CN204014143U - Coil panel and electromagnetic oven - Google Patents
Coil panel and electromagnetic oven Download PDFInfo
- Publication number
- CN204014143U CN204014143U CN201420423211.1U CN201420423211U CN204014143U CN 204014143 U CN204014143 U CN 204014143U CN 201420423211 U CN201420423211 U CN 201420423211U CN 204014143 U CN204014143 U CN 204014143U
- Authority
- CN
- China
- Prior art keywords
- metal layer
- conductive metal
- layer band
- coil panel
- coil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The utility model provides a kind of coil panel and electromagnetic oven.This coil panel comprises circuit board substrate, is printed with conductive metal layer band on circuit board substrate, and conductive metal layer band spiral surrounding forms many ring metal foil coil, and conductive metal layer band is provided with at least one groove, to increase the surface area of metal foil coil.The coil panel that the utility model embodiment provides, the conductive metal layer band of its circuit board substrate is provided with at least one groove, and the setting of groove can increase the surface area of metal foil coil, reduce the loss that skin effect causes, and then increased the efficiency of heating surface of electromagnetic oven.
Description
Technical field
The utility model relates to electromagnetic heating technique field, more specifically, relates to a kind of coil panel and the electromagnetic oven that comprises this coil panel.
Background technology
As shown in Figure 1 to Figure 3, on existing PCB (printed circuit board (PCB)) coil panel 1 ˊ, Copper Foil 100 ˊ of the every circle on its circuit board 10 ˊ are all comprised of wall scroll Copper Foil, cause the surface area of Copper Foil less, in 1 ˊ when work of coil panel, is because skin effect (while having alternating current or alternating electromagnetic field in conductor, the circuit skewness of conductor inside, and electric current concentrates on a kind of phenomenon of " skin " part of conductor.The inner actual electric current of wire diminishes, electric current concentrates on the thin layer of wire outer surface, and result causes the resistance of wire to increase, and its loss power is also increased, this phenomenon is called skin effect) loss that causes is large, thus affected the efficiency of heating surface of electromagnetic oven.
Utility model content
The utility model is intended at least solve one of technical problem existing in prior art.
For this reason, the object of an aspect of the utility model is, a kind of surface area that increases conductive metal layer is provided, reduces the coil panel of the loss that skin effect causes.
The object of another aspect of the utility model is, a kind of electromagnetic oven that comprises above-mentioned coil panel is provided.
For achieving the above object, embodiment of the present utility model provides a kind of coil panel, comprise circuit board substrate, on described circuit board substrate, be printed with conductive metal layer band, described conductive metal layer band spiral surrounding, form many ring metal foil coil, described conductive metal layer band is provided with at least one groove, to increase the surface area of described metal foil coil.
Coil panel described in above-described embodiment of the present utility model is PCB coil panel, on its circuit board substrate, be printed with conductive metal layer band, spiral surrounding forms many rings metal foil coil of coil panel, conductive metal layer band is provided with at least one groove, the setting of groove, can increase the surface area of metal foil coil, reduce the loss that skin effect causes, and then increase the efficiency of heating surface of electromagnetic oven.
In addition, the coil panel that the utility model above-described embodiment provides also has following additional technical feature:
According to an embodiment of the present utility model, described groove arranges along the length direction line of described conductive metal layer band, and does not run through the end of described conductive metal layer band.
According to an embodiment of the present utility model, described groove runs through described conductive metal layer band or does not run through described conductive metal layer band at thickness direction at thickness direction.
According to an embodiment of the present utility model, the width of described groove is not less than 0.1mm, and is not more than 2 times of thickness of described conductive metal layer band.
According to an embodiment of the present utility model, on described conductive metal layer band, be provided with two described grooves.
According to an embodiment of the present utility model, described conductive metal layer band spiral surrounding and the ring spacings that form many ring metal foil coil are 0.3-1mm.
According to an embodiment of the present utility model, described conductive metal layer band is copper foil layer.
According to an embodiment of the present utility model, described circuit board substrate is circular slab.
The utility model embodiment on the other hand provide a kind of electromagnetic oven, includes the coil panel described in above-mentioned arbitrary embodiment.
