TWI523019B - Method of booting system with non-volatile memory device and related memory apparatus - Google Patents

Method of booting system with non-volatile memory device and related memory apparatus Download PDF

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TWI523019B
TWI523019B TW102137231A TW102137231A TWI523019B TW I523019 B TWI523019 B TW I523019B TW 102137231 A TW102137231 A TW 102137231A TW 102137231 A TW102137231 A TW 102137231A TW I523019 B TWI523019 B TW I523019B
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volatile memory
status flag
block
flag
bias voltage
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TW102137231A
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TW201514998A (en
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郭忠山
陳致豪
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晶豪科技股份有限公司
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記憶體裝置及使用非揮發性記憶體元件對系統進行開機之 方法 Memory device and booting the system using non-volatile memory components method

本發明係關於一種記憶體裝置;特別關於一種使用非揮發性記憶體元件對系統進行開機之方法以及相關的記憶體裝置。 The present invention relates to a memory device; and more particularly to a method of booting a system using a non-volatile memory component and associated memory device.

在抹除一非揮發性記憶體的過程中,更具體而言,在抹除一非揮發性記憶體內之特定區塊的過程中,可能會發生非預期的中斷,例如非預期的電源中斷。在此狀況下,將無法成功執行完整的抹除運作。舉例而言,參照圖1,如果一記憶體區塊已完成預程式化(preprogramming)步驟(步驟12),但在電源中斷時未能完成過抹除校正(Over Erase Correction,OEC)步驟(步驟16),則由於過抹除現象可能導致位元線之漏電。當系統再度送電時,未能完成OEC步驟的記憶體區塊所造成的位元線漏電可能會影響到共享相同位元線的相關聯記憶體區塊。如果該相關聯記憶體區塊係用來儲存開機碼(booting code)時,在系統重新送電後執行開機程序 時,系統可能無法讀取開機碼。這會導致很長的開機時間,或者,系統可能會無法開機。 In the process of erasing a non-volatile memory, more specifically, in the process of erasing a particular block in a non-volatile memory, unintended interruptions, such as unintended power interruptions, may occur. In this case, the complete erase operation will not be successfully performed. For example, referring to FIG. 1, if a memory block has completed the preprogramming step (step 12), the over Erase Correction (OEC) step (step) is not completed when the power is interrupted. 16), because the over-wipe phenomenon may cause leakage of the bit line. When the system is powered again, the bit line leakage caused by the memory block that fails to complete the OEC step may affect the associated memory block sharing the same bit line. If the associated memory block is used to store the booting code, the boot process is executed after the system is re-powered. The system may not be able to read the boot code. This can result in a very long boot time or the system may not boot.

隨著手持式電子裝置的蓬勃發展,系統的穩定度在許多消費性產品中是一個重要的課題。此外,高容量的記憶體元件中會合併越來越多的記憶體區塊。因此,需要解決上述位元線漏電現象之方案。 With the rapid development of handheld electronic devices, system stability is an important issue in many consumer products. In addition, more and more memory blocks are combined in high-capacity memory components. Therefore, it is necessary to solve the above-mentioned scheme of bit line leakage phenomenon.

根據本發明一實施例之一種使用一非揮發性記憶體元件對一系統進行開機之方法,包含以下步驟:當該系統供電時,讀取對應到該非揮發性記憶體元件中之至少一記憶體區塊的一狀態旗標,該狀態旗標之旗標值指示施加至該記憶體區塊的一完整的抹除運作是否已完成;根據該狀態旗標之旗標值對所對應的記憶體區塊選擇性地執行一漏電流抑制程序;以及根據儲存在該非揮發性記憶體元件中之一開機碼對該系統進行開機。 A method for booting a system using a non-volatile memory component according to an embodiment of the invention includes the steps of: reading at least one memory corresponding to the non-volatile memory component when the system is powered a status flag of the block, the flag value of the status flag indicating whether a complete erasing operation applied to the memory block has been completed; according to the flag of the status flag, the corresponding memory The block selectively performs a leakage current suppression process; and powering up the system based on one of the boot codes stored in the non-volatile memory component.

