TWI526811B - Computer device with heat dissipation channel - Google Patents

Description

Expansion-type computer device using heat dissipation channel to dissipate heat

The invention relates to a connection expansion type computer device which utilizes a heat dissipation channel to dissipate heat, in particular, a connection expansion type computer device which combines a computer main body and peripheral devices to integrate a heat dissipation channel to dissipate heat by using a heat dissipation channel.

With the advancement of technology, the development of a thin and short trend has led to the connection of expansion-type computer devices. Generally speaking, the connection expansion computer can be operated by only one computer host, and depending on the user's needs, whether to install a hard disk or a video is selected. Peripheral devices such as Video Graphics Array (VGA) expand the functions of the host computer. However, for the above expansion, heat dissipation has also become a problem to be overcome. Among them, the fanless computer mainframe is one of the current development trends. It uses natural heat convection to dissipate heat, but when the peripheral devices are connected to the computer mainframe (for example, stacked up and down), the fanless computer can not use the heat convection to dissipate heat, and the heat dissipation problem of the peripheral devices is also Become one of the topics to be solved.

In view of the fact that the existing connection expansion type computer device is connected to the peripheral device, there is generally a problem that the heat cannot be effectively dissipated. Therefore, the present invention mainly provides a connection expansion type computer device that utilizes a heat dissipation channel to dissipate heat, in particular, a computer main unit and peripheral devices are combined to integrate a heat dissipation channel, thereby utilizing the heat dissipation channel to simultaneously make the computer main unit and the peripheral device. Dissipate heat to solve the problems of the prior art.

Based on the above objects, the main technical means adopted by the present invention provides a connection expansion type computer device that utilizes a heat dissipation channel to dissipate heat, and includes a computer host and a peripheral device. The host computer includes a main body housing and a first working component, the main housing has at least one first connecting surface, the first connecting surface is provided with at least one first heat dissipation hole, and at least one first in the main body housing The heat dissipation channel is connected to an external space via the first heat dissipation hole. The first working element is disposed in the main body casing, and the first heat dissipation channel passes through the first working element. The peripheral device includes a peripheral device housing and at least one fan, the peripheral device housing has at least one second connecting surface, the second connecting surface is provided with at least one second heat dissipation hole, and at least one second heat dissipation channel in the peripheral device housing It is connected to the external space via the second heat dissipation hole. The fan is located in the peripheral device housing and disposed at the second heat dissipation passage. The second working element is disposed within the peripheral device housing and adjacent to the fan for cooling with a fan. The first heat dissipation channel, the first heat dissipation hole, the second heat dissipation hole and the second heat dissipation channel are sequentially connected and integrated into each other when the peripheral device is combined with the computer main body and the first connection surface is adjacent to the second connection surface. An integrated heat dissipation channel is provided, and the fan operates to cause a first cooling airflow to flow through the integrated heat dissipation channel.

The host housing further has at least one first heat dissipating surface, and the first heat dissipating surface is provided with at least one third heat dissipating hole, in a preferred embodiment of the method for attaching the expansion type computer device using the heat dissipating channel. The third heat dissipation hole is in communication with the first heat dissipation channel, and the first heat dissipation surface is a side surface of the main body casing, and the first connection surface is a bottom surface of the main body casing. In addition, the peripheral device housing further has at least one second heat dissipation surface, the second heat dissipation surface is provided with at least one fourth heat dissipation hole, and the fourth heat dissipation hole is in communication with the second heat dissipation channel, and the second heat dissipation surface is surrounded by The side of the device housing, the second connecting surface is the top surface of the peripheral device housing.

In a preferred embodiment of the above-mentioned auxiliary technology for connecting the expansion type computer device using the heat dissipation channel, the peripheral device housing further includes a third heat dissipation surface, and the third heat dissipation surface is provided with at least a fifth heat dissipation hole. The fifth heat dissipation hole is connected to the external space via at least one third heat dissipation channel in the peripheral device housing, and the third heat dissipation channel is connected to the fourth heat dissipation hole, and when the fan is operated, a second cooling airflow is caused to flow through The third heat dissipation channel. In addition, the peripheral device further has a second working component disposed in the peripheral device housing and adjacent to the fan, and the first working component is a central processing unit (CPU), and the second working component is It is a Graphics Processing Unit (GPU).

