TWI531776B - 散熱鰭片及散熱裝置 - Google Patents

散熱鰭片及散熱裝置 Download PDF

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TWI531776B
TWI531776B TW102146943A TW102146943A TWI531776B TW I531776 B TWI531776 B TW I531776B TW 102146943 A TW102146943 A TW 102146943A TW 102146943 A TW102146943 A TW 102146943A TW I531776 B TWI531776 B TW I531776B
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heat
heat dissipating
disposed
heat dissipation
fin
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黃永慶
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華碩電腦股份有限公司
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Priority to US14/575,708 priority patent/US20150168082A1/en
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00Tubular elements; Assemblies of tubular elements
    • F28F1/10Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814Conductive parts
    • H01L21/4871Bases, plates or heatsinks
    • H01L21/4882Assembly of heatsink parts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
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  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

散熱鰭片及散熱裝置
本案關於一種散熱鰭片,特別是有關於一種應用於散熱裝置的散熱鰭片。
一般的電子裝置於運作時皆會產生廢熱,為了避免大量廢熱累積於電子裝置而造成工作溫度升高進而影響電子裝置的效能,因此一般電子裝置均需配設一個散熱裝置。
傳統的散熱裝置,至少包括一接觸熱源的基板、複數鰭片以及連接於該基板上並穿設各鰭片的熱管,透過基板將電子裝置的廢熱傳遞至熱管上,再經由熱管將廢熱傳遞至各鰭片上,以達成散熱的目的。
然而,傳統散熱裝置的鰭片與熱管組裝時,多先將複數個鰭片間隔設置後,再利用沖床模具將熱管直接與該些散熱鰭片沖壓以結合。此種作法的缺點在於,單方向的沖壓方式將會使得熱管與鰭片接合處磨損的情況難以控制,更甚,沖壓的過程更可能破壞熱管內部的微結構,降低整體的良率。此外,此種組裝方式,更會讓熱管先沖壓的區段(前端)磨損較嚴重,使得散熱鰭片與熱管被磨損區間的夾持力降低,故散熱鰭片與熱管之間無法維持一個均勻的夾持力道,進而讓整體架構的穩定性降低。
本案提供一種散熱鰭片,包括本體以及至少一穿孔。
穿孔設置於本體,且各個穿孔包括至少二凸頸部,且凸頸部環繞穿孔的外徑設置。各個凸頸部可包括第一延伸段以及第一橋接段。第一延伸段與第一橋接段夾一第一夾角,且第一橋接段得以穿設於相鄰的另一散熱鰭片的一穿孔。
