TWI522692B - Backlight module and fabricating method thereof - Google Patents

Description

Backlight module and manufacturing method thereof

The present disclosure relates to a backlight module and a method of fabricating the same, and more particularly to an edge-lit backlight module and a method of fabricating the same.

Liquid crystal display devices are widely used in consumer electronic products such as displays, LCD TVs, mobile phones, and notebook computers because of their thinness, low power consumption, and low radiation. However, the liquid crystal itself does not emit light, so a general liquid crystal display device requires a backlight module to provide a light source. The illumination source of the backlight module mainly adopts a cold cathode ray tube or a light emitting diode, wherein the light emitting diode has high color saturation, no mercury, high life and the like, so the light emitting diode has gradually replaced the cold cathode ray tube. And is widely used in backlight modules.

The liquid crystal display device mainly comprises an edge light type backlight module and a liquid crystal display module, wherein the edge light type backlight module is disposed under the liquid crystal display module to provide a light source required for the liquid crystal display device. The edge-lit backlight module includes a housing, a light source, a light guide plate and a fixing frame. The housing is used to carry the light source and the light guide plate, and the holder is used to fix the light source and the light guide plate in the housing. In the edge-lit backlight module, the light guide plate is disposed on the casing, and the light source is disposed on the sidewall of the casing and adjacent to the side of the light guide plate, wherein a majority of the light emitted by the light source enters from the side of the light guide plate. In the light guide plate, the light is guided toward the light emitting surface of the backlight module (usually the top surface of the backlight module) through the light guide plate.

In order to fix the illumination source on the side wall of the housing, screws are generally used to lock the illumination source to the side wall of the housing, thereby limiting the degree of freedom and fit of the illumination source on the housing.

However, such a locking method requires a considerable amount of man-hours to assemble the light source, and also increases the hardware cost of the screw. Also. During the locking of the screw, some metal chips are easily generated due to the friction between the screw and the screw hole. These metal shavings can cause a short circuit in the light source.

Therefore, there is a need for a new backlight module and a method of manufacturing the same to overcome the above problems.

One aspect of the present invention is to provide a backlight module and a method of manufacturing the same to avoid the cost increase and short-circuit of the light source caused by the use of the screw lock.

According to an embodiment of the invention, the backlight module comprises a housing, a light guide plate, a diffusion plate and a light source. The housing includes a bottom plate and a side wall. The bottom plate has a raised portion. The side wall comprises a top plate and a side plate to form an inverted L-shaped side wall, wherein the side plate of the side wall is connected to the bottom plate, so that the side wall and the convex portion of the bottom plate form an accommodating space for accommodating the light source, and between the top plate and the convex portion With a gap. The light source is disposed in the accommodating space and includes a circuit board and a diode chip. The circuit board is placed against the side panel of the side wall of the housing, and the diode chip is disposed on the circuit board. The light guide plate is disposed in the housing, and the diffusion plate is disposed on the light guide plate.

According to another embodiment of the present invention, in the manufacturing method of the backlight module, a housing is first provided, and the housing includes a bottom plate and a side wall. The bottom plate has a raised portion. The side wall includes a top plate and a side plate to form an inverted L-shaped side wall, wherein the side plates of the side wall are connected to the bottom plate to form a receiving space between the side wall and the convex portion of the bottom plate, and a gap between the top plate and the convex portion. Next, a light source is provided, the light source comprising a circuit board and a diode chip, wherein the diode chip is disposed on the circuit board. Then, the light source is placed into the accommodating space of the casing from the gap between the top plate and the boss at an oblique angle so that the circuit board abuts against the side plate of the side wall.

It can be seen from the above description that the backlight module and the manufacturing method thereof are formed on the casing to accommodate an illuminating source, so that the illuminating source can be fixed in the casing without screws. Locking. In addition, when the light source is assembled, the light source can be placed into the accommodating space of the casing from the gap between the top plate and the boss portion, so that the purpose of quick installation can be achieved.

