TWI522684B - Panel structure and fabricating method thereof - Google Patents

Description

Panel structure and manufacturing method thereof

The present invention relates to a panel structure and a method of fabricating the same, and more particularly to a panel structure having a particle composite carbon film release layer and a method of fabricating the same.

With the rapid advancement of display technology, displays have evolved from early cathode ray tube (CRT) displays to current flat panel displays (FPDs). Compared with a flat-panel display composed of a rigid substrate (such as a glass substrate), since a flexible substrate (such as a plastic substrate) has characteristics such as flexibility and impact resistance, in recent years, research into the fabrication of an active device on a flexible substrate has been conducted. Flexible display.

In general, flexible displays are made by first attaching a flexible substrate to a glass carrier. Thereafter, the manufacturing process of the display element is performed on the flexible substrate. After the component to be displayed is fabricated to form the display, the flexible display is removed from the glass carrier by disengaging the flexible substrate from the glass carrier. A release method that has been proposed so far includes forming a release layer between a glass carrier and a flexible substrate, wherein the formation of the release layer is, for example, surface modification. However, some display elements The process of the part requires higher temperature process conditions to have better electrical properties, but the conventional release layer (mostly organic materials such as fluorocarbons or hydrocarbons) has poor high temperature tolerance and is not suitable. In high temperature processes, increasing the time or cost required for manufacturing. For example, the release layer of a fluoroaklylene silane (FAS) material has a high cost, and the coverage of the glass surface modification and the reaction time cannot be determined. The release layer of parylene is still subjected to high temperature tempering after deposition to confirm the surface crystallization characteristics, and the process is complicated and the process time is long, and the release is carried out in a subsequent high temperature process (for example, greater than 400 ° C). The organic material on the surface of the layer is prone to breakage and causes problems of outgasing. In addition, the conventional flexible substrate and the glass carrier are both poor electrical conductors. Therefore, when the flexible substrate is released from the separation, the display element on the flexible substrate is easily damaged by static electricity accumulation, and the process yield is lowered. Therefore, how to develop the panel structure of the release layer with good high temperature tolerance and improve the process yield of the panel structure is one of the goals that the developer wants to achieve.

The invention provides a panel structure and a manufacturing method thereof, which are applicable to a high temperature process and can improve the process yield of the panel structure.

The invention provides a panel structure comprising a flexible substrate, a particle composite carbon film release layer and an element layer. The particle composite carbon film release layer is on the first surface of the flexible substrate, wherein the particle composite carbon film release layer comprises a plurality of particles, and the surface of each particle has a carbon film. The component layer is on the second surface of the flexible substrate, wherein the second surface is opposite to the first surface.

The present invention further provides a method of fabricating a panel structure comprising the following steps. A material layer is coated on the support substrate, and the material layer includes a plurality of particles and a carbon oxyhydroxide. A sintering process is performed to carbonize the carbon oxyhydroxide on the surface of the particles to form a particle composite carbon film release layer. A soft substrate is formed on the release layer of the particulate composite carbon film. An element layer is formed on a flexible substrate. A release process is performed to separate the flexible substrate from the support substrate.

Based on the above, since the particle composite carbon film release layer of the present invention includes a plurality of particles, it can be formed not only by wet coating, but also easier to control film thickness and uniformity, so that the process is simple and the process time is simple. Shorter advantages. Furthermore, since the surface of each particle of the particle composite carbon film release layer of the present invention has a carbon film, it is not only resistant to a high temperature process, but also does not require a surface modification step to reduce the cost. Therefore, the granular composite carbon film release layer having a dense structure can prevent the soft substrate from penetrating to the support substrate, thereby reducing the release force (or adhesion). Further, when the conductive particles are used to form the release layer of the particle composite carbon film, the element layer which is damaged by the static buildup of the flexible substrate during the release can be avoided, and the process yield of the panel structure can be improved.

The above described features and advantages of the invention will be apparent from the following description.