本案更提供一種散熱裝置,散熱裝置包括散熱鰭片組、至 少一熱管以及散熱底座,且散熱鰭片組設置於散熱底座。散熱鰭片組包括複數個散熱鰭片,且各個散熱鰭片包括包括本體以及至少一穿孔。熱管可穿設各個散熱鰭片的各個穿孔。
散熱鰭片的穿孔設置於本體,且各個穿孔包括至少二凸頸部,且凸頸部環繞穿孔的外徑設置。各個凸頸部可包括第一延伸段以及第一橋接段。第一延伸段與第一橋接段夾一第一夾角,且第一橋接段得以穿設於相鄰的另一散熱鰭片的一穿孔。
承上所述,本案所提供散熱鰭片以及散熱裝置,能夠使散熱鰭片與熱管間形成均勻夾持力、降低組裝過程中熱管損壞、提高整體散熱效能。
1‧‧‧散熱鰭片
10‧‧‧本體
12‧‧‧穿孔
122‧‧‧凸頸部
122A‧‧‧第一延伸段
122B‧‧‧第一橋接段
14‧‧‧嵌槽
142A‧‧‧第二延伸段
142B‧‧‧第二橋接段
16‧‧‧導流片
2‧‧‧熱管
3‧‧‧散熱底座
32‧‧‧凸肋
4‧‧‧風扇
R1、R2、R3、R4‧‧‧直徑
θ1‧‧‧第一夾角
θ2‧‧‧第二夾角
AA、BB、DD‧‧‧割線
C‧‧‧虛線框
圖1為本案散熱鰭片的一實施例立體示意圖。
圖2為圖1的散熱鰭片的沿DD割線的剖面示意圖。
圖3為圖1的散熱鰭片的穿孔的放大示意圖。
圖4為本案散熱裝置的第一實施例的組裝示意圖。
圖5為本案散熱裝置的第一實施例的部份爆炸示意圖。
圖6A為圖5的散熱裝置沿AA割線的剖面側視圖。
圖6B為圖6A的虛線框C的放大示意圖。
圖6C為圖5的散熱裝置沿BB割線的剖面側視圖。
以下將參照相關圖式,說明依本案較佳實施例的散熱鰭片及散熱裝置。其中相同的構件將以相同的參照符號加以說明。且為了便於理解,與本案非直接相關的構件將省略不繪出。
請先參考圖1至圖3,圖1為本案散熱鰭片的一實施例立體示意圖,圖2為圖1的散熱鰭片的沿DD割線的剖面示意圖。圖3為圖1的散熱鰭片的穿孔的放大示意圖。
本案的其一實施例的散熱鰭片1,包括本體10以及至少一穿孔12,且穿孔12設置於本體10。本實施例例示四個穿孔12,但穿孔12 的數量可依據實際上搭配的熱管有所調整。且,本實施例的散熱鰭片1的材料可為鋁、銅、鋁合金、銅合金與銅鋁合金的任一種。
詳細而言,各個穿孔12包括至少二凸頸部122,各個凸頸部122環繞穿孔12的外徑設置。此外,各個凸頸部122是經由沖孔而形成,故凸頸部122的一端與穿孔12相連結。本實施例例示四個凸頸部122,且各凸頸部12間隔設置,此間隔配置的目的在於可給予各凸頸部122一個彈性形變的空間,以降低複數個散熱鰭片組裝時的累積公差。
請繼續參考圖2及圖3,各該凸頸部122可包括第一延伸段122A以及第一橋接段122B。第一延伸段122A與第一橋接段122B夾一第一夾角θ1
另外,本實施例的凸頸部122的第一延伸段122A與第一橋接段122B夾的第一夾角θ1為鈍角。或者,第一延伸段122A的直徑R1大於第一橋接段122B的直徑R2。此處所定義的直徑R1係指第一延伸段122A的最寬處的直徑,直徑R2係指第一橋接段122B的最窄處的直徑。簡言之,凸頸部122的第一延伸段122A向內、朝向穿孔12的中軸延長線方向彎折,使得第一橋接段122B得以輕易的穿設、套入於相鄰的另一散熱鰭片的穿孔內。
舉例來說,在一實施例中,散熱鰭片1的板厚為0.4mm,可先利用衝床模具係先衝出直徑為0.6mm的衝孔以形成第一橋接段122B,接著,再衝出直徑0.62mm的衝孔,以形成第一延伸段122A。或者,亦可有一實施態樣,散熱鰭片1的板厚為0.3mm,可先利用衝床模具係先衝出直徑為0.59mm的衝孔以形成第一橋接段122B,接著,再衝出直徑0.60mm的衝孔,以形成第一延伸段122A。
