TWI524028B - Illumination apparatus - Google Patents

Description

Lighting device

The present invention relates to a lighting device, and more particularly to a lighting device using a light emitting diode as a light source.

In daily life, the application of a light-emitting diode as a light source has become more and more common due to the small size and long service life of the light-emitting diode source. In the application of the conventional light-emitting diode light source, since the light-emitting diode light source is a light source with directivity, the direct light-emitting area in front of the light-emitting diode light source usually has high brightness instead of direct light. The brightness of the area is lower than the brightness of the direct area of light. Due to the directivity characteristics of the light-emitting diode light source, the light-emitting diode light source is mostly applied to a local illumination device requiring high brightness, and when applied to a decorative type illumination device, there is uneven brightness and a range of viewing angles. Smaller defects.

The present invention provides an illumination device having a lateral illumination effect.

The lighting device of the invention comprises two transparent boards, a line layout, and One less light emitting element and at least one reflective element. The light transmissive plates are disposed opposite each other. The circuit layout is disposed on one of the light-transmitting plates, and includes a plurality of lines and at least one pair of pads electrically connected to the lines. The light-emitting component is located between the two light-transmitting plates, and is corresponding to the docking pad and electrically connected to the docking pad. The reflective element is disposed on the other of the light-transmitting plates and disposed corresponding to the light-emitting elements.

In an embodiment of the invention, the light transmissive plate has a light transmittance of more than 70%.

In an embodiment of the invention, the material of the light transmissive plate comprises glass, a polymer material or sapphire.

In an embodiment of the invention, at least one of the light transmissive plates has a haze greater than 50%.

In an embodiment of the invention, the material of the light transmissive plate comprises frosted glass.

In an embodiment of the invention, the at least one pair of pads are a plurality of pads, and each of the pads comprises a first pad and a second pad. The at least one light emitting element is a plurality of light emitting elements, and each of the light emitting elements has a first electrode and a second electrode. The first electrode and the second electrode of each of the light-emitting elements directly contact the first and second pads of the same butt pad.

In an embodiment of the invention, the light-emitting elements are electrically connected in series, in parallel, or in series and parallel.

In an embodiment of the invention, each of the light-emitting elements is a flip-chip light-emitting diode chip.

In an embodiment of the invention, the reflective element overlaps with the orthographic projection of the illuminating element on one of the light transmissive plates.

In an embodiment of the invention, the orthographic projection area of the reflective element on one of the light transmissive plates is 1 to 5 times the orthographic projection area of the light emitting element on one of the light transmissive plates.

In an embodiment of the invention, the other of the light-transmitting plates has an outer surface and an inner surface opposite to each other, and the reflective member is located on the outer surface.

In an embodiment of the invention, the lighting device further includes: at least one encapsulant disposed between the two light transmissive plates.

In an embodiment of the invention, the encapsulant is in contact with the light transmissive plates, and the maximum vertical height of the encapsulant is greater than or equal to the thickness of the light emitting element.

In an embodiment of the invention, the encapsulant is disposed between the light-emitting element and the other of the light-transmitting plates, and the encapsulant covers at least a light-emitting surface of the light-emitting element.

In an embodiment of the invention, the encapsulant comprises a transparent encapsulant or an encapsulant colloid doped with a phosphor.

Based on the above, since the circuit layout and the light-emitting elements of the present invention are disposed on the same light-transmitting plate, the reflective elements are disposed on the other light-transmitting plate and disposed corresponding to the light-emitting elements. Therefore, the forward light emitted by the light-emitting element of the present invention emits light from the side of the light-emitting element due to the reflection of the reflective element, and the lateral light generates approximately annular light due to the corresponding arrangement of the two light-transmitting plates. shape. Therefore, the illumination device of the present invention is provided with the ability to emit light laterally and can be used as illumination for artwork or painting. In addition, Since the illuminating device of the present invention has a light-transmitting plate that allows light to pass through, the effect of double-sided light emission can be achieved. In addition, since the light-emitting element is located between the two light-transmitting plates, the light-transmitting plate has a good protection effect on the light-emitting elements and the circuit layout, so that the lighting device is not easily damaged by external force and can be used, thereby improving the reliability of the lighting device.

The above described features and advantages of the invention will be apparent from the following description.

