TWI528436B - Acoustic energy system, method and apparatus for processing flat articles - Google Patents

Description

Acoustic energy system, method and device for processing flat objects

The present invention relates generally to the field of processing flat objects using sonic energy, and in particular to systems, methods and apparatus for utilizing acoustic energy to clean flat objects such as conductor wafers.

In the field of semiconductor manufacturing, it has been recognized from the beginning of the industry that it is a key requirement for the removal of the quality of wafers from semiconductor wafers during the manufacturing process. Although many different systems and methods have been developed over the years to remove particles from semiconductor wafers, many such systems and methods are undesirable because they can destroy such wafers. Therefore, the removal of particles from the wafer, which is often measured in terms of particle removal efficiency ("PRE"), must weigh the amount of damage caused by the cleaning method and/or system to the wafer. It is desirable to have a cleaning method or system capable of damaging the particles away from the fragile semiconductor wafer without causing damage to the device on the wafer surface.

Existing techniques for detaching such particles from the surface of a semiconductor wafer utilize a combination of chemical and mechanical procedures. A typical cleaning chemistry standard cleansing 1 ("SC1") used in the art is a mixture of ammonium hydroxide, hydrogen peroxide, and water. SC1 oxidizes and etches the surface of the wafer. This etching process (known as base etching) reduces the physical contact area of the wafer surface to which the particles are bonded, thus making removal easier. However, a mechanical procedure is still needed to actually remove the particles from the wafer surface.

For larger particles and for larger devices, scrubbers have historically been used to physically sweep particles away from the wafer surface. However, as device sizes shrink, scrubbers and other forms of physical cleaning defects become inadequate because their physical contact with the wafers begins to cause significant damage to such smaller/miniaturized devices.

Recently, the application of sonic/sonic energy to the wafers during chemical processing to effect particle removal has replaced physical washing. The terms "sound wave" and "sound wave" are used interchangeably throughout this application. The acoustic energy used in the substrate processing is generated via a source of acoustic energy, which typically comprises a transducer made of a piezoelectric crystal. In operation, the converter is coupled to a power source (ie, an electrical energy source). An electrical energy signal (ie, electricity) is supplied to the converter. The converter converts this electrical energy signal into vibrating mechanical energy (i.e., sonic/sonic energy) which is then transmitted to the processed substrate. The characteristics of the electrical energy signal (which is typically a sinusoidal waveform) supplied from the power source to the converter govern the characteristics of the acoustic energy produced by the converter. For example, increasing the frequency and/or power of the electrical energy signal will increase the frequency and/or power of the acoustic energy generated by the transducer.

Wafer cleaning with sonic energy becomes the most effective particle removal method in semiconductor wet processing applications over time. Acoustic energy has been shown to be an effective way to remove particles, however, as with any mechanical procedure, damage can occur and sonic cleaning faces the same damage problems as conventional physical cleaning methods and devices. In the past, cleaning systems using sonic energy were designed to batch process semiconductor wafers, typically cleaning twenty-five substrates at a time. The benefits of batch cleaning become less important as the size of the substrate and the effectiveness of a single wafer cleaning system increase. The greater the value of each semiconductor wafer and the fragile nature of these devices, the industry's transformation toward single wafer processing equipment.

U.S. Patent No. 6,039,059 ("Bran") issued on March 21, 2000, and U.S. Patent No. 7,1003,304 ("Lauerhaas et al." issued on Sep. 5, 2006, discloses the use of an ultrasonic wave. An example of a single wafer cleaning system for energy is incorporated herein by reference in its entirety. A single wafer cleaning system for the subject of U.S. Patent No. 6,039,059 and U.S. Patent No. 7,1003,304 is owned by Akrion of Allentown, Pennsylvania as "Goldfinger". The name comes to the market. U.S. Patent No. 7,145,286 ("Beck et al.") issued on December 5, 2006, and U.S. Patent No. 6,539,952 ("Itzkowitz") issued on April 1, 2003, and published on December 14, 2006. Other examples of a single wafer cleaner utilizing sonic energy are disclosed in U.S. Patent Application Publication No. 2006/0278253 ("Verhaverbeke et al."). In a plurality of single wafer sonic cleaning systems such as those described above, a semiconductor wafer is supported and rotated in a horizontal orientation while a liquid film is applied to one or both sides/surfaces of the wafer. A transducer assembly is positioned adjacent one of the wafer surfaces such that one of the transducer assemblies contacts the liquid meniscus of the liquid film. The converter assembly is actuated during rotation of the wafer to subject the wafer to sonic energy generated by the converter assembly.

However, the transformation of the industry into devices below 100 nm has created additional challenges for semiconductor processing equipment manufacturers. The cleaning procedure is no different. As these devices become more and more miniaturized, the need for cleaning is becoming increasingly important and urgent. When processing a reduced size device, the ratio of the size of a contaminant to the size of a device is large, and the likelihood that a contaminated device will not function properly will increase. Therefore, there is a need for progressive cleaning and PRE requirements. Therefore, there is a high need for improved semiconductor wafer processing techniques that reduce the amount and size of contaminants that occur during wafer production.

Due to these gradual pressing cleaning and PRE requirements, the inventors of the present invention have found that removing particles from the sides/surface of the wafer plays a progressively important role in achieving high throughput. In existing single wafer systems, the removal of particles from both surfaces of the semiconductor wafer during a cleaning cycle is achieved by providing a single converter assembly adjacent one of the surfaces of the wafer. The converter assembly operates at a sufficient power level such that the generated acoustic energy passes through the wafer itself to release particles from the opposing surfaces of the wafer. This basic concept is one of the subject inventions of U.S. Patent No. 6,039,059. The two-sided cleaning concept is also utilized and emulated in the system disclosed in U.S. Patent Application Publication No. 2006/0278253 ("Verhaverbeke et al."), the location of which is adjacent to the back side of the wafer.

While such advances in single wafer systems and methods are capable of cleaning both sides of the wafer, there is still a need for a single wafer system that can achieve improved PRE with minimal device damage. In addition, continued miniaturization of devices continues to enable existing cleaning systems to achieve an acceptable balance between high PRE and minimal device damage.

It is therefore an object of the present invention to provide a system, apparatus and method for processing flat objects such as semiconductor wafers using acoustic energy.

Another object of the present invention is to provide a system, apparatus and method for utilizing acoustic energy to simultaneously clean both surfaces of a flat object such as a semiconductor wafer.

Still another object of the present invention is to provide a system, apparatus and method for utilizing acoustic energy to simultaneously clean both surfaces of a flat object such as a semiconductor wafer to improve PRE and/or reduce damage to the flat object.

Yet another object of the present invention is to provide a system, apparatus and method for applying acoustic energy to a bottom surface of a rotating flat object.

Another object of the present invention is to provide a system, apparatus and method for simultaneously cleaning both surfaces of a flat object such as a semiconductor wafer using acoustic energy reflection.

Still another object of the present invention is to provide an apparatus and method for enabling existing single wafer cleaners to be retrofitted to achieve improved cleaning of both surfaces of the wafer.