100, 100’‧‧‧ panel structure

110‧‧‧Support substrate

110E‧‧‧Edge area

120‧‧‧Material layer

122‧‧‧ granules

122a‧‧‧ surface

124‧‧‧Carbon Hydroxide

126‧‧‧Solvent

130‧‧‧Particle composite carbon film release layer

130’‧‧‧ Section

130a‧‧‧ upper surface

130b‧‧‧ side surface

134‧‧‧ carbon film

140‧‧‧Soft substrate

140a‧‧‧ first surface

140b‧‧‧second surface

150‧‧‧Component layer

160‧‧‧ cutting line

D‧‧‧diameter

R‧‧‧ area

S102, S104, S106, S108, S110‧‧ steps

T, T’‧‧‧ thickness

1 is a flow chart of a method of manufacturing a panel structure according to an embodiment of the invention Figure.

2A to 2F are schematic cross-sectional views showing a method of manufacturing the panel structure of Fig. 1.

3A to 3B are enlarged schematic views of a region R of Figs. 2A to 2B, respectively.

4A-4B are schematic cross-sectional views showing a method of fabricating a panel structure in accordance with other embodiments of the present invention.

1 is a flow chart showing a method of fabricating a panel structure according to an embodiment of the present invention, and FIGS. 2A to 2F are cross-sectional views showing a method of fabricating the panel structure of FIG. 1, and FIGS. 3A to 3B are respectively FIG. 2A to FIG. 2B. An enlarged schematic view of the area R.

Referring to steps S102, 2A, and 3A of FIG. 1 simultaneously, first, the material layer 120 is coated on the support substrate 110. In more detail, the material layer 120 may be formed on the support substrate 110 by wet coating, wherein the material layer 120 may be referred to as a coating liquid. The support substrate 110 may be a substrate having high rigidity, a low expansion coefficient, and a high Young's modulus property. In the present embodiment, the support substrate 110 is, for example, an inorganic substrate, and includes a glass substrate, a quartz substrate, or a germanium substrate. Further, the material layer 120 includes a solvent 126, a plurality of particles 122, and a carbon oxyhydroxide 124.

The solvent 126 includes, for example, water, acetone, ethanol, isopropyl alcohol (IPA), propylene glycol monomethyl ether (PGME), alcohols, ethers, esters, or other suitable solvent, or A mixture of at least two of the above solvents.

The particles 122 are dispersed within the solvent 126 and the particles 122 occupy the material layer 120 The weight percentage can be from 0.1% to 10%. The size of the particles 122, such as the diameter D, is, for example, less than 1 micrometer (μm), preferably greater than 0 nanometers (nm) and less than 100 nanometers (nm). In the present embodiment, the material of the particles 122 is, for example, an inorganic material. For example, the particles 122 include titanium oxide particles, cerium oxide particles, or aluminum oxide particles. However, the present invention is not limited thereto. In other embodiments, the material of the particles 122 is, for example, a conductive material, including metals, alloys, semiconductors, metal oxides, metal nitrides, metal oxynitrides, alloy oxides, alloy nitrides. An alloy oxynitride, a semiconductor oxide, a semiconductor nitride, a semiconductor oxynitride, or other suitable material, or a combination of at least two of the foregoing. For example, the particles 122 include zinc oxide particles, indium tin oxide particles, gold particles, silver particles, platinum particles, or conductive particles. Additionally, the particles 122 have a surface 122a.

The carbon oxyhydroxide 124 is dissolved in the solvent 126, and the carbon oxyhydroxide 124 may be 0.1% to 15% by weight of the material layer 120. The carbon oxyhydroxide 124 includes, for example, polyvinyl alcohol (PVA, (C ₂ H ₄ O) _x ), polyethylene glycol (PEG, C _2n H _4n+2 O _n+1 ), poly Polyethylene oxide (PEO, C _2n H _4n+2 O _n+1 ), polypropylene glycol (PPG, C _3n H _6n+2 O _n+1 ), or other suitable compound, or A combination thereof or a copolymer of at least two of the above compounds. Among them, the molecular weight of polyethylene glycol (PEG) is, for example, 2,000 to 20,000, and the molecular weight of polyoxyethylene (PEO) is, for example, 20,000 to 200,000. The copolymer is, for example, a copolymer of PEG-PPG-PEG having a molecular weight of, for example, about 140,000.