100a, 100b, 100c, 100d, 100e‧‧‧ lighting devices

110a, 110b‧‧‧ Translucent panels

111‧‧‧ edge

112‧‧‧ first surface

114‧‧‧ outer surface

116‧‧‧ inner surface

120, 120’‧‧‧ line layout

122, 122’‧‧‧ lines

124, 124'‧‧‧ pads

124a, 124a’‧‧‧ first mat

124b, 124b’‧‧‧second pads

126a, 126b‧‧‧ external pads

130‧‧‧Lighting elements

131‧‧‧Glossy surface

132‧‧‧First electrode

134‧‧‧second electrode

140, 140b, 140c‧‧‧reflecting elements

150, 150', 150''‧‧‧ encapsulant

D, D’‧‧‧ separation distance

H2, H3, H4, T‧‧‧ thickness

H1, H1’‧‧‧ maximum vertical height

FIG. 1A is a perspective exploded view of a lighting device according to an embodiment of the invention.

FIG. 1B is a perspective exploded view of a lighting device according to an embodiment of the invention.

2 is a cross-sectional view of a lighting device in accordance with an embodiment of the present invention.

3 is a cross-sectional view showing a lighting device according to another embodiment of the present invention.

4 is a cross-sectional view showing a lighting device according to another embodiment of the present invention.

FIG. 5 is a cross-sectional view showing a lighting device according to another embodiment of the present invention.

FIG. 1A is a perspective exploded view of a lighting device according to an embodiment of the invention. Referring to FIG. 1A, in the embodiment, the illumination device 100a includes two light-transmitting plates 110a and 110b, a line layout 120, at least one light-emitting element 130 (a plurality of components are schematically illustrated in FIG. 1A), and at least one reflective element 140. (Some are shown schematically in Figure 1A). The light-transmitting plates 110a, 110b are disposed opposite to each other. The circuit layout 120 is disposed on the light-transmitting plate 110a and includes a plurality of lines 122 and at least one pair of pads 124 electrically connected to the lines (a plurality of pairs are schematically illustrated in FIG. 1A). The light-emitting elements 130 are disposed between the two light-transmitting plates 110a and 110b, and are respectively disposed corresponding to the mating pads 124 and electrically connected to the mating pads 124. The reflective element 140 is disposed on the light-transmitting plate 110b and disposed corresponding to the light-emitting element 130.

More specifically, in the present embodiment, the light-transmitting plates 110a and 110b have a light transmittance of more than 70%, and the material thereof is, for example, glass, a polymer material, or sapphire. In addition, at least one of the light-transmitting plates 110a and 110b may be a matte material having a haze of more than 50%, such as frosted glass.

It should be noted that the present embodiment does not limit the outer contour of the light-transmitting plates 110a, 110b, although the outer contour of the light-transmitting plates 110a, 110b in FIG. 1A is embodied as a semi-circular shape. However, in other embodiments not shown, the outer shape of the light-transmitting plates 110a and 110b may be other suitable shapes, which are not limited herein.

The line 122 of the circuit layout 120 of the present embodiment and the docking pads 124 are disposed on a first surface 112 of the light-transmitting plate 110a. Here, the line layout 120 is formed, for example, by photolithography or nanoimprint technology. The light-transmitting plate 110a is not limited herein. In addition, the circuit layout 120 of the present embodiment extends to an edge 111 of the light-transmitting plate 110a, and the circuit layout 120 further includes two external pads 126a, 126b, wherein the external pads 126a, 126b are located on the edge 111 and are electrically connected. Line 122. Since the external pads 126a and 126b of the embodiment are disposed on the edge 111 of the light-transmitting plate 110a, the external circuit (not shown) is electrically connected to the external pads 126a and 126b of the circuit layout 120. The thickness of the illumination device 100a. On the other hand, when the external circuit and the external pads 126a, 126b are electrically non-conducting due to human factors, the external pads 126a, 126b are disposed at positions that are easy for the user to rework to re-solder the external circuit. Moreover, the external pads 126a, 126b are disposed on the edge 111, so that the connection between the circuit layout 120 and the external circuit can be prevented from being affected by the subsequent potting process, thereby improving reliability.

It should be noted that, the present invention does not limit the position of the external pads 126a, 126b only on the edge 111 of the light-transmitting plate 110a, or as shown in FIG. 1B, the external pads 126a, 126b are disposed on the light-transmitting plate. On the first surface 112 of the 110a, the area of the transparent plate 110b is slightly smaller than the area of the transparent plate 110a, and does not cover the external pads 126a, 126b. Thus, an external circuit (not shown) and the line layout 120 The external pads 126a, 126b do not affect the thickness of the overall illumination device 100a when electrically connected. On the other hand, when the external circuit and the external pads 126a, 126b are electrically non-conducting due to human factors, since the external pads 126a, 126b are exposed, it is easy for the user to rework to re-solder the external circuit. Moreover, in FIG. 1B, the arrangement positions of the external pads 126a, 126b can also make the connection of the circuit layout 120 and the external circuit unaffected by the subsequent potting process, thereby improving the reliability.