Please refer to FIG. 1 , which is a schematic structural diagram of a backlight module 100 according to an embodiment of the invention. The backlight module 100 includes a housing 110, a light guide plate 115, a diffusion plate 116, and a light source 120. The light guide plate 115 is disposed in the housing 110, and the diffusion plate 116 is disposed on the light guide plate 115. The backlight module 100 of the present embodiment is an edge-lit backlight module. The light source 120 is disposed on the sidewall of the housing 110, and the light emitted by the light source 120 is guided by the light guide plate 115 to the light guide plate 115. The diffusion plate 116 is uniformly emitted to the outside of the backlight module 100 through the diffusion of the diffusion plate 116.

Referring to FIG. 1A and FIG. 1B , FIG. 1A is a partial perspective view of a backlight module 100 according to an embodiment of the invention, and FIG. 1B is a backlight module 100 according to an embodiment of the invention. A partial cross-sectional structural diagram. The circuit board 122 has an elongated shape with a light emitting diode wafer 124 disposed thereon to provide a white light source. In the embodiment, the circuit board 122 is a Metal Core Printed Circuit Board (MCPCB), but the embodiment of the present invention is not limited thereto.

The housing 110 is composed of a bottom plate 112 and side walls 114. The side wall 114 is disposed at the end of the bottom plate 112 and has a side plate 114a and a top plate 114b to form an inverted L-shaped side wall 114, wherein the top plate 114b remains flat without bending. The bottom plate 112 has a convex portion 112a, and the convex portion 112a forms an accommodating space 130 with the inverted L-shaped side wall 114 to accommodate the light source 120. In the present embodiment, the circuit board 122 of the light source 120 has two surfaces, one of which is abutted against the side plate 114a of the side wall 114, and the other surface is provided with the light emitting diode chip 124, and the side wall 114 is not contacted. The top plate 114b.

There is a gap 140 between the top plate 114b and the raised portion 112a of the bottom plate 112. The gap 140 is used for the light source 120 to be placed in the accommodating space 130. Wherein one end of the top plate 114b is connected to the side plate 114a, and the other end of the top plate 114b defines a gap 140 with the convex portion 112a and does not protrude the position of the convex portion 112a at the furthest distance from the side plate to facilitate the passage from the gap 140. The light source 120 is placed in the accommodating space 130. In addition, the vertical distance D between the top plate 114b and the bottom plate 112 is approximately equal to the vertical distance L of the two diagonal sides of the circuit board 120, which can facilitate the following method for manufacturing the backlight module.

It should be noted that the housing 110 of the embodiment is made of metal. Therefore, the housing 110 not only has the function of dissipating heat, but also can be directly used as the back panel of the backlight module, so that the housing 110 is directly in contact with the outside air. The heat dissipation effect of the backlight module 100 is increased. In other embodiments of the present invention, a backplane may be added to the housing 110 to make the backlight module 100 more aesthetically pleasing and strong.

Please refer to FIG. 2 , which is a schematic flow chart of a method for manufacturing a backlight module according to an embodiment of the invention. In the backlight module manufacturing method 200, a housing providing step 210 and a light source providing step 220 are first performed to provide the housing 110 and the light source 120 described above. In an embodiment of the present invention, the housing providing step 210 may utilize an aluminum extrusion process to extrude an aluminum sheet into the housing 110 to integrally form the housing 110. After steps 210 and 220, a mounting step 230 is then performed to place the illumination source 120 into the housing space 130.

In the mounting step 230, the illumination source 120 is first tilted at an angle such that the end of the illumination source 120 is aligned with the gap 140, and then the illumination source 120 is pushed into the accommodation space 130 along the gap 140, as shown in FIG. Shown. Since the vertical distance D between the top plate 114b and the bottom plate 112 is approximately equal to the vertical distance L of the two diagonal sides of the circuit board 120, the light source 120 is slightly stuck to the top plate 114b of the side wall 114 during the pushing of the light source 120. However, this point does not hinder the installation of the light source 120. Because the side wall 114 has a certain degree of elasticity, the installer only needs a little force to make the light source 120 slightly open the top plate 114b of the side wall 114, and take advantage of the trend. Slide into the accommodating space 130.

