TWI545478B - Very fine metal wire manufacturing method and its structure - Google Patents

Description

Manufacturing method and structure of extremely fine metal lines

The present invention relates to a method for manufacturing a touch sensor in a circuit substrate or a touch panel having a very thin metal line, and a structure thereof, and more particularly to a method for forming a conductive electrode by using a masking step while providing a surface of the conductive electrode. The structure and method of complete cladding protection enhances the production yield and durability of metal circuits.

With the development of electronic information products in the direction of lightness and thinness, the manufacturing method of semiconductors is also moving toward high-density and automated production. Currently, R&D personnel in the industry are moving toward electronic circuits with circuit boards or sensing electrodes on the market. The wire diameter of the metal line in the product or equipment is made very fine as the research and development direction.

In fact, in general, the structure and process of the metal circuit, usually in step (1), the metal conductive electrode layer to be formed into the metal wiring body is adhered to the substrate through at least one adhesion layer (also referred to as an adhesion layer) to have a line pattern. The metal circuit is not easily detached from the substrate, and step (2) then covers at least one weather resistant layer (resist layer) on the upper surface of the metal line, and step (3) forms a line pattern between the metal lines. The masking layer, step (4) is followed by wet etching using an etching liquid to form a metal conductive electrode electrode line, and the mask layer is removed to complete the preliminary fabrication of the metal line, and The sensing electrodes of the control panel can be used to carry out the entire surface of the sensing electrodes in the circuit substrate or the touch panel with an OCC before the final sensing electrodes are completed.

The conventional adhesion layer is generally designed as two layers, which are respectively an interposer combined with the substrate and a conductive substrate layer combined with the metal conductive electrode layer.

However, the wet etching is isotropic, and since the weathering layer is an etching resistant material, the etching rate between the weathering layer and the metal conductive electrode layer for the etching liquid is very large, and The distribution of the weather-resistant layer formed in the step (3) is often a thickness unevenness state. Therefore, when the etching solution is longitudinally etched, lateral etching of the surface of the metal conductive electrode layer during the etching process is bound to occur. The phenomenon.

In other words, it is the left and right side portions of the above metal lines, especially the metal lines having a width of the wire diameter of less than 20 μm and a thickness design of more than 0.3 μm, which is more likely to occur in the lateral etching phenomenon. The ratio of the total area of the etching of the metal line is too large, and the local unevenness in the etching process further causes the impedance value of the wire diameter of the metal line to be too large, so that the yield and quality of the metal line produced by the manufacturer are difficult to control. It is a fundamental problem for the development of ultra-fine metal lines.

Furthermore, in the case where the wire diameter of the electrode line which is commonly used in the industrial field is extremely fine, if the protective measures are not further designed, the user can use it for a long time in the environment. Under oxidation, the extremely fine metal wires in the above electronic products may not be able to achieve the originally predetermined working efficiency, which may shorten the service life of the products, affect the yield of finished products of the final electronic products produced by the manufacturers, and the environmental durability. Performance and many other possible situations.

In addition, a series of strictly specified environmental testing experiments are performed on the electronic products having the fine metal lines as described above, for example, the touch panel is subjected to a high temperature heating test under 1000 hours, 85 ° C, and 90% humidity. Alternatively, it may be boiled at 100 ° C for 100 minutes to simulate a long-term high temperature and high pressure environment.

In the present two kinds of detection experiments, water molecules penetrate into the above protective film, and then contact with the above metal circuit, which is likely to cause a gradual oxidation phenomenon of the metal line, thereby knowing that if the user uses the above process for a long time In the electronic products produced, the impedance value of the capacitive sensing that forms the touch screen is likely to increase greatly until it is unable to supply the user to a normal use state.

The lack of a touch panel of an electronic product having a circuit board or an induction electrode of the above metal wiring produced by the above-mentioned various conventional processes is the object of the present invention.

SUMMARY OF THE INVENTION A primary object of the present invention is to provide a process for producing a conductive electrode having a very fine wire diameter by using an associated step of a shielding layer having a predetermined line pattern, which is a step of replacing a conventional metal wire by an etching technique. The result of a serious reduction in the yield of the metal line product caused by the severe lateral etching phenomenon of the material of the conventional metal circuit during the etching process is completely avoided.