Still another object of the present invention is to provide a system, apparatus and method for achieving a liquid coupling between a converter assembly and a bottom surface of a flat object.

Yet another object of the present invention is to provide a system, apparatus and method for enhancing the backside particle removal efficiency of a single wafer cleaning system without increasing damage to devices located on the top side of the wafer.

Yet another object of the present invention is to provide a system, apparatus and method for applying ultrasonic energy to the back side of a flat object.

The present invention satisfies these and other objects. In one embodiment of the present invention, a system for processing a flat object includes: a rotatable bracket for supporting a flat object; a first point An injector for applying a liquid to a first surface of a flat object on the rotatable support; a second dispenser for applying a liquid to one of the flat objects on the rotatable support a second surface; a first converter assembly comprising a first transducer and acoustic wave coupled to one of the first transducers for generating acoustic energy, the first transducer assembly being positioned Causing a first portion between a portion of the first emitter and the first surface of the planar object when the first dispenser applies liquid to the first surface of one of the flat objects on the rotatable mount a liquid meniscus; and a second converter assembly including a second transducer for generating sound energy and a second wave of sound waves coupled to the second transducer, the second transducer assembly Positioned so that Second Dispenser applying liquid to the second surface of the rotatable body on the flat of the stent, to the emitter of the second portion is formed with a second liquid meniscus between the second surface of the planar object.

In another embodiment, the present invention can be a system for cleaning a flat object, comprising: a rotatable support for supporting a flat object; a first converter assembly including a first a transducer and acoustic wave coupled to the first emitter of the first transducer, the first transducer assembly being positioned such that one of the first emitter and a first surface of one of the rotatable brackets are flat objects There is a first small gap therebetween, and when a liquid is applied to the first surface, a first liquid meniscus is formed between the portion of the first emitter and the first surface of the flat object; and a second converter assembly including a second transducer and acoustic wave coupled to one of the second transducers, the second transducer assembly being positioned such that one of the second emitters is a second small gap exists between the second surface of the flat object of the rotatable bracket, and a portion is formed between the portion of the second emitter and the second surface when the liquid is applied to the second surface Two liquid meniscus.

In still another embodiment, the present invention can be a system for processing a flat object, comprising: a rotatable mount for supporting and rotating a flat object in a substantially horizontal orientation; a shank comprising a transducer for generating acoustic energy, a sound wave coupled to one of the first transducer, and a dam surrounding at least a portion of one of the emitters, such that the emitter and the dam A liquid retaining passage can be formed between the dams; and the converter assembly is positioned such that a portion of the emitter is adjacent a bottom surface of one of the flat objects on the rotatable mount such that a liquid is applied to the flat object The bottom surface forms a liquid meniscus between the portion of the emitter and the bottom surface of the planar object.

In still another embodiment, the present invention can be a converter assembly for mounting under a bottom surface of a flat object, comprising: a converter for generating sonic energy; a transmitter, An acoustic wave is coupled to the first converter; and a dam surrounding at least a portion of a periphery of the emitter such that a liquid retention channel can be formed between the second emitter and the dam.

In another embodiment, the invention can be a method of making a converter assembly comprising: providing a side-by-side cylindrical emitter plate; joining one or more transducers to the emitter plate a convex inner surface; an outer casing coupled to the emitter to produce a fitting having the one or more converters in one of the substantially closed cavities; and the assembly encapsulated in an inert, non-reactive plastic.

In one embodiment, the present invention can be a method of processing a flat object comprising: a) supporting a flat object in a substantially horizontal orientation within a gaseous environment, the flat object having a a bottom surface and a top surface; b) rotating the flat object while maintaining the substantially horizontal orientation; c) applying a liquid film to the top surface of the flat object; d) on the bottom surface of the flat object Applying a liquid film; e) applying acoustic energy to the top surface of the flat object via a first transducer assembly including a first transducer and a first emitter, one of the first emitters being Contacting the liquid film on the top surface of the flat object; and f) applying sonic energy to the bottom surface of the flat object via a second transducer assembly including a second transducer and a second emitter, One of the second emitters partially contacts the liquid film on the bottom surface of the flat object.

In another embodiment, the present invention can be a system for processing a flat object, comprising: a rotatable mount for supporting a flat object in a substantially horizontal orientation; a device assembly comprising a transducer for generating acoustic energy and acoustic waves coupled to one of the transducers, the transducer assembly being positioned such that a portion of the emitter is adjacent to a flat object on the support a top surface such that a first liquid meniscus is formed between the portion of the emitter and the top surface when liquid is applied to the top surface; and a reflective member positioned such that one of the reflective members is partially Adjacent to a bottom surface of one of the flat objects on the bracket such that a second liquid meniscus is formed between a portion of the reflective member and the bottom surface when liquid is applied to the bottom surface; and the reflective member Positioning causes at least a fraction of the acoustic energy generated by the first transducer assembly and passing through the flat object to be reflected back toward the bottom surface of the planar object.

In still another embodiment, the present invention can be a system for processing a flat object, comprising: a rotatable support for supporting a flat object in a gaseous environment; a converter assembly, A transducer and a transmitter coupled to the transducer, the transducer assembly being positioned such that a first small gap exists between a portion of the emitter and a first surface of one of the planar objects on the support, Having a first liquid meniscus formed between the portion of the emitter and the first surface of the planar object when a liquid is applied to the first surface of the planar object; a reflective member positioned such that There is a second small gap between a portion of the reflective member and a second surface of one of the planar objects on the support such that when liquid is applied to the second surface of the planar object, the portion of the reflective member Forming a second liquid meniscus with the second surface of the flat object; and the reflective member positioned to be generated by the first transducer assembly and to pass the sound of the flat object To experience less of the energy of the system towards the second planar surface of the object is reflected by the back of the reflector member.

In another embodiment, the present invention can be a method of processing a flat object, comprising: a) supporting a flat object in a substantially horizontal orientation within a gaseous environment, the planar object having a bottom surface and a a top surface; b) rotating the flat object while maintaining the substantially horizontal orientation; c) applying a liquid film to the top surface of the flat object; d) applying a liquid film to the bottom surface of the flat object e) applying sonic energy to the top surface of the flat object via a converter assembly comprising a converter and a transmitter, one of the emitters contacting the liquid film on the top surface of the flat object; And f) a reflective member that contacts the liquid film on the bottom surface of the flat object toward the bottom surface of the flat object to be generated by the first transducer assembly and reflected back by the sound energy of the flat object.

These and various other novel advantages and features of the invention may be pointed out and formed in part in the appended claims. However, in order to better understand the general technique, its advantages, and the purpose for which it is obtained, reference should be made to the drawings which form a further portion, and with reference to the description and description thereof. The illustrative content of the preferred embodiment is provided.