Further, the material layer 120 (ie, the coating liquid) may further include other additives. Example In other words, the material layer 120 may further include a dispersing agent to obtain a more stable coating liquid. The dispersing agent includes a polymer, an organic decane or a surfactant. Types of surfactants include anionic, cationic, nonionic or diionic.

Referring to steps S104, 2B, and 3B of FIG. 1 simultaneously, a sintering process is performed to carbonize the carbon oxyhydroxide 124 of the surface 122a of the particles 122 to form the particle composite carbon film release layer 130.

In more detail, a high-temperature sintering process is performed in an inert gas atmosphere to remove the solvent 126 and carbonize the carbon oxyhydroxide 124 by pyrolysis. The temperature of the sintering process is, for example, 300 ° C to 500 ° C. As a result, the carbon film 134 (that is, the carbonized carbon oxyhydroxide 124) can be formed on the surface 122a of the particle 122, so that the particle composite carbon film release layer 130 formed after high temperature sintering includes the particles 122 and carbon. Membrane 134. In the present embodiment, the carbon film 134 is, for example, completely covering the surface 122a of the particles 122 and the number of layers of the particles 122 is, for example, 5 to 500 layers, but the present invention is not limited thereto. In other embodiments, the carbon film 134 may also be a surface 122a partially covering the particles 122, and the present invention does not particularly limit the number of layers (one or more layers) of the particles 122 as long as the formed particle composite carbon film release layer 130 is sufficient. Dense to avoid penetration of the subsequently formed film layer.

The thickness T of the particle composite carbon film release layer 130 may be 50 nm to 500 nm, and the weight percentage of the carbon atoms (mainly from the carbon oxyhydroxide 124) of the particle composite carbon film release layer 130 may be 1% to 99%. For example, when the particles 122 are titanium oxide particles having a diameter D of 10 nm, the weight percentage of carbon atoms of the particle composite carbon film release layer 130 is preferably 5% to 30%. Furthermore, the granular composite carbon film release layer 130 is covered The cover portion supports the substrate 110 to expose a portion of the edge region 110E of the support substrate 110. Further, the particle composite carbon film release layer 130 has an upper surface 130a and a side surface 130b.

Referring to step S106 and FIG. 2C of FIG. 1 simultaneously, a flexible substrate 140 is formed on the particle composite carbon film release layer 130, wherein the flexible substrate 140 includes a first surface 140a and a second surface 140b disposed opposite to each other. In more detail, the flexible substrate 140 covers the upper surface 130a of the particle composite carbon film release layer 130 and the side surface 130b, and is in contact with the support substrate 110 at the edge region 110E of the support substrate 110. In other words, the particle composite carbon film release layer 130 is located between the support substrate 110 and the flexible substrate 140, and the particle composite carbon film release layer 130 is located on the first surface 140a of the flexible substrate 140. In the present embodiment, the flexible substrate 140 is, for example, an organic substrate, and includes a polyimide substrate or a plastic substrate. The method of forming the flexible substrate 140 is, for example, a coating process. In this embodiment, after the flexible substrate 140 is formed, the baking process may be further included to remove moisture and a solvent, wherein the temperature of the baking process is, for example, 300 ° C to 500 ° C. In addition, in the present embodiment, the particle composite carbon film release layer 130 having a multilayer structure may have a hydrophilic surface (for example, the surface 130a), wherein the hydrophilic surface may be in contact with the flexible substrate 140 to facilitate coating of the flexible substrate 140, carbon The film 134 may be in contact with the support substrate 110 to reduce the release force (or adhesion).