Additional aspect of the present utility model and advantage will become in description part below obviously, or recognize by practice of the present utility model.
Accompanying drawing explanation
Above-mentioned and/or additional aspect of the present utility model and advantage accompanying drawing below combination obviously and is easily understood becoming the description of embodiment, wherein:
Fig. 1 is according to the structural representation of the coil panel described in correlation technique;
Fig. 2 is that the A-A of Fig. 1 is to sectional structure schematic diagram;
Fig. 3 is the B portion structure enlarged diagram of Fig. 1;
Fig. 4 is according to the perspective view of coil panel described in the utility model one embodiment;
Fig. 5 is the main TV structure schematic diagram of Fig. 4;
Fig. 6 is that the C-C of Fig. 5 is to sectional structure enlarged diagram;
Fig. 7 is the D portion structure enlarged diagram of Fig. 5.
Wherein, in Fig. 1 to Fig. 3, the corresponding relation between Reference numeral and component names is:
1 ˊ coil panel, 10 ˊ circuit boards, 100 ˊ Copper Foils
Corresponding relation in Fig. 4 to Fig. 7 between Reference numeral and component names is:
1 coil panel, 10 circuit board substrates, 100 conductive metal layer bands, 101 grooves
Embodiment
In order more clearly to understand above-mentioned purpose of the present utility model, feature and advantage, below in conjunction with the drawings and specific embodiments, the utility model is further described in detail.It should be noted that, in the situation that not conflicting, the application's embodiment and the feature in embodiment can combine mutually.
A lot of details have been set forth in the following description so that fully understand the utility model; but; the utility model can also adopt other to be different from mode described here and implement, and therefore, protection range of the present utility model is not subject to the restriction of following public specific embodiment.
The coil panel providing according to the utility model embodiment is described with reference to the accompanying drawings.
As shown in Figures 4 to 7, the coil panel 1 providing according to some embodiment of the utility model, comprise circuit board substrate 10, on described circuit board substrate 10, be printed with conductive metal layer band 100, described conductive metal layer band 100 spiral surroundings, form many ring metal foil coil, described conductive metal layer band 100 is provided with at least one groove 101, to increase the surface area of described metal foil coil.
Coil panel described in above-described embodiment of the present utility model is PCB coil panel, its circuit board substrate is provided with conductive metal layer band, spiral surrounding forms many rings metal foil coil of coil panel, conductive metal layer band is provided with at least one groove, the setting of groove, can increase the surface area of metal foil coil, reduce the loss that skin effect causes, and then increase the efficiency of heating surface of electromagnetic oven.
In embodiment more of the present utility model, described groove 101 arranges continuously along the length direction of described conductive metal layer band 100, and does not run through the end of described conductive metal layer band 100.
Groove is along the length direction setting of conductive metal layer band, and do not run through the end of conductive metal layer band, and groove does not run through the end of conductive metal layer band 100, in order to avoid groove is separated a conductive metal layer band to be a plurality of separate conductive metal regions.
In the concrete example shown in Fig. 4 to Fig. 7, described groove 101 runs through described conductive metal layer band 100 at thickness direction, and described groove 101 does not run through the end of described conductive metal layer band 100 at length direction
Further, as shown in Figure 6, the width b of described groove 101 is not less than 0.1mm, and is not more than 2h (h represents the thickness of conductive metal layer band).
It should be noted that, groove also can run through conductive metal layer band in thickness direction portion.
In a preferred embodiment of the present utility model, on described conductive metal layer band 100, be provided with two described grooves 101, as shown in Figure 6, figure further groove 101 is two, two grooves 101 are divided into three circles by every ring conductive metal layer band 100.
On conductive metal layer band, be provided with two grooves, can prevent that groove from offering quantity on the one hand very few, can not effectively increase the surface area of metal foil coil, reach the object that reduces the loss that skin effect causes, can prevent that on the other hand groove from offering quantity too much, make the surface area of metal foil coil not increase counter falling.
In embodiment of the present utility model, offering of groove 101 is in order to increase the surface area of metal foil coil, if groove 101 through-thickness run through conductive metal layer band 100, the relation that the width b of groove 101 and the thickness h of conductive metal layer band 100, groove 101 are offered between quantity n should meet: nb≤2nh, i.e. b≤2h.