Referring first to Figure 1, an illustration of an acoustic energy cleaning system 1000 (hereinafter referred to as "cleaning system 1000") is illustrated in accordance with an embodiment of the present invention. For ease of discussion, the systems and methods of the present invention will be discussed in terms of cleaning semiconductor wafers. However, the invention is not so limited and can be used for any desired wet processing of any flat object.

The cleaning system 1000 generally includes a top converter assembly 200, a bottom converter assembly 300 and a rotatable mount 10 for supporting a semiconductor wafer 50 in a substantially horizontal orientation. Preferably, the semiconductor wafer 50 is supported such that its top surface 51 is the device side of the wafer 50 and the bottom surface 52 is the non-device side. Of course, the wafer may be supported as needed such that its top surface 51 is the non-device side and the bottom surface 52 is the device side.

The rotatable mount 10 is designed to only contact and engage one of the sides of the substrate 50 when performing its supporting function. However, the exact details of the construction of the rotatable mount 10 do not limit the invention, but a wide variety of other support structures, such as collets, support plates, and the like, can be utilized. Moreover, while the stent structure preferably supports and rotates the semiconductor wafer in a substantially horizontal orientation, in other embodiments of the invention, the system can be configured to support the semiconductor crystal in other orientations. A circle, such as vertical or at an angle. In these particular embodiments, the remaining components of the cleaning system 1000 (including the conversion assemblies 200, 300) can be correspondingly repositioned in the system, thereby enabling the desired function to be performed and/or relative to The necessary relative positions of the other components of the system are as discussed below.

The swivel mount 10 is operatively coupled to a motor 11 to cause the wafer 50 to rotate in a horizontal plane of support. The motor 11 is preferably a variable speed motor that can rotate the bracket 10 at any desired rotational speed ω. The motor 11 is electrically and operatively coupled to the controller 12. The controller 12 controls the operation of the motor 11 and ensures that the desired rotational speed ω is achieved with the desired rotational duration.

The cleaning system 1000 further includes a top dispenser 13 and a bottom dispenser 14. Both the top dispenser 13 and the bottom dispenser 14 are operated and fluidly coupled to a liquid supply subsystem 16 via liquid supply lines 17, 18. The liquid supply subsystem 16 is in turn fluidly coupled to the liquid reservoir 15. The liquid supply subsystem 16 controls the supply of liquid to both the top dispenser 13 and the bottom dispenser 14.

The liquid supply subsystem 16 (which is schematically illustrated as a block for the sake of brevity) contains all the necessary configurations of pumps, valves, conduits, connectors and inductors to control the cleaning of the liquid throughout Flow and transmission in system 1000. The direction of flow of the liquid is indicated by the arrows on the supply lines 17, 18. Those skilled in the art will appreciate that the presence, location and function of the various components of the liquid supply subsystem 16 will vary depending on the needs of the cleaning system 1000 and the procedures that must be implemented thereon, and accordingly Adjust it. The components of the liquid supply subsystem 16 are operatively coupled to and controlled by the controller 12.

The liquid reservoir 15 will contain the liquid to be supplied to the wafer 50 for processing to be performed. In the case of the cleaning system 1000, the liquid reservoir 15 will contain a cleaning liquid such as, for example, deionized water ("DIW"), standard cleaning 1 ("SC1"), standard cleaning 2 ("SC2"), ozone deionization. Water ("DIO ₃ "), distilled or super-distillated chemicals, and/or combinations thereof. As used herein, the term "liquid" includes at least a liquid, a liquid-liquid mixture, and a liquid-gas mixture. In some cases, it is also possible to treat certain other supercritical and/or dense fluids as liquids.

In addition, it is possible to have multiple liquid reservoirs. For example, in some embodiments of the invention, the top dispenser 13 and the bottom dispenser 14 are operatively and fluidly coupled to different liquid reservoirs. This will allow different liquids to be applied to the bottom surface 52 and top surface 51 of the wafer 50 as needed.

The cleaning system 1000 further includes a gas supply subsystem 19 that is operationally and fluidly coupled to a source of gas 20. The gas supply subsystem 19 is operated and fluidly coupled to the top converter assembly 200 via the gas supply line 21 and is operatively and fluidly coupled to the bottom converter assembly 300 via the gas supply line 22 . The gas supply subsystem 19 (which is schematically illustrated in a block for the sake of brevity) contains all the necessary configurations of pumps, valves, conduits, connectors and inductors to control the gas throughout the cleaning process. Flow and transmission in system 1000. The direction of flow of the gas is indicated by the arrows on the supply lines 21, 22. Those skilled in the art will appreciate that the presence, location, and function of the various components of the gas supply subsystem 19 will vary depending on the needs of the cleaning system 1000 and the procedures that must be implemented thereon, and Adjust it. The components of the gas supply subsystem 19 are operatively coupled to and controlled by the controller 12. Therefore, the gas transmission from the gas supply subsystem 19 is based on signals received from the controller 12.

As will be explained in more detail below, the gas system is supplied to the top and bottom converter assemblies 200, 300 to provide cooling and/or purification to the converters in the assemblies 200, 300, and The electrical energy is converted into the acoustic energy. The gas source 15 preferably contains an inert gas such as nitrogen, helium, carbon dioxide or the like. However, the invention is not limited to the use of any particular gas. Furthermore, as is the case with such liquids, it is possible to have multiple sources of gas. For example, in some embodiments of the invention, the top converter assembly 200 and the bottom converter assembly 300 are operatively and fluidly coupled to different gas reservoirs. This will allow different gases to be applied as needed.

The cleaning system 1000 further includes a horizontal actuator 250 operatively coupled to the top converter assembly 200 and a vertical actuator 350 operatively coupled to the bottom converter assembly 300. The actuators 250, 350 are operatively coupled to and controlled by the controller 12. The actuators 250, 350 can be pneumatic actuators, drive assembly actuators, or any other type needed to perform the necessary movements.

The horizontal actuator 250 can horizontally transfer the top converter assembly 200 between a retracted position and a process position. If in the retracted position, the top converter assembly 200 is fully withdrawn away from the rotatable mount 10, so that the wafer 50 can be loaded onto and removed from the bracket 10 without hindrance. 10 Unload the wafer 50. If in the process of positioning, at least a portion of the top converter assembly 200 is spaced from the top surface 51 of the wafer, but sufficiently close to the top surface 51 of the wafer such that the top surface of the wafer 50 When the liquid is supplied 51, a liquid meniscus is formed between the top surface 51 of the wafer 50 and the portion of the top converter assembly 200. In Figure 1, the top converter assembly 200 is in the process position.

Similarly, the vertical actuator 350 can vertically transfer the bottom converter assembly 300 between a retracted position and a process position. With respect to the bottom converter assembly 300, the retracted positioning system can be implemented without contact with the bottom converter assembly 300 and/or other programs that may interfere with the bottom surface 52 of the wafer 50 and require additional space. The wafer 50 is safely loaded to a reduced position on the support 10. If the bottom converter assembly 300 is in its process position, at least a portion of the bottom converter assembly 300 is spaced from the bottom surface 52 of the wafer 50, but sufficiently close to the bottom surface of the wafer 50. 52, such that when liquid is supplied to the top surface 51 of the wafer 50, a liquid meniscus is formed between the top surface 51 of the wafer 50 and the portion of the top converter assembly 200. In Figure 1, the bottom converter assembly 300 is in this process position.