It is worth mentioning that the carbon atoms on the surface of the granular composite carbon film release layer 130 (including the inorganic particles or the conductive particles having the surface 122a having the carbon film 134) are not formed with the functional groups on the surface of the flexible substrate 140 or the support substrate 110. Strong bond hydrogen bonds (or ionic bonds), but only weaker van der Waals due to intermolecular attraction. Furthermore, soft A strongly bonded hydrogen bond is formed between the substrate 140 (for example, a polyimide substrate (organic material)) and the support substrate 110 (for example, a glass substrate (inorganic material)). In this embodiment, the release force between the flexible substrate 140 and the support substrate 110 is greater than the release force between the particle composite carbon film release layer 130 and the support substrate 110, and the particle composite carbon film release layer 130 and the softness The release force between the substrates 140 is greater than the release force between the particle composite carbon film release layer 130 and the support substrate 110. The release force between the particle composite carbon film release layer 130 and the support substrate 110 is, for example, 100 gf or less, preferably 50 gf or less. In the present embodiment, the flexible substrate 140 can be temporarily fixed to the support substrate 110 by covering the granular composite carbon film release layer 130 and contacting the support substrate 110. However, the present invention is not limited thereto. In other embodiments, the release force between the particle composite carbon film release layer 130 and the support substrate 110 may be greater than between the particle composite carbon film release layer 130 and the flexible substrate 140. Release force.

Please refer to step S108 and FIG. 2D of FIG. 1 simultaneously, after that, in soft The element layer 150 is formed on the substrate 140, and the element layer 150 is located on the second surface 140b of the flexible substrate 140. For example, the element layer 150 may be an active driving element including an amorphous germanium thin film transistor, a microcrystalline germanium thin film transistor, an oxide transistor, or a low temperature polycrystalline germanium transistor. In the present embodiment, the peripheral region of the element layer 150 (that is, the region overlapping the edge region 110E of the support substrate 110) is, for example, an ineffective region. For example, the step S108 is performed to form a buffer layer (not shown), a gate layer (not shown), and a gate insulating layer (not shown) on the flexible substrate 140. Illustrated), channel layer (not shown), etch stop layer (not shown), source and drain layers (not shown), protective layer (not shown), pixel electrode layer (not shown) And insurance Steps such as a protective layer (not shown). However, the present invention is not limited thereto. In other embodiments, the element layer 150 may also include a thin film transistor, a color filter, a black matrix, an organic light emitting element, a photoelectric conversion element, or other suitable element, or the foregoing element. The combination. In the present embodiment, in the process of forming the component layer 150, the baking process may be further included to obtain better electrical properties, wherein the temperature of the baking process is, for example, 300 ° C to 500 ° C.

Referring to step S110 and FIG. 2D to FIG. 2F of FIG. 1 simultaneously, a release process is performed to separate the flexible substrate 140 from the support substrate 110. In more detail, the release process includes a dicing process along the dicing line 160 in FIG. 2D to simultaneously remove the flexible substrate 140 at the edge region 110E and the peripheral region (not labeled) of the component layer 150, thereby enabling the flexible substrate 140. Separated from the support substrate 110. In the present embodiment, the dicing line 160 is, for example, an inner region (not labeled) corresponding to the particle composite carbon film release layer 130, but the invention is not limited thereto. In another embodiment, the cutting line 160 may also be a side surface 130b corresponding to the particle composite carbon film release layer 130. In general, although this cutting process is simultaneously cut to the peripheral area of the element layer 150, since these peripheral areas are ineffective areas, the functions provided by the element layer 150 are not affected. The cutting procedure is for example laser cutting or other suitable cutting method. Furthermore, as shown in FIG. 2E, the particle-composite carbon film release layer 130 is permeable to the interface between the particle composite carbon film release layer 130 and the support substrate 110 by a blade, air knife, wire or other suitable means. Separated from the support substrate 110.