Another object of the present invention is to produce a metal line using a related step of a masking layer having a predetermined line pattern, which achieves the purpose of accurately controlling and maintaining the wire diameter of each of the conductive electrodes.

A further object of the present invention is to design a complete weather-resistant layer coating protection through a conductive electrode forming a line pattern, thereby further reducing the oxidation process of the conductive electrode in the air for a long time in the air, and enhancing the conductivity. The corrosion resistance of the electrode extends the useful life of the circuit board or touch panel related products.

In order to achieve the above object, in the method for manufacturing a very fine metal circuit of the present invention, (A) a selected substrate is used to form a substrate layer; (B) a shielding layer is formed on the surface of the substrate layer, and the shielding layer has a plurality of layers. a groove of the line pattern; (C) forming an adhesion layer on the surface of the shielding layer and the surface of the plurality of grooves; (D) forming a conductive layer filling the plurality of grooves on the surface of the adhesion layer; (E) removing the local conductive layer and the adhesion layer on the upper surface of the shielding layer, and forming a conductive electrode by the adhesion layer remaining in the groove and the conductive layer, and the substrate layer and the plurality of conductive electrodes are combined The above metal line.

In the first preferred embodiment, the step (E) further includes a step (F) of removing the shielding layer, and the substrate layer and the plurality of conductive electrodes together form a circuit substrate having a line pattern, and The outer peripheral surface of the conductive electrodes forms a weather resistant layer to isolate the conductive electrodes from the outside.

In the second preferred embodiment, the step (E) further includes a step (F) of forming a weather-resistant layer on the upper surface of the conductive electrode and removing the shielding layer, the substrate layer, the plurality of conductive electrodes, and The weather resistant layers collectively constitute a circuit substrate having a line pattern.

The weatherable layer may be provided to shield the conductive layer and have blackening properties.

Furthermore, in a preferred embodiment, the step (C) further forms an interposer on the surface of the substrate layer, forms a conductive base layer on the surface of the interposer, and forms a surface on the conductive substrate layer. An anti-oxidation layer is used to jointly construct the above adhesion layer.

In another preferred embodiment, the step (C) further forms a blackening layer on the surface of the substrate layer, forms an interposer on the surface of the blackening layer, and forms a conductive layer on the surface of the interposing layer. The base layer is used to jointly construct the above adhesion layer.

In a further preferred embodiment, the step (C) further forms a blackening layer on the surface of the substrate layer, forms an interposer on the surface of the blackening layer, and forms a conductive layer on the surface of the interposer layer. The base layer and an anti-oxidation layer are formed on the surface of the conductive base layer to jointly construct the adhesion layer.

Moreover, the above adhesion layer may be selected from vacuum sputtering, electroless plating, or vapor deposition, or a combination thereof.

The above masking layer is processed by one of printing or photoresist exposure developing techniques or a combination thereof.

The conductive layer may be selected from the group consisting of vacuum sputtering, evaporation, electroless plating, electroplating, or conductive polymer coating, or a combination thereof.

The weatherable layer may be selected from one of electroless plating, electroplating, or conductive polymer coating, or a combination thereof.

Furthermore, the ultrafine metal circuit of the present invention comprises a substrate layer; and a plurality of conductive electrodes are arranged on the surface of the substrate layer to form a line pattern, and the conductive electrode is provided with an adhesion layer connected to the substrate layer. The adhesion layer forms a recess and accommodates a conductive layer in the recess.

Moreover, the conductive electrode further includes a weather-resistant layer disposed on the surface of the conductive electrode. More precisely, in a preferred embodiment, the weather-resistant layer is coated on the outer peripheral surface of the conductive electrode to make the conductive layer. And the adhesion layer is isolated from the outside, or in another preferred embodiment, the weather resistance layer is formed on the upper surface of the conductive electrode.

In addition, the above adhesion layer can be designed into three different structural forms, as described below:

The first type is that the adhesion layer comprises an interposer on the surface of the substrate layer, a conductive substrate layer formed on the surface of the interposer, and an anti-oxidation layer on the surface of the conductive substrate layer.