Although the actuators 200, 300 are respectively illustrated as horizontal and vertical actuators in the system 1000, in other embodiments of the invention, different types of actuators may be employed in place of each. For example, the actuator operatively coupled to the bottom converter assembly 300 can be a horizontal, vertical, angular transfer actuator or a pivotally rotatable actuator. The same choice exists for operating an actuator coupled to the top converter assembly 200.

A positioning sensor 305 is provided in the cleaning system 1000 so that the positioning of the bottom converter assembly 300 can be effectively monitored and controlled. The positioning sensor 305 measures the distance between the bottom converter assembly 300 and the bottom surface 52 of the wafer 50 such that a suitable distance between the two can be achieved to perform the appropriate processing gap to form the liquid. Meniscus. The positioning sensor 305 is operative and communicatively coupled to the controller 12. More specifically, the positioning sensor 305 generates a signal ' indicating the measured distance' and transmits this signal to the controller 12 for processing. Although the sensor 305 is illustrated as being coupled to the bottom converter assembly 300, it can be mounted anywhere in the cleaning system 1000 as long as it can perform its position indicating function.

The cleaning system 1000 also includes an electrical energy signal source 23 operatively coupled to the top converter assembly 200 and the bottom converter assembly 300. The electrical energy signal source 23 generates the electrical signal that is transmitted to the top converter assembly 200 and the converter in the bottom converter assembly 300 (discussed later) for conversion to corresponding acoustic waves. energy. The desired electrical signals may be transmitted to the top and bottom converter assemblies 200, 300 simultaneously, continuously, and/or in an alternating manner depending on the needs of the programs. The source of electrical energy signals 23 is operatively coupled to and controlled by the controller 12. Thus, the controller 12 will specify the frequency, power level, and duration of the acoustic energy generated by the top converter assembly 200 and the bottom converter assembly 300. Preferably, the source of electrical energy signals 23 is controlled such that the acoustic energy generated by the top converter assembly 200 and the bottom converter assembly 300 has a frequency in the ultrasonic range.

Depending on system requirements, it may not be desirable to utilize a single electrical energy signal to control both the top converter assembly 200 and the bottom converter assembly 300. Thus, in other embodiments of the invention, multiple sources of electrical energy signals can be utilized, each having a source of electrical energy signals.

The controller 12 can be a processor that can be a programmable logic controller, a personal computer, or the like for program control. The controller 12 preferably includes a plurality of input/output ports for providing connections to a plurality of components of the cleaning system 1000 that must be controlled and/or communicated. This electrical and/or intercommunication connection is indicated in Figure 1 by dashed lines. The controller 12 preferably also includes sufficient memory to store program prescriptions and other data, such as threshold values, processing time, rotational speed, processing conditions, processing temperature, flow rate, desired concentration input by a processor. , sequence operations, and the like. The controller 12 can be in communication with various components of the cleaning system 1000 to automatically adjust processing conditions, such as flow rate, rotational speed, movement of components of the cleaning system 1000, and the like, as desired. The type of system controller used in any given system will depend on the exact needs of the system being incorporated.

The top dispenser 13 is positioned and oriented such that the liquid system is applied to the top surface 51 of the substrate 50 as a liquid flows therethrough. If the substrate 50 is continuously rotated, the liquid will form a liquid layer or film across the entirety of the top surface 51 of the substrate 50. Similarly, the bottom dispenser 14 is positioned and oriented such that the liquid system is applied to the bottom surface 52 of the substrate 50 as it flows therethrough. If the substrate 50 is continuously rotated, the liquid will form a liquid layer or film across the entirety of the bottom surface 52 of the substrate 50.

The top converter assembly 200 is positioned such that there is a small gap between a portion of the top converter assembly 200 and the top surface of the wafer 50. The gap is sufficiently small that a liquid meniscus is attached to the top surface 51 of the wafer 50 and the portion of the top converter assembly 200 when the liquid is applied to the top surface 51 of the wafer 50. Formed between. Similarly, the bottom converter assembly 300 is positioned such that there is a small gap between a portion of the bottom converter assembly 300 and the bottom surface 52 of the wafer 50. The gap is sufficiently small that a liquid meniscus is attached to the bottom surface 52 of the wafer 50 and the bottom converter assembly 300 when the liquid is applied to the bottom surface 52 of the wafer 50. Formed between. The meniscus is not limited to any particular shape.

As will be indicated, the top and bottom converter assemblies 200, 300 are generally illustrated as squares. Thus, the present invention is not limited to any particular configuration, shape, and/or assembly configuration for the converter assemblies 200, 300 in its broadest sense. For example, US Patent No. 6,039,059 ("Bran") issued on March 21, 2000, and US Patent 7, 148,286 ("Beck et al.") issued on December 5, 2006, April 1, 2003 Any one of the converter assemblies disclosed in U.S. Patent No. 6,539,952 ("Itzkowitz"), issued to U.S. Patent Application Publication No. 2006/0278253 ("Verhaverbeke et al." issued on Dec. 14, 2006). It can be used as the top and/or bottom converter assembly 200, 300. Of course, other forms of converter assemblies can be utilized, such as such converter assemblies having an elongated emitter rod that supports the surface of the wafer at an angle.

Referring now to Figure 2, a preferred embodiment of the cleaning system 1000 is illustrated. The same code is used in Figures 2 through 14 to indicate the corresponding structural display of the components illustrated in Figure 1.

In the cleaning system 1000 of FIG. 2, the top converter assembly 200 includes an elongated rod-shaped emitter 201 that is acoustically coupled to a transducer 203 (visible in FIG. 3) located within the outer casing 202. Many details of this type of extended rod-shaped emitter 201 are disclosed in U.S. Patent No. 6,684,891 ("Bran") issued on Feb. 3, 2004, and U.S. Patent No. 6,892,738 issued on March 17, 2005 ("Bran et al. It is to be noted that all of these U.S. patents are incorporated herein by reference. The top converter assembly 200 is operatively coupled to a drive assembly/actuator 250 that allows the rod emitter 201 to move between a retracted position and a process position. If the rod-shaped emitter 201 is in the retracted position, the rod-shaped emitter 201 is located on the outer side of the processing cassette 203 so that a wafer 50 can be placed on the rotatable holder 10 without hindrance. on. More specifically, the drive assembly 250 will withdraw the rod-shaped emitter 201 through an opening in one of the side walls of the process cartridge 203. If in the process of positioning, the rod-shaped emitter 201 is positioned directly above the top surface 51 of one of the wafers 50 on the rotatable mount 10. The rod-shaped emitter 201 is in this process position in FIG.