此外,本實施例的散熱鰭片1更包括至少二嵌槽14,各個嵌槽14得以與散熱底座相配合。此處的嵌槽14作用有二,其一為與相鄰的散熱鰭片1相卡合,其二為將散熱鰭片1與散熱底座相嵌合。嵌槽14設置於散熱鰭片1的本體10,此外,本實施例的嵌槽14設置於本體10邊緣或底緣處,且嵌槽14與凸頸部122設置於相異面。
嵌槽14包括第二延伸段142A以及第二橋接段142B。第二 橋接段142B得以穿設於相鄰的另一散熱鰭片的一嵌槽。故,本實施例的散熱鰭片1除了可透過前述的凸頸部122的第一橋接段122B與相鄰的散熱鰭片1卡合以外,更可透過嵌槽14的第二橋接段142B與相鄰散熱鰭片1卡合。
相似地,本實施例的第二延伸段142A與第二橋接段142B的第二夾角θ2為鈍角。或者,第二延伸段142A的直徑R3大於第二橋接段142B的直徑R4。此處所定義的直徑R3係指第二延伸段142A的最寬處的直徑,直徑R4係指第二橋接段142B的最窄處的直徑。簡言之,嵌槽14的第二延伸段142A向內、朝向其中軸延長線方向彎折,使得第二橋接段142B得以輕易的穿設、套入於相鄰的另一散熱鰭片的嵌槽內。
另外,本實施例的散熱鰭片1更可包括至少二導流片16,且各個導流片16設置於本體10,較佳地,設置於本體10的邊緣、底緣靠近散熱底座處。當複數個散熱鰭片1組裝成散熱鰭片組時,相鄰的散熱鰭片1上的各個導流片16將可形成氣流導流通道,增加散熱底座的散熱效率,且可避免氣流形成亂流。
接著,請一併參考圖4及圖5,其分別為本案的散熱裝置的第一實施例的組裝示意圖以及第一實施例的部份爆炸示意圖。
本實施例更可提供一種散熱裝置,散熱裝置包括散熱鰭片組、至少一熱管2以及散熱底座3。此外,散熱鰭片組設置於散熱底座3。散熱鰭片組包括複數個如前述的散熱鰭片1,熱管2則可穿設各個散熱鰭片1的各個穿孔12。
此外,散熱裝置更可包括至少一風扇4,圖面只例示一個風扇4,但不以一個風扇為限制。且風扇4可架設於散熱鰭片組之上。
詳細而言,散熱底座3其係以導熱性良好之材質所製成,如鋁、銅等,散熱底座3的底面乃用以與一如顯示卡、晶片等電子發熱元件(圖未示出)作貼合。散熱底座3更更包括複數個凸肋32,以供前述嵌槽14各個凸肋32相嵌合、卡設或埋設。
簡言之,各散熱鰭片1的嵌槽14貼接於散熱底座3的複數 個凸肋32,除了可以固定散熱鰭片組以外,更可透過散熱鰭片組與散熱底座3的接觸,以增加散熱效率。
本實施例中的熱管2為一真空腔體,且真空腔體內壁可界 定有燒結層,其中,燒結層內具有至少一液態傳熱介質。此外,在本實施例中,熱管2的數量係為複數,故上述穿孔12的數量亦須配合熱管2的數量,各熱管2為「U」字形,且本實施例的熱管2以由「U」字形的一端作為受熱段、另一端作為冷凝段。
請參考圖4,顯示散熱裝置的組裝過程。習知是先組裝具有 間隔設置的散熱鰭片組後,再固定散熱鰭片組於散熱底座上,並將熱管壓入散熱鰭片組。而於本實施例則是先將熱管2固定於散熱底座3後,再將散熱鰭片1的穿孔12對準熱管2,依序以將散熱鰭片1套設於其上,其中,散熱鰭片1的凸頸部122的第一橋接段122B將會穿設於相鄰的散熱鰭片1的穿孔12中,以使散熱鰭片1與另一散熱鰭片可等距地間隔設置。且,散熱鰭片1的嵌槽14則可與散熱底座3的凸肋32坎合。
此外,關於散熱鰭片1的其餘配置以及設計與前述實施例相似,將不再此贅述。
最後,請一併參考圖6A至圖6C,圖6A及圖6C分別為圖5的散熱裝置沿AA割線、BB割線的剖面側視圖。而,圖6B則為圖6A的虛線框C的放大示意圖。
請先參考圖6A及圖6B,當熱管2穿設各個散熱鰭片1的各個穿孔12,熱管2的外壁將會抵頂第一橋接段122B,使其產生形變並貼合熱管2,藉此除了可以強化散熱鰭片1與相鄰的散熱鰭片1卡合的穩定性,更可透過增加散熱鰭片1與熱管2的接觸面積有效的提高散熱效率。
請接著參考圖6C,當散熱鰭片1的穿孔12套設於熱管2時,散熱鰭片1的嵌槽14將會與散熱底座3的凸肋32相嵌合。相似地,凸肋32將會抵頂第二橋接段142B,使其產生形變並嵌合散熱底座3,以達到固定散熱鰭片1於散熱底座3之目的。
