramic coating layer covering the metal plate, the metal sacrificial layer is connected to the ceramic coating layer of the composite substrate and the ceramic seed layer, and the ceramic seed layer has a shape facing away from the surface of the metal sacrificial layer Forming the three-dimensional object on the molding surface by selective laser sintering or selective laser sintering; and removing the metal sacrificial layer with a removal liquid. The three-dimensional printing method according to claim 9, wherein the ceramic seed layer has a thickness in a first direction of not less than 0.1 mm, and the first direction is parallel to a normal vector of the molding surface.