The bottom converter assembly 300 is positioned at the bottom of the processing cassette 203 below the rotatable mount 10. The bottom converter assembly 300 includes a dam 301, a transmitter 302 and a substrate 303. The bottom dispenser 14 is in the form of a plurality of sprayers located within the substrate 303 itself rather than a single nozzle dispenser.

Referring now to Figure 3, it can be seen that the rotatable mount 10 is located within the processing bowl 203. The rotatable mount 10 supports a wafer 50 in a substantially horizontal orientation in the gaseous environment of the processing cartridge 203, the processing cartridge 203 surrounding the wafer 50. The rotatable mount 10 is operatively coupled to the motor assembly 11. The motor assembly rotates the wafer along the central axis. The motor assembly 11 can be a direct drive motor or a bearing with a bias belt/pulley drive.

The rotatable mount 10 supports a lifting position of the wafer 50 between the elongated rod emitter 201 of the top converter assembly 200 and the emitter 302 of the bottom converter assembly 300. If the wafer 50 is supported as such, the emitter 201 of the top converter assembly 200 will extend in a substantially parallel orientation on the top surface 51 of the wafer 50 in a closely spaced relationship. . Similarly, the emitter 302 of the bottom converter assembly 300 will extend in a substantially parallel orientation with respect to the bottom surface 52 of the wafer 50 in a closely spaced relationship. When liquid is applied from the dispensers 13, 14 to the top and bottom surfaces 51, 52, respectively, a liquid meniscus is formed in a portion of the emitter 201 and the top surface 51 of the wafer 50, respectively. There is such a close spacing relationship between a portion of the emitter 302 and the bottom surface 52 of the wafer 50.

The bottom converter assembly 300 is operatively coupled to the elevator/actuator 350. The lifter/actuator 350 can be a pneumatic lifter and can also include a bracket. The lifter 350 moves the bottom converter assembly 300 between a process position and a retracted position. In FIG. 3, the bottom converter assembly 300 is in the process position, which is an elevated position, wherein the emitter 302 is in the close spaced relationship discussed above. When in the retracted position, the bottom converter assembly 300 is in a lowered position to ensure that the wafer 50 is not damaged during insertion onto the rotatable mount 10.

The converters 203, 305 of the top and bottom converter assemblies 200, 300 are acoustically coupled to the emitters 201, 302, respectively. This can be achieved by direct bonding or indirect bonding using one of the intermediate transport layers. The converters 203, 305 are operatively coupled to a source of an electrical energy signal. The converters 203, 305 can be a piezoelectric ceramic or crystal, as is well known in the art.

Referring now to Figures 4 through 7, the bottom converter assembly 300 is illustrated as being removed from the cleaning system 1000, and thus details thereof can be seen. It will be appreciated that the bottom converter assembly 300 is, by itself, a novel device that may constitute a particular embodiment of the present invention.

The bottom converter assembly 300 includes a base structure 303, a housing 304, a transmitter 302, a converter 305 and a dam 301. The base structure 303 is preferably made of PTFE or other suitably rigid, non-contaminating material. The base structure 303 has a top convex surface which generally has a volleyball shape. The base structure 303 is coupled to and supports the remaining components of the bottom converter assembly 300. The base structure 303 also includes a plurality of liquid dispensing orifices/nozzles 14 that are adapted to supply a liquid film to the bottom surface of a wafer during processing. The apertures/nozzles 14 are located on opposite sides of the emitter 302 along two separate columns extending the length of the emitter 302.

The emitter 302 is generally a side-by-side cylindrical shaped plate having a convex outer surface 306 and a concave inner surface 307. However, the launcher 302 can take a wide variety of other shapes and sizes. The transmitter 302 can be constructed of any material that transmits the acoustic energy generated by the converter 305, including but not limited to quartz, sapphire, boron nitride, plastic, and metal. A suitable metal is aluminum.

The outer convex surface of the emitter 302 will end at a top 313. Because the emitter 302 is in the form of a side-by-side cylindrical shape, the top portion 313 (Fig. 7) forms an elongated edge 314 along the length of the emitter. Of course, as used herein, the term extended edge is not limited to the top of an elongated curved surface, but rather includes, between other things, the intersection of the two surfaces. Moreover, in other embodiments, the emitter 302 can be spherical in nature, such that the top can be a point.

The transducer 305 is a curved plate having a convex surface 308 and a concave lower surface 309. The construction of a converter that converts electrical energy into sonic energy is well known in the art. The convex surface 308 of the transducer has a curvature that corresponds to the curvature of the concave surface 307. The converter 305 is acoustically coupled to the transmitter 302 such that acoustic energy generated by the converter 305 propagates through the transmitter 302 and reaches the wafer 50. More specifically, the convex surface 308 of the transducer 305 is bonded to the concave inner surface 307 of the emitter. This bond may be a direct bond between the surfaces 307, 308 or may be an indirect bond using an intermediate transfer layer. In other embodiments, the converters can be flat plates or other shapes. Moreover, although the bottom converter assembly 300 is illustrated as utilizing a single converter 305, a plurality of converters can be used to generate sonic energy, as desired. Preferably, the converter 305 is adapted to generate ultrasonic energy.

The emitter 302 is coupled to the outer casing 304 to form a substantially enclosed space 310 in which the transducer 305 is located. The outer casing 304 can be attached to the emitter 302 using any suitable means, including adhesive, heat welded, fastener or a tightly bonded assembly. A plurality of openings 311 are provided in a bottom portion of the outer casing 304. The openings 311 are provided to allow a gas to be introduced and/or directed to the space 310 so that the converter 305 can be cooled and/or purified. The openings 311 are operatively coupled to the gas source 20 as illustrated in FIG. The housing 304 also includes an opening 312 to allow for electrical connections (i.e., wiring) that are necessary to provide power to the converter 305 for access to the space 310. This opening 312 can also be used to enable the gas to escape the space 310. The outer casing 304 can take a wide variety of shapes and configurations and is not limited by the invention. In some embodiments, the outer casing may be only a plate or other simple structure.

To further protect the wafer 50 from possible contamination, once the emitter 302 is attached to the outer casing 304, the combination assembly is conveniently coated with an inert, non-contaminating plastic such as Teflon or the like. Fully packaged. This also serves to protect the transmitter 302 from chemical attack. When the emitter 302 is packaged and/or coated as such, the package and/or coating is considered part of the emitter 302.

Referring only to Figures 4 and 7, the bottom emitter assembly 300 further includes a dam 301 that surrounds the periphery/periphery of the emitter 302. The dam 301 defines an upwardly projecting ridge 316 having an angled inner surface 317, an outer surface 318 and a top edge 319. The dam 301 will form a liquid retaining passage 315 on both sides of the launcher 302. More specifically, the inner surface 317 of the ridge 316 will form a channel/groove with the emitter 302. Of course, in some embodiments, the dam 301 can be used to form the channel 315 in other ways and/or by incorporating other structures.

The dam 301 is a rectangular frame-shaped structure, but other shapes are still available. The dam 301 also does not have to surround the entire periphery of the emitter 302, but may only surround a small portion as desired. The dam 301 can be constructed of HDPE, PVDF, NPP, or any other material. Preferably, the materials selected are chemically and mechanically stable.