根據本發明一實施例之一種記憶體裝置,包含一非揮發性記憶體元件,一狀態暫存器,一控制單元以及一漏電流校正單元。該非揮發性記憶體元件包含複數個記憶體區塊。該狀態暫存器電性連接至該非揮發性記憶體元件,其配置以儲存一狀態旗標,該狀態旗標用以指示施加至該非揮發性記憶體元件中之至少一記憶體區塊的一完整的抹除運作是否已完成。該控制單元配置以在該記憶體裝置供電後讀取該 狀態旗標的旗標值。該漏電流校正單元電性連接至該控制單元,其配置以根據該狀態旗標之旗標值對該等記憶體區塊選擇性地執行一漏電流抑制程序。 A memory device according to an embodiment of the invention includes a non-volatile memory component, a state register, a control unit and a leakage current correction unit. The non-volatile memory component includes a plurality of memory blocks. The state register is electrically coupled to the non-volatile memory component and configured to store a state flag for indicating one of the at least one memory block applied to the non-volatile memory component Whether the complete erase operation has been completed. The control unit is configured to read the power after the memory device is powered The flag value of the status flag. The leakage current correcting unit is electrically connected to the control unit, and is configured to selectively perform a leakage current suppression process on the memory blocks according to the flag value of the status flag.

10-18‧‧‧步驟 10-18‧‧‧Steps

200‧‧‧記憶體裝置 200‧‧‧ memory device

202‧‧‧非揮發性記憶體元件 202‧‧‧Non-volatile memory components

204‧‧‧狀態暫存器庫 204‧‧‧Status Register Library

206‧‧‧或閘電路 206‧‧‧ or gate circuit

208‧‧‧控制單元 208‧‧‧Control unit

210‧‧‧漏電流校正單元 210‧‧‧Leakage current correction unit

212‧‧‧第一偏壓電壓產生器 212‧‧‧First bias voltage generator

214‧‧‧第二偏壓電壓產生器 214‧‧‧Second bias voltage generator

216‧‧‧再抹除單元 216‧‧‧Repeating unit

32‧‧‧開機區塊 32‧‧‧ boot block

34‧‧‧資料區塊 34‧‧‧Information block

36‧‧‧感測放大器 36‧‧‧Sense Amplifier

400‧‧‧完整抹除運作 400‧‧‧complete erase operation

402-414‧‧‧步驟 402-414‧‧‧Steps

500‧‧‧開機方法 500‧‧‧ boot method

502-512‧‧‧步驟 502-512‧‧‧Steps

600‧‧‧開機方法 600‧‧‧ boot method

602-612‧‧‧步驟 602-612‧‧‧Steps

BL‧‧‧位元線 BL‧‧‧ bit line

圖1顯示一習知之完整的抹除運作的流程圖。 Figure 1 shows a flow chart of a conventional complete erase operation.

圖2顯示結合本發明一實施例之一記憶體裝置的方塊示意圖。 2 is a block diagram showing a memory device in accordance with an embodiment of the present invention.

圖3顯示共享一相同位元線之兩記憶體區塊的示意圖。 Figure 3 shows a schematic diagram of two memory blocks sharing a same bit line.

圖4顯示根據本發明一實施例之該非揮發性記憶體元件之一完整的抹除運作的流程圖。 4 shows a flow chart of a complete erase operation of one of the non-volatile memory elements in accordance with an embodiment of the present invention.

圖5顯示根據本發明一實施例之使用非揮發性記憶體元件對系統進行開機之一方法之流程圖。 5 shows a flow chart of one method of booting a system using a non-volatile memory component, in accordance with an embodiment of the present invention.

圖6顯示根據本發明另一實施例之使用非揮發性記憶體元件對系統進行開機之一方法之流程圖 6 shows a flow chart of a method for booting a system using a non-volatile memory element in accordance with another embodiment of the present invention.

圖2顯示結合本發明一實施例之一記憶體裝置200的方塊示意圖。參照圖2,該記憶體裝置200包括一非揮發性記憶體元件202,一狀態暫存器庫204,一或閘電路206,一控制單元208以及一漏電流校正單元210。該漏電流校正單元210包括一第一偏壓電壓產生器212,一第二偏壓電壓產生器214以及一再抹除單元216。 2 shows a block diagram of a memory device 200 in accordance with an embodiment of the present invention. Referring to FIG. 2, the memory device 200 includes a non-volatile memory component 202, a state register bank 204, a gate circuit 206, a control unit 208, and a leakage current correction unit 210. The leakage current correcting unit 210 includes a first bias voltage generator 212, a second bias voltage generator 214, and a re-erasing unit 216.