Each of the light-emitting elements 130 is, for example, a flip-chip light-emitting diode wafer, and the light-emitting elements 130 can emit light of the same color or light of different colors. Each of the light-emitting elements 130 has a first electrode 132 and a second electrode 134, and each of the pads 124 includes a first pad 124a and a second pad 124b, wherein the first electrode 132 of each of the light-emitting elements 130 The first electrode 124a and the second pad 124b of the same butt pad 124 are directly contacted with the second electrode 134. That is to say, the light-emitting elements 130 are fixed to the mating pads 124 of the line layout 120 by flip-chip bonding. As shown in FIG. 1A, the light-emitting elements 130 can be electrically connected in series through the design of the line layout 120. Of course, in other embodiments not shown, the light-emitting elements 130 can also be electrically connected in parallel or in series and parallel, which is not limited herein.

In this embodiment, the reflective element 140 is disposed on an inner surface 116 of the light transmissive plate 110b, wherein the inner surface 116 of the light transmissive plate 110b faces the first surface 112 of the light transmissive plate 110a. The number of the reflective elements 140 of the present embodiment is the same as that of the light-emitting elements 130, and the reflective elements 140 are disposed directly above the light-emitting elements 130. Preferably, the orthographic projection of the reflective element 140 on the light-transmitting plate 110a overlaps with the orthographic projection of the light-emitting element 130 on the light-transmitting plate 110a to effectively reflect the forward light emitted by the light-emitting element 130. More preferably, the orthographic projection area of the reflective element 140 on the light-transmitting plate 110a is 1 to 5 times the area of the orthographic projection of the light-emitting element 130 on the light-transmitting plate 110a, so that the visually seen effect is better, and At the same time as the amount of light emitted, the space on which the light-emitting element 130 is placed on the light-transmitting plate 110a can be effectively utilized. Here, the material of the reflective member 140 is, for example, a metal or an alloy.

Since the line layout 120 and the light emitting element 130 of the embodiment are configured On the same light-transmitting plate 110a, the reflective element 140 is disposed on the other light-transmitting plate 110b and disposed corresponding to the light-emitting element 130. Therefore, the forward light emitted by the light-emitting element 130 of the present embodiment is emitted by the lateral direction of the light-emitting element 130 due to the reflection of the reflective element 140, and lateral light is formed, and the lateral light is caused by the two light-transmitting plates 110a, 110b produces an approximately annular shape corresponding to the set relationship. Therefore, the illumination device 100a of the present embodiment is provided with the ability to emit light laterally, and can be used as illumination for artwork or painting. Further, since the illumination device 100a of the present embodiment has the light-transmitting plates 110a, 110b through which light can pass, the effect of double-sided light emission can be achieved.

It is to be noted that the following embodiments use the same reference numerals and parts of the above-mentioned embodiments, and the same reference numerals are used to refer to the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted portions, reference may be made to the foregoing embodiments, and the following embodiments are not repeated.

2 is a cross-sectional view of a lighting device in accordance with an embodiment of the present invention. Referring to FIG. 2, the illuminating device 100b of the present embodiment is similar to the illuminating device 100a of FIG. 1A, but the main difference between the two is that the line 122' of the line layout 120' of the present embodiment is buried with the docking pad 124'. In the light-transmitting plate 110a, the reflective element 140b is buried in the light-transmitting plate 110b. The first electrode 132 and the second electrode 134 of the light-emitting element 130 directly contact the first pad 124a' and the second pad 124b' of the same docking pad 124'.

In addition, the illuminating device 100b of the embodiment further includes an encapsulant 150, wherein the encapsulant 150 is disposed between the transparent plates 110a, 110b. As shown in FIG. 2, the encapsulant 150 of the embodiment is in contact with the light-transmitting plates 110a and 110b, and is sealed. The maximum vertical height H1 of the adhesive body 150 is equal to the thickness H2 of the light-emitting element 130, wherein the encapsulant 150 is an encapsulant doped with a phosphor, but is not limited thereto. In other embodiments not shown, the encapsulant may also be a transparent encapsulant, which still belongs to the technical solution that can be adopted by the present invention without departing from the scope of the invention.

