TWI524363B - Metal plate micro resistance - Google Patents

Description

Metal plate micro resistance

The invention relates to a metal plate micro-resistor, in particular to an inflow resistor body which can reduce the electrode impedance and make the current can be evenly distributed, so as to reduce heat generation, reduce power consumption, improve resistance value stability and increase load power, It can reduce the impedance of the resistor body, and can produce low-resistance metal plate micro-resistance without using thick alloy plate material, can achieve low resistance value, reduce the use of alloy plate material, and reduce the production cost of metal. Plate micro resistance.

Metal plate metal resistors are often used in electronic devices as current sensing resistors, so they must be characterized by low resistance, high stability, high current, and large load power.

As shown in the first, second, and third figures, respectively, it is a conventional metal plate micro-resistor 10, which basically comprises a resistor body 11 which is made of an alloy plate material, and the two ends of the resistor body 11 are respectively An electrode 12 is formed by electroforming of pure copper, and the electrode 12 can be soldered to a copper foil circuit of a PCB circuit board. The electrode 12 is more commonly formed in the upper surface, the side surface, and the bottom surface of the opposite ends of the resistor body 11 as shown in FIG. 1, or the "inline" formed on the resistor body as shown in FIG. The bottom surface of the both end portions or the "L-shape" as shown in Fig. 3 is formed on the side surface and the bottom surface of both end portions of the resistor body 11.

As shown in Fig. 4, the metal plate micro-resistor 10 of the "L-shaped" electrode 12 is used. For example, since the a→a' current path is short, the impedance is low, the b→b' current path is long, the impedance is large, and since the impedance between the electrodes a and b is large, most of the current is The dense current flows through the a→a' current path, and then sequentially descends to the b→b' current path; in other words, since the current cannot be uniformly distributed through the resistor body 11, most of the current will flow through a→ A' current path, so that the resistor body 11 is easy to generate heat, increase power consumption, and cause the resistance value to be easily drifted and unstable.

Furthermore, since the current path of the resistor body 11 b→b' is long, the impedance is large, In order to achieve the low resistance value, the thickness of the resistor body 11 must be increased to reduce the impedance of the resistor body 11, and the metal plate micro-resistor 10 with lower resistance value can be produced; however, increasing the thickness of the resistor body 11 will waste the use of more alloys. Board material, while increasing production costs.

The object of the present invention is to improve the existence of the above-mentioned conventional metal plate micro-resistance Missing, providing an inflow resistor body that can reduce the impedance of the electrode and make the current evenly distributed to reduce heat generation, reduce power consumption, improve resistance value stability and increase load power, and reduce the impedance of the resistor body. The production of low-resistance metal plate micro-resistors does not require the use of thicker alloy plate materials, which can achieve low resistance requirements, reduce the use of alloy plate materials, and reduce the production cost of metal plate micro-resistance.

In order to achieve the above object, the metal plate micro-resistor of the present invention comprises a resistor body And two electrodes; wherein: the resistor body is respectively etched to form a sheet-shaped electroformed end portion, and at least one current input end surface perpendicular to the electroforming end portion; the two electrodes are respectively combined with electroformed copper to the resistor Two electroformed ends of the body, the same The electroforming is combined with the current input end surface, and the bottom of the two electrodes protrudes from the bottom surface of the resistor body to form a soldering end; by the above structure, the electrode impedance can be reduced, and the current can be evenly distributed from the current input end surface into the resistor body. In order to reduce heat generation, reduce power consumption, improve resistance value stability and increase load power, and at the same time reduce the impedance of the resistor body, it is not necessary to use a thick alloy plate material when producing a low resistance metal plate micro resistance. Reach low resistance requirements and reduce the use of alloy sheet materials to reduce production costs.

<Utility Part>

10‧‧‧Metal plate micro-resistance

11‧‧‧Resistive body

12‧‧‧ electrodes

<present invention>

20‧‧‧Metal plate micro-resistance

21‧‧‧Resistive body

211‧‧‧Electronic casting end

212‧‧‧current input end face

22‧‧‧Electrode

221‧‧‧welding end

Fig. 1 is a cross-sectional view showing a micro-resistance of a metal plate of a "ㄈ-shaped" electrode.

Figure 2 is a cross-sectional view of a microplate of a metal plate using a "inline" electrode.

Fig. 3 is a cross-sectional view showing the micro-resistance of the metal plate of the "L-shaped" electrode.

Figure 4 is a schematic diagram of the current path of a conventional metal plate micro-resistor.