In a specific embodiment of the present utility model, as shown in Figure 6, described conductive metal layer band 100 spiral surroundings and the ring spacing a that form many ring metal foil coil are 0.3-1mm.
Further, described conductive metal layer band 100 is copper foil layer.
Further, as shown in Figure 4 and Figure 5, described circuit board substrate 10 is circular slab.
It should be noted that, circuit board substrate is rounded, so that suitable with the structure of electromagnetic oven, circuit board substrate can, for other shapes, not repeat them here yet certainly; Conductive metal layer is copper foil layer, the good conductivity of copper foil layer, and price is relatively cheap, and certainly, conductive metal wire layer can be not only copper foil layer, all right other metal levels, as: gold, silver, nickel etc.; Metal foil coil can be other shapes outside helical form equally.
The utility model embodiment on the other hand provides a kind of electromagnetic oven (not shown), includes the coil panel described in above-mentioned arbitrary embodiment, and has whole beneficial effects of coil panel described in above-described embodiment.
In sum, the coil panel that the utility model embodiment provides, the conductive metal layer band of its circuit board substrate is provided with at least one groove, the setting of groove, can increase the surface area of metal foil coil, reduce the loss that skin effect causes, and then increase the efficiency of heating surface of electromagnetic oven.
In description of the present utility model, term " is fixed " etc. and all should be interpreted broadly, and for example, " fixing " can be removably to fix, or non-disconnectable fixing; Can be directly fixing, also can be indirectly fixing by intermediary.For the ordinary skill in the art, can understand as the case may be the concrete meaning of above-mentioned term in the utility model.
In the description of this specification, the description of term " embodiment ", " some embodiment ", " specific embodiment " " concrete example " etc. means to be contained at least one embodiment of the present utility model or example in conjunction with specific features, structure, material or the feature of this embodiment or example description.In this manual, the schematic statement of above-mentioned term is not necessarily referred to identical embodiment or example.And the specific features of description, structure, material or feature can be with suitable mode combinations in any one or more embodiment or example.
The foregoing is only preferred embodiment of the present utility model, be not limited to the utility model, for a person skilled in the art, the utility model can have various modifications and variations.All within spirit of the present utility model and principle, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection range of the present utility model.
Claims (9)
1. a coil panel, it is characterized in that, comprise circuit board substrate, on described circuit board substrate, be printed with conductive metal layer band, described conductive metal layer band spiral surrounding, form many ring metal foil coil, described conductive metal layer band is provided with at least one groove, to increase the surface area of described metal foil coil.
2. coil panel according to claim 1, is characterized in that,
Described groove arranges and does not run through the end of described conductive metal layer band continuously along the length direction of described conductive metal layer band.
3. coil panel according to claim 2, is characterized in that,
Described groove runs through described conductive metal layer band or on thickness direction, does not run through described conductive metal layer band on thickness direction.
4. coil panel according to claim 3, is characterized in that,
The width of described groove is not less than 0.1mm, and is not more than 2 times of thickness of described conductive metal layer band.
5. coil panel according to claim 1, is characterized in that,
On described conductive metal layer band, be provided with two described grooves.
6. according to the coil panel described in any one in claim 1 to 5, it is characterized in that,
Described conductive metal layer band spiral surrounding and the ring spacings that form many ring metal foil coil are 0.3-1mm.
7. according to the coil panel described in any one in claim 1 to 5, it is characterized in that,
Described conductive metal layer band is copper foil layer.
8. according to the coil panel described in any one in claim 1 to 5, it is characterized in that,
Described circuit board substrate is circular slab.