The second type is that the adhesion layer comprises a blackening layer formed on a surface of the substrate layer, an interposer formed on a surface of the blackening layer, and a conductive underlayer formed on a surface of the interposer.

And a third embodiment, wherein the adhesion layer comprises a blackening layer formed on a surface of the substrate layer, an interposer formed on a surface of the blackening layer, a conductive underlayer formed on a surface of the interposer, and An oxidation resistant layer formed on a surface of the above conductive substrate layer.

Wherein, the base material layer may be composed of a soft material or a glass plate, and the soft material is composed of polyterephthalic acid as a diester, polymethyl methacrylate, polycarbonate, polyphenylene fluorene or polyethylene. The amine is either one of polyamines.

The above adhesion layer is made of one of a metal, a metal oxide or a composite material thereof, and the metal is selected from the group consisting of tungsten, nickel, chromium, copper, vanadium, molybdenum, tin, zinc, cobalt, iron, and titanium. Or one of aluminum, bismuth or an alloy thereof, wherein the metal oxide is one of tungsten, nickel, chromium, copper, vanadium, molybdenum, tin, zinc, cobalt, iron, titanium, aluminum, cerium or an alloy thereof. Made by oxidation.

The conductive layer is made of a metal such as gold, copper, silver, zinc, aluminum, nickel, tin, or an alloy thereof, or one of conductive polymer materials.

The weathering layer is made of carbon, graphite, metal, metal oxide, conductive polymer material or a composite material thereof, and the metal is selected from the group consisting of tungsten, nickel, chromium, copper, aluminum, Made of silver, titanium, molybdenum, tin, zinc, cobalt, iron, bismuth or an alloy thereof, the above metal oxides are respectively tungsten, nickel, chromium, copper, aluminum, silver, titanium, molybdenum, tin, zinc , one of oxidation of cobalt, iron, ruthenium or its alloy.

As can be seen from the foregoing description, the present invention is characterized in that the effect of greatly increasing the production yield of the metal line and further stably producing the wire diameter of each of the conductive electrodes by using a related process such as a shielding layer; The patterned conductive electrode is completely covered and protected, thereby improving the durability of the product of the metal line of the sensing electrode in the circuit substrate or the touch panel.

In order to further clarify and understand the structure, the use and the features of the present invention, the preferred embodiment is described in detail with reference to the following drawings:

Referring to FIG. 1 , in a first preferred embodiment of the method for manufacturing a very thin metal line 1 in a circuit substrate or a touch panel of the present invention, the manufacturing steps are as follows:

Step (A) selecting a substrate to construct a substrate layer 2, wherein the substrate layer 2 may be composed of a soft material or a glass plate, and the soft material is polyethylene terephthalate (PET), poly Methyl methacrylate (PMMA), polycarbonate (PC), polyphenylene fluorene (PPSU), polyethyleneimine (PEI) or polyimidamide (PI);

In the step (B), a shielding layer 3 having a line pattern is formed on the surface of the base material layer 2, and a plurality of grooves 4 are formed by the wiring pattern.

Step (C) forming an adhesion layer 5 on the surface of the shielding layer 3 and the surface of the plurality of grooves 4, in other words, on the entire surface of the shielding layer 3 and the substrate layer 2 in the groove 4. The surface of the above-mentioned adhesion layer 5 is continuously formed by using the photoresist resist development technique in combination with a photoresist or a printing method in combination with one or a combination of polymer materials.

In addition, the adhesion layer 5 may be selected from one of vacuum sputtering, electroless plating, or vapor deposition, or a combination thereof, and the adhesion layer 5 is made of one of a metal, a metal oxide, or a composite material thereof. to make.

Wherein, the metal of the adhesion layer 5 is selected from the group consisting of tungsten (W), nickel (Ni), chromium (Cr), copper (Cu), vanadium (V), molybdenum (Mo), tin (Sn), and zinc ( Made of one of Zn), cobalt (Co), iron (Fe), titanium (Ti), aluminum (Al), niobium (Nb) or an alloy thereof, and the above-mentioned metal oxide of the above-mentioned adhesion layer 5 is made of tungsten ( W), nickel (Ni), chromium (Cr), copper (Cu), vanadium (V), molybdenum (Mo), tin (Sn), zinc (Zn), cobalt (Co), iron (Fe), titanium ( One of oxidation of Ti), aluminum (Al), niobium (Nb) or an alloy thereof.