Fig. 5 is a cross-sectional view showing the micro-resistance of the metal plate of the present invention.

Figure 6 is a schematic diagram showing the current path of the microplate resistance of the metal plate of the present invention.

Figure 7 is a cross-sectional view showing another possible embodiment of the metal plate micro-resistance of the present invention.

In order to more clearly understand the technical means and the structure of the present invention for achieving the object, the embodiment shown in Figures 5 and 6 and the other embodiment shown in Figure 7 are further described in detail below. As shown in FIG. 5, the metal plate micro-resistor 20 of the embodiment includes a resistor body 21 and two electrodes 22; wherein: The resistor body 21 (as shown in FIG. 5), the resistor body 21 is an electric resistance plate body having a predetermined resistance value, and the two ends of the resistor body 21 are respectively etched to form a sheet-shaped electroformed end portion 211. A current input end surface 212 perpendicular to the electroformed end portion 211 is formed on the upper and lower sides of the two electroformed end portions 211, respectively.

The two electrodes 22 (shown in FIG. 5) are respectively coated with electroformed copper and bonded to the two electroformed end portions 211 of the resistor body 21, and simultaneously electroformed to the current input end surface 212, and the bottom electrodes of the two electrodes 22 are convex. A soldering end 221 is formed on the bottom surface of the resistor body 21.

As shown in Fig. 6, since the electrode 22 is formed by pure copper electroforming, the impedance between the points a and b of the electrode 22 is low, the current difference is small, and the current can be uniformly distributed. The electrode 22 flows into the resistor body via the current input end face 212. 21; Therefore, since the current can be uniformly distributed through the electrode 22 into the resistor body 21, heat generation can be reduced, power consumption can be reduced, resistance value stability can be improved, and load power can be improved, and the impedance of the resistor body can be reduced. When producing low-resistance metal plate micro-resistors, it is not necessary to use thick alloy plate materials to achieve low resistance requirements and reduce the use of alloy plate materials to reduce production costs.

As shown in FIG. 7, another possible embodiment of the present invention is different from the embodiment shown in FIG. 5 in that the electroformed end portion 211 formed by etching the both ends of the resistor body 21 is upwardly offset, and at least The lower side of the two electroformed end portions 211 respectively form a current input end face 212 perpendicular to the electroformed end portion 211; thereby, the same purpose can be achieved with the embodiment shown in Fig. 5.

As can be seen from the above description and the embodiments of the drawings, the present invention mainly comprises forming a sheet-shaped electroformed end portion 211 by etching at both ends of the resistor body 21, and at least two electroforming end portions 211. The lower side of the resistor body 21 is formed with a current input end surface 212 perpendicular to the electroformed end portion 211, and the electrode 22 is formed by electroforming copper on both ends of the resistor body 21, so that the current can be distributed. The uniform electrode 22 flows into the resistor body 21 to reduce heat generation, reduce power consumption, improve resistance value stability and increase load power, and at the same time reduce impedance of the resistor body 21, and can produce low resistance metal plate micro resistance. It is not necessary to use thicker alloy plate materials to achieve low resistance requirements and reduce the use of alloy plate materials to reduce production costs.

The above descriptions are merely illustrative of the possible embodiments of the present invention, and thus the scope of the present invention should not be construed as limiting the scope of the present invention. It is still within the scope of protection covered by the present invention.

20‧‧‧Metal plate micro-resistance

21‧‧‧Resistive body

211‧‧‧Electronic casting end

212‧‧‧current input end face

22‧‧‧Electrode

221‧‧‧welding end

Claims (1)

A metal plate micro-resistor includes a resistor body and two electrodes; wherein: the resistor body has two ends formed by etching to form a sheet-shaped electroformed end portion, and at least one of the lower sides of the two electroformed end portions respectively form an electric a vertical input end of the casting end; the two electrodes are respectively coated with electroformed copper and bonded to the two electroformed ends of the electric resistance body, and electroformed and bonded to the vertical end surface, and the bottoms of the two electrodes protrude from the bottom surface of the electric resistance body Forming a soldering end; by the above structure, the current can be evenly distributed through the electrode into the resistor body to reduce heat generation, reduce power consumption, improve resistance value stability and increase load power, and at the same time reduce resistance of the resistor body, In the production of low-resistance metal plate micro-resistors, it is not necessary to use thick alloy plate materials to achieve low resistance requirements and reduce the use of alloy plate materials to reduce production costs.