After the main technical means of the connection expansion type computer device using the heat dissipation channel to dissipate heat by the present invention, the fan can make the cooling air flow flow through the integrated heat dissipation channel to dissipate the first working element and the second working element, thereby effectively The computer mainframe and peripheral devices are dissipated to solve the problems of the prior art.

After the auxiliary technology of the connection expansion type computer device using the heat dissipation channel to dissipate heat by the present invention, since the fan can simultaneously pass another cooling airflow through the third heat dissipation channel to further dissipate the second working element, the pair can be improved. Peripheral device cooling efficiency.

The specific embodiments of the present invention will be further described by the following examples and drawings.

1‧‧‧Connected expansion computer unit using heat dissipation channel

11‧‧‧Computer host

111, 111a‧‧‧ mainframe housing

1111, 1111a‧‧‧ first connection surface

11111, 11111a‧‧‧ first vent

1112‧‧‧First heat sink

11121‧‧‧3rd vent

112, 112a‧‧‧ first working element

12‧‧‧ peripheral devices

121‧‧‧ Peripheral device housing

1211‧‧‧second connection surface

12111‧‧‧Second cooling hole

1212‧‧‧second heat sink

12121‧‧‧4th vent

1213‧‧‧ Third heat sink

12131‧‧‧Fixed vents

122‧‧‧fan

123‧‧‧Second working element

2a‧‧‧Removable components

L1‧‧‧First heat dissipation channel

L2‧‧‧second heat dissipation channel

L3‧‧‧ third cooling channel

P1‧‧‧First cooling airflow

P2‧‧‧second cooling airflow

The first figure shows a perspective exploded view of a connection expansion type computer device using a heat dissipation channel for heat dissipation according to a first preferred embodiment of the present invention; and the second figure shows a connection expansion using a heat dissipation channel for heat dissipation according to the first preferred embodiment of the present invention. FIG. 3 is a schematic cross-sectional view showing a connection expansion type computer device using a heat dissipation channel for heat dissipation according to a first preferred embodiment of the present invention; and a fourth diagram showing a second preferred embodiment of the present invention. Side view of an extended expansion computer unit using a heat sink to dissipate heat.

Since the connection expansion type computer device using the heat dissipation channel to provide heat dissipation according to the present invention is exemplified, the detailed description thereof will not be repeated, and only a preferred embodiment will be specifically described.

Referring to the first to third figures, the first figure shows a perspective exploded view of the connection expansion type computer device using the heat dissipation channel for heat dissipation according to the first preferred embodiment of the present invention, and the second figure shows the first aspect of the present invention. The connection of the expansion type computer device using the heat dissipation channel to dissipate heat in the preferred embodiment FIG. 3 is a schematic cross-sectional view showing a connection expansion type computer device using a heat dissipation channel for heat dissipation according to a first preferred embodiment of the present invention.

As shown in the figure, the connection expansion type computer device 1 (hereinafter referred to as the connection expansion type computer device 1) that uses the heat dissipation channel to dissipate heat according to the first preferred embodiment of the present invention includes a computer host 11 and a peripheral device 12, but in other implementations. More peripheral devices can be included in the example.

The mainframe 11 includes a main housing 111 and a first working component 112. The main housing 111 has at least one first connecting surface 1111 and at least one first heat dissipating surface 1112. In other embodiments, the first The connecting surface 1111 and the first heat dissipating surface 1112 may be plural, but in the first preferred embodiment of the present invention, only one is taken as an example.

The first connecting surface 1111 is a bottom surface of the main body casing 111, but the other embodiments are not limited thereto, and may be one of the four sides or the top surface, and the first connecting surface 1111 is provided with at least one first heat dissipation. The hole 11111 (only one is shown), and the first heat dissipation hole 11111 is connected to an external space (not shown) via at least one first heat dissipation channel L1 in the main body casing 111.

The first heat dissipating surface 1112 is one of the side surfaces of the main body casing 111. However, in other embodiments, the first heat dissipating surface 1112 may be disposed on the other surface or the plurality of heat dissipating surfaces, and the first heat dissipating surface 1112 is provided with at least one third cooling hole. 11121 (only one is shown in the figure), and the third heat dissipation hole 11121 is in communication with the first heat dissipation channel L1, that is, the third heat dissipation hole 11121 and the first heat dissipation hole 11111 are connected to each other via the first heat dissipation channel L1. .