Referring to FIG. 2, further, the conventional adhesion layer 5 is composed of two layers. In the first preferred embodiment, the adhesion layer 5 can be sequentially processed by a sputtering process. An interposer 51, a conductive underlayer 52, and an anti-oxidation layer 53 are formed in three layers. An interposer 51 is formed on the surface of the substrate layer 2, and a conductive substrate is formed on the surface of the interposer 51. The layer 52 and an anti-oxidation layer 53 are formed on the surface of the conductive substrate layer 52.

Referring to FIG. 3, in the second preferred embodiment, the adhesion layer 5 can be sequentially formed by a blackening layer 50, an interposer 51, and a conductive substrate layer 52 in a sputtering process. A blackening layer 50 is formed on the surface of the substrate layer 2, an interposer 51 is formed on the surface of the blackening layer 50, and a conductive substrate layer 52 is formed on the surface of the interposer 51.

Referring to FIG. 4, in the third preferred embodiment, the adhesion layer 5 may sequentially comprise a blackening layer 50, an interposer 51, a conductive substrate layer 52, and an anti-oxidation layer by using a sputtering process. A total of four layers are formed together, a blackening layer 50 is formed on the surface of the substrate layer 2, an interposer 51 is formed on the surface of the blackening layer 50, and a conductive substrate layer is formed on the surface of the interposer 51. 52 and an anti-oxidation layer 53 is formed on the surface of the conductive substrate layer 52.

The interposer 51 (also referred to as a Tie-coat) is used to bond the blackening layer 50 and the conductive base layer 52. The conductive base layer 52 (also referred to as a seed layer) has an oxidizable property and is used in comparison with the conventional one. The following three methods avoid the occurrence of the oxidation state of the conductive underlayer 52: the method (1) removes the oxidized conductive substrate layer 52 with an acidic solution, and the method (2) is temporarily freeze-dried or stored under low temperature and low humidity for 12 to 24 hours. The conductive base layer 52 and the method (3) are used for vacuum storage and the conductive base layer 52 is used within three to six months. However, the present invention is designed to form an oxidation resistant layer 53 on the surface of the conductive base layer 52. The oxidation of the above conductive substrate layer 52 is avoided.

Step (D) further forming a conductive layer 6 on the surface of the adhesion layer 5 to fill the space of the plurality of grooves 4 and simultaneously forming the surface of the adhesion layer 5 on the shielding layer 3, the conductive layer 6 It is not limited to the above-described grooves 4, and a state in which the entire surface of the above-mentioned adhesion layer 5 is completely covered by the above-mentioned conductive layer 6 is formed.

The conductive layer 6 may be selected from the group consisting of vacuum sputtering, evaporation, electroless plating, electroplating, or conductive polymer coating, and the conductive layer 6 is made of gold (Au) or copper ( A metal such as Cu), silver (Ag), zinc (Zn), aluminum (Al), nickel (Ni), or tin (Sn), or an alloy thereof, or one of conductive polymer materials.

Step (E) etching the partial conductive layer 6 on the upper surface of the shielding layer 3 and removing the adhesion layer 5 on the upper surface of the shielding layer 3, leaving only the adhesion layer 5 located in the groove 4 and The conductive layer 6 is formed by the adhesion layer 5 remaining in the recess 4 and the conductive layer 6 to form the conductive electrode 7 of the present invention. The base layer 2 and the plurality of conductive electrodes 7 together constitute the metal line 1.

Accordingly, it can be seen that the width of the conductive electrode 7 of the present invention can be precisely controlled by the related steps of setting the shielding layer 3 in the etching manner as described above, and the etching liquid in the etching process does not occur with the above-mentioned grooves 4 The possibility that the adhesion layer 5 and the conductive layer 6 are in contact with each other, the protection of the shielding layer 3 further avoids the lateral etching phenomenon that may occur in the adhesion layer 5 and the conductive layer 6 during the etching process, thereby ensuring the production. The wire diameter of the above-mentioned conductive electrode 7.