In this way, after the flexible substrate 140 and the particle composite carbon film release layer 130 are separated from the support substrate 110, the fabrication of the panel structure 100 is completed. As shown in Figure 2F As shown, the panel structure 100 includes a flexible substrate 140, a particulate composite carbon film release layer 130, and an element layer 150. The particle composite carbon film release layer 130 is disposed on the first surface 140a of the flexible substrate 140, wherein the particle composite carbon film release layer 130 (shown in FIG. 3B) includes a plurality of particles 122, and the surface 122a of each of the particles 122 has Carbon film 134. The component layer 150 is on the second surface 140b of the flexible substrate 140, wherein the second surface 140b is opposite to the first surface 140a.

It is worth mentioning that when the particles 122 of conductive material (such as conductive particles) When the particle composite carbon film release layer 130 is formed, not only the conductivity of the particle composite carbon film release layer 130 can be improved (especially when the carbon film 134 only partially covers the particles 122), but also the particle composite carbon during release. The film release layer 130 adheres to the flexible substrate 140 as a conductive layer to prevent the flexible substrate 140 from being damaged by the electrostatic accumulation of the device layer 150 when it is released, thereby improving the process yield of the panel structure 100.

The above embodiment of FIG. 2E to FIG. 2F is a release layer from a granular composite carbon film. The interface separation between the 130 and the support substrate 110 (that is, the particle composite carbon film release layer 130 is completely separated from the support substrate 110) is taken as an example, but the invention is not limited thereto. In other embodiments, it may be separated from the particle composite carbon film release layer 130 (that is, a portion of the particle composite carbon film release layer 130 is separated from the support substrate 110 while another portion remains attached to the support substrate 110. Or, the interface between the flexible substrate 140 and the particle composite carbon film release layer 130 is separated (that is, the flexible substrate 140 is completely separated from the particle composite carbon film release layer 130), and the present invention does not particularly limit the separated interface. .

For example, please refer to FIG. 4A to FIG. 4B simultaneously, through the interface between any two layers of particles 122 formed by the particles 122 in the particle composite carbon film release layer 130. A portion of the particulate composite carbon film release layer 130 is separated from the support substrate 110 by a knife, air knife, wire or other suitable means. Therefore, when the release process is performed, a part of the particle composite carbon film release layer 130 is separated from the support substrate 110 (that is, a part of the particle composite carbon film release layer 130 adheres to the flexible substrate 140), and A portion of the particulate composite carbon film release layer 130 will still adhere to the support substrate 110. Here, the portion 130' of the particle composite carbon film release layer 130 attached to the flexible substrate 140 has a thickness T', and the thickness T' is, for example, smaller than the thickness T. In other words, the present invention does not particularly limit the thickness T' of the portion 130' of the particle composite carbon film release layer 130 attached to the flexible substrate 140, wherein the thickness 0 < T' ≦ T. In this manner, after the flexible substrate 140 and the partial particle composite carbon film release layer 130 are separated from the support substrate 110, the fabrication of the panel structure 100' is completed. As shown in FIG. 4B, the panel structure 100' includes a flexible substrate 140, a portion 130' of the particulate composite carbon film release layer 130, and an element layer 150. A portion 130' of the particle composite carbon film release layer 130 is disposed on the first surface 140a of the flexible substrate 140, wherein the portion 130' of the particle composite carbon film release layer 130 (shown in FIG. 3B) includes a plurality of particles 122, and The surface 122a of each particle 122 has a carbon film 134. The component layer 150 is on the second surface 140b of the flexible substrate 140, wherein the second surface 140b is opposite to the first surface 140a.