此外,此處所繪製的第一橋接段122B與第二橋接段142B的形變方式僅為例示,實際組裝時,形變的程度以及狀態將會依據散熱鰭 片1的材質、第一夾角θ1、第二夾角θ2、直徑等等不同的情況而有所不同
綜上所述,本案透過在散熱鰭片的穿孔配置至少二凸頸部,各凸頸部則由第一延伸段與第一橋接段所組成,再並透過第一橋接段穿設於相鄰的另一散熱鰭片的穿孔內的方式,使相鄰的散熱鰭片扣合、組裝成一散熱鰭片組,透過此種結合方式可有效的提高散熱鰭片間接合的穩定度。再透過將散熱鰭片依序套設於熱管的組裝方式,更可使散熱鰭片與熱管組裝時可提供一穩定的夾持力,進而避免組裝過程中熱管損壞。此外,此種散熱鰭片的構造,於組裝時熱管將會抵頂第一延伸段,使其貼合於熱管,以增加散熱鰭片與熱管的接觸面積的方式,並提高散熱效率。
以上所述僅為舉例性,而非為限制性者。任何未脫離本案之精神與範疇,而對其進行之等效修改或變更,均應包含於後附之申請專利範圍中。
1‧‧‧散熱鰭片
10‧‧‧本體
12‧‧‧穿孔
122‧‧‧凸頸部
14‧‧‧嵌槽
16‧‧‧導流片
DD‧‧‧割線

Claims (14)

  1. 一種散熱鰭片,包括:一本體;至少一穿孔,設置於該本體,且各該穿孔包括至少二凸頸部,且該些凸頸部環繞該穿孔的外徑設置,且各該凸頸部包括:一第一延伸段以及一第一橋接段,且該第一延伸段與該第一橋接段夾一第一夾角,其中,該第一橋接段得以穿設於相鄰的另一散熱鰭片的一穿孔;以及至少二嵌槽,設置於該本體,該嵌槽包括一第二延伸段以及一第二橋接段,且該第二延伸段與該第二橋接段夾一第二夾角,其中該第二橋接段穿設於相鄰的另一散熱鰭片的一嵌槽。
  2. 如申請專利範圍第1項所述的散熱鰭片,其中該第一夾角為一鈍角。
  3. 如申請專利範圍第1項所述的散熱鰭片,其中該第一延伸段的直徑大於該第一橋接段的直徑。
  4. 如申請專利範圍第1項所述的散熱鰭片,其中該第二延伸段與該第二橋接段夾的該第二夾角為一鈍角。
  5. 如申請專利範圍第1項所述的散熱鰭片,其中該第二延伸段的直徑大於該第二橋接段的直徑。
  6. 如申請專利範圍第1項所述的散熱鰭片,更包括至少二導流片,設置於該本體。
  7. 一種散熱裝置,包括:一散熱鰭片組,包括複數個散熱鰭片,且各該散熱鰭片包括:一本體;至少一穿孔,設置於該本體,且各該穿孔包括至少二凸頸部,且該些凸頸部環繞該穿孔的外徑設置,且各該凸頸部包括:一第一延伸段以及一第一橋接段,且該第一延伸段與該第一橋接段夾一第一夾角,其中,該第一橋接段得以穿設於相鄰的另一散熱鰭片的一穿孔;以及 至少二嵌槽,設置於該本體,該嵌槽包括一第二延伸段以及一第二橋接段,且該第二延伸段與該第二橋接段夾一第二夾角,其中該第二橋接段穿設於相鄰的另一散熱鰭片的一嵌槽;至少一熱管,穿設該些散熱鰭片的該些穿孔;以及一散熱底座,且該散熱鰭片組設置於該散熱底座。
  8. 如申請專利範圍第7項所述的散熱裝置,更包括至少一風扇,設置於該散熱鰭片組之上。
  9. 如申請專利範圍第7項所述的散熱裝置,其中該散熱底座更包括複數個凸肋。
  10. 如申請專利範圍第7項所述的散熱裝置,其中該第一夾角為一鈍角。
  11. 如申請專利範圍第7項所述的散熱裝置,其中該第一延伸段的直徑大於該第一橋接段的直徑。
  12. 如申請專利範圍第7項所述的散熱裝置,其中該第二延伸段與該第二橋接段夾的該第二夾角為一鈍角。
  13. 如申請專利範圍第7項所述的散熱裝置,其中該第二延伸段的直徑大於該第二橋接段的直徑。
  14. 如申請專利範圍第7項所述的散熱裝置,其中該散熱鰭片更包括至少二導流片,設置於該本體。
TW102146943A 2013-12-18 2013-12-18 散熱鰭片及散熱裝置 TWI531776B (zh)

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