The dam 301 is implemented into the bottom converter assembly 300 to increase the meniscus size that couples the emitter 302 to the bottom surface 52 of the wafer 50. This promotes an increase in the amount of sonic energy transmitted to the wafer 50 to improve cleaning. As illustrated in FIG. 7, the meniscus only couples region A of the emitter 302 to the wafer 50 without the dam 301. However, with the dam 301, the meniscus coupling region is increased to the region B.

Referring now to Figures 8 through 12, a possible relative configuration of the bottom converter assembly 300 and the top converter assembly 200 relative to one another in the cleaning system 1000 will be discussed.

Referring first to Figures 8 and 9, a configuration in which the transmitter 201 of the top converter assembly 200 is aligned with the emitter 302 of the bottom converter assembly 300 and opposite the emitter 302 of the bottom converter assembly 300 It is explained. A wafer 50 is illustrated as being interposed between the assemblies 200, 300. When liquid 70 is applied to the top surface 51 of the wafer 50, a liquid meniscus 72 is attached to the bottom portion 207 of the emitter 201 of the top converter assembly 200 and the top of the wafer 50. The surface 51 is formed. Similarly, when liquid 70 is applied to the bottom surface 52 of the wafer 50, a liquid meniscus 71 is attached to the emitter 302 of the bottom converter assembly 300 and the bottom surface 52 of the wafer 50. Formed between. As can be seen, the coupling portions of the top emitter 201 and the bottom emitter 302 will oppose each other in an aligned manner. As a result, the acoustic energy generated by the top and bottom converter assemblies 200, 300 and transmitted to the wafer via the meniscus 71, 72 can be correlated with each other or offset.

Thus, in some cases, it may be desirable to operate the top and bottom converter assemblies 200, 300 in an alternating and/or continuous manner during a wafer cleaning cycle. In other embodiments, if interference is not an issue, then the operations of the top and bottom converter assemblies 200, 300 may need to be actuated simultaneously.

Referring now to Figures 10 and 11, an alternative relative configuration of the bottom converter assembly 300 and the top converter assembly 200 relative to one another in the cleaning system 1000 is illustrated. In this embodiment, the emitters 201, 302 of the top and bottom converter assemblies 200, 300 are not aligned or opposite each other. Therefore, interference should not cause problems during the simultaneous generation and transmission of acoustic energy to the wafer. Although the horizontal angle of separation between the top and bottom emitters 201, 302 is 90 degrees in this description, any other angle may be utilized including, but not limited to, 180 degrees, 45 degrees, and the like.

During the production of the above system, it was found that even when not actuated (i.e., passive), the improved cleaning results are present in the cleaning system 1000 only by the bottom converter assembly 300 and configured as shown in Figure 8. Show and achieve. It has been discovered that the emitter 302 of the bottom converter assembly 300 will continue to reflect at least a fraction of the acoustic energy generated by the top converter assembly 200 toward the bottom surface 51 of the wafer 50. Thus, in another aspect, the present invention is a novel system that utilizes one of the opposing surfaces coupled to the wafer to be a passive reflective component rather than the active converter assembly.

Referring now to Figure 12, a cleaning system 2000 utilizing a passive backside reflective component 400 is schematically illustrated. The cleaning system 2000 is identical to the cleaning system 1000 except that the bottom converter assembly is replaced by a reflective member. In fact, in some embodiments, the reflective component 400 can be a converter assembly (such as the converter assembly described above) that is not actuated. However, the reflective member 400 is not so limited, and the structure that can be employed is more extensive and diverse. Therefore, since the description of the above cleaning system 1000 for the same part is sufficient, a detailed description of the cleaning system 2000 will be omitted. The same code is used to refer to the same part.

The reflective component 400 can be just a plate or other structure. Preferably, the reflective member 400 is made of a material having a sonic impedance value that is much greater than the acoustic impedance value of water. In a specific embodiment, the acoustic impedance value is preferably at least greater than 5.0, such as quartz. Preferably, the reflective component 400 can also be spaced apart from the surface of the wafer to which it is fluidly coupled by a distance of one-fourth the wavelength of the acoustic energy generated by the acoustic source 200.

Figure 13 shows an alternative embodiment of the passive cleaning system 200 in which the reflective component is positioned adjacent the top surface of the wafer rather than the bottom.

Referring to Figure 14, it has been found that a hollow tubular structure can preferably be utilized as the reflective member 400. Hollow tubular members 500A to E are exemplified as an example. The hollow tubular members 500A-E may optionally be provided with transducers 305A-E. The tubular member can be made of quartz, plastic, metal, or other materials.

However, it should be understood that the various features and advantages of the present invention, as well as the details of the structure and function of the present invention, are only illustrative, and may vary in detail, particularly in The shapes, sizes, and configurations of the components are fully extended within the principles of the present invention and do not depart from the broad general meaning of the items of the appended claims.

10. . . Rotatable bracket

11. . . motor

12. . . Controller

13. . . Top dispenser

14. . . Bottom dispenser

15. . . Liquid reservoir

16. . . Liquid supply subsystem

17. . . Liquid supply line

18. . . Liquid supply line

19. . . Gas supply subsystem

20. . . Gas source

twenty one. . . Gas supply line

twenty two. . . Gas supply line

twenty three. . . Source of electrical energy signal

50. . . Semiconductor wafer

51. . . Top surface

52. . . Bottom surface

70. . . liquid

71. . . Liquid meniscus

72. . . Liquid meniscus

200. . . Top converter assembly

201. . . Rod emitter

202. . . shell

203. . . Processing

207. . . Bottom part

250. . . Drive assembly / actuator

300. . . Bottom converter assembly

301. . . dam

302. . . launcher

303. . . Base

304. . . shell

305. . . converter

305A-E. . . converter

306. . . Convex outer surface

307. . . Concave inner surface

308. . . Convex surface

309. . . Concave lower surface

310. . . Substantial closed space

311. . . Opening

312. . . Opening

313. . . top

314. . . Extend the edge

315. . . Liquid retention channel

316. . . Upward raised ridge

317. . . The inner surface

318. . . The outer surface

319. . . Top edge

350. . . Actuator

400. . . Passive backside reflector

500A-E. . . Hollow tubular part

1000. . . Cleaning system

2000. . . Cleaning system

1 is a schematic illustration of a sonic energy cleaning system in accordance with an embodiment of the present invention.

2 is a perspective view of a structural embodiment of one of the acoustic energy cleaning systems of FIG. 1.

Figure 3 is a cross-sectional side view of the acoustic wave energy cleaning system of Figure 2.

4 is a converter assembly for use as the bottom side converter assembly in the sonic energy cleaning system of FIG. 2, in accordance with an embodiment of the present invention.

Figure 5 is a cross-sectional view of the converter assembly of Figure 4 taken along line A-A of the section of Figure 4.