In order to prove that the design of the particle composite carbon film release layer 130 of the present invention can indeed improve the high temperature tolerance of the release layer, it is verified by an experiment. The materials of the particles 122 used in Experimental Examples 1 to 3 of this experiment were respectively titanium oxide (TiO ₂ ), cerium oxide (SiO ₂ ), and aluminum oxide (Al ₂ O ₃ ). Further, in this experiment, the carbon oxyhydroxide 124 is a copolymer of PEG-PPG-PEG (molecular weight of about 140,000), and the weight ratio of the carbon oxyhydroxide 124 to the particles 122 (carbon oxyhydroxide 124 / granule 122) It is 1.2/1. Under the condition that the weight ratio of the carbon oxyhydroxide 124 to the particles 122 is fixed at 1.2/1, as the solid content (%) of the particles 122 increases, the thickness T of the formed granular composite carbon film release layer 130 is also increase. Further, the highest baking temperature used to form the particle composite carbon film release layer 130 is 350 ° C, the highest baking temperature used to form the flexible substrate 140 is 450 ° C, and the highest baking temperature used after forming the element layer 150 is 430 ° C.

From the experimental results in Table 1, the soft substrate at the highest temperature of 450 ° C is known. After the 140 baking step and the baking step of the element layer 150 having a maximum temperature of 430 ° C, the release forces of the experimental examples 1 to 3 were all below 100 gf, even below 50 gf. Since the experimental examples 1 to 3 can be effectively released after being subjected to a high temperature process (for example, 450 ° C) (for example, the release force is 50 gf or less), the design of the particle composite carbon film release layer 130 of the present invention can be improved. High temperature tolerance of the release layer. Further, as the thickness T of the particle composite carbon film release layer 130 was increased (or the solid content (%) of the particles 122 was increased), the release forces of Experimental Examples 2 to 3 were all remarkably reduced. It can be seen that increasing the thickness T of the particle composite carbon film release layer 130 can prevent the subsequently formed flexible substrate 140 from penetrating to the support. Substrate 110. That is to say, the thicker composite carbon film release layer 130 can block and prevent the soft substrate 140 from forming a stronger bonding hydrogen bond with the support substrate 110, thereby reducing the release force. Further, when the thickness T of the particle composite carbon film release layer 130 is sufficiently thick, the experimental examples 1 to 3 can be effectively released. For example, when the solid content of the particles 122 is 2.7%, the release forces of the experimental examples 1 to 3 are all reduced to about 10 gf.

In summary, in the panel structure of the present invention and the method of manufacturing the same, the particle composite carbon film release layer of the panel structure includes a plurality of particles, and the surface of each particle has a carbon film. Since the particle composite carbon film release layer of the present invention comprises a plurality of particles (for example, nano particles), it can be formed not only by wet coating but also by easier control of film thickness (layer or layers) and uniformity thereof. Therefore, it has the advantages of simple process and short process time. Furthermore, since the surface of each particle of the particle composite carbon film release layer of the present invention has a carbon film, it is not only resistant to a high temperature process (because the carbon film has good high temperature properties under an inert gas), and does not need to be performed. Surface modification steps to reduce costs. Therefore, the granular composite carbon film release layer having a dense structure can prevent the soft substrate from penetrating to the support substrate (that is, the formation of a strong bonding hydrogen bond can be avoided), thereby reducing the release force (or adhesion). Further, when the conductive particles are used to form the release layer of the particle composite carbon film, the element layer which is damaged by the static buildup of the flexible substrate during the release can be avoided, and the process yield of the panel structure can be improved.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

S102, S104, S106, S108, S110‧‧ steps

Claims (21)