The above steps (A), (B), (C), (D), (E) together form a preliminary product of the present invention which can be applied to a very thin metal line 1 in a circuit board or a touch panel in a touch panel, and the above The width of each of the conductive electrodes 7 can be precisely adjusted to be between 0.5 μm and 20 μm.

In the first preferred embodiment, the foregoing step (E) can further include a step (F) of removing the shielding layer 3, leaving only the conductive electrode 7 originally located in the groove 4, so that the base The material layer 2 and the plurality of conductive electrodes 7 together form a circuit substrate having a circuit pattern and a very thin wire diameter metal circuit 1 or an induction electrode disposed in the touch panel, and are on the entire surface 70 of the plurality of conductive electrodes 7 (also That is, the outer peripheral surface thereof forms a weather resistant layer 8 to isolate the conductive electrode 7 from the outside.

The conductive layer 6 having the line pattern is sealed from the outside by the weather-resistant layer 8, and the weather-resistant layer 8 is formed in a U-shaped form. Further, the weather-resistant layer 8 can be set to have a comparative The blackening nature of the dark color, that is to say, the material properties of the dark color, such as blue, green, purple, brown or black, are darker colors.

Wherein, the weathering layer 8 may be selected from one of electroless plating, electroplating or conductive polymer coating or a combination thereof, and the weather resistant layer 8 is made of carbon (C), graphite, metal, metal. An oxide, a conductive polymer material, or one of its composite materials.

Wherein, the metal of the weathering layer 8 is selected from the group consisting of tungsten (W), nickel (Ni), chromium (Cr), copper (Cu), aluminum (Al), silver (Ag), titanium (Ti), and molybdenum ( Mo), tin (Sn), zinc (Zn), cobalt (Co), iron (Fe), niobium (Nb) or an alloy thereof, the metal oxide of the weathering layer 8 is made of tungsten ( W), nickel (Ni), chromium (Cr), copper (Cu), aluminum (Al), silver (Ag), titanium (Ti), molybdenum (Mo), tin (Sn), zinc (Zn), cobalt ( Co), iron (Fe), niobium (Nb) or an alloy thereof is produced by oxidation of one of them.

In addition, the conductive electrode 7 of the present invention can be designed to be constructed on one side (one side) of the substrate layer 2, or on both sides (not shown) of the substrate layer 2, or even distributed on the above. A plurality of surfaces of the substrate layer 2 (not shown).

Referring to FIG. 5, in the second preferred embodiment, the manufacturing steps (A), (B), (C), (D), and (E) are the same as the first embodiment, only in the step (F). Having the difference: step (F) after the weathering layer 8 is formed on the upper surface 71 of the conductive electrode 7, the shielding layer 3 is removed, and the substrate layer 2, the plurality of conductive electrodes 7, and the weathering layer 8 are combined. A circuit substrate having a metal line 1 wiring pattern.

It is further explained that the weather-resistant layer 8 in the second preferred embodiment is simultaneously formed on the upper surface of the conductive layer 6 and the upper surface of the adhesion layer 5 in the groove 4, so that the weather-resistant layer 8 is further formed. It is in the form of the upper surface 71 of the above-mentioned conductive electrode 7.

In this way, the design of the weather-resistant layer 8 of the present invention and the adhesion layer 5 are completely covered on the entire surface of the conductive layer 6 having the line pattern, which can be different from the conventional one to prevent the user from using the circuit board. Or the purpose of the product of the metal line 1 of the sensing electrode in the touch panel.

Further, in the process of the present invention, by using the shielding layer 3 having a predetermined line pattern to fabricate the wiring pattern of the conductive layer 6, it is possible to completely avoid the occurrence of severe lateral etching in the etching process, resulting in each In the case where the yield of the product of the metal line 1 is extremely low and the line width is inconsistent, in other words, the present invention can improve the production yield of the above-mentioned conductive electrode 7, and precisely control the wire diameter of each of the conductive electrodes 7. The width of the two items.

Referring to FIG. 6 and FIG. 7, the ultra-fine metal circuit 1 of the present invention mainly comprises two parts: a substrate layer 2 and a plurality of conductive electrodes 7 in the following preferred embodiments.