Figure 6 is an exploded view of the converter assembly of Figure 4.

7 is a schematic illustration of the converter assembly of FIG. 4 positioned adjacent one of the bottom surfaces of a semiconductor wafer in accordance with an embodiment of the present invention, wherein the converter assembly of FIG. 4 is shown in cross section.

Figure 8 is a schematic representation of one configuration of a top side converter assembly for the bottom side converter assembly of the sonic energy cleaning system of Figure 2.

Figure 9 is a schematic cross-sectional view showing the arrangement of the converter assembly of Figure 8 taken along line BB of Figure 8;

Figure 10 is a schematic representation of an alternative configuration of a top side converter assembly for the bottom side converter assembly of the sonic energy cleaning system of Figure 2.

Figure 11 is a schematic cross-sectional view of the alternative converter assembly configuration of Figure 10 taken along line C-C of the section of Figure 8.

Figure 12 is a schematic illustration of a sonic energy cleaning system utilizing a reflective member in accordance with an embodiment of the present invention.

Figure 13 is a schematic illustration of a sonic energy cleaning system utilizing a reflective member in accordance with an alternative embodiment of the present invention.

Figure 14 shows a five alternative embodiment of a converter assembly that can also function as a reflective component in the acoustic energy cleaning system of Figure 12.

10. . . Rotatable bracket

11. . . motor

12. . . Controller

13. . . Top dispenser

14. . . Bottom dispenser

15. . . Liquid reservoir

16. . . Liquid supply subsystem

17. . . Liquid supply line

18. . . Liquid supply line

19. . . Gas supply subsystem

20. . . Gas source

twenty one. . . Gas supply line

twenty two. . . Gas supply line

twenty three. . . Source of electrical energy signal

50. . . Semiconductor wafer

51. . . Top surface

52. . . Bottom surface

200. . . Top converter assembly

250. . . Drive assembly / actuator

300. . . Bottom converter assembly

305. . . converter

350. . . Actuator

1000. . . Cleaning system

Claims (40)