參照圖2,該非揮發性記憶體元件202包含N個記憶體區塊[0]至記憶體區塊[N-1]以儲存正常資料或開機碼,其中N為一正整數。舉例而言,在本實施例中記憶體區塊[0]中的記憶體晶胞係建構以儲存正常資料,而記憶體區塊[1]中的記憶體晶胞係建構以儲存開機碼。此外,記憶體區塊[0]中的記憶體晶胞和記憶體區塊[1]中的記憶體晶胞電性連接至相同的位元線。為了降低該記憶體元件202的晶片面積,在記憶體區塊[0]中的記憶體晶胞和記憶體區塊[1]中的記憶體晶胞彼此間並無隔離元件。 Referring to FIG. 2, the non-volatile memory component 202 includes N memory blocks [0] to memory blocks [N-1] to store normal data or boot codes, where N is a positive integer. For example, in the present embodiment, the memory cell system in the memory block [0] is constructed to store normal data, and the memory cell system in the memory block [1] is constructed to store the boot code. In addition, the memory cell in the memory block [0] and the memory cell in the memory block [1] are electrically connected to the same bit line. In order to reduce the wafer area of the memory element 202, the memory cell in the memory block [0] and the memory cell in the memory block [1] have no isolation elements therebetween.

請參照圖3,其顯示共享一相同位元線BL之兩記憶體區塊的示意圖,其中開機區塊32係用以儲存開機碼,而資料區塊34係用以儲存正常資料。假設該資料區塊34的記憶體晶胞被過度抹除,且在未能完成OEC步驟時電源中斷,由於開機區塊32中的記憶體晶胞和資料區塊34中的記憶體晶胞分享同一位元線,在送電後進行開機程序時,從開機區塊32中讀取開機碼時會讀取失敗。這是由於過抹除現象導致之位元線漏電(Ileak>0μA),使得感測放大器(Sense Amplifier,SA)36在讀取開機區塊32中之所選擇晶胞的邏輯”0”資料時感測到錯誤的電流,進而讀取到錯誤的資料值。這會導致很長的開機時間,或者,系統可能會無法開機。 Referring to FIG. 3, a schematic diagram of two memory blocks sharing the same bit line BL is shown, wherein the boot block 32 is used to store the boot code, and the data block 34 is used to store normal data. It is assumed that the memory cell of the data block 34 is over-erased, and the power supply is interrupted when the OEC step is not completed, due to the memory cell in the boot block 32 and the memory cell share in the data block 34. The same bit line, when the boot process is performed after power transmission, the read failure will be read when the boot code is read from the boot block 32. This is due to the leakage of the bit line caused by the erase phenomenon (Ileak>0μA), so that the sense amplifier (SA) 36 reads the logic “0” data of the selected cell in the boot block 32. The wrong current is sensed and the wrong data value is read. This can result in a very long boot time or the system may not boot.

參照圖2,在本實施例中該狀態暫存器庫204包括N個狀態暫存器[0]至[N-1]。該等暫存器[0]至[N-1]用以儲存狀 態旗標FL[0]至FL[N-1],其中每一狀態旗標用以指示該非揮發性記憶體元件202中對應的記憶體區塊是否已成功完成一完整的抹除運作。舉例來說,FL[0]指示記憶體區塊[0]是否已成功完成一完整的抹除運作,而FL[1]指示記憶體區塊[1]是否已成功完成一完整的抹除運作,依此類推。然而,本發明不應以此為限。在其他實施例中該狀態暫存器庫204可包括小於N個的狀態暫存器。亦即,可能有多個記憶體區塊分配到一狀態旗標。 Referring to FIG. 2, the state register library 204 includes N status registers [0] through [N-1] in this embodiment. The registers [0] to [N-1] are used for storage The status flags FL[0] to FL[N-1], wherein each status flag is used to indicate whether the corresponding memory block in the non-volatile memory element 202 has successfully completed a complete erase operation. For example, FL[0] indicates whether the memory block [0] has successfully completed a complete erase operation, and FL[1] indicates whether the memory block [1] has successfully completed a complete erase operation. ,So on and so forth. However, the invention should not be limited thereto. In other embodiments, the state register library 204 can include fewer than N state registers. That is, there may be multiple memory blocks assigned to a status flag.