The base material layer 2 may be selected from one of glass, a plastic plate, and a plastic film, and the extremely fine metal wire 1 of the present invention is formed on one, at least one or all of the surface of the substrate layer 2.

The conductive electrode 7 of the present invention has a structure in which a predetermined line pattern is formed on the surface of the base material layer 2, and the conductive electrode 7 is provided with an adhesion to the substrate layer 2 and presents a plurality of grooves 4 The layer 5 and a conductive layer 6 are accommodated in the groove 4.

When the present invention is applied to a product of a very thin metal line 1 in a sensing electrode of a circuit substrate or a touch panel, the width of each of the conductive electrodes 7 is between 0.1 μm and 10 μm.

Referring to FIG. 6 , in the first preferred embodiment, the adhesion layer 5 is distributed on the left and right sides and the lower side of the conductive layer 6 , and is further completely coated on the conductive electrode with a weather resistant layer 8 . The outer peripheral surface of 7, that is, the entire surface 70 of the above-mentioned conductive electrode 7, the weather-resistant layer 8 finally exhibits a U-shaped structure.

Furthermore, the weather-resistant layer 8 can be further configured to have a blackening property of a darker color having both protection and shielding effects, and the weather-resistant layer 8 of the first preferred embodiment is in cross-sectional view. A weather-resistant layer 8 coated on the entire surface 70 of the above-mentioned conductive electrode 7 and exhibiting a U-shaped structure.

Or in the second preferred embodiment, as shown in FIG. 7, the weather-resistant layer 8 can be formed on the upper surface 71 of the conductive electrode 7. Further, the weather-resistant layer 8 is distributed on the adhesion layer. 5 and the position of the upper surface of the conductive layer 6, the weather-resistant layer 8 can be integrally bonded to the adhesion layer 5 distributed on the left and right sides and the lower side of the conductive layer 6 to completely protect the conductive layer 6 from being protected.

Furthermore, the thickness of the adhesion layer 5 of the present invention is set to be in the range of 0.01 μm to 1 μm; and the thickness of the above-mentioned conductive layer 6 is set to be in the range of 0.1 μm to 6 μm; and the thickness of the weather-resistant layer 8 described above. It is set to be in the range of 0.01 μm to 1 μm.

Accordingly, the positional distribution design of the weather-resistant layer 8 of the first and second preferred embodiments of the ultra-fine metal wiring 1 of the present invention is such that the conductive layer 6 is coated therein for high temperature, high humidity or low temperature. Under the environment, the extremely fine metal line 1 product of the invention has extremely high environmental weather resistance and high yield.

Moreover, the structure of the extremely thin metal wiring 1 of the present invention can surely prevent the oxidation of the conductive electrode 7 which is coated in the interior of the adhesion layer 5 and the weathering layer 8 for a long period of time in the air. In the process, the invention can complete the oxidation resistance of the conductive electrode 7 and extend the service life of the metal line 1 product.

Finally, the weather-resistant layer 8 of the extremely fine metal wiring 1 of the present invention in the preferred embodiment described above can be further designed to have a blackening property of a dark color.

The above-mentioned embodiments are merely intended to be illustrative of the present invention and are not intended to limit the scope of the invention, and the various modifications and modifications made by those skilled in the art in accordance with the scope of the invention and the description of the invention are still It is included in the scope of the following patent application.

1‧‧‧Metal lines
2‧‧‧Substrate layer
3‧‧‧shading layer
4‧‧‧ Groove
5‧‧‧Adhesive layer
50‧‧‧Blackening layer
51‧‧‧Intermediary
52‧‧‧ conductive base layer
53‧‧‧Antioxidant layer
6‧‧‧ Conductive layer
7‧‧‧Conductive electrode
70‧‧‧ surface
71‧‧‧Upper surface
8‧‧‧ weathering layer

1 is a flow chart of a manufacturing method of a first preferred embodiment of a very thin metal circuit of the present invention; FIG. 2 is a schematic structural view of a first preferred embodiment of an adhesion layer; FIG. 3 is a schematic structural view of a second preferred embodiment of an adhesion layer. 4 is a schematic structural view of a third preferred embodiment of an adhesion layer; FIG. 5 is a flow chart of a manufacturing method of a second preferred embodiment of a very thin metal circuit of the present invention; FIG. 6 is a first preferred embodiment of a conductive electrode of the present invention; FIG. 7 is a schematic structural view of a second preferred embodiment of a conductive electrode according to the present invention.