A system for processing a flat object, comprising: a rotatable support for supporting a flat object; a first dispenser for applying a liquid to one of the flat objects on the rotatable support a first surface; a second dispenser for applying a liquid to a second surface of a flat object on the rotatable support; a first converter assembly containing one of the sound energy for generating sound waves a first transducer and acoustic wave coupled to one of the first transducers, the first transducer assembly being positioned such that the first dispenser dispenses liquid to a flat object on the rotatable mount The first surface forms a first liquid meniscus between a portion of the first emitter and the first surface of the planar object; and a second transducer assembly for generating acoustic energy a second converter and acoustic wave coupled to one of the second transducers, wherein the second emitter has a convex outer surface, the convex outer surface having a second elongated edge, the second transducer Accessories Positioning such that when the second dispenser applies liquid to the second surface of the flat object on the rotatable mount, the second elongated edge of the convex outer surface of the second emitter and the flat object A second liquid meniscus is formed between the second surfaces. The system of claim 1, wherein the rotatable support supports and rotates the flat object in a substantially horizontal orientation, the first surface of the flat object being a top surface and the second surface of the flat object being a bottom surface. The system of claim 1 further comprising an actuator operatively coupled to the second converter assembly to move the second converter assembly between a process positioning and a retracted position. The system of claim 3, wherein: the rotatable support supports and rotates the flat object in a substantially horizontal orientation, the first surface of the object being a top surface and the second surface of the object being a a bottom surface; and wherein the processing positioning is elevated, wherein at least a portion of the second transducer assembly is spaced from the bottom surface of the planar object such that the second liquid meniscus is formed The bottom surface of the flat object is between the second extended edge of the convex outer surface of the second emitter, and the retracted positioning is lowered, wherein the flat object can be safely loaded to the Rotate the bracket without coming into contact with the second converter assembly. The system of claim 1, further wherein: the first emitter portion includes a first elongated edge that extends substantially parallel to the first surface of the planar object on the rotatable mount; and wherein the first The second extended edge extends substantially parallel to the second surface of the planar object on the rotatable mount. The system of claim 1 further comprising a substrate for supporting the second transducer assembly, the second dispenser being located at a plurality of nozzles of the substrate and adapted to apply liquid to the rotatable mount The second surface of the flat object. The system of claim 1, wherein the second converter assembly further comprises a housing coupled to the second emitter to form a substantially enclosed space in which the second converter is located, the housing One or more openings for a gas to flow into and/or out of the space are included. The system of claim 1 further comprising a dam surrounding at least a portion of a perimeter of one of the second emitters to form a liquid retention channel, the second elongated edge of the second emitter protruding beyond the The top of one of the dams. The system of claim 1, further comprising: a dam surrounding at least a portion of one of the second emitters to form a liquid retention channel; and the convex outer surface of the second emitter having a top portion The top of the second emitter will protrude beyond the top of one of the dams. The system of claim 1 further comprising a dam surrounding at least a portion of one of the second emitters to form a liquid retention channel between the second emitter and the dam. The system of claim 1, wherein the portion of the first emitter and the second elongated edge of the second emitter are opposite each other. The system of claim 1, further comprising: a controller operatively coupled to the first converter assembly and to the second converter assembly; the controller being programmed to continuously operate the first converter Assembly and the second converter assembly. The system of claim 1, wherein the second emitter is cylindrically side by side A plate having a concave inner surface and the convex outer surface. A system for cleaning a flat object, comprising: a rotatable support for supporting a flat object; a first converter assembly including a first converter and acoustic waves coupled to the first converter a first transmitter, the first converter assembly being positioned such that a first gap exists between a portion of the first emitter and a first surface of the planar object of the rotatable mount, and When a first dispenser is applied to the first surface, a first liquid meniscus is formed between the portion of the first emitter and the first surface of the planar object; and a second transducer is mounted An accessory comprising a second transducer and acoustic wave coupled to one of the second transducers, the second transducer assembly being positioned such that a portion of the second emitter and the rotatable mount are a second gap exists between the second surface of the flat object, and is formed between the portion of the second emitter and the second surface when the liquid is applied to the second surface by a second dispenser a second liquid meniscus; a controller operatively coupled to the first converter assembly and the second converter assembly; the controller being programmed to operate the first converter assembly and the second in an alternate manner or in a continuous manner a converter assembly; and wherein the portion of the first emitter and the portion of the second emitter are opposite each other. A system for processing a flat object, comprising: a rotatable mount for supporting and rotating a flat object in a substantially horizontal orientation; a converter assembly including a transducer for generating acoustic energy, a transmitter and surrounding the emitter a dam of at least a portion of a perimeter such that a liquid retention channel can be formed between the emitter and the dam, the emitter having a convex outer surface having a top surface, the top acoustic wave coupled to the converter The top protrusion of the second emitter exceeds a top of the dam; and the converter assembly is positioned such that the top of the emitter is adjacent to a bottom surface of the planar object on the rotatable mount such that When a liquid is applied to the bottom surface of the flat object, a liquid meniscus is formed between the top of the emitter and the bottom surface of the flat object. The system of claim 15 further comprising a dispenser for applying a liquid to a bottom surface of a flat object on the rotatable mount. The system of claim 15 wherein the emitter is a side-by-side cylindrical plate and the top portion forms an elongated edge. The system of claim 15 wherein the converter assembly further comprises a housing coupled to the transmitter to form a substantially enclosed space in which the converter is located. a converter assembly for mounting under a bottom surface of a flat object, comprising: a transducer for generating acoustic energy; a transmitter having acoustic waves coupled to the transducer; a dam; Surrounding at least a portion of one of the perimeters of the emitter to enable Forming a liquid holding passage between the emitter and the dam; and wherein the emitter has a convex outer surface having a top protruding from a top of one of the dams, the top of the emitter being adjacent to the flat object The bottom surface is such that when a liquid is applied to the bottom surface of the flat object, a liquid meniscus is formed between the top of the emitter and the bottom surface of the flat object. The transducer assembly of claim 19, wherein the emitter is a side-by-side cylindrical plate having a concave inner surface and a convex outer surface. A method of processing a flat object, comprising: a) supporting a flat object in a substantially horizontal orientation within a gaseous environment, the flat object having a bottom surface and a top surface; b) rotating the flat object simultaneously Maintaining the substantially horizontal orientation; c) applying a liquid film to the top surface of the flat object; d) applying a liquid film to the bottom surface of the flat object; e) via including a first transducer a first transducer assembly of a first emitter applies acoustic energy to the top surface of the planar object, a portion of the first emitter contacting the liquid film on the top surface of the planar object; and f) Applying acoustic energy to the bottom surface of the planar object via a second transducer assembly comprising a second transducer and a second emitter, the second emitter having a convex outer surface having a convex outer surface a second elongated edge that contacts the liquid film on the bottom surface of the flat object. The method of claim 21, wherein steps e) and f) are performed in situ. The method of claim 21, wherein the step f) further comprises raising the second converter assembly from a retracted position to a process position, wherein the second extended edge of the second transmitter contacts the flat object The liquid film on the bottom surface. The method of claim 21, wherein the step e) comprises moving the first transducer assembly from a retracted position to a process position, wherein the portion of the first emitter contacts the top surface of the flat object The liquid film. The method of claim 21, wherein steps e) and f) are performed in an alternative, simultaneous and/or continuous manner. The method of claim 21, wherein the acoustic energy applied in steps e) and f) is in the ultrasonic frequency range. The method of claim 21, wherein the second elongated edge of the second emitter forms a top that contacts the liquid film on the bottom surface of the planar object. The method of claim 27, wherein the first emitter has an elongated edge that contacts the liquid film on the top surface of the flat object. The method of claim 21, wherein the planar system is a semiconductor wafer, the top surface being one of the device sides of the wafer and the bottom surface being one of the non-device sides of the wafer. A system for processing a flat object, comprising: a rotatable mount for supporting a flat object in a substantially horizontal orientation; a converter assembly including one for converting acoustic energy And sound waves are coupled to one of the transducers of the transducer, the transducer assembly being positioned such that a portion of the emitter is adjacent a top surface of the planar object on the support such that a liquid is applied to the planar object The top surface forms a first liquid meniscus between the portion of the emitter and the top surface of the flat object; and a reflective member having a convex outer surface, the convex outer surface ending at a top portion The top portion defines an elongated edge extending along a length of the reflective member, the reflective member being positioned such that the extended edge of the reflective member is adjacent to a bottom surface of the planar object on the support, Forming a bottom surface of the flat object with a second liquid meniscus between the extended edge of the reflective member and the bottom surface of the flat object; and the reflective member is positioned such that the first transducer is mounted At least one fraction of the sound wave energy generated by the accessory passes through the first first meniscus, the flat object, and the second meniscus, and is toward the bottom of the flat object Face reflected back. The system of claim 30, wherein the reflective component is comprised of a material having an acoustic impedance greater than 5.0 Mrayl. The system of claim 30, wherein the converter assembly is adapted to generate acoustic wave energy having a wavelength, and wherein the extended edge of the reflective member is spaced a distance from the bottom surface of the planar object, One quarter of the wavelength of the sonic energy is spaced. The system of claim 30, wherein the reflective member is comprised of quartz, sapphire, boron nitride, tantalum carbide, carbonized glass, or a combination thereof. The system of claim 30, further comprising: a first dispenser for applying liquid to the top surface of the flat object of the rotatable mount; and a second dispenser for Liquid is applied to the bottom surface of the flat object on the rotatable mount. The system of claim 30, wherein the reflective component is a second transducer assembly capable of generating acoustic energy. A system for processing a flat object, comprising: a rotatable support for supporting a flat object in a gaseous environment; a converter assembly including a transducer coupled to one of the transducers for emission The transducer assembly is positioned such that a first small gap exists between a portion of the emitter and a first surface of the planar object on the support such that the first application of liquid to the planar object Forming a first liquid meniscus between the portion of the emitter and the first surface of the flat object; a reflective member having a convex outer surface, the convex outer surface ending at a top, the surface Forming an extended edge at the top, the extended edge extending along a length of the reflective member, the reflective member being positioned such that there is a first edge between the extended edge of the reflective member and a second surface of the planar object on the bracket a small gap such that when the liquid is applied to the second surface of the flat object, a relationship is formed between the extended edge of the reflective member and the second surface of the flat object Second liquid meniscus; and The reflective member is positioned such that at least a fraction of the acoustic energy generated by the first transducer assembly passes through the first meniscus, the flat object and the second meniscus, and is toward the flat object The second surface is reflected back by the reflector component. A method of processing a flat object, comprising: a) supporting a flat object in a substantially horizontal orientation within a gaseous environment, the flat object having a bottom surface and a top surface; b) rotating the flat object while maintaining The substantially horizontal orientation; c) applying a liquid film to the top surface of the flat object; d) applying a liquid film to the bottom surface of the flat object; e) via including a converter and an emitter One of the transducer assemblies applies sonic energy to the top surface of the flat object, one of the emitters contacting the liquid film on the top surface of the flat object, at least the acoustic energy generated by the converter assembly a fraction passing through the liquid film on the top surface of the flat object, passing the flat object and passing the liquid film on the bottom surface of the flat object; and f) via contacting the bottom surface of the flat object a reflective member of the liquid film toward the bottom surface of the flat object will be generated by the first converter assembly and reflected back by the sound energy of the flat object The reflecting member having a top end of the outer surface of one of the convex surface, forming an extension of the top edge, the edge extension member extending along the length of one of said reflector. The method of claim 37, wherein the reflecting member is constructed of a material having an acoustic impedance greater than 5.0. The method of claim 37, wherein the reflecting member is a tubular member, a side-by-side cylindrical member, a flat plate or a curved plate. The method of claim 37, wherein the acoustic energy has a wavelength, the reflective member being spaced from the bottom surface of the planar object by a distance of one quarter of the wavelength of the acoustic energy.