After the illumination source 120 enters the accommodating space 130, since the overall weight of the illuminating source 120 is not large, the illuminating source 120 cannot open the top plate 114b from the inside to the outside, so that the illuminating source 120 is confined in the accommodating space 130. .

It can be seen from the above description that the backlight module of the embodiment of the present invention forms an easy-to-access housing space on the housing to accommodate the light source, so that the light source can be fixed in the housing without screws. To lock up. In addition, the manufacturing method of the backlight module of the embodiment of the present invention utilizes the elasticity of the housing. Push the light source into the housing space of the housing, so that the purpose of quick installation can be achieved.

Please refer to FIG. 4 , which is a partial cross-sectional structural diagram of a backlight module 300 according to an embodiment of the invention. The backlight module 300 is similar to the backlight module 100, but the backlight module 300 further includes a thermal conductive adhesive 310. The thermal conductive adhesive 310 is disposed between the circuit board 122 and the side plate 114a to adhere the thermal conductive adhesive 310 to the side plate 114a, and the thermal energy on the circuit board 122 is easily conducted to the housing 110.

Please refer to FIG. 5 , which is a partial cross-sectional structural diagram of a backlight module 400 according to an embodiment of the invention. The backlight module 400 is similar to the backlight module 100, but the difference is that the bottom plate protrusion 412a of the embodiment has a chamfer angle 420 (C angle). In the present embodiment, wires (not shown) are connected to the external device on the circuit board 122, and these wires are usually disposed on the circuit board area 122a. When the wires extend outward from the accommodating space 130, they may be cut and damaged by the sharp corners of the convex portion. Therefore, the bottom plate convex portion 412a of the embodiment forms a chamfer angle 420 to avoid wire cuts. Since the chamfer angle 420 is an obtuse angle of a large angle, it is possible to effectively prevent the electric wire from being cut.

Please refer to FIG. 6 , which is a partial cross-sectional structural diagram of a backlight module 500 according to an embodiment of the invention. The backlight module 500 is similar to the backlight module 400, but the difference is that the bottom plate protrusion 512a of the backlight module 500 replaces the C angle in the backlight module 400 by using an arc angle (R angle) 520 to avoid The electric wire 190 connected to the circuit board 122 is cut by the corner of the convex portion and is damaged.

In summary, the backlight module of the embodiment of the present invention utilizes the accommodating space on the housing to accommodate the light source without the need for screws for locking. Therefore, problems such as an increase in cost due to screw locking and a short circuit of the light source can be avoided. Secondly, the manufacturing method of the backlight module of the embodiment of the invention provides a method for quickly installing the light source to greatly reduce the time required for manufacturing the backlight module. Furthermore, the backlight module of the embodiment of the present invention forms a lead angle at a corner of the accommodating space (ie, the corner of the convex portion), so that the wire can be prevented from being damaged by the cut.

While the invention has been described above in terms of several embodiments, it is not intended to limit the scope of the invention, and the invention may be practiced in various embodiments without departing from the spirit and scope of the invention. The scope of protection of the present invention is defined by the scope of the appended claims.

100‧‧‧Backlight module

110‧‧‧shell

112‧‧‧floor

112a‧‧‧ raised parts

114‧‧‧ side wall

114a‧‧‧ side panels

114b‧‧‧ top board

120‧‧‧Light source

122‧‧‧ boards

122a‧‧‧Board area

124‧‧‧Light Emitting Diode Wafer

130‧‧‧ accommodating space

140‧‧‧ gap

200‧‧‧Backlight module manufacturing method

210‧‧‧Shelf providing steps

220‧‧‧Light source supply steps

230‧‧‧Installation steps

300‧‧‧Backlight module

310‧‧‧thermal adhesive

400‧‧‧Backlight module

412a‧‧‧floor boss

420‧‧‧C corner

500‧‧‧Backlight module

512a‧‧‧Bottom plate boss

520‧‧‧R angle

D‧‧‧Distance between the top plate and the bottom plate

L‧‧‧Distance of the diagonal side

The above and other objects, features, and advantages of the present invention will become more apparent and understood. A schematic structural view of a backlight module according to an embodiment of the invention.