1‧‧‧Metal lines

2‧‧‧Substrate layer

3‧‧‧shading layer

4‧‧‧ Groove

5‧‧‧Adhesive layer

6‧‧‧ Conductive layer

7‧‧‧Conductive electrode

70‧‧‧ surface

8‧‧‧ weathering layer

Claims (11)

A method for manufacturing a very fine metal line, (A) selecting a substrate to form a substrate layer; (B) forming a shielding layer on a surface of the substrate layer, the shielding layer having a plurality of grooves forming a line pattern; (C) forming an adhesion layer on the surface of the shielding layer and the surface of the plurality of grooves; (D) forming a conductive layer filling the plurality of grooves on the surface of the adhesion layer; (E) removing the shielding a local conductive layer and an adhesion layer on the upper surface of the layer, and a conductive electrode is formed by the adhesion layer remaining in the groove and the conductive layer. The method for manufacturing a very fine metal circuit according to the first aspect of the invention, wherein the step (E) further comprises a step (F): removing the shielding layer, and forming the substrate layer and the plurality of conductive electrodes together A circuit board having a line pattern, and a weather-resistant layer is formed on an outer peripheral surface of the plurality of conductive electrodes to isolate the conductive electrode from the outside. The method for manufacturing a very fine metal line according to the first aspect of the invention, wherein the step (E) further comprises a step (F): forming a weather-resistant layer on the upper surface of the conductive electrode and removing the shielding layer, A circuit board having a line pattern is formed by the base material layer, the plurality of conductive electrodes, and the weather resistant layer. The method for producing a very fine metal wire according to the second or third aspect of the invention, wherein the weatherable layer is provided to shield the metal conductive electrode and has a blackening property. The method for manufacturing a very fine metal wire according to the first aspect of the invention, wherein the step (C) further forms an interposer on the surface of the substrate layer, and forms a conductive substrate on the surface of the interposer. And forming an anti-oxidation layer on the surface of the conductive base layer to jointly construct the adhesion layer. The method for manufacturing a very fine metal wire according to the first aspect of the invention, wherein the step (C) further forms a blackening layer on the surface of the substrate layer to form an intermediary on the surface of the blackening layer. The layer and the surface of the interposer are formed with a conductive base layer to jointly construct the adhesion layer. The method for manufacturing a very fine metal wire according to the first aspect of the invention, wherein the step (C) further forms a blackening layer on the surface of the substrate layer to form an intermediary on the surface of the blackening layer. And forming an electroconductive base layer on the surface of the interposer and forming an anti-oxidation layer on the surface of the conductive base layer to jointly construct the adhesion layer. An extremely thin metal circuit comprising: a substrate layer; a plurality of conductive electrodes arranged on a surface of the substrate layer to form a line pattern, wherein the conductive electrode is provided with an adhesion layer connected to the substrate layer, the adhesion layer Forming a groove and accommodating a conductive layer in the groove; and a weather-resistant layer disposed on a surface of the conductive electrode, wherein the weather-resistant layer is coated on an outer peripheral surface of the conductive electrode to make the conductive layer and the adhesion layer They are all isolated from the outside. The ultrafine metal circuit of claim 8, wherein the adhesion layer comprises an interposer on a surface of the substrate layer, a conductive substrate layer formed on a surface of the interposer, and a conductive layer An oxidation resistant layer on the surface of the substrate layer. The ultrafine metal circuit according to claim 8, wherein the adhesion layer comprises a blackening layer formed on a surface of the substrate layer, an interposer formed on a surface of the blackening layer, and a formation layer. a conductive substrate layer on the surface of the above interposer. The ultrafine metal circuit according to claim 10, wherein the adhesion layer further comprises an oxidation resistant layer formed on a surface of the conductive base layer.