TWI545612B - - Google Patents

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Publication number
TWI545612B
TWI545612B TW103141173A TW103141173A TWI545612B TW I545612 B TWI545612 B TW I545612B TW 103141173 A TW103141173 A TW 103141173A TW 103141173 A TW103141173 A TW 103141173A TW I545612 B TWI545612 B TW I545612B
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TW
Taiwan
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TW103141173A
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TW201528327A (zh
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Links

TW103141173A 2013-12-12 2014-11-27 用於電感耦合型等離子處理器射頻視窗的加熱裝置 TW201528327A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310671759.8A CN104717817A (zh) 2013-12-12 2013-12-12 一种用于电感耦合型等离子处理器射频窗口的加热装置

Publications (2)

Publication Number Publication Date
TW201528327A TW201528327A (zh) 2015-07-16
TWI545612B true TWI545612B (zh) 2016-08-11

Family

ID=53416638

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103141173A TW201528327A (zh) 2013-12-12 2014-11-27 用於電感耦合型等離子處理器射頻視窗的加熱裝置

Country Status (2)

Country Link
CN (1) CN104717817A (zh)
TW (1) TW201528327A (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106711006B (zh) * 2015-11-13 2019-07-05 北京北方华创微电子装备有限公司 上电极组件及半导体加工设备
CN107305832A (zh) * 2016-04-25 2017-10-31 中微半导体设备(上海)有限公司 一种半导体处理装置及处理基片的方法
US11749509B2 (en) * 2017-02-20 2023-09-05 Beijing E-Town Semiconductor Technology, Co., Ltd Temperature control using temperature control element coupled to faraday shield
CN111261483B (zh) * 2018-11-30 2022-03-11 江苏鲁汶仪器有限公司 一种耦合窗加热装置及具有其的电感耦合等离子处理装置
CN112071734B (zh) * 2019-06-11 2023-10-31 中微半导体设备(上海)股份有限公司 绝缘材料窗及其制造方法及电感耦合等离子体处理装置
CN113571399A (zh) * 2020-04-29 2021-10-29 北京鲁汶半导体科技有限公司 一种等离子刻蚀机及其使用方法
CN113745084A (zh) * 2020-05-28 2021-12-03 北京鲁汶半导体科技有限公司 一种法拉第屏蔽装置、等离子体刻蚀系统及其使用方法
CN211957596U (zh) * 2020-05-28 2020-11-17 北京鲁汶半导体科技有限公司 一种等离子体刻蚀系统及其可用于加热的法拉第屏蔽装置
CN113921360B (zh) * 2020-07-10 2023-10-31 中微半导体设备(上海)股份有限公司 等离子体处理装置中的加热装置及抗射频干扰方法
CN115513025A (zh) * 2021-06-23 2022-12-23 北京鲁汶半导体科技有限公司 一种等离子刻蚀机的激励射频系统

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100372317B1 (ko) * 1997-03-17 2003-05-16 마쯔시다덴기산교 가부시키가이샤 플라즈마처리방법및장치
EP1230663A1 (en) * 1999-11-15 2002-08-14 LAM Research Corporation Temperature control system for plasma processing apparatus
CN101818336B (zh) * 2004-07-05 2011-09-14 东京毅力科创株式会社 处理装置和加热器单元
KR101554123B1 (ko) * 2008-03-21 2015-09-18 어플라이드 머티어리얼스, 인코포레이티드 차폐식 리드 히터 조립체
CN101827466B (zh) * 2010-03-30 2012-05-02 东莞宏威数码机械有限公司 平板加热装置
CN202058689U (zh) * 2011-05-25 2011-11-30 中微半导体设备(上海)有限公司 一种用于等离子处理器的加热装置
KR101251930B1 (ko) * 2011-06-03 2013-04-08 (주)스마텍 필드 강화 유도 결합 플라즈마 처리 장치 및 플라즈마 형성 방법
CN203310073U (zh) * 2013-05-07 2013-11-27 富铄科技股份有限公司 加热器

Also Published As

Publication number Publication date
TW201528327A (zh) 2015-07-16
CN104717817A (zh) 2015-06-17

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