The maximum vertical height H1 of the encapsulant 150 of the present embodiment is substantially equal to the thickness H2 of the light-emitting element 130. That is, the thickness T of the illumination device 100b of the present embodiment is only the thickness H3 of the light-transmitting plates 110a and 110b. H4 is added to the thickness H2 of the light-emitting element 130. In this way, the illumination device 100b of the present embodiment can have a thin overall thickness to conform to the trend of thinning. In addition, the forward light emitted by the light-emitting element 130 enters the encapsulant 150 due to the reflection of the reflective element 140b, and is emitted by the side of the light-emitting element 130 via optical phenomena such as refraction, scattering, etc. of the encapsulant 150, so as to form a so-called Lateral light. This lateral light generates an approximately annular shape due to the corresponding relationship between the two light-transmitting plates 110a and 110b. Therefore, the illumination device 100b of the present embodiment can be used as illumination for artwork or painting, in addition to the ability to provide lateral light emission.

3 is a cross-sectional view of a lighting device in accordance with an embodiment of the present invention. Referring to FIG. 3, the illumination device 100c of the present embodiment is similar to the illumination device 100b of FIG. 2, but the main difference is that the reflective element 140c of the present embodiment is located on the outer surface 114 of the light-transmitting plate 110b, wherein The outer surface 114 and the inner surface 116 are disposed opposite each other.

Since the reflective element 140c of the present embodiment is disposed on the outer surface 114 of the light-transmitting plate 110b, the forward light emitted by the light-emitting element 130 may be due to the reflective element. The reflection of 140c enters the light-transmitting plate 110b. At this time, the light-transmitting plate 110b can be regarded as a light guide plate, which is beneficial for guiding the forward light reflected by the reflective element 140c to the side of the light-transmitting plate 110b, so as to achieve the lateral light-emitting effect of the illumination device 100b.

4 is a cross-sectional view of a lighting device in accordance with an embodiment of the present invention. Referring to FIG. 4, the illumination device 100d of the present embodiment is similar to the illumination device 100c of FIG. 3, but the main difference is that the maximum vertical height H1' of the encapsulant 150' of the present embodiment is greater than the thickness of the light-emitting element 130. H2, wherein the encapsulant 150' extends over the light-emitting surface 131 of the light-emitting element 130. As shown in FIG. 4, the encapsulant 150' covers the light-emitting surface 131 of the light-emitting element 130 except for the periphery of the light-emitting element 130, wherein the light-emitting surface 131 of the light-emitting element 130 and the inner surface 116 of the light-transmitting plate 110b are disposed. Has a separation distance D. When the encapsulant 150' is doped with a phosphor, the separation distance D can increase the mixing distance, thereby allowing the illumination device 100d to have better light uniformity. If the encapsulant 150' is a transparent encapsulant, the separation distance D can also be used to increase the lateral exit angle of the illumination device 100d.

FIG. 5 is a cross-sectional view showing a lighting device according to another embodiment of the present invention. Referring to FIG. 5, the illuminating device 100e of the present embodiment is similar to the illuminating device 100d of FIG. 4, but the main difference is that the encapsulating body 150'' of the embodiment is disposed on the light-emitting element 130 and the light-transmitting plate 110b. Meanwhile, the encapsulant 150 ′′ covers only the light-emitting surface 131 of the light-emitting element 130 . In this way, the effect of fixing the light-transmitting plates 110a and 110b can be achieved except that a small amount of the encapsulating body 150'' can be used, and because the light-emitting surface 131 of the light-emitting element 130 has a separation distance from the inner surface 116 of the light-transmitting plate 110b. D', so when the encapsulant 150'' is doped with a phosphor In time, the light mixing distance can be increased, so that the illumination device 100e has better light uniformity; if the encapsulant 150' is a transparent encapsulant, the separation distance D' can also be used to increase the lateral light exit angle of the illumination device 100e. . In this embodiment, the encapsulant 150 ′′ is embodied as a block encapsulant. Of course, in other embodiments not shown, the encapsulant 150 ′′ may also have a semi-spherical shape with a curved contour. Limit the shape of the encapsulant. It is worth mentioning that if the block encapsulant is used, it is more conducive to enhancing the lateral light.

In addition, the present invention does not limit the arrangement position of the line 122 and the pad 124 of the circuit layout 120 on the first transparent plate 110a. The line 122 and the pad 124 may be disposed on the first surface 112 of the transparent plate 110a. It may also be embedded in the light-transmitting plate 110a, as long as the effect of the circuit connecting the pad 124 and the light-emitting element 130 can be achieved, which is within the scope of protection of the present invention. Similarly, the present invention does not limit the position of the reflective elements 140b, 140c at the light-transmitting plate 110b. The reflective elements 140b, 140c may be disposed on the outer surface 114 of the light-transmitting plate 110b, on the inner surface 116, or embedded in the light-transmitting plate. In the plate 110b, as long as the reflective elements 140b, 140c have the function of reflecting the light emitted by the corresponding light-emitting elements 130, they are all protected by the present invention.