The first working component 112 is a central processing unit (CPU) and is disposed in the host housing 111, and The first heat dissipating channel L1 passes through the first working component 112. The first working component 112 is electrically connected to the circuit board (not shown) to form a circuit board module. Therefore, the first working component 112 can also be Refers to the aforementioned circuit board module, which is hereby described.

The peripheral device 12 is a graphics processing device, but is not limited thereto. In other embodiments, it may be a hard disk or other device with high processing performance. The peripheral device 12 includes a peripheral device housing 121, at least one fan 122, and a second working component 123. The peripheral device housing 121 has at least one second connecting surface 1211, at least one second heat dissipating surface 1212, and a third heat dissipating portion. In other embodiments, the second connecting surface 1211 and the second heat dissipating surface 1212 may be plural, but in the first preferred embodiment of the present invention, only one is taken as an example.

The second connecting surface 1211 is a top surface of the peripheral device housing 121, but the other embodiments are not limited thereto, and may be one of the four sides or the top surface, and the second connecting surface 1211 is provided with at least a second surface. The heat dissipation holes 12111 (only one is shown), and the second heat dissipation holes 12111 are connected to the external space via at least one second heat dissipation channel L2 in the peripheral device housing 121.

The second heat dissipation surface 1212 is one of the side surfaces of the peripheral device housing 121. However, in other embodiments, the second heat dissipation surface 1212 may be disposed on the other surface or the plurality of heat dissipation surfaces, and the second heat dissipation surface 1212 is provided with at least one fourth heat dissipation hole. The second heat dissipation hole 12121 is in communication with the second heat dissipation hole L12, that is, the fourth heat dissipation hole 12121 communicates with the second heat dissipation hole 12111 via the second heat dissipation hole L12.

The third heat dissipation surface 1213 is provided with at least one fifth heat dissipation hole 12131 (in the figure) Only the first heat dissipation hole 12131 is connected to the external space via the at least one third heat dissipation channel L3 in the peripheral device housing 121, and the third heat dissipation channel L3 is connected to the fourth heat dissipation hole 12121, that is, It is said that the fifth heat dissipation holes 12131 and the fourth heat dissipation holes 12121 are in communication with each other.

The fan 122 is located in the peripheral device housing 121 and is disposed at the intersection of the second heat dissipation passage L2 and also adjacent to the third heat dissipation passage L3. The second working component 123 is a graphics processing unit (GPU) and is disposed in the peripheral device housing 121 adjacent to the fan 122 for cooling by the fan 122. Wherein, in general, the fan 122 is located above the second working element 123.

In addition, a plurality of heat dissipation fins (not shown) may be disposed in the peripheral device housing 121. The heat dissipation fins are disposed at the intersection of the second heat dissipation channel L2 and adjacent to the fan 122 to improve heat dissipation efficiency.

The first heat dissipation channel L1, the first heat dissipation hole 11111, the second heat dissipation hole 12111, the second heat dissipation hole 12111 and the second heat dissipation channel are formed when the peripheral device 12 is stacked on the computer main body 11 and the first connection surface 1111 is adjacent to the second connection surface 1211. The L2 is sequentially connected to be integrated into an integrated heat dissipation channel. When the fan 122 is in operation, a first cooling airflow P1 flows through the integrated heat dissipation channel, that is, from the external space through the third heat dissipation hole 11121 into the main body casing 111. The internal heat is further discharged from the fourth heat dissipation hole 12121 to the external space through the first heat dissipation hole L1, the first heat dissipation hole 11111, the second heat dissipation hole 12111, and the second heat dissipation channel L2 (which may be further passed through the heat dissipation fins). .

In addition, when the fan 122 is in operation, a second cooling airflow P2 is also caused. It flows through the third heat dissipation channel L3, that is, from the fifth heat dissipation hole 12131, and is discharged from the fourth heat dissipation hole 12121 to the external space via the third heat dissipation channel L3.

Please refer to the fourth figure, which is a side view showing the connection expansion type computer device using the heat dissipation channel to dissipate heat according to the second preferred embodiment of the present invention. As shown in the figure, unlike the first preferred embodiment, the first connecting surface 1111a of the main body casing 111a can be a non-flat surface, that is, the bottom surface of the main casing 111a is assembled and detachable. The component 2a can be assembled with the detachable component 2a when the peripheral device 112a is not normally connected, and the detachable component 2a can be detached when the peripheral device 112a is to be connected, so that the first heat dissipation hole 11111a of the first connection surface 1111a is large. Other embodiments are the same as the first preferred embodiment, and are not described herein again.