A panel structure comprising: a flexible substrate; a particle composite carbon film release layer on the first surface of the flexible substrate, wherein the particle composite carbon film release layer comprises a plurality of particles, the particles are made of inorganic And a material layer having a carbon film on the surface; and an element layer on the second surface of the flexible substrate, wherein the second surface is opposite to the first surface. The panel structure of claim 1, further comprising a support substrate, wherein the particle composite carbon film release layer is located between the support substrate and the flexible substrate. The panel structure of claim 2, wherein the flexible substrate covers an upper surface and a side surface of the particle composite carbon film release layer and is in contact with the support substrate at an edge region of the support substrate. The panel structure according to claim 1, wherein the particle composite carbon film release layer has a thickness of 50 nm to 500 nm. The panel structure of claim 1, wherein the particles comprise titanium oxide particles, cerium oxide particles or aluminum oxide particles. The panel structure of claim 1, wherein the particles have a size greater than 0 nanometers (nm) and less than 100 nanometers (nm). The panel structure according to claim 1, wherein the weight percentage of carbon atoms of the particle composite carbon film release layer is 5% to 30%. The panel structure according to claim 1, wherein the materials of the particles include metals, alloys, semiconductors, metal oxides, metal nitrides, metal oxynitrides, alloy oxides, alloy nitrides, and alloy oxynitride. A combination of at least two of a material, a semiconductor oxide, a semiconductor nitride, a semiconductor oxynitride, or the above materials. The panel structure of claim 8, wherein the particles comprise zinc oxide particles, indium tin oxide particles, gold particles, silver particles, platinum particles or other conductive particles. The panel structure according to claim 1, further comprising a thin film transistor, a color filter, a black matrix, an organic light emitting element, a photoelectric conversion element or a combination of at least two of the foregoing. A method for manufacturing a panel structure, comprising: coating a material layer on a support substrate, the material layer comprising a plurality of particles and a carbon oxyhydroxide; performing a sintering process to cause carbon oxyhydroxide on the surface of the particles Producing carbonization to form a particle composite carbon film release layer; forming a soft substrate on the particle composite carbon film release layer; forming a component layer on the flexible substrate; and performing a release process to make the softness The substrate is separated from the support substrate, wherein at least a portion of the particle composite carbon film release layer is attached to the flexible substrate. The method for manufacturing a panel structure according to claim 11, wherein the material layer includes a solvent, the particles dispersed in the solvent, and the carbon Hydroxide. The method for manufacturing a panel structure according to claim 12, wherein the particles account for 0.1% to 10% by weight of the material layer, and the carbon oxyhydroxide accounts for 0.1% by weight of the material layer. ~15%. The method for manufacturing a panel structure according to claim 11, wherein the sintering procedure has a temperature of 300 ° C to 500 ° C. The method for manufacturing a panel structure according to claim 11, wherein the flexible substrate covers an upper surface and a side surface of the particle composite carbon film release layer and is in an edge region of the support substrate and the support substrate Contacting, and the release process includes performing a cutting process to remove the flexible substrate located in the edge region, thereby separating the flexible substrate from the support substrate. The method for manufacturing a panel structure according to claim 11, wherein the particle composite carbon film release layer has a thickness of 50 nm to 500 nm. The method of fabricating a panel structure according to claim 11, wherein the particles have a size greater than 0 nanometers (nm) and less than 100 nanometers (nm). The method for manufacturing a panel structure according to claim 11, wherein the materials of the particles include inorganic materials, metals, alloys, semiconductors, metal oxides, metal nitrides, metal oxynitrides, alloy oxides, and alloys. A nitride, an alloy oxynitride, a semiconductor oxide, a semiconductor nitride, a semiconductor oxynitride or a combination of at least two of the foregoing. The method for manufacturing a panel structure according to claim 18, wherein the particles comprise titanium oxide particles, cerium oxide particles, aluminum oxide particles, and zinc oxide. Granules, indium tin oxide particles, gold particles, silver particles, platinum particles or other conductive particles. The method for producing a panel structure according to claim 11, wherein the carbon oxyhydroxide comprises polyvinyl alcohol, polyethylene glycol, polypropylene glycol, and Its copolymer or a combination thereof. The method for manufacturing a panel structure according to claim 11, further comprising forming a thin film transistor, a color filter, a black matrix, an organic light emitting element, a photoelectric conversion element or the foregoing on the flexible substrate. A combination of at least two components.