In summary, since the circuit layout and the light-emitting elements of the present invention are disposed on the same light-transmitting plate, the reflective elements are disposed on the other light-transmitting plate and disposed corresponding to the light-emitting elements. Therefore, the forward light emitted by the light-emitting element of the present invention forms lateral light due to the reflection of the reflective element, and the lateral light generates an approximately annular shape due to the corresponding arrangement of the two light-transmitting plates. Therefore, the illumination device of the present invention is provided with the ability to emit light laterally and can be used as illumination for artwork or painting. Furthermore, due to the issue The illuminating device of the illuminating device has a light-transmitting plate for allowing light to pass through, so that the double-sided light-emitting effect can be achieved, and an approximately annular light shape can be seen regardless of the light-receiving plate viewed from the top or the bottom. In addition, since the maximum vertical height of the encapsulant in some embodiments of the present invention may be equal to the thickness of the light-emitting element, the overall thickness of the illumination device of the present invention is composed only of the thickness of the two light-transmitting plates and the thickness of the light-emitting elements. Therefore, the illuminating device of the present invention can have a thin thickness and can conform to the trend of thinning. Furthermore, since the light-emitting element is located between the two light-transmitting plates, the light-transmitting plate has a good protection effect on the light-emitting elements and the circuit layout, so that the lighting device is less likely to be damaged by external force and fails, and the reliability of the lighting device can be improved. In addition, the encapsulant of the present invention can be doped with a phosphor, and can simultaneously have the functions of changing the color of light, guiding lateral light emission, and fixing.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

100a‧‧‧Lighting device

110a, 110b‧‧‧ Translucent panels

111‧‧‧ edge

112‧‧‧ first surface

116‧‧‧ inner surface

120‧‧‧Line layout

122‧‧‧ lines

124‧‧‧ pads

124a‧‧‧first mat

124b‧‧‧second mat

126a, 126b‧‧‧ external pads

130‧‧‧Lighting elements

132‧‧‧First electrode

134‧‧‧second electrode

140‧‧‧reflecting elements

Claims (15)

A lighting device comprising: two light-transmitting plates disposed opposite to each other; a circuit layout disposed on one of the light-transmitting plates, and comprising a plurality of wires and at least one pair of pads electrically connected to the wires At least one light-emitting element is disposed between the two light-transmitting plates, and is disposed opposite to the mating pad and electrically connected to the docking pad; and at least one reflective element disposed on the other of the light-transmitting plates and corresponding to the light-emitting plate The component is disposed, wherein each of the light emitting elements emits a light beam, and the light beam is reflected by the reflective element disposed corresponding to each of the light emitting elements to form lateral light. The lighting device of claim 1, wherein the light-transmitting plates have a light transmittance of more than 70%. The lighting device of claim 2, wherein the material of the light-transmitting plate comprises glass, a polymer material or sapphire. The illuminating device of claim 1, wherein at least one of the light-transmitting plates has a haze greater than 50%. The lighting device of claim 4, wherein the light transmissive plate is made of frosted glass. The illuminating device of claim 1, wherein the at least one pair of pads is a plurality of mating pads, and each of the mating pads comprises a first pad and a second pad, and the at least one light emitting component is a plurality of a light-emitting element, each light-emitting element having a first electrode and a second electrode, the first electrode and the second electrode of each light-emitting element being directly Contacting the first pad and the second pad in the same docking pad. The illuminating device of claim 6, wherein the illuminating elements are electrically connected in series, in parallel or in series and parallel. The illumination device of claim 6, wherein each of the light-emitting elements is a flip-chip light-emitting diode chip. The illuminating device of claim 1, wherein the reflective element overlaps with an orthographic projection of the illuminating element on one of the light transmissive plates. The illuminating device of claim 9, wherein an orthographic projection area of the reflective element on one of the light-transmitting plates is an orthographic projection area of the light-emitting element on one of the light-transmitting plates. 1 to 5 times. The illuminating device of claim 1, wherein the other of the light-transmitting plates has an outer surface and an inner surface opposite to each other, and the reflective element is located on the outer surface. The lighting device of claim 1, further comprising: at least one encapsulant disposed between the two transparent plates. The illuminating device of claim 12, wherein the encapsulant is in contact with the two transparent plates, and the maximum vertical height of the encapsulant is greater than or equal to the thickness of the illuminating element. The illuminating device of claim 12, wherein the encapsulant is disposed between the illuminating element and the other of the light transmissive plates, and the encapsulant covers at least a light emitting surface of the illuminating element. The lighting device of claim 12, wherein the sealing glue The body comprises a transparent encapsulant or an encapsulant colloid doped with a phosphor.