圖4顯示根據本發明一實施例之該非揮發性記憶體元件202之一完整的抹除運作400的流程圖。參照圖4,開始首先進行步驟402,其中該非揮發性記憶體元件202中有至少一個特定區塊準備被抹除。接著,在步驟404中,在該狀態暫存器庫204中對應到該至少一個特定區塊之暫存器的狀態旗標FL會設定為邏輯”1”。在步驟406中,對該等特定區塊內的記憶體晶胞執行一預程式化運作。在步驟408中,對該等特定區塊內的記憶體晶胞執行一抹除運作。在步驟406中,對該等特定區塊內的記憶體晶胞執行一過抹除校正運作。當該等特定區塊內的記憶體晶胞已依序執行預程式化運作406,抹除運作408和過抹除校正運作410後,將該狀態暫存器庫204中對應到該等特定區塊之暫存器的狀態旗標FL之旗標值設定為邏輯”0”。 4 shows a flow diagram of a complete erase operation 400 of the non-volatile memory component 202 in accordance with an embodiment of the present invention. Referring to Figure 4, step 402 begins first, wherein at least one particular block of the non-volatile memory element 202 is ready to be erased. Next, in step 404, the status flag FL corresponding to the temporary register of the at least one particular block in the status register bank 204 is set to logic "1". In step 406, a pre-programming operation is performed on the memory cells in the particular block. In step 408, an erase operation is performed on the memory cells in the particular block. In step 406, an erase erase correction operation is performed on the memory cells in the particular block. When the memory cells in the particular block have sequentially performed the pre-programming operation 406, the erase operation 408 and the erase erase correction operation 410, the state register library 204 corresponds to the specific regions. The flag of the status flag FL of the block register is set to logic "0".

圖5顯示根據本發明一實施例之使用非揮發性記 憶體元件對系統進行開機之一方法500之流程圖。熟悉本項技術者應體認本發明的施行並未限定於須逐一或準確地實施圖5中的每一步驟。舉例而言,可於圖5中的每一步驟之間增加中間步驟或進行局部修改。 Figure 5 shows the use of non-volatile notes in accordance with an embodiment of the present invention. A flow chart of a method 500 for booting a system into a system. Those skilled in the art should recognize that the practice of the present invention is not limited to the need to implement each of the steps of FIG. 5 one by one or accurately. For example, an intermediate step or partial modification can be added between each step in FIG.

參照圖5,首先進行步驟502,在步驟502中對該記憶體裝置200提供電力。接著,在步驟504中,讀取對應到該非揮發性記憶體元件202中之全部記憶體區塊[0]至[N-1]的一總狀態旗標OFL。之後,在步驟506中,判斷該總狀態旗標OFL之旗標值是否為邏輯”1”,若否,根據儲存在該非揮發性記憶體元件202中之開機碼進行開機;若是,檢查每一狀態旗標FL以確認何者旗標值為邏輯”1”。 Referring to Figure 5, step 502 is first performed, in which power is supplied to the memory device 200. Next, in step 504, a total status flag OFL corresponding to all of the memory blocks [0] through [N-1] in the non-volatile memory element 202 is read. Then, in step 506, it is determined whether the flag value of the total status flag OFL is logic "1", and if not, the power-on code stored in the non-volatile memory element 202 is turned on; if so, check each The status flag FL is used to confirm which flag value is logical "1".

在步驟508中,若狀態旗標FL之旗標值為邏輯”1”者,表示對應的區塊未完成完整的抹除運作,例如尚未進行OEC運作。因此,在步驟510中須對對應至狀態旗標值為邏輯”1”之區塊執行一漏電流抑制程序。接著,在步驟512中方能根據儲存在該非揮發性記憶體元件202中之開機碼進行開機。 In step 508, if the flag of the status flag FL is logic "1", it indicates that the corresponding block has not completed the complete erasing operation, for example, the OEC operation has not been performed. Therefore, in step 510, a leakage current suppression procedure must be performed on the block corresponding to the status flag value of logic "1". Then, in step 512, the power-on code stored in the non-volatile memory element 202 can be turned on.

參照圖2,該總狀態旗標OFL是由該或閘電路206所產生。該總狀態旗標OFL係用以指示是否有任何不完整的抹除運作發生。若該總狀態旗標OFL之旗標值為邏輯”1”,表示有一個或超過一個的記憶體區塊未完成抹除方法400,因此該控制單元208會依序讀取對應至記憶體區塊[0]至[N-1]的之狀 態旗標的旗標值以找出邏輯”1”的旗標值所對應的區塊。接著,一漏電流抑制程序會加至所找到的區塊中的未被選擇之記憶體晶胞,以確保圖3中的感測放大器在執行開機程序時不會感測到錯誤的電流。 Referring to FIG. 2, the total status flag OFL is generated by the OR gate circuit 206. The total status flag OFL is used to indicate if any incomplete erase operations have occurred. If the flag of the total status flag OFL is logic "1", indicating that one or more memory blocks have not completed the erasing method 400, the control unit 208 sequentially reads the corresponding to the memory area. The shape of the block [0] to [N-1] The flag value of the flag is used to find the block corresponding to the flag value of the logical "1". Next, a leakage current suppression program is added to the unselected memory cells in the found block to ensure that the sense amplifier in Figure 3 does not sense the erroneous current when performing the power-on procedure.