FIG. 1A is a partial perspective view of a backlight module according to an embodiment of the invention.

FIG. 1B is a partial cross-sectional structural diagram of a backlight module according to an embodiment of the invention.

FIG. 2 is a schematic flow chart showing a method of manufacturing a backlight module according to an embodiment of the invention.

Figure 3 is a schematic diagram showing the steps of installing a light source in accordance with an embodiment of the present invention.

4 is a partial cross-sectional structural view of a backlight module according to an embodiment of the invention.

FIG. 5 is a partial cross-sectional structural diagram of a backlight module according to an embodiment of the invention.

FIG. 6 is a partial cross-sectional structural view of a backlight module according to an embodiment of the invention.

112. . . Bottom plate

112a. . . Raised portion

114a. . . Side panel

114b. . . roof

122. . . Circuit board

124. . . Light-emitting diode chip

300. . . Backlight module

310. . . Thermal adhesive

Claims (11)

A backlight module comprising: a housing comprising: a bottom plate having a raised portion; and a side wall comprising a top plate and a side plate, wherein the side plate of the side wall is coupled to the bottom plate such that the side wall The convex portion of the bottom plate forms an accommodating space, and a gap is formed between the top plate and the convex portion, and one end of the top plate is connected to the side plate, and the other end of the top plate defines the same with the convex portion a light source is disposed in the accommodating space, wherein the light source comprises: a circuit board having two surfaces, wherein a surface abuts against the side plate of the side wall; and a diode a chip disposed on the other surface of the circuit board, the other surface of the circuit board not contacting the top plate of the sidewall; and a light guide plate disposed in the housing; wherein the other end of the top plate The position of the raised portion relative to the farthest distance of the side plate is not protruded, and the top plate and the side plate form the side wall of the inverted L-shape, and the top plate is kept flat without bending. The backlight module of claim 1, wherein the raised portion of the bottom plate has a lead angle. The backlight module of claim 2, wherein the guide The angle is the bevel angle. The backlight module of claim 2, wherein the lead angle is an arc angle. The backlight module of claim 1, further comprising a thermal adhesive disposed between the circuit board and the side plate to adhere the circuit board to the side plate. The backlight module of claim 1, wherein a vertical distance between the top plate and the bottom plate is equal to a vertical distance between two sides of the circuit board, and the two sides are located at two diagonals of the circuit board. Location. The backlight module of claim 1, wherein the circuit board is a Metal Core Printed Circuit Board (MCPCB). The backlight module of claim 1, wherein the backlight module further comprises a diffusion plate disposed on the light guide plate. The backlight module of claim 1, wherein the housing is integrally formed. A method of manufacturing a backlight module, comprising: providing a housing, wherein the housing comprises: a bottom plate having a raised portion; and a side wall comprising a top plate and a side plate, wherein the side plate of the side wall is coupled to the bottom plate such that the side wall forms an accommodation space with the convex portion of the bottom plate. And a gap between the top plate and the convex portion, the other end of the top plate does not protrude from a position of the convex portion at a farthest distance from the side plate, and the top plate and the side plate form an inverted L-shaped side wall The top plate is kept flat without bending; a light source is provided, wherein the light source comprises: a circuit board, wherein a surface abuts against the side plate of the side wall; and a diode chip disposed on the circuit board And the other surface of the circuit board does not contact the top plate of the sidewall; the illumination source is placed into the accommodating space from the gap at an oblique angle so that the circuit board abuts against the sidewall The side panel. The method for manufacturing a backlight module according to claim 10, further comprising bonding the circuit board to the side plate by using a thermal conductive adhesive.