In summary, after the connection expansion type computer device provided by the heat dissipation channel of the present invention is used, the fan can make the cooling airflow flow through the integrated heat dissipation channel to dissipate the first working element and the second working element. Effectively dissipating heat between the computer mainframe and the peripheral device, thereby solving the problems of the prior art, and the fan can simultaneously dissipate another cooling airflow through the third heat dissipation channel to further dissipate the second working component, thereby improving the heat dissipation efficiency of the peripheral device. .

The features and spirit of the present invention will be more apparent from the detailed description of the preferred embodiments. On the contrary, the intention is to cover various modifications and equivalents within the scope of the invention as claimed.

1111‧‧‧First connection surface

11111‧‧‧First vent

1112‧‧‧First heat sink

11121‧‧‧3rd vent

112‧‧‧First working element

1211‧‧‧second connection surface

12111‧‧‧Second cooling hole

1212‧‧‧second heat sink

12121‧‧‧4th vent

1213‧‧‧ Third heat sink

12131‧‧‧Fixed vents

122‧‧‧fan

123‧‧‧Second working element

L1‧‧‧First heat dissipation channel

L2‧‧‧second heat dissipation channel

L3‧‧‧ third cooling channel

P1‧‧‧First cooling airflow

P2‧‧‧second cooling airflow

Claims (7)

A connection expansion type computer device that utilizes a heat dissipation channel for heat dissipation, comprising: a computer main body, comprising: a main body housing having at least one first connection surface, wherein the first connection surface is provided with at least one first heat dissipation hole, and At least one first heat dissipation channel in the main body of the main body is connected to an external space through the first heat dissipation hole; and a first working component is disposed in the main body casing, and the first heat dissipation channel passes through The first working component; and a peripheral device, comprising: a peripheral device housing having at least one second connecting surface, the second connecting surface is provided with at least one second heat dissipation hole, and at least one of the peripheral device housings The second heat dissipation channel is connected to the external space via the second heat dissipation hole; and at least one fan is disposed in the peripheral device housing and disposed at the second heat dissipation channel; wherein, when the peripheral device is combined The first heat dissipation channel, the first heat dissipation hole, the second heat dissipation hole and the second heat dissipation channel are sequentially connected to each other when the first connection surface is adjacent to the second connection surface And integrated as an integrated cooling channels, and based upon a first operation of the fan so that cooling gas flow through the integrated cooling channels. The connection expansion type computer device using the heat dissipation channel to dissipate heat according to the first aspect of the invention, wherein the main body casing further has at least one first heat dissipation surface, and the first heat dissipation surface is provided with at least one third heat dissipation hole. And the third heat dissipation The hole system is in communication with the first heat dissipation channel. The connection expansion type computer device using the heat dissipation channel to dissipate heat according to the second aspect of the invention, wherein the first heat dissipation surface is a side surface of the main body casing, and the first connection surface is the main body casing The bottom surface. The connection expansion type computer device using the heat dissipation channel to dissipate heat according to the first aspect of the invention, wherein the peripheral device housing further has at least one second heat dissipation surface, and the second heat dissipation surface is provided with at least one fourth heat dissipation hole. And the fourth heat dissipation hole is in communication with the second heat dissipation channel. The connection expansion type computer device using the heat dissipation channel to dissipate heat according to the fourth aspect of the invention, wherein the second heat dissipation surface is a side surface of the peripheral device housing, and the second connection surface is the peripheral device housing. The top surface. The connection expansion type computer device using the heat dissipation channel to dissipate heat according to the fourth aspect of the invention, wherein the peripheral device housing further comprises a third heat dissipation surface, wherein the third heat dissipation surface is provided with at least a fifth heat dissipation hole. The fifth heat dissipation hole is communicated to the external space through at least one third heat dissipation channel in the peripheral device housing, and the third heat dissipation channel is in communication with the fourth heat dissipation hole, and when the fan is in operation, A second cooling airflow flows through the third heat dissipation channel. The connection expansion type computer device using the heat dissipation channel to dissipate heat as described in claim 1, wherein the peripheral device further has a second working component. The first working component is a central processing unit (CPU), and the second working component is a graphics processing unit (Graphics Processing Unit). The first working component is a central processing unit (CPU). , GPU).