以下將舉實施例詳細說明該漏電流抑制程序的細節。當該總狀態旗標OFL之旗標值為邏輯”0”時,表示該非揮發性記憶體元件202中之全部記憶體區塊[0]至[N-1]已完整地執行預程式化運作,抹除運作和OEC運作。在此狀況下,圖2中的該第一偏壓電壓產生器212會施加一第一偏壓電壓,亦即一正常偏壓電壓會施加至該等記憶體區塊中的未被選擇之記憶體晶胞。反之,當該總狀態旗標OFL之旗標值為邏輯”1”時,表示該非揮發性記憶體元件202中之至少有一記憶體區塊未完成完整的抹除運作。在此狀況下,圖2中的該第二偏壓電壓產生器214會施加一第二偏壓電壓,亦即一抑制偏壓電壓會施加至該等記憶體區塊中的所有未被選擇之記憶體晶胞,或至少是開機區塊中的所有未被選擇之記憶體晶胞。在本實施例中,該第二偏壓電壓為一負電壓,且電壓值足以截止一過抹除記憶體晶胞。在步驟512中,該系統根據儲存在該非揮發性記憶體元件202中之開機碼進行開機。當該系統成功地開機後,對應於狀態旗標FL之旗標值為邏輯”1”的記憶體區塊會進行修復,或者維持於原狀態。 Details of the leakage current suppression program will be described in detail below by way of examples. When the flag of the total status flag OFL is logic "0", it indicates that all memory blocks [0] to [N-1] in the non-volatile memory element 202 have completely performed the pre-program operation. , erase operations and OEC operations. In this case, the first bias voltage generator 212 in FIG. 2 applies a first bias voltage, that is, a normal bias voltage is applied to the unselected memory in the memory blocks. Body unit cell. Conversely, when the flag of the total status flag OFL is logic "1", it indicates that at least one memory block of the non-volatile memory element 202 has not completed a complete erase operation. In this case, the second bias voltage generator 214 of FIG. 2 applies a second bias voltage, that is, a suppression bias voltage is applied to all unselected ones of the memory blocks. The memory cell, or at least all of the unselected memory cells in the boot block. In this embodiment, the second bias voltage is a negative voltage, and the voltage value is sufficient to turn off the erase memory cell. In step 512, the system is powered on based on the boot code stored in the non-volatile memory component 202. When the system is successfully powered on, the memory block corresponding to the flag flag of the status flag FL is logical "1", or is restored or maintained in the original state.

圖6顯示根據本發明另一實施例之使用非揮發性 記憶體元件對系統進行開機之一方法600之流程圖。熟悉本項技術者應體認本發明的施行並未限定於須逐一或準確地實施圖6中的每一步驟。舉例而言,可於圖6中的每一步驟之間增加中間步驟或進行局部修改。 Figure 6 shows the use of non-volatiles in accordance with another embodiment of the present invention. A flowchart of one method 600 of booting a memory component to a system. Those skilled in the art will recognize that the practice of the present invention is not limited to the need to implement each of the steps of FIG. 6 one by one or accurately. For example, an intermediate step or partial modification can be added between each step in FIG.

參照圖6,首先進行步驟602,在步驟602中對該記憶體裝置200提供電力。接著,在步驟604中,讀取對應到該非揮發性記憶體元件202中之全部記憶體區塊[0]至[N-1]的一總狀態旗標OFL。之後,在步驟606中,檢察該總狀態旗標OFL之旗標值是否為邏輯”1”,若是,進行步驟608,若否,進行步驟612。在步驟608中,檢察該等狀態旗標FL[0]至FL[N-1]中之每一者的旗標值。在步驟610中,對對應於旗標值為邏輯”1”的記憶體區塊進行一漏電流修復運作。在步驟612中,根據儲存在該非揮發性記憶體元件202中之開機碼對該系統進行開機。 Referring to Figure 6, step 602 is first performed, in which power is supplied to the memory device 200. Next, in step 604, a total status flag OFL corresponding to all of the memory blocks [0] through [N-1] in the non-volatile memory element 202 is read. Thereafter, in step 606, it is checked whether the flag value of the total status flag OFL is logic "1", and if so, step 608 is performed, and if not, step 612 is performed. In step 608, the flag values for each of the status flags FL[0] through FL[N-1] are examined. In step 610, a leakage current repair operation is performed on the memory block corresponding to the flag value of logic "1". In step 612, the system is powered on based on the boot code stored in the non-volatile memory component 202.

參照圖2,該總狀態旗標OFL是由該或閘電路206所產生。該總狀態旗標OFL係用以指示是否有任何不完整的抹除運作發生。在步驟604中,會讀取該總狀態旗標OFL的旗標值。在步驟606中,若該總狀態旗標OFL之旗標值為邏輯”0”,會進行步驟612;若該總狀態旗標OFL之旗標值為邏輯”1”,在步驟608中該控制單208元會對該等狀態旗標FL[0]至FL[N-1]之每一者進一步執行一檢查運作。這是由於若該總狀態旗標OFL之旗標值為邏輯”1”,表示該非揮發性記憶體元件202中有 至少一個記憶體區塊未完成完整的抹除步驟,因此該控制單元208會找出邏輯”1”的旗標值所對應的區塊。接著,該漏電流校正單元210會對所找出的區塊之所有記憶體晶胞進行漏電流修復運作,以確保系統在試圖讀取相關連區塊時不會發生圖3中的感測放大器之誤判狀況。更具體而言,當該總狀態旗標OFL指示有至少一個記憶體區塊未完成完整的抹除步驟時,該再抹除單元216會對記憶體區塊中的所有記憶體晶胞進行再抹除運作。 Referring to FIG. 2, the total status flag OFL is generated by the OR gate circuit 206. The total status flag OFL is used to indicate if any incomplete erase operations have occurred. In step 604, the flag value of the total status flag OFL is read. In step 606, if the flag of the total status flag OFL is logic "0", step 612 is performed; if the flag of the total status flag OFL is logic "1", the control is performed in step 608. A single 208 element will further perform an inspection operation for each of the status flags FL[0] to FL[N-1]. This is because if the flag of the total status flag OFL is logic "1", it means that the non-volatile memory element 202 has At least one of the memory blocks does not complete the complete erasing step, so the control unit 208 will find the block corresponding to the flag value of the logic "1". Then, the leakage current correcting unit 210 performs a leakage current repair operation on all the memory cells of the found block to ensure that the sense amplifier in FIG. 3 does not occur when the system attempts to read the associated block. The status of misjudgment. More specifically, when the total status flag OFL indicates that at least one memory block has not completed the complete erase step, the re-erase unit 216 performs re-memory of all memory cells in the memory block. Wipe the operation.

因此,藉由本發明所揭露之方法可避免習知技術中的開機潛在問題。系統的穩定度可以改善,且共享相同位元線的相關聯記憶體區塊不會有位元線漏電之現象。 Therefore, the potential problem of booting in the prior art can be avoided by the method disclosed by the present invention. The stability of the system can be improved, and the associated memory blocks sharing the same bit line will not have bit line leakage.

本發明之技術內容及技術特點已揭示如上,然而熟悉本項技術之人士仍可能基於本發明之教示及揭示而作種種不背離本發明精神之替換及修飾。因此,本發明之保護範圍應不限於實施例所揭示者,而應包括各種不背離本發明之替換及修飾,並為隨後之申請專利範圍所涵蓋。 The technical and technical features of the present invention have been disclosed as above, and those skilled in the art can still make various substitutions and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention should be construed as not limited by the scope of the invention, and the invention is intended to be

200‧‧‧記憶體裝置 200‧‧‧ memory device

202‧‧‧非揮發性記憶體元件 202‧‧‧Non-volatile memory components

204‧‧‧狀態暫存器庫 204‧‧‧Status Register Library

206‧‧‧或閘電路 206‧‧‧ or gate circuit

208‧‧‧控制單元 208‧‧‧Control unit

210‧‧‧漏電流校正單元 210‧‧‧Leakage current correction unit

212‧‧‧第一偏壓電壓產生器 212‧‧‧First bias voltage generator

214‧‧‧第二偏壓電壓產生器 214‧‧‧Second bias voltage generator

216‧‧‧再抹除單元 216‧‧‧Repeating unit

Claims (11)

一種使用一非揮發性記憶體元件對一系統進行開機之方法,該非揮發性記憶體元件包含一開機區塊和複數個資料區塊,其中該開機區塊中的記憶體晶胞和該等資料區塊中的記憶體晶胞電性連接至相同的位元線,該方法包括:當該系統供電時,讀取對應到該非揮發性記憶體元件中之該開機區塊和該等資料區塊的一狀態旗標,該狀態旗標之旗標值指示施加至該非揮發性記憶體元件的一完整的抹除運作是否已完成;根據該狀態旗標之旗標值對所對應的該開機區塊和該等資料區塊選擇性地執行一漏電流抑制程序;以及根據儲存在該開機區塊中之一開機碼對該系統進行開機。 A method of booting a system using a non-volatile memory component, the non-volatile memory component comprising a boot block and a plurality of data blocks, wherein the memory cell and the data in the boot block The memory cells in the block are electrically connected to the same bit line, the method comprising: when the system is powered, reading the boot block and the data block corresponding to the non-volatile memory element a status flag, the flag value of the status flag indicating whether a complete erase operation applied to the non-volatile memory element has been completed; according to the flag of the status flag, the corresponding boot area The block and the data blocks selectively perform a leakage current suppression procedure; and powering up the system based on one of the boot codes stored in the boot block. 根據申請專利範圍第1項之方法,其中該根據該狀態旗標之旗標值對該所對應的該開機區塊和該等資料區塊選擇性地執行該漏電流抑制程序之步驟包含:當該狀態旗標指示施加至該非揮發性記憶體元件的該完整的抹除運作已完成時,施加一第一偏壓電壓至該開機區塊和該等資料區塊中之未被選擇的記憶體晶胞;以及當該狀態旗標指示施加至該非揮發性記憶體元件的該完整的抹除運作未完成時,施加一第二偏壓電壓至該該開機區塊和該等資料區塊中之未被選擇的記憶體晶胞; 其中,該第二偏壓電壓的電壓值低於該第一偏壓電壓的電壓值。 The method of claim 1, wherein the step of selectively performing the leakage current suppression procedure on the corresponding boot block and the data blocks according to the flag value of the status flag comprises: The status flag indicates that when the complete erase operation applied to the non-volatile memory element has been completed, applying a first bias voltage to the boot block and the unselected memory in the data block a unit cell; and when the status flag indicates that the complete erase operation applied to the non-volatile memory element is not complete, applying a second bias voltage to the boot block and the data blocks Unselected memory cell; The voltage value of the second bias voltage is lower than the voltage value of the first bias voltage. 根據申請專利範圍第2項之方法,其中該第二偏壓電壓為一負電壓,且電壓值足以截止一過抹除記憶體晶胞。 The method of claim 2, wherein the second bias voltage is a negative voltage and the voltage value is sufficient to turn off the erase memory cell. 根據申請專利範圍第1項之方法,更包含:當該系統開機後,對該等資料區塊執行一漏電流修復運作。 According to the method of claim 1, the method further comprises: when the system is powered on, performing a leakage current repair operation on the data blocks. 根據申請專利範圍第1項之方法,其中該根據該狀態旗標之旗標值對該所對應的該開機區塊和該等資料區塊選擇性地執行該漏電流抑制程序之步驟包含:當該狀態旗標指示施加至該非揮發性記憶體元件的該完整的抹除運作未完成時,對該等資料區塊中的記憶體晶胞進行再抹除運作。 The method of claim 1, wherein the step of selectively performing the leakage current suppression procedure on the corresponding boot block and the data blocks according to the flag value of the status flag comprises: The status flag indicates that the memory cell in the data block is re-erased when the complete erase operation applied to the non-volatile memory element is not completed. 根據申請專利範圍第1項之方法,其中該讀取對應到該非揮發性記憶體元件中之該開機區塊和該等資料區塊的該狀態旗標之步驟包含:讀取該非揮發性記憶體元件中之每一資料區塊的一狀態旗標;以及藉由對該等資料區塊的所有狀態旗標執行一或運算,藉以獲得一總狀態旗標;且該方法更包含:檢查該總狀態旗標以確認該非揮發性記憶體元件中是否具有至少一資料區塊未完成完整的抹除步驟。 The method of claim 1, wherein the step of reading the status flag corresponding to the boot block and the data blocks in the non-volatile memory element comprises: reading the non-volatile memory a status flag of each of the data blocks; and performing an OR operation on all of the status flags of the data blocks to obtain a total status flag; and the method further comprises: checking the total The status flag is used to confirm whether the non-volatile memory element has at least one data block that does not complete the complete erase step. 一種記憶體裝置,包括:一非揮發性記憶體元件,包含一開機區塊和複數個資料區塊,該開機區塊中的記憶體晶胞和該等資料區塊中的記憶體晶胞電性連接至相同的位元線;一狀態暫存器,電性連接至該非揮發性記憶體元件,其配置以儲存一狀態旗標,該狀態旗標用以指示施加至該非揮發性記憶體元件中的一完整的抹除運作是否已完成;一控制單元,其配置以在該記憶體裝置供電後讀取該狀態旗標的旗標值;以及一漏電流校正單元,電性連接至該控制單元,其配置以根據該狀態旗標之旗標值對該非揮發性記憶體元件選擇性地執行一漏電流抑制程序,藉以完成一開機程序。 A memory device comprising: a non-volatile memory component, comprising a boot block and a plurality of data blocks, the memory cell in the boot block and the memory cell in the data block Connected to the same bit line; a state register electrically coupled to the non-volatile memory element, configured to store a status flag for indicating application to the non-volatile memory element Whether a complete erase operation has been completed; a control unit configured to read a flag value of the status flag after powering the memory device; and a leakage current correction unit electrically connected to the control unit And configured to selectively perform a leakage current suppression process on the non-volatile memory component according to the flag value of the state flag, thereby completing a booting process. 根據申請專利範圍第7項之記憶體裝置,其中該漏電流校正單元包含:一第一偏壓電壓產生器,其配置以當該狀態旗標指示施加至該非揮發性記憶體元件中的該完整的抹除運作已完成時,施加一第一偏壓電壓至該開機區塊和該等資料區塊中之未被選擇的記憶體晶胞;以及一第二偏壓電壓產生器,其配置以當該狀態旗標指示施加至該非揮發性記憶體元件中的該完整的抹除運作未完成時,施加一第二偏壓電壓至該非揮發性記憶體元件中之未被選擇的記憶體晶胞; 其中,該第二偏壓電壓的電壓值低於該第一偏壓電壓的電壓值。 The memory device of claim 7, wherein the leakage current correcting unit comprises: a first bias voltage generator configured to indicate the integrity applied to the non-volatile memory element when the status flag indicates When the erasing operation is completed, applying a first bias voltage to the boot block and the unselected memory cells in the data blocks; and a second bias voltage generator configured to When the status flag indicates that the complete erase operation applied to the non-volatile memory element is not completed, applying a second bias voltage to the unselected memory cell in the non-volatile memory element ; The voltage value of the second bias voltage is lower than the voltage value of the first bias voltage. 根據申請專利範圍第8項之記憶體裝置,其中該第二偏壓電壓為一負電壓,且電壓值足以截止一過抹除記憶體晶胞。 The memory device of claim 8 wherein the second bias voltage is a negative voltage and the voltage value is sufficient to turn off the erased memory cell. 根據申請專利範圍第7項之記憶體裝置,其中該漏電流校正單元包含:一再抹除單元,其配置以當該狀態旗標指示施加至該非揮發性記憶體元件中的該完整的抹除運作未完成時,對該等資料區塊進行一再抹除運作。 The memory device of claim 7, wherein the leakage current correction unit comprises: a re-wiping unit configured to indicate the complete erase operation applied to the non-volatile memory element when the status flag indicates When it is not completed, the data blocks are repeatedly erased. 根據申請專利範圍第7項之記憶體裝置,更包含:複數個狀態暫存器;以及一或閘電路,電性連接至該等狀態暫存器,其配置以產生一總狀態旗標;其中,該控制單元在該記憶體裝置供電後讀取該總狀態旗標的旗標值,且當該總狀態旗標指示該非揮發性記憶體元件未完成完整的抹除運作時,該控制單元個別地讀取該等狀態暫存器以找出未完成完整的抹除運作的該資料區塊。 The memory device of claim 7 further comprising: a plurality of state registers; and an OR gate circuit electrically connected to the state registers configured to generate a total status flag; The control unit reads the flag value of the total status flag after the memory device is powered, and when the total status flag indicates that the non-volatile memory element has not completed the complete erasing operation, the control unit individually The status registers are read to find the data block that did not complete the complete erase operation.
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