9. an electromagnetic oven, is characterized in that, includes the coil panel as described in any one in claim 1 to 8.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201420423211.1U CN204014143U (en) | 2014-07-29 | 2014-07-29 | Coil panel and electromagnetic oven |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201420423211.1U CN204014143U (en) | 2014-07-29 | 2014-07-29 | Coil panel and electromagnetic oven |
Publications (1)
Publication Number | Publication Date |
---|---|
CN204014143U true CN204014143U (en) | 2014-12-10 |
Family
ID=52054079
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201420423211.1U Active CN204014143U (en) | 2014-07-29 | 2014-07-29 | Coil panel and electromagnetic oven |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN204014143U (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016141645A1 (en) * | 2015-03-09 | 2016-09-15 | 佛山市顺德区美的电热电器制造有限公司 | Coil plate, manufacturing method thereof, and electromagnetic heating device containing coil plate |
WO2017088197A1 (en) * | 2015-11-25 | 2017-06-01 | 佛山市顺德区美的电热电器制造有限公司 | Coil disc and manufacturing method therefor, and electromagnetic heating device |
CN106900098A (en) * | 2015-12-21 | 2017-06-27 | 佛山市顺德区美的电热电器制造有限公司 | A kind of coil panel and preparation method thereof, electromagnetic heating apparatus |
WO2019096321A1 (en) * | 2017-11-20 | 2019-05-23 | 华为技术有限公司 | Coil, wireless charging receiving device, wireless charging transmitting device and wireless charging system |
-
2014
- 2014-07-29 CN CN201420423211.1U patent/CN204014143U/en active Active
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016141645A1 (en) * | 2015-03-09 | 2016-09-15 | 佛山市顺德区美的电热电器制造有限公司 | Coil plate, manufacturing method thereof, and electromagnetic heating device containing coil plate |
WO2017088197A1 (en) * | 2015-11-25 | 2017-06-01 | 佛山市顺德区美的电热电器制造有限公司 | Coil disc and manufacturing method therefor, and electromagnetic heating device |
CN106900098A (en) * | 2015-12-21 | 2017-06-27 | 佛山市顺德区美的电热电器制造有限公司 | A kind of coil panel and preparation method thereof, electromagnetic heating apparatus |
WO2019096321A1 (en) * | 2017-11-20 | 2019-05-23 | 华为技术有限公司 | Coil, wireless charging receiving device, wireless charging transmitting device and wireless charging system |
US11916399B2 (en) | 2017-11-20 | 2024-02-27 | Huawei Technologies Co., Ltd. | Coil, wireless charging receiving apparatus, wireless charging transmission apparatus, and system |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN204014143U (en) | Coil panel and electromagnetic oven | |
KR102047563B1 (en) | Coil component and and board for mounting the same | |
JP6296543B2 (en) | Coil parts and their mounting boards | |
PH12016502502A1 (en) | Printed circuit board, electronic component, and method for producing printed circuit board | |
MX2014014386A (en) | Variable pitch resistance coil heater. | |
EP1993135A3 (en) | Heat conducter | |
JP2014053395A (en) | Surface mount inductor | |
SG10201803987PA (en) | Interconnect wires including relatively low resistivity cores | |
CN105704928B (en) | A kind of printed circuit board | |
MY188816A (en) | Electrical connector, mobile terminal and electrical connector manufacturing method | |
CN105990009B (en) | Coil component and plate with the coil component | |
EP2977475A4 (en) | Copper alloy for electrical and electronic equipment, copper alloy thin sheet for electrical and electronic equipment, and conductive component and terminal for electrical and electronic equipment | |
CN204119639U (en) | Ferrite circuit board | |
EP2977476A4 (en) | Copper alloy for electrical and electronic equipment, copper alloy thin sheet for electrical and electronic equipment, and conductive component and terminal for electrical and electronic equipment | |
CN204010813U (en) | Novel signal transmission line | |
CN204577174U (en) | A kind of coaxial cable | |
CN202502874U (en) | Ultra-high power transformer | |
CN204178735U (en) | A kind of webserver confluxes busbar | |
TWM461284U (en) | The jumper for printed wiring board and printed wiring board | |
CN202626091U (en) | Single-conduction copper foil adhesive tape | |
CN203377085U (en) | High power density magnetic integration planar transformer | |
TWM389411U (en) | Circuit board | |
CN202513003U (en) | Building block combination type high-power transformer | |
JP6044214B2 (en) | Litz wire and high frequency power supply coil | |
CN106997994B (en) | Inserting slot electric connector and electronic device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |