TWI522641B - Positive radiation-sensitive composition for discharging-nozzle type coating method, interlayer insulation film for display element and method for forming the same - Google Patents

Description

Positive-type radiation-emitting composition for nozzle-jet coating method, interlayer insulating film for display element, and method for forming same

The present invention relates to a positive-type radiation-sensitive composition for a discharge nozzle coating method, an interlayer insulating film for a display element formed of the composition, and a method for forming the same, which is suitable as a liquid crystal display element. A material for forming an interlayer insulating film for a display element of a display element such as an organic EL display element.

In the display element, an interlayer insulating film for a display element is generally provided for the purpose of insulating between wirings arranged in a layer. As a material for forming the interlayer insulating film for a display element, a positive-type radiation-sensitive composition is widely used because the number of steps for obtaining a necessary pattern shape is small, and the obtained interlayer insulating film for display elements requires high flatness.

A positive-type radiation-sensitive resin composition containing a acetal structure and/or a ketal structure and an epoxy group-containing resin and an acid generation is proposed in Japanese Laid-Open Patent Publication No. 2004-264623. Agent. However, this positive-type radiation-sensitive resin composition is insufficient in radiation sensitivity and cannot be satisfied as a material for forming an interlayer insulating film for a display element.

On the other hand, JP-A-2002-131896 discloses a spin coating method as a method of applying a radiation-sensitive composition on a small substrate. According to this spin coating method, it is possible to obtain good coating uniformity by applying a radiation-sensitive composition to the center of the substrate and then applying a coating method to rotate the substrate. However, when a large-sized substrate is coated by the spin coating method, the amount of the radiation-induced radiation-induced linear composition that is removed by the rotation increases, and the substrate may be broken due to high-speed rotation, and it is necessary to ensure troubles such as tact time. Moreover, when it is used for a larger substrate, in order to obtain the acceleration required for the rotation, a motor that is specially ordered is required, which is disadvantageous in terms of manufacturing cost.

Therefore, as a coating method instead of the spin coating method, a discharge nozzle type coating method in which a radiation-sensitive composition is discharged from a nozzle and applied to a substrate is used. The discharge nozzle coating method is a method of applying a coating film by scanning a coating nozzle in a predetermined direction and forming a coating film on a substrate. Compared with the spin coating method, the amount of the radiation-sensitive composition required for coating can be reduced, and coating is also required. The shortening of time is advantageous in terms of manufacturing cost. However, when the conventional radiation-sensitive composition is applied by the discharge nozzle coating method, coating unevenness occurs, and the high flatness required to realize the characteristics of the interlayer insulating film for display elements is an obstacle. In addition, although the radiation-sensitive linear composition described in the above publication may be applied by a method other than the spin coating method, for example, the viscosity and solid content concentration are not specifically disclosed. In the examples, the solvent or the like was not applied by a discharge nozzle coating method or the like.

In view of such a situation, it is desired to develop a positive-type radiation-sensitive composition for a discharge nozzle type coating method which has high radiation sensitivity and can form a display having high flatness (film thickness uniformity) without coating unevenness. The interlayer insulating film for the element is coated at a high speed.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] JP-A-2004-264623

[Patent Document 2] JP-A-2002-131896

[Patent Document 3] JP-A-2009-98673

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a positive-type radiation-sensitive composition for a discharge nozzle coating method, an interlayer insulating film for a display element, and a method for forming the same, which have high radiation. The sensitivities and the interlayer insulating film for display elements having high flatness (thickness uniformity) without coating unevenness can be formed, and can be applied at a high speed.

The present invention has been made in order to solve the above problems, and is a positive-type radiation-sensitive composition for a discharge nozzle coating method, which comprises:

[A] a polymer having a structural unit (I) having a group represented by the following formula (1) and a structural unit containing an epoxy group in the same or different polymer molecules (hereinafter also referred to as "[A] polymer"),

[B] at least one compound selected from the group consisting of an oxime sulfonate compound and an onium salt compound (hereinafter also referred to as "[B] compound"), and

[C] an organic solvent having a solid content concentration of 10% by mass or more and 30% by mass or less, a viscosity at 25° C. of 2.0 mPa·s or more and 12 mPa·s or less, and at least (C1) as the [C] organic solvent. An organic solvent having a vapor pressure at 20 ° C of 0.1 mmHg or more and less than 1 mmHg;

(In the formula (1), R ¹ and R ² each independently represent a hydrogen atom, an alkyl group, a cycloalkyl group or an aryl group; however, part or all of the hydrogen atom possessed by the above alkyl group, cycloalkyl group or aryl group And may be substituted; in the case where R ¹ and R ^{2 are} simultaneously a hydrogen atom; R ³ is an alkyl group, a cycloalkyl group, an arylalkyl group, an aryl group or a group represented by -M(R ^3m ) ₃ , Some or all of the hydrogen atoms possessed by such groups may be substituted; M is Si, Ge or Sn; R ^3m is an alkyl group; however, R ¹ and R ³ may be attached, and these may be bonded to the carbon The atoms together form a cyclic ether).

This composition has high radiation sensitivity at the time of exposure because it contains the above [A] polymer, [B] compound, and [C] organic solvent. In addition, by setting the solid content concentration of the composition to the above-described specific range, it is possible to effectively suppress the occurrence of coating unevenness, and it is possible to maintain the film thickness uniformity while maintaining the viscosity of the composition within the above specific range. Even if coating unevenness occurs, the viscosity which is automatically uniform can be achieved in a well-balanced manner, and high-speed coatability can be achieved. Further, by using the [C] organic solvent having the vapor pressure in the above specific range, even if the discharge nozzle coating method is employed, coating unevenness can be prevented and high-speed coating can be prevented.

In the composition, the [C] organic solvent further contains (C2) an organic solvent having a vapor pressure at 20 ° C of 1 mmHg or more and 20 mmHg or less, (C2) an organic solvent content, and (C1) an organic solvent and ( C2) The total amount of the organic solvent is preferably 10% by mass or more and 90% by mass or less, and the content of the (C2) organic solvent is more than the total amount of the (C1) organic solvent and the (C2) organic solvent. It is preferably 10% by mass or more and 50% by mass or less. The mass ratio of the (C1) organic solvent having a low vapor pressure to the (C2) organic solvent having a high vapor pressure is within the above specific range, and in particular, in the coating film after prebaking, the amount of residual solvent is optimized, and the coating film is applied. The fluidity is balanced, and as a result, uneven coating (unevenness of the tendons, unevenness of the needle marks, unevenness of the mist, etc.) can be suppressed, and the film thickness uniformity can be further improved. In addition, by optimizing the amount of residual solvent, the amount of acid generated is highly balanced with the acid-dissociable group, and the radiation sensitivity tends to be changed.

The composition further contains [D] at least one surfactant selected from the group consisting of a fluorine-based surfactant or a polysiloxane surfactant (hereinafter also referred to as "[D] surfactant]" The content of the [D] surfactant is preferably 0.01 parts by mass or more and 2 parts by mass or less based on 100 parts by mass of the [A] polymer. Since the composition further contains the [D] surfactant, the surface smoothness of the coating film can be improved, and as a result, the film thickness uniformity of the interlayer insulating film for a display element can be further improved. Further, by setting the content of the [D] surfactant to the above specific range, the surface smoothness of the coating film can be further improved.

In the composition, it is preferred to further contain a [E] polyfunctional (meth) acrylate compound. Since the composition further contains the [E] polyfunctional (meth) acrylate compound, the transmittance and heat-resistant transparency of the interlayer insulating film for a display element can be improved.

Preferably, the composition further contains [F] an antioxidant. Since the composition further contains [F] an antioxidant, the transmittance and heat-resistant transparency of the interlayer insulating film for a display element can be improved.

The composition preferably further contains a [G] epoxy compound. Since the composition further contains a [G] epoxy compound, the transmittance and heat-resistant transparency of the interlayer insulating film for a display element can be improved.

The (C1) organic solvent is preferably selected from the group consisting of diethylene glycol ethyl methyl ether, diethylene glycol diethyl ether, dipropylene glycol dimethyl ether, benzyl alcohol, and dipropylene glycol monomethyl ether. At least one organic solvent, the (C2) organic solvent is preferably selected from the group consisting of diethylene glycol dimethyl ether, ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol. At least one of a group consisting of monopropyl ether acetate, propylene glycol monomethyl ether acetate, cyclohexanone, n-butyl acetate, methyl isobutyl ketone, and methyl 3-methoxypropionate Organic solvents. The (C1) organic solvent and the (C2) organic solvent are selected from the above specific compounds to further improve the film thickness uniformity.

In the present invention, an interlayer insulating film for a display element formed of the composition is also suitably contained.

The method for forming an interlayer insulating film for a display element of the present invention has:

(1) a step of forming a coating film by applying the composition onto a substrate while moving the discharge nozzle relative to the substrate.

(2) a step of irradiating at least a part of the coating film formed as described above,

(3) a step of developing a coating film irradiated with the above radiation, and

(4) A step of heating the above-described developed coating film.

According to this formation method, it is possible to form a cured film having excellent film thickness uniformity by coating at a high speed and having excellent radiation sensitivity, and forming a pattern by radiation-sensitive exposure, illumination, and heating. An interlayer insulating film for a display element having a fine and delicate pattern can be easily formed. In addition, the interlayer insulating film for a display element thus formed has high flatness without coating unevenness, and is applicable to display elements such as liquid crystal display elements and organic EL display elements.

In addition, the "discharge nozzle type coating method" as used in the present specification means a method of applying the composition to the object to be coated by a nozzle, and for example, a method in which a plurality of nozzle holes are arranged in a row is used. A nozzle for discharging the discharge, a method of applying the composition, a nozzle having a slit-shaped discharge port, a method of applying the composition, and the like, and coating the composition on the substrate, and then rotating the substrate to adjust the film thickness. The concept of operation. The concept of the [A] polymer as referred to in the present specification also includes a structural unit (I) in one polymer molecule, and an epoxy group-containing structural unit in a polymer molecule different from the one polymer molecule. . The concept of "radiation" of the "radiation-sensitive linear resin composition" as used in the present specification includes visible light rays, ultraviolet rays, far ultraviolet rays, X-rays, charged particle rays, and the like.

As described above, the positive-type radiation-sensitive composition for the discharge nozzle coating method of the present invention has high radiation sensitivity, and can form interlayers for display elements having high flatness (thickness uniformity) without coating unevenness. The insulating film is coated at a high speed. Therefore, the composition is suitable as a material for forming an interlayer insulating film for a display element such as a liquid crystal display element or an organic EL display element.

[Formation of the Invention]

The positive-acting radiation-sensitive composition for the discharge nozzle coating method of the present invention contains the [A] polymer, the [B] compound, and the [C] organic solvent. Further, the composition may contain a [D] surfactant as a suitable component, [E] a polyfunctional (meth) acrylate compound, [F] an antioxidant, and a [G] epoxy compound. Further, other optional components may be contained as long as the effects of the present invention are not impaired. Hereinafter, each component will be described in detail.

<[A]polymer>

The [A] polymer has a structural unit (I) and an epoxy group-containing structural unit in the same or different polymer molecules, and may have other structural units as needed. The aspect of the [A] polymer having the structural unit (I) and the epoxy group-containing structural unit is not particularly limited, and examples thereof include:

(i) a case where both of the structural unit (I) and the epoxy group-containing structural unit have the same polymer molecule in the [A] polymer;

(ii) having a structural unit (I) in one polymer molecule, an epoxy group-containing structural unit in a polymer molecule different therefrom, and two polymer molecules in the [A] polymer;

(iii) having both a structural unit (I) and an epoxy group-containing structural unit in one polymer molecule, having a structural unit (I) in a polymer molecule different therefrom, and a polymer different from the above a structural unit having an epoxy group in a molecule, and three polymer molecules are present in the [A] polymer;

(iv) In the case of the polymer molecules specified in (i) to (iii), the [A] polymer further contains one or more polymer molecules.

[Structural unit (I)]

In the structural unit (I), since the group represented by the above formula (1) exists in the form of a group (acid dissociable group) which dissociates in the presence of an acid to generate a polar group, irradiation by radiation is performed. On the other hand, the acid produced by the [B] compound causes dissociation, and as a result, the alkali-insoluble polymer [A] becomes alkali-soluble. The above-mentioned acid-dissociable group has a relatively stable acetal structure or ketal structure for the base, which can be Dissociated by the action of acid.

In the above formula (1), R ¹ and R ² each independently represent a hydrogen atom, an alkyl group, a cycloalkyl group or an aryl group. However, some or all of the hydrogen atoms of the above alkyl group, cycloalkyl group and aryl group may be substituted. Further, there is no case where R ¹ and R ^{2 are} simultaneously a hydrogen atom. R ³ is an alkyl group, a cycloalkyl group, an aralkyl group, an aryl group or a group represented by -M(R ^3m ) ₃ . However, some or all of the hydrogen atoms possessed by such groups may be substituted. M is Si, Ge or Sn. R ^3m is an alkyl group. However, R ¹ and R ³ may be attached, and these may form a cyclic ether together with the carbon atom to which they are attached.

The alkyl group represented by the above R ¹ and R ^{2 is} preferably a linear or branched alkyl group having 1 to 30 carbon atoms. Further, the alkyl group may have an oxygen atom, a sulfur atom or a nitrogen atom in the alkyl chain. Examples of the linear or branched alkyl group having 1 to 30 carbon atoms include a methyl group, an ethyl group, a n-propyl group, a n-butyl group, a n-pentyl group, a n-hexyl group, an n-octyl group, and a positive ten. a branched alkyl group such as a dibasic group, an n-tetradecyl group or an n-octadecyl group, a branched chain such as an isopropyl group, an isobutyl group, a tert-butyl group, a neopentyl group, a 2-hexyl group or a 3-hexyl group. Alkyl and the like.

The cycloalkyl group represented by the above R ¹ and R ^{2 is} preferably a cycloalkyl group having 3 to 20 carbon atoms. Further, the cycloalkyl group having 3 to 20 carbon atoms may be a polycyclic ring and may have an oxygen atom in the ring. Examples of the cycloalkyl group having 3 to 20 carbon atoms include a cyclopropyl group, a cyclopentyl group, a cyclohexyl group, a cycloheptyl group, a cyclooctyl group, a borneol group, a norbornyl group, and an adamantyl group.

The aryl group represented by the above R ¹ and R ^{2 is} preferably an aryl group having 6 to 14 carbon atoms. The aryl group having 6 to 14 carbon atoms may be a single ring or a structure in which a single ring is bonded, or may be a condensed ring. Examples of the aryl group having 6 to 14 carbon atoms include a phenyl group and a naphthyl group.

Examples of the substituent of the substitutable alkyl group, the cycloalkyl group and the aryl group represented by the above R ¹ and R ² include a halogen atom, a hydroxyl group, a nitro group, a cyano group, a carboxyl group, a carbonyl group, and a cycloalkyl group (for example). For example, cyclopropyl, cyclopentyl, cyclohexyl, cycloheptyl, cyclooctyl, borneol, norbornyl, adamantyl, etc.), aryl (eg phenyl, naphthyl, etc.), alkoxy (eg eg a methoxy group such as a methoxy group having 1 to 20 carbon atoms such as a methoxy group, an ethoxy group, a propoxy group, a n-butoxy group, a pentyloxy group, a hexyloxy group, a heptyloxy group or an octyloxy group; a fluorenyl group having 2 to 20 carbon atoms, such as an ethyl fluorenyl group, a propyl fluorenyl group, a butyl sulfonyl group or an isobutyl fluorenyl group, or an anthraceneoxy group (for example, an ethoxy group, a propyloxy group, a butoxy group, a third butyl group). An alkoxycarbonyl group having a carbon number of 2 to 10, such as a methoxycarbonyl group, an ethoxycarbonyl group or a propyloxycarbonyl group; , haloalkyl (such as methyl, ethyl, n-propyl, n-butyl, n-pentyl, n-hexyl, n-octyl, n-dodecyl, n-tetradecyl, n-octadecyl, etc. Alkyl, isopropyl, isobutyl, tert-butyl, new An alkyl group such as a branched alkyl group such as a pentyl group, a 2-hexyl group or a 3-hexyl group; a cycloalkane such as a perfluoromethyl group, a perfluoroethyl group, a perfluoropropyl group, a fluorocyclopropyl group or a fluorocyclobutyl group; a group in which a part or all of a hydrogen atom is substituted by a halogen atom or the like).

As an example of the alkyl group, the cycloalkyl group and the aryl group represented by the above R ³ , for example, the groups exemplified above for R ¹ and R ² can be used. The aralkyl group represented by the above R ³ may, for example, be an aralkyl group having 7 to 20 carbon atoms such as a benzyl group, a phenethyl group, a naphthylmethyl group or a naphthylethyl group. As -M (R ^3m) represented by the above R ^{₃ 3,} for example, include alkyl trimethyl silicon, trimethyl germyl and the like. As aralkyl or -M (R ^3m) represented by the above substituent group R ³ ₃ may be employed the above-described R ¹ and R substituents exemplified ^2.

As the cyclic ether to which R ¹ and R ³ are bondable and which may be formed together with the carbon atom to be bonded, for example, 2-oxetanyl group, 2-tetrahydrofuranyl group, 2-tetrahydropyran is exemplified. Base, 2-two Alkyl and the like.

The structural unit (I) has a functional group capable of having an acetal structure or a ketal structure by being bonded to another carbon atom, whereby the acetal structure or the ketal structure can be possessed.

The above-mentioned functional group capable of having an acetal structure by being bonded to another carbon atom may, for example, be 1-methoxyethoxy, 1-ethoxyethoxy or 1-n-propoxyB. Oxyl, 1-isopropoxyethoxy, 1-n-butoxyethoxy, 1-isobutoxyethoxy, 1-second butoxyethoxy, 1-tert-butoxy Ethyloxy, 1-cyclopentyloxyethoxy, 1-cyclohexyloxyethoxy, 1-norborneoxyethoxy, 1-borneooxyethoxy, 1-phenoxy Oxyl, 1-(1-naphthalenyloxy)ethoxy, 1-benzyloxyethoxy, 1-phenylethyloxyethoxy, (cyclohexyl)(methoxy)methoxy, Cyclohexyl)(ethoxy)methoxy, (cyclohexyl)(n-propoxy)methoxy, (cyclohexyl)(isopropoxy)methoxy, (cyclohexyl)(cyclohexyloxy) Methoxy, (cyclohexyl)(phenoxy)methoxy, (cyclohexyl)(benzyloxy)methoxy, (phenyl)(methoxy)methoxy, (phenyl)(ethoxy) Methoxy, (phenyl) (n-propoxy) methoxy, (phenyl) (isopropoxy) methoxy, (phenyl) (cyclohexyloxy) methoxy, (benzene (phenoxy)methoxy, (phenyl)(benzyloxy)methoxy, (methoxy)methoxy, (benzyl)(ethoxy)methoxy, (benzyl)(n-propoxy)methoxy, (benzyl)(isopropoxy)methoxy , (benzyl)(cyclohexyloxy)methoxy, (benzyl)(phenoxy)methoxy, (benzyl)(benzyloxy)methoxy, 2-tetrahydrofuranyloxy, 2- Tetrahydropyranyloxy, 1-trimethyldecyloxyethoxy, 1-trimethylmethylindenyloxyethoxy, and the like. Among these, 1-ethoxyethoxy, 1-cyclohexyloxyethoxy, 2-tetrahydropyranyloxy, 1-n-propoxyethoxy, 1-positive is preferred. Butoxyethoxy, 2-tetrahydropyranyloxy.

As the functional group having a ketal structure by being bonded to another carbon atom, for example, 1-methyl-1-methoxyethoxy group, 1-methyl-1-ethoxy group B can be mentioned. Oxyl, 1-methyl-1-n-propoxyethoxy, 1-methyl-1-isopropoxyethoxy, 1-methyl-1-n-butoxyethoxy, 1- Methyl-1-isobutoxyethoxy, 1-methyl-1-butoxyethoxy, 1-methyl-1-butoxyethoxy, 1-methyl- 1-cyclopentyloxyethoxy, 1-methyl-1-cyclohexyloxyethoxy, 1-methyl-1-norbornyloxyethoxy, 1-methyl-1-borneoyloxy Ethoxy, 1-methyl-1-phenoxyethoxy, 1-methyl-1-(1-naphthalenyloxy)ethoxy, 1-methyl-1-benzyloxyethoxy, 1-methyl-1-phenylethyloxyethoxy, 1-ethyl-1-methoxyethoxy, 1-ethyl-1-ethoxyethoxy, 1-ethyl-1 - n-propoxyethoxy, 1-ethyl-1-isopropoxyethoxy, 1-ethyl-1-n-butoxyethoxy, 1-ethyl-1-isobutoxy Ethoxy, 1-ethyl-1-butoxyethoxy, 1-ethyl-1-t-butoxyethoxy, 1-ethyl-1-cyclopentyloxyethoxy 1-ethyl-1-ring Oxyethoxyethoxy, 1-ethyl-1-norbornyloxyethoxy, 1-ethyl-1-borneooxyethoxy, 1-ethyl-1-phenoxyethoxy, 1 -ethyl-1-(1-naphthalenyloxy)ethoxy, 1-ethyl-1-benzyloxyethoxy, 1-ethyl-1-phenylethyloxyethoxy, 1-ring Hexyl-1-methoxyethoxy, 1-cyclohexyl-1-ethoxyethoxy, 1-cyclohexyl-1-n-propoxyethoxy, 1-cyclohexyl-1-isopropoxy Ethyloxy, 1-cyclohexyl-1-cyclohexyloxyethoxy, 1-cyclohexyl-1-phenoxyethoxy, 1-cyclohexyl-1-benzyloxyethoxy, 1- Phenyl-1-methoxyethoxy, 1-phenyl-1-ethoxyethoxy, 1-phenyl-1-n-propoxyethoxy, 1-phenyl-1-isopropyl Oxyethoxy, 1-phenyl-1-cyclohexyloxyethoxy, 1-phenyl-1-phenoxyethoxy, 1-phenyl-1-benzyloxyethoxy, 1 -benzyl-1-methoxyethoxy, 1-benzyl-1-ethoxyethoxy, 1-benzyl-1-n-propoxyethoxy, 1-benzyl-1-iso Propoxyethoxy, 1-benzyl-1-cyclohexyloxyethoxy, 1-benzyl-1-phenoxyethoxy, 1-benzyl-1-benzyloxyethoxy, 2-(2-methyl-tetrahydrofuranyl)oxy, 2-(2-methyl- Tetrahydropyranyl) oxy, 1-methoxy - cyclopentyloxy, 1-methoxy - cyclohexyloxy and the like. Among these, 1-methyl-1-methoxyethoxy and 1-methyl-1-cyclohexyloxyethoxy are preferred.

The structural unit (I) having an acetal structure or a ketal structure, for example, a structural unit represented by the following formulas (1-1) to (1-3).

In the above formulae (1-1) to (1-3), R ¹ , R ² and R ³ are the same as the above formula (1). In the above formulae (1-1) and (1-3), R' is a hydrogen atom or a methyl group.

Examples of the monomer to which the structural unit represented by the above formulas (1-1) to (1-3) (hereinafter also referred to as "the monomer having an acetal structure") are given, for example, (meth)acrylic acid 1 - alkoxyalkyl ester, (meth) acrylate 1-(cycloalkoxy) alkyl ester, 1-(haloalkoxy)alkyl (meth) acrylate, 1-(aralkyl) (meth) acrylate a (meth) acrylate such as an oxy)alkyl ester or a tetrahydropyranyl (meth) acrylate-based acetal-containing monomer; 2,3-di(1-(trialkylsulfonyloxy)) Alkoxy)carbonyl)-5-norbornene, 2,3-bis(1-(trialkylcarbinyloxy)alkoxy)carbonyl)-5-norbornene, 2,3-di (1-alkoxyalkoxycarbonyl)-5-norbornene, 2,3-bis(1-(cycloalkoxy)alkoxycarbonyl)-5-norbornene, 2,3-di(1- (aralkyloxy)alkoxycarbonyl)-5-norbornene and the like norbornene-based acetal-containing monomer; 1-alkoxyalkoxystyrene, 1-(haloalkoxy)alkane A styrene-based acetal-containing monomer such as oxystyrene, 1-(aralkyloxy)alkoxystyrene or tetrahydropyranyloxystyrene.

More specific examples of the (meth)acrylate-based acetal-containing monomer include 1-ethoxyethyl methacrylate, 1-methoxyethyl methacrylate, and methacrylic acid. 1-n-butoxyethyl ester, 1-isobutoxyethyl methacrylate, 1-t-butoxyethyl methacrylate, 1-(2-chloroethoxy)ethyl methacrylate, 1-(2-ethylhexyloxy)ethyl methacrylate, 1-n-propoxyethyl methacrylate, 1-cyclohexyloxyethyl methacrylate, 1-(2-ring) methacrylate Hexylethoxy)ethyl ester, 1-benzyloxyethyl methacrylate, 2-tetrahydropyranyl methacrylate, 1-ethoxyethyl acrylate, 1-methoxyethyl acrylate, acrylic acid 1 - n-butoxyethyl ester, 1-isobutoxyethyl acrylate, 1-t-butoxyethyl acrylate, 1-(2-chloroethoxy)ethyl acrylate, 1-(2-B) Hexyloxy)ethyl ester, 1-n-propoxyethyl acrylate, 1-cyclohexyloxyethyl acrylate, 1-(2-cyclohexylethoxy)ethyl acrylate, 1-benzyloxyethyl acrylate Ester, 2-tetrahydropyranyl acrylate, and the like.

More specific examples of the norbornene-based acetal-containing monomer include, for example, 2,3-bis(1-(trimethyldecyloxy)ethoxy)carbonyl)-5-norborn. Alkene, 2,3-bis(1-(trimethylformamoxy)ethoxy)carbonyl)-5-norbornene, 2,3-bis(1-methoxyethoxycarbonyl)- 5-norbornene, 2,3-bis(1-(cyclohexyloxy)ethoxycarbonyl)-5-norbornene, 2,3-bis(1-(benzyloxy)ethoxycarbonyl)-5 - norbornene and the like.

More specific examples of the styrene-based acetal-containing monomer include p- or m-ethoxyethoxystyrene, p- or m-methoxymethoxystyrene. , p- or m-n-butoxyethoxystyrene, p- or m-isobutoxyethoxystyrene, p- or m-(1,1-dimethylethoxy) Ethoxystyrene, p- or m-(2-chloroethoxy)ethoxystyrene, p- or m-(2-ethylhexyloxy)ethoxystyrene, or 1-n-propoxy ethoxystyrene, p- or m-hexacyclohexyloxyethoxystyrene, p- or m-(2-cyclohexylethoxy)ethoxystyrene , p- or m-benzyloxyethoxystyrene, and the like.

The structural unit (1) is preferably a structural unit represented by the above formula (1-1). As the monomer having an acetal structure, 1-alkyloxyalkyl (meth)acrylate, tetrahydropyranyl (meth)acrylate, and 1-alkoxyalkoxybenzene (meth)acrylate are preferred. Ethylene, tetrahydropyranyloxystyrene, more preferably 1-alkoxyalkyl (meth)acrylate, particularly preferably 1-ethoxyethyl methacrylate, 1-n-butoxy methacrylate Ethyl ester, 2-tetrahydropyranyl methacrylate, 1-benzyloxyethyl methacrylate.

A commercially available product may be used as the single system containing the acetal structure, or a compound synthesized by a known method may be used. For example, by giving the monomer having an acetal structure of the structural unit (1) represented by the above formula (1-1), for example, by using (meth)acrylic acid in the presence of an acid catalyst, as shown below, It is synthesized by a method of reacting a vinyl ether or the like.

In the above formula, R', R ¹ and R ³ are synonymous with the above formula (1-1). R ²¹ and R ²² are synonymous with R ² in the above formula (1-1) as -CH(R ²¹ )(R ²² ).

The [A] polymer system may have one or two or more types of structural units (I). The content of the structural unit (I) in the polymer is not particularly limited as long as the [A] polymer exhibits alkali solubility via an acid and exhibits desired heat resistance of the cured film, and is contained in one polymer molecule. When both the structural unit (I) and the epoxy group-containing structural unit are used, the monomer addition ratio is preferably 5% by mass to 70% by mass, more preferably 10% by mass to 60% by mass, particularly preferably 20% by mass to 50% by mass.

On the other hand, when there is a structural unit (I) in one polymer molecule and a structural unit containing an epoxy group in another polymer molecule, a structural unit in one polymer molecule having the structural unit (I) The content of (I) is preferably 40% by mass to 99% by mass, more preferably 50% by mass to 98% by mass, even more preferably 55% by mass to 95% by mass, based on the monomer addition ratio.

[Alkoxy group-containing structural unit]

The [A] polymer has the above structural unit (I) together with an epoxy group-containing structural unit. The epoxy group-containing structural unit is derived from a structural unit of an epoxy group-containing monomer. Further, the epoxy group is a concept including an oxiranyl group (1,2-epoxy structure) and an oxetane group (1,3-epoxy structure). [A] The polymer has a structural unit containing an oxirane group or an oxetanyl group in the molecule, and the hardness of the cured film obtained from the composition can be improved, and the heat resistance can be further improved.

Examples of the epoxy group-containing monomer to which the epoxy group-containing structural unit is administered include, for example, glycidyl (meth)acrylate, 3,4-epoxybutyl (meth)acrylate, and acrylic acid 3. -Methyl-3,4-epoxybutyl butyl ester, 3-ethyl-3,4-epoxybutyl methacrylate, 5,6-epoxyhexyl (meth)acrylate, methacrylic acid 5-methyl-5,6-epoxyhexyl acrylate, 5-ethyl-5,6-epoxyhexyl methacrylate, 6,7-epoxyheptyl (meth)acrylate, methyl 3,4-Epoxycyclohexyl acrylate, 3,4-epoxycyclohexylmethyl methacrylate, 3,4-epoxycyclohexylethyl (meth)acrylate, methacrylic acid 3,4 - Epoxycyclohexyl propyl ester, 3,4-epoxycyclohexyl methacrylate, 3,4-epoxycyclohexyl hexyl (meth) acrylate, 3,4-epoxy acrylate Hexylmethyl ester, 3,4-epoxycyclohexylethyl acrylate, 3,4-epoxycyclohexyl propyl acrylate, 3,4-epoxycyclohexyl acrylate, 3,4-epoxy acrylate Ethylene oxide group-containing (meth)acrylic compound such as cyclohexylhexyl group; o-vinylbenzylepoxypropyl ether, m-vinylbenzyl ring Propyl ether, p-vinylbenzyl epoxypropyl ether, α-methyl-o-vinylbenzylepoxypropyl ether, α-methyl-m-vinylbenzylepoxypropyl ether, α-甲Vinylbenzylepoxypropyl ethers such as vinyl-p-vinylbenzylepoxypropyl ether; o-vinylphenylepoxypropyl ether, m-vinylphenylepoxypropyl ether, vinyl Vinyl phenylepoxypropyl ethers such as phenylepoxypropyl ether; 3-(acryloxymethyl)oxetane, 3-(acryloxymethyl)-3-methyl Oxycyclobutane, 3-(acryloxymethyl)-3-ethyloxetane, 3-(acryloxymethyl)-3-phenyloxetane, 3 -(2-propenyloxyethyl)oxetane, 3-(2-propenyloxyethyl)-3-ethyloxetane, 3-(2-propyleneoxyl B 3-ethyloxetane, 3-(2-propenyloxyethyl)-3-phenyloxetane, 3-(methacryloxymethyl)oxy Cyclobutane, 3-(methacryloxymethyl)-3-methyloxetane, 3-(methacryloxymethyl)-3-ethyloxetane, 3-(methacryloxymethyl)-3-phenyloxetane 3-(2-methylpropenyloxyethyl)oxetane, 3-(2-methylpropenyloxyethyl)-3-ethyloxetane, 3-(2- Methyl propylene methoxyethyl)-3-ethyl oxetane, 3-(2-methylpropenyloxyethyl)-3-phenyl oxetane, 2-(acrylofluorene Oxymethyl)oxetane, 2-(acryloxymethyl)-2-methyloxetane, 2-(acryloxymethyl)-2-ethyloxocycle Butane, 2-(acryloxymethyl)-2-phenyloxetane, 2-(2-propenyloxyethyl)oxetane, 2-(2-propyleneoxyl) Benzyl)-2-ethyloxetane, 2-(2-propenyloxyethyl)-2-ethyloxetane, 2-(2-propenyloxyethyl) -2-phenyloxetane, 2-(methacryloxymethyl)oxetane, 2-(methacryloxymethyl)-2-methyloxetane Alkane, 2-(methacryloxymethyl)-2-ethyloxetane, 2-(methacryloxymethyl)-2-phenyloxetane, 2- (2-methacryloxyethyl) oxetane, 2-(2-methylpropenyloxyethyl)-2-ethyloxetane, 2-(2-methyl Acryloxy Oxetane group-containing (methyl)-2-ethyloxetane, 2-(2-methylpropenyloxyethyl)-2-phenyloxetane ) an acrylic compound or the like.

Among the above epoxy group-containing monomers, from the viewpoint of copolymerization reactivity with other radical polymerizable monomers and development of the composition, glycidyl methacrylate is preferred. 2-methylglycidyl methacrylate, 3,4-epoxycyclohexyl methacrylate, 3,4-epoxycyclohexyl methacrylate, 3-(methacryloxyloxy) Methyl)-3-methyloxetane, 3-(methacryloxymethyl)-3-ethyloxetane.

The [A] polymer may have one or two or more epoxy group-containing structural units. The content of the epoxy group-containing structural unit in the polymer is not particularly limited as long as it exhibits the desired heat resistance of the interlayer insulating film for a display element, and the structural unit (I) is contained in one polymer molecule. In the case of the structural unit containing an epoxy group, the structural unit (I) contained in the [A] polymer is preferably from 1% by mass to 60% by mass based on the monomer addition ratio, more preferably 15% by mass to 55% by mass, particularly preferably 20% by mass to 50% by mass.

On the other hand, when there is a structural unit (I) in one polymer molecule and a structural unit containing an epoxy group in another polymer molecule, in a polymer molecule having a structural unit containing an epoxy group The content of the epoxy group-containing structural unit is preferably from 1% by mass to 80% by mass, more preferably from 30% by mass to 70% by mass, particularly preferably from 35% by mass to 65% by mass based on the monomer addition ratio. %.

[Other structural units]

The [A] polymer may contain structural units other than the structural unit (I) and the epoxy group-containing structural unit. Examples of the monomer to be given to another structural unit include a monomer having a carboxyl group or a derivative thereof, a monomer having a hydroxyl group, and another monomer.

Examples of the monomer having a carboxyl group or a derivative thereof include acrylic acid, methacrylic acid, crotonic acid, 2-propenyloxyethyl succinic acid, 2-methylpropenyloxyethyl succinic acid, and 2 a monocarboxylic acid such as acryloxyethylhexahydrophthalic acid or 2-methylpropenyloxyethyl hexahydrophthalic acid; maleic acid, fumaric acid, citric acid, mesaconic acid, and y a dicarboxylic acid such as a benzoic acid; an acid anhydride of the above dicarboxylic acid; and the like. Among these monomers having a carboxyl group or a derivative thereof, methacrylic acid is preferred.

Examples of the monomer having a hydroxyl group include acrylic acid such as 2-hydroxyethyl acrylate, 3-hydroxypropyl acrylate, 4-hydroxybutyl acrylate, and 4-hydroxymethylcyclohexyl methyl acrylate. Hydroxyalkyl ester; 2-hydroxyethyl methacrylate, 3-hydroxypropyl methacrylate, 4-hydroxybutyl methacrylate, 5-hydroxypentyl methacrylate, methacrylic acid-6- Hydroxyhexyl methacrylate, hydroxyalkyl methacrylate such as 4-hydroxymethyl-cyclohexylmethyl methacrylate or the like. Among the monomers having a hydroxyl group, from the viewpoint of heat resistance of the obtained interlayer insulating film for a display element, 2-hydroxyethyl acrylate, 3-hydroxypropyl acrylate, and acrylic-4 are preferable. - hydroxybutyl ester, 2-hydroxyethyl methacrylate, 4-hydroxybutyl methacrylate, 4-hydroxymethyl-cyclohexyl methyl acrylate, 4-hydroxymethyl-cyclohexyl methacrylate Methyl ester.

Examples of the other monomer include alkyl acrylates such as methyl acrylate and isopropyl acrylate; methyl methacrylate, ethyl methacrylate, n-butyl methacrylate, and second butyl methacrylate; An alkyl methacrylate such as a third butyl methacrylate; cyclohexyl acrylate, 2-methylcyclohexyl acrylate, tricyclo[5.2.1.0 ^2,6 ]decane-8-yl acrylate, Acrylic cycloalkyl ester of 2-(tricyclo[5.2.1.0 ^2,6 ]decane-8-yloxy)ethyl acrylate or isobornyl acrylate; cyclohexyl methacrylate, methacrylic acid -2-methylcyclohexyl ester, tricyclo [5.0.1.02 ^2,6 ]decane-8-yl methacrylate, 2-(tricyclo[5.2.1.0 ^2,6 ]decane-methacrylate Ethyl methacrylate alicyclic ester such as 8-ethyloxy)ethyl ester or isobornyl methacrylate; aryl acrylate of acrylic acid such as phenyl acrylate or benzyl acrylate; and arylalkyl acrylate; phenyl methacrylate An aryl ester of methacrylic acid such as an ester or a benzyl methacrylate; and an arylalkyl methacrylate; a dicarboxylic acid of diethyl maleate, diethyl fumarate or diethyl iconate. Alkyl ester Unsaturated five-membered ring methacrylate containing one oxygen atom, such as tetrahydrofurfuryl methacrylate, tetrahydrofuran methacrylate, tetrahydropyran-2-methyl methacrylate, and unsaturated six members Cyclomethic acid; 4-methylpropenyloxymethyl-2-methyl-2-ethyl-1,3-dioxolane, 4-methylpropenyloxymethyl-2-methyl 2-isobutyl-1,3-dioxolane, 4-methylpropenyloxymethyl-2-cyclohexyl-1,3-dioxolan, 4-methylpropenyloxy 2-methyl-2-ethyl-1,3-dioxolane, 4-methylpropenyloxymethyl-2-methyl-2-isobutyl-1,3-dioxolan An unsaturated heterocyclic 5-membered ring methacrylic acid containing 2 oxygen atoms; 4-propenyloxymethyl-2,2-dimethyl-1,3-dioxolan, 4-propene oxime Methyl-2-methyl-2-ethyl-1,3-dioxolane, 4-propenyloxymethyl-2,2-diethyl-1,3-dioxolane, 4 - propylene methoxymethyl-2-methyl-2-isobutyl-1,3-dioxolane, 4-propenyloxymethyl-2-cyclopentyl-1,3-dioxolan Ring, 4-propenyloxymethyl-2-cyclohexyl-1,3-dioxolan, 4-propenyloxyethyl-2-methyl-2-ethyl- 1,3-dioxolane, 4-propenyloxypropyl-2-methyl-2-ethyl-1,3-dioxolane, 4-propenyloxybutyl-2-methyl Unsaturated five-membered ring acrylic acid containing 2 oxygen atoms such as 2-ethyl-1,3-dioxolane; styrene, α-methylstyrene, m-methylstyrene, p-methylbenzene a vinyl aromatic compound such as ethylene, p-methoxystyrene or 4-isopropenylphenol; N-phenylmaleimide, N-cyclohexylmaleimide, N-benzylmalanium Imine, N-succinimide-3-maleimide benzoate, N-succinimide-4-maleimine butyrate, N-succinimide- N-substituted horse of 6-maleimide caproate, N-succinimide-3-maleimide propionate, N-(9-acridinyl)maleimide a conjugated diene compound such as 1,3-butadiene, isoprene or 2,3-dimethyl-1,3-butadiene; acrylonitrile or methacrylonitrile; An unsaturated compound such as acrylamide, methacrylamide, vinyl chloride, vinylidene chloride or vinyl acetate.

Among these other monomers, styrene is preferred from the viewpoints of copolymerization reactivity with the monomer having a carboxyl group or a derivative thereof, a monomer having a hydroxyl group, and the developability of the composition. , 4-isopropenylphenol, tricyclo[cyclopropyl][5.2.1.0 ^2,6 ]decane-8-yl ester, tetrahydrofurfuryl methacrylate, 1,3-butadiene, 4-propene oxime Methyl-2-methyl-2-ethyl-1,3-dioxolane, N-cyclohexylmaleimide, N-phenylmaleimide, benzyl methacrylate.

[A] The polystyrene-equivalent weight average molecular weight (Mw) of the polymer as measured by gel permeation chromatography (GPC) is preferably 2.0 × 10 ³ to 1.0 × 10 ⁵ , more preferably 5.0 × 10 ³ ～ 5.0×10 ⁴ . By setting the Mw of the [A] polymer to the above range, the radiation sensitivity and the alkali developability of the composition can be improved.

The polystyrene-equivalent number average molecular weight (Mn) of the polymer [A] measured by GPC is preferably 2.0 × 10 ³ to 1.0 × 10 ⁵ , more preferably 5.0 × 10 ³ to 5.0 × 10 ⁴ . By setting the Mn of the [A] polymer to the above specific range, the curing reactivity at the time of curing of the coating film of the composition can be improved.

The molecular weight distribution (Mw/Mn) of the [A] polymer is preferably 3.0 or less, more preferably 2.6 or less. When the Mw/Mn of the [A] polymer is 3.0 or less, the developability of the obtained interlayer insulating film for display elements can be improved.

Further, Mw and Mn were measured by GPC under the following conditions.

Device: GPC-101 (made by Showa Denko)

Pipe column: combined with GPC-KF-801, GPC-KF-802, GPC-KF-803 and GPC-KF-804

Mobile phase: tetrahydrofuran

Column temperature: 40 ° C

Flow rate: 1.0 mL/min

Sample concentration: 1.0% by mass

Sample injection amount: 100 μL

Detector: Differential Refractometer

Reference material: monodisperse polystyrene

<[A] Synthesis Method of Polymer>

The [A] polymer system can be synthesized by radical copolymerization of a monomer capable of imparting each of the above structural units. When synthesizing the [A] polymer containing both the structural unit (I) and the epoxy group-containing structural unit in the same polymer molecule, it is only necessary to use a monomer containing at least an acetal-containing structure and an epoxy group-containing The mixture of monomers can be copolymerized. On the other hand, when manufacturing a [A] polymer having a structural unit (I) in one polymer molecule and having an epoxy group-containing structural unit in a polymer molecule different therefrom, as long as it contains at least a shrinkage A polymerizable solution of a monomer having an aldehyde structure is subjected to radical polymerization to obtain a polymer having a structural unit (I), and a polymerizable solution containing at least an epoxy group-containing monomer is subjected to radical polymerization to obtain a ring-containing polymer. The polymer of the structural unit of the oxy group is finally mixed to form the [A] polymer.

Examples of the solvent used in the polymerization reaction of the [A] polymer include alcohols, ethers, glycol ethers, ethylene glycol alkyl ether acetates, diethylene glycol alkyl ethers, and propylene glycols. Alkyl ether, propylene glycol monoalkyl ether acetate, propylene glycol monoalkyl ether propionate, aromatic hydrocarbons, ketones, other esters, and the like.

Examples of the alcohols include methanol, ethanol, benzyl alcohol, 2-phenylethyl alcohol, and 3-phenyl-1-propanol.

Examples of the ethers include tetrahydrofuran and the like.

Examples of the glycol ether include ethylene glycol monomethyl ether and ethylene glycol monoethyl ether.

Examples of the ethylene glycol alkyl ether acetate include methyl cellosolve acetate, ethyl cellosolve acetate, ethylene glycol monobutyl ether acetate, and ethylene glycol monoethyl. Ether acetate and the like.

Examples of the diethylene glycol alkyl ether include diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, and Ethylene glycol ethyl methyl ether and the like.

Examples of the propylene glycol monoalkyl ether include propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, and propylene glycol monobutyl ether.

Examples of the propylene glycol monoalkyl ether acetate include propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, propylene glycol monobutyl ether acetate, and the like. .

Examples of the propylene glycol monoalkyl ether propionate include propylene glycol monomethyl ether propionate, propylene glycol monoethyl ether propionate, propylene glycol monopropyl ether propionate, propylene glycol monobutyl ether propionate, and the like. .

Examples of the aromatic hydrocarbons include toluene and xylene.

Examples of the ketones include methyl ethyl ketone, cyclohexanone, and 4-hydroxy-4-methyl-2-pentanone.

Examples of the other esters include methyl acetate, ethyl acetate, propyl acetate, butyl acetate, ethyl 2-hydroxypropionate, methyl 2-hydroxy-2-methylpropionate, and 2-hydroxy- Ethyl 2-methylpropionate, methyl hydroxyacetate, ethyl hydroxyacetate, butyl glycolate, methyl lactate, ethyl lactate, propyl lactate, butyl lactate, methyl 3-hydroxypropionate, 3- Ethyl hydroxypropionate, propyl 3-hydroxypropionate, butyl 3-hydroxypropionate, methyl 2-hydroxy-3-methylbutanoate, methyl methoxyacetate, ethyl methoxyacetate, A Propyl oxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, propyl ethoxyacetate, butyl ethoxyacetate, methyl propoxyacetate, propoxy Ethyl acetate, propyl propyl acetate, butyl propyl acetate, methyl butoxyacetate, ethyl butoxyacetate, propyl butoxyacetate, butyl butoxyacetate, 2-methyl Methyl oxypropionate, ethyl 2-methoxypropionate, propyl 2-methoxypropionate, butyl 2-methoxypropionate, methyl 2-ethoxypropionate, 2-B Ethyl oxypropionate, propyl 2-ethoxypropionate, 2- Butyl oxypropionate, methyl 2-butoxypropionate, ethyl 2-butoxypropionate, propyl 2-butoxypropionate, butyl 2-butoxypropionate, 3-methyl Methyl oxypropionate, ethyl 3-methoxypropionate, propyl 3-methoxypropionate, butyl 3-methoxypropionate, methyl 3-ethoxypropionate, 3-B Ethyl oxypropionate, propyl 3-ethoxypropionate, butyl 3-ethoxypropionate, methyl 3-propoxypropionate, ethyl 3-propoxypropionate, 3-propane Propyl oxypropionate, butyl 3-propoxypropionate, methyl 3-butoxypropionate, ethyl 3-butoxypropionate, propyl 3-butoxypropionate, 3-butyl Butyl oxypropionate and the like.

Among these solvents, preferred are ethylene glycol alkyl ether acetates, diethylene glycol alkyl ethers, propylene glycol monoalkyl ethers, propylene glycol monoalkyl ether acetates, and methoxyacetic acid. The ester is particularly preferably diethylene glycol dimethyl ether, diethylene glycol ethyl methyl ether, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, or butyl methoxyacetate.

As the polymerization initiator to be used in the polymerization reaction, those generally known as radical polymerization initiators can be used, and examples thereof include 2,2'-azobisisobutyronitrile and 2,2'-azobis- (2,4-Dimethylvaleronitrile) (ADVN), 2,2'-azobis-(4-methoxy-2,4-dimethylvaleronitrile), 2,2'-azo double An azo compound such as -(2-methylpropionate), benzamidine peroxide, lauric acid peroxide, tert-butyl peroxide, 1,1'-bis-(t-butylperoxy An organic peroxide such as cyclohexane or hydrogen peroxide.

In the polymerization for producing the [A] polymer, a molecular weight modifier may be used in order to adjust the molecular weight. Examples of the molecular weight modifier include halogenated hydrocarbons such as chloroform and carbon tetrabromide; n-hexyl mercaptan, n-octyl mercaptan, n-dodecyl mercaptan, tertiary dodecyl mercaptan, and thioglycolic acid; And other thiols; xanthates such as dimethyl xanthate sulfide and diisopropyl xanthate disulfide; terpinolene, α-methylstyrene dimer, and the like.

<[B] compound>

The compound [B] is at least one compound selected from the group consisting of an oxime sulfonate compound and an onium salt compound, and is a compound which generates an acid by irradiation with radiation. Here, as the radiation, for example, visible light, ultraviolet light, far ultraviolet light, electron beam, X-ray or the like can be used. This composition exhibits positive radiation characteristics by containing the [A] polymer having the compound [B] and an acid dissociable group.

[肟sulfonate compound]

The oxime sulfonate compound may, for example, be a compound containing an oxime sulfonate group represented by the following formula (2).

In the above formula (2), R ^B1 is a linear, branched, cyclic alkyl group or a substituted aryl group which may be substituted.

The alkyl group represented by the above R ^{B1 is} preferably a linear or branched alkyl group having 1 to 10 carbon atoms. The linear or branched alkyl group having 1 to 10 carbon atoms may be substituted, and examples of the substituent include an alkoxy group having 1 to 10 carbon atoms and 7,7-dimethyl-2-oxo group. An alicyclic group having a bridged alicyclic group, such as a norbornene group. Further, a preferred alicyclic group is a bicycloalkyl group. The aryl group represented by the above R ^{B1 is} preferably an aryl group having 6 to 11 carbon atoms, more preferably a phenyl group or a naphthyl group. The aryl group may be substituted, and examples of the substituent include an alkyl group having 1 to 5 carbon atoms, an alkoxy group, and a halogen atom.

Examples of the compound containing the oxime sulfonate group represented by the above formula (2) include an oxime sulfonate compound represented by the following formula (3).

In the above formula (3), R ^B1 is synonymous with the above formula (2). X is an alkyl group, an alkoxy group or a halogen atom. m is an integer of 0 to 3. However, when X is a complex number, the plural Xs may be the same or different.

The alkyl group which may be represented by the above X is preferably a linear or branched alkyl group having 1 to 4 carbon atoms. The alkoxy group represented by the above X is preferably a linear or branched alkoxy group having 1 to 4 carbon atoms. The halogen atom represented by the above X is preferably a chlorine atom or a fluorine atom. m is preferably 0 or 1. In the above formula (3), a compound in which m is 1, X is a methyl group, and a substitution position of X is an ortho position is preferable.

Examples of the oxime sulfonate compound represented by the above (3) include compounds represented by the following formulas (i) to (v).

Further, the above compound (i) (5-propylsulfonyloxyimino-5H-thienylene-2-yl)-(2-methylphenyl)acetonitrile, compound (ii) (5-octyl) Sulfomethoxyimino-5H-thienylene-2-yl)-(2-methylphenyl)acetonitrile, compound (iii) (camphorsulfonyloxyimino-5H-thiophen-2-yl) )-(2-methylphenyl)acetonitrile, compound (iv) (5-p-toluenesulfonyloxyimino-5H-thienylene-2-yl)-(2-methylphenyl)acetonitrile and compound (v) (5-octylsulfonyloxyimino)-(4-methoxyphenyl)acetonitrile is commercially available.

[鎓盐]

Examples of the onium salt include a diphenylphosphonium salt, a triphenylsulfonium salt, a phosphonium salt, a benzothiazolium salt, and a tetrahydrothiophene salt.

Examples of the diphenylphosphonium salt include diphenylphosphonium tetrafluoroborate, diphenylphosphonium hexafluorophosphate, diphenylphosphonium hexafluoroarsenate, and diphenylsulfonium trifluoromethanesulfonate. Diphenylphosphonium trifluoroacetate, diphenylphosphonium-p-toluenesulfonate, diphenylphosphonium butyl tris(2,6-difluorophenyl)borate, 4-methoxyphenylphenyl Tetrafluoroborate, bis(4-t-butylphenyl)phosphonium tetrafluoroborate, bis(4-t-butylphenyl)phosphonium hexafluoroarsenate, bis(4-tert-butylbenzene)錪) trifluoromethanesulfonate, bis(4-t-butylphenyl)phosphonium trifluoroacetate, bis(4-t-butylphenyl)phosphonium-p-toluenesulfonate, double (4 -T-butylphenyl)camphorsulfonic acid and the like.

Examples of the triphenylsulfonium salt include triphenylsulfonium trifluoromethanesulfonate, triphenyl camphorsulfonic acid, triphenylsulfonium tetrafluoroborate, triphenylsulfonium trifluoroacetate, and the like. Phenylhydrazine-p-toluenesulfonate, triphenylphosphonium butyl tris(2,6-difluorophenyl)borate, and the like.

Examples of the onium salt include an alkyl phosphonium salt, a benzyl phosphonium salt, a dibenzyl phosphonium salt, and a substituted benzyl phosphonium salt.

Examples of the alkyl phosphonium salt include 4-ethyloxy phenyl dimethyl hexafluoroantimonate, 4-ethyl methoxy phenyl dimethyl hexafluoro arsenate, and dimethyl- 4-(Benzyloxycarbonyloxy)phenylphosphonium hexafluoroantimonate, dimethyl-4-(benzylideneoxy)phenylphosphonium hexafluoroantimonate, dimethyl-4-(phenylene)醯oxy)phenylphosphonium hexafluoroarsenate, dimethyl-3-chloro-4-ethenyloxyphenylphosphonium hexafluoroantimonate, and the like.

Examples of the benzyl sulfonium salt include benzyl-4-hydroxyphenylmethylphosphonium hexafluoroantimonate, benzyl-4-hydroxyphenylmethylphosphonium hexafluorophosphate, and 4-ethenyloxybenzene. Base benzyl methyl hexafluoroantimonate, benzyl-4-methoxyphenylmethyl hexafluoroantimonate, benzyl-2-methyl-4-hydroxyphenylmethyl hexafluoroantimony An acid salt, benzyl-3-chloro-4-hydroxyphenylmethylphosphonium hexafluoroarsenate, 4-methoxybenzyl-4-hydroxyphenylmethylphosphonium hexafluorophosphate or the like.

Examples of the dibenzyl sulfonium salt include dibenzyl-4-hydroxyphenylphosphonium hexafluoroantimonate, dibenzyl-4-hydroxyphenylphosphonium hexafluorophosphate, and 4-ethyloxyphenylene. Dibenzyl hexafluoroantimonate, dibenzyl-4-methoxyphenylphosphonium hexafluoroantimonate, dibenzyl-3-chloro-4-hydroxyphenylphosphonium hexafluoroarsenate, dibenzyl Alkyl-3-methyl-4-hydroxy-5-tert-butylphenylphosphonium hexafluoroantimonate, benzyl-4-methoxybenzyl-4-hydroxyphenylphosphonium hexafluorophosphate, and the like.

Examples of the substituted benzyl sulfonium salt include p-chlorobenzyl-4-hydroxyphenylmethylphosphonium hexafluoroantimonate and p-nitrobenzyl-4-hydroxyphenylmethylphosphonium hexafluoroantimonate. , p-chlorobenzyl-4-hydroxyphenylmethyl sulfonium hexafluorophosphate, p-nitrobenzyl-3-methyl-4-hydroxyphenylmethyl hexafluoroantimonate, 3,5-dichloro Benzyl-4-hydroxyphenylmethylphosphonium hexafluoroantimonate, o-chlorobenzyl-3-chloro-4-hydroxyphenylmethylphosphonium hexafluoroantimonate, and the like.

Examples of the benzothiazolium salt include 3-benzylbenzothiazolium hexafluoroantimonate, 3-benzylbenzothiazolium hexafluorophosphate, and 3-benzylbenzothiazolium tetrafluoroborate. , 3-(p-methoxybenzyl)benzothiazolium hexafluoroantimonate, 3-benzyl-2-methylthiobenzothiazolium hexafluoroantimonate, 3-benzyl-5-chlorobenzene And thiazolium hexafluoroantimonate.

Examples of the tetrahydrothiophene sulfonium salt include 4,7-di-n-butoxy-1-naphthyltetrahydrothiophene trifluoromethanesulfonate and 1-(4-n-butoxynaphthalene-1- Tetrahydrothiophene trifluoromethanesulfonate, 1-(4-n-butoxynaphthalen-1-yl)tetrahydrothiophene nonafluoro-n-butane sulfonate, 1-(4-n-butoxy Naphthyl-1-yl)tetrahydrothiophene-1,1,2,2-tetrafluoro-2-(norbornane-2-yl)ethanesulfonate, 1-(4-n-butoxynaphthalene) -1-yl)tetrahydrothiophene-2-(5-t-butoxycarbonyloxybicyclo[2.2.1]heptan-2-yl)-1,1,2,2-tetrafluoroethanesulfonic acid Salt, 1-(4-n-butoxynaphthalen-1-yl)tetrahydrothiophene-2-(6-t-butoxycarbonyloxybicyclo[2.2.1]heptan-2-yl)-1, 1,2,2-tetrafluoroethane sulfonate, and the like.

Further, the compound [B] may contain a sulfonium imine compound, a halogen-containing compound, a diazomethane compound, a hydrazine compound, a sulfonate compound, a carboxylic acid ester compound or the like.

Examples of the sulfonium imine compound include N-(trifluoromethylsulfonyloxy) succinimide, N-(camphorsulfonyloxy) succinimide, and N-(4-methylbenzene). Sulfosulfonyloxy) amber quinone imine, N-(2-trifluoromethylphenylsulfonyloxy) succinimide, N-(4-fluorophenylsulfonyloxy) amber quinone imine, N-(trifluoromethylsulfonyloxy)benzylidene imine, N-(camphorsulfonyloxy)benzonitrile, N-(2-trifluoromethylphenylsulfonyloxy) Benzene dimethylimine, N-(2-fluorophenylsulfonyloxy) phthalimide, N-(trifluoromethylsulfonyloxy)diphenylmaleimide, N -( camphorsulfonyloxy)diphenylmaleimide, 4-methylphenylsulfonyloxy)diphenylmaleimide, N-(2-trifluoromethylphenylsulfonate) Oxy)diphenylmaleimide, N-(4-fluorophenylsulfonyloxy)diphenylmaleimide, N-(4-fluorophenylsulfonyloxy)diphenyl Maleidin, N-(phenylsulfonyloxy)bicyclo[2.2.1]hept-5-ene-2,3-dicarboxylimenide, N-(4-methylphenylsulfonate Bicyclo[2.2.1]hept-5-ene-2,3-dicarboxylimenine, N-(trifluoromethanesulfonyloxy)bicyclo[2.2.1]hept-5-ene-2,3 - Dicarboxy quinone imine, N-(nonafluorobutane sulfonyloxy)bicyclo[2.2.1]hept-5-ene-2,3-dicarboxylimenimimine, N-(camphorsulfonyloxy) Bicyclo[2.2.1]hept-5-ene-2,3-dicarboxylimenimimine, N-(camphorsulfonyloxy)-7-oxabicyclo[2.2.1]hept-5-ene-2, 3-dicarboxylimine imine, N-(trifluoromethylsulfonyloxy)-7-oxabicyclo[2.2.1]hept-5-ene-2,3-dicarboxylimenide, N-( 4-methylphenylsulfonyloxy)bicyclo[2.2.1]hept-5-ene-2,3-dicarboxylimenine, N-(4-methylphenylsulfonyloxy)-7- Oxabicyclo[2.2.1]hept-5-ene-2,3-dicarboxylimenine, N-(2-trifluoromethylphenylsulfonyloxy)bicyclo[2.2.1]hept-5- Aceene-2,3-dicarboxyarsenine, N-(2-trifluoromethylphenylsulfonyloxy)-7-oxabicyclo[2.2.1]hept-5-ene-2,3-di Carboxylimine, N-(4-fluorophenylsulfonyloxy)bicyclo[2.2.1]hept-5-ene-2,3-dicarboxylimenide, N-(4-fluorophenylsulfonate Oxy)-7-oxabicyclo[2.2.1]hept-5-ene-2,3-dicarboxylimenine, N-(trifluoromethylsulfonyloxy)bicyclo[2.2.1]heptane -5,6-oxo-2,3-dicarboxyindoleimine, N-(camphorsulfonyloxy)bicyclo[2.2.1]heptane-5,6-oxo-2,3-dicarboxyindole Imine, N-(4-methylphenylsulfonyloxy)bicyclo[2.2.1] Alkane-5,6-oxo-2,3-dicarboxylimenine, N-(2-trifluoromethylphenylsulfonyloxy)bicyclo[2.2.1]heptane-5,6-oxo -2,3-dicarboxylimine imine, N-(4-fluorophenylsulfonyloxy)bicyclo[2.2.1]heptane-5,6-oxo-2,3-dicarboxylimenide, N-(Trifluoromethylsulfonyloxy)naphthyldicarbenium imine, N-(camphorsulfonyloxy)naphthyldicarbenium imine, N-(4-methylphenylsulfonyloxy) ) naphthyl dicarboxy quinone imine, N-(phenylsulfonyloxy)naphthyl dicarboxy quinone imine, N-(2-trifluoromethylphenylsulfonyloxy)naphthyl dicarboxy quinone imine , N-(4-fluorophenylsulfonyloxy)naphthyldicarbenium imine, N-(pentafluoroethylsulfonyloxy)naphthyldicarbenium imine, N-(heptafluoropropylsulfonate)醯oxy)naphthyl dicarboxy quinone imine, N-(nonafluorobutylsulfonyloxy)naphthyl dicarboxy quinone imine, N-(ethylsulfonyloxy)naphthyl dicarboxy quinone imine, N-(propylsulfonyloxy)naphthyldicarbenium imine, N-(butylsulfonyloxy)naphthyldicarbenium imine, N-(pentylsulfonyloxy)naphthyldicarboxylate Yttrium, N-(hexylsulfonyloxy)naphthyldicarbenium imine, N-(heptylsulfonyloxy)naphthyldicarbenium imine, N-(octylsulfonyloxy)naphthalene Carboquinone imine, N-( Sulfonic group-yl) naphthalene carboxylic acyl imine.

Examples of the halogen-containing compound include a halogenated alkyl group-containing hydrocarbon compound and a halogenated alkyl group-containing heterocyclic compound.

Examples of the diazomethane compound include bis(trifluoromethylsulfonyl)diazomethane, bis(cyclohexylsulfonyl)diazomethane, bis(phenylsulfonyl)diazomethane, and bis ( P-tolylsulfonyl)diazomethane, bis(2,4-dimethylphenylsulfonyl)diazomethane, bis(p-chlorophenylsulfonyl)diazomethane, methylsulfonyl-p-toluene Sulfhydryl diazomethane, cyclohexylsulfonyl (1,1-dimethylethylsulfonyl)diazomethane, bis(1,1-dimethylethylsulfonyl)diazomethane, benzene Sulfosyl (benzhydryl) diazomethane, etc.

Examples of the ruthenium compound include a β-keto oxime compound, a β-sulfonyl fluorene compound, and a diaryl ruthenium compound.

Examples of the sulfonate compound include a sulfonic acid alkyl ester, a sulfonic acid haloalkyl ester, a sulfonic acid aryl ester, and a sulfonic acid imide ester.

Examples of the carboxylic acid ester compound include o-nitrobenzyl carboxylic acid ester and the like.

The oxime sulfonate compound is preferably a compound containing an oxime sulfonate group represented by the above formula (2), more preferably an oxime sulfonate compound represented by the above formula (3), and particularly preferably commercially available. (5-propylsulfonyloxyimino-5H-thienylene-2-yl)-(2-methylphenyl)acetonitrile, (5-octylsulfonyloxyimino-5H) -Thienthiophen-2-yl)-(2-methylphenyl)acetonitrile, (5-p-toluenesulfonyloxyimino-5H-thienylene-2-yl)-(2-methylphenyl) Acetonitrile, (camphorsulfonyloxyimido-5H-thienylene-2-yl)-(2-methylphenyl)acetonitrile, (5-octylsulfonyloxyimino)-(4-A Oxyphenyl) acetonitrile. As the onium salt, a tetrahydrothiophene salt, a benzyl phosphonium salt, more preferably 4,7-di-n-butoxy-1-naphthyltetrahydrothiophene trifluoromethanesulfonate, benzyl- 4-hydroxyphenylmethyl sulfonium hexafluorophosphate.

The compound [B] may be used singly or in combination of two or more. The content of the compound [B] in the composition is preferably from 0.1 part by mass to 10 parts by mass, more preferably from 1 part by mass to 5 parts by mass, per 100 parts by mass of the [A] polymer. By setting the content of the [B] compound to the above-mentioned specific range, the radiation sensitivity of the composition can be optimized, and an interlayer insulating film for a display element having high surface hardness while maintaining transparency can be formed.

<[C]organic solvent>

This composition is obtained by mixing a suitable component such as [A] polymer, [B] compound, and optionally [D] surfactant, and other optional components in a [C] organic solvent to dissolve or disperse. modulation. The organic solvent of [C] contains at least (C1) an organic solvent having a vapor pressure at 20 ° C of 0.1 mmHg or more and less than 1 mmHg. Moreover, as the (C2) organic solvent, an organic solvent containing a vapor pressure at 20 ° C of 1 mmHg or more and 20 mmHg or less is preferable. By using the [C] organic solvent having the vapor pressure in the above specific range, even if the discharge nozzle coating method is employed, it is possible to apply the coating at a high speed while preventing coating unevenness. Further, a known method can be used for the measurement of the vapor pressure, but in the present specification, it means a value measured by an evapotranspiration method (gas flow method).

As the [C] organic solvent, those in which each component can be uniformly dissolved or dispersed can be suitably used without being reacted with each constituent element. Examples of the [C] organic solvent include benzyl alcohol, ethylene glycol monoalkyl ethers, ethylene glycol dialkyl ethers, propylene glycol monoalkyl ethers, diethylene glycol monoalkyl ethers, and Ethylene glycol dialkyl ethers, diethylene glycol monoalkyl ether acetates, dipropylene glycol monoalkyl ethers, dipropylene glycol dialkyl ethers, dipropylene glycol monoalkyl ether acetates, lactates , aliphatic carboxylic acid esters, guanamines, ketones, and the like. These may be used singly or in combination of two or more.

Examples of the (C1) organic solvent include benzyl alcohol; ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, and ethylene glycol monobutyl ether; Alcohol monoalkyl ethers; ethylene glycol dialkyl ethers such as ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol dipropyl ether; propylene glycol monomethyl ether, propylene glycol monoethyl a propylene glycol monoalkyl ether such as a propyl ether, a propylene glycol monopropyl ether or a propylene glycol monobutyl ether; a diethylene glycol monoalkyl ether such as diethylene glycol monomethyl ether or diethylene glycol monoethyl ether Diethylene glycol dialkyl ethers such as diethylene glycol diethyl ether and diethylene glycol ethyl methyl ether; diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl Diethylene glycol monoalkyl ether acetates such as ether ether acetate, diethylene glycol monopropyl ether acetate, diethylene glycol monobutyl ether acetate; dipropylene glycol monomethyl ether, Dipropylene glycol monoalkyl ethers such as dipropylene glycol monoethyl ether, dipropylene glycol monopropyl ether, dipropylene glycol monobutyl ether; dipropylene glycol dialkyl such as dipropylene glycol dimethyl ether or dipropylene glycol diethyl ether Ethers; Dipropylene glycol monoalkyl ether acetates such as dipropylene glycol monomethyl ether acetate, dipropylene glycol monoethyl ether acetate, dipropylene glycol monopropyl ether acetate, dipropylene glycol monobutyl ether acetate Lactic acid esters such as n-propyl lactate, isopropyl lactate, n-butyl lactate, isobutyl lactate, n-amyl lactate, and isoamyl lactate; ethyl hydroxyacetate, 2-hydroxy-2-methylpropane Ethyl acetate, ethyl 2-hydroxy-3-methylbutanoate, ethyl ethoxyacetate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, 3-ethoxypropane Ethyl acetate, 3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, 3-methyl-3-methoxybutyl propionate, 3-methyl An aliphatic carboxylic acid ester such as benzyl-3-methoxybutyl butyrate, ethyl acetoacetate, ethyl acetate, methyl pyruvate or ethyl pyruvate; N-methylformamide , N,N-dimethylformamide, N-methylacetamide, N,N-dimethylacetamide, etc.; N-methylpyrrolidone, γ-butyrolactone, etc. Ketones and the like.

(C1) The organic solvent may be used singly or in combination of two or more. The (C1) organic solvent is preferably selected from the group consisting of diethylene glycol ethyl methyl ether, diethylene glycol diethyl ether, dipropylene glycol dimethyl ether, benzyl alcohol, and dipropylene glycol monomethyl ether. At least one organic solvent in the group.

Examples of the (C2) organic solvent include diethylene glycol dimethyl ether, ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, and ethylene glycol monopropyl ether. Acid ester, ethylene glycol monobutyl ether acetate, propylene glycol monomethyl ether acetate, cyclohexanone, ethyl acetate, propyl acetate, n-butyl acetate, methyl propyl ketone, methyl isobutyl Ketone, methyl 3-methoxypropionate, methyl lactate, ethyl lactate, and the like.

(C2) The organic solvent may be used singly or in combination of two or more. The (C2) organic solvent is preferably selected from the group consisting of diethylene glycol dimethyl ether, ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, and ethylene glycol monopropyl ether. At least one organic solvent selected from the group consisting of acetate, propylene glycol monomethyl ether acetate, cyclohexanone, n-butyl acetate, methyl isobutyl ketone, and methyl 3-methoxypropionate.

When the (C1) organic solvent and the (C2) organic solvent are used in combination, diethylene glycol ethyl methyl ether/diethylene glycol dimethyl ether, diethylene glycol ethyl methyl ether/propylene glycol monomethyl is preferred. Ethyl acetate, diethylene glycol ethyl methyl ether / cyclohexanone, diethylene glycol diethyl ether / diethylene glycol dimethyl ether, diethylene glycol diethyl ether / propylene glycol monomethyl Ethyl acetate, diethylene glycol diethyl ether / cyclohexanone, diethylene glycol diethyl ether / methyl 3-methoxypropionate, diethylene glycol diethyl ether / methyl A combination of butyl ketone, diethylene glycol diethyl ether / n-butyl acetate.

(C2) The content of the organic solvent is preferably 10% by mass or more and 90% by mass or less, more preferably 10% by mass or more and 50% by mass or less based on the total amount of the (C1) organic solvent and the (C2) organic solvent. . The mass ratio of the (C1) organic solvent having a low vapor pressure to the (C2) organic solvent having a high vapor pressure is within the above specific range, and in particular, in the coating film after prebaking, the amount of residual solvent is optimized, and the coating film is applied. The fluidity is balanced, and as a result, uneven coating (unevenness of the tendons, unevenness of the needle marks, unevenness of the mist, etc.) can be suppressed, and the film thickness uniformity can be further improved. In addition, by optimizing the amount of residual solvent, the amount of acid generated is highly balanced with the acid-dissociable group, and the radiation sensitivity tends to be changed.

The solid content concentration of the composition is 10% by mass or more and 30% by mass or less, preferably 20% by mass or more and 25% by mass or less. By setting the solid content concentration of the composition to the above specific range, the occurrence of coating unevenness can be effectively suppressed.

The composition has a viscosity at 25 ° C of 2.0 mPa ‧ s or more and 12 mPa ‧ s or less, preferably 2.0 mPa ‧ s or more and 10 mPa ‧ s or less. By setting the viscosity of the composition to the above-described specific range, even if coating unevenness occurs while maintaining the uniformity of the film thickness, the viscosity which is automatically uniform can be achieved in a well-balanced manner, and high-speed coatability can be achieved.

<[D] surfactant]

The composition may further contain [D] a surfactant as a suitable component for further improving the film formability of the composition. Examples of the surfactant include a fluorine-based surfactant and a polyfluorene-based surfactant. Since the composition contains the [D] surfactant, the surface smoothness of the coating film can be improved, and as a result, the film thickness uniformity of the interlayer insulating film for a display element can be further improved.

The fluorine-based surfactant is preferably a compound having a fluoroalkyl group and/or a fluorine-extended alkyl group in at least a part of the terminal, the main chain and the side chain, and examples thereof include 1,1,2,2-tetra. Fluoryl-n-octyl (1,1,2,2-tetrafluoro-n-propyl)ether, 1,1,2,2-tetrafluoro-n-octyl (n-hexyl)ether, hexaethylene glycol di(1,1, 2,2,3,3-hexafluoro-n-pentyl)ether, octaethylene glycol di(1,1,2,2-tetrafluoro-n-butyl)ether, hexa-propylene glycol di(1,1,2,2, 3,3-hexafluoro-n-pentyl)ether, octapropylene glycol bis(1,1,2,2-tetrafluoro-n-butyl)ether, sodium perfluoro-n-dodecanesulfonate, 1,1,2,2, 3,3-hexafluoro-n-decane, 1,1,2,2,3,3,9,9,10,10-decafluoro-n-dodecane, sodium fluoroalkylbenzenesulfonate, sodium fluoroalkyl phosphate , sodium fluoroalkylcarboxylate, diglycerol tetrakis (fluoroalkyl polyoxyethylene ether), fluoroalkyl ammonium iodide, fluoroalkyl betaine, fluoroalkyl polyoxyethylene ether, perfluoroalkyl polyoxyethylene, Perfluoroalkyl alkoxide, fluoroalkyl carboxylate, and the like.

Examples of the commercially available product of the fluorine-based surfactant include BM-1000, BM-1100 (above, BM CHEMIE), Megafac F142D, F172, F173, F183, F178, F191, and F471. , with F476 (above is made by Dainippon Ink Chemical Industry), Florad FC-170C, with FC-171, with FC-430, with FC-431 (above Sumitomo 3M), Surflon S-112, and S-113 Same as S-131, same S-141, same S-145, same S-382, same SC-101, same SC-102, same SC-103, same SC-104, same SC-105, same SC-106 (The above is the Asahi Glass system), Eftop EF301, the same EF303, the same EF352 (the above is the new Akita Chemicals), Ftergent FT-100, the same FT-110, the same FT-140A, the same FT-150, the same FT-250, the same FT-251, the same FT-300, the same FT-310, the same FT-400S, the same FTX-218, the same FT-251 (above the NEOS system).

As a polyfluorene-based surfactant, for example, Toray Silicone DC3PA, same DC7PA, same SH11PA, same SH21PA, same SH28PA, same SH29PA, same SH30PA, same SH-190, same SH-193, same SZ-6032, same SF- 8428, same DC-57, same DC-190, SH 8400 FLUID (above is Toray ‧ Dow Corning ‧ polyoxygen), TSF-4440, TSF-4300, TSF-4445, TSF-4446, TSF-4460, TSF -4452 (The above is a GE Toshiba polyfluorene system), an organic siloxane polymer KP341 (manufactured by Shin-Etsu Chemical Co., Ltd.), and the like.

The [D] surfactant may be used singly or in combination of two or more. The content of the [D] surfactant in the composition is preferably 0.01 parts by mass or more and 2 parts by mass or less, more preferably 0.05 parts by mass or more and 1 part by mass or less based on 100 parts by mass of the [A] polymer. . By setting the content of the [D] surfactant to the above specific range, the surface smoothness of the coating film can be further improved.

<[E] polyfunctional (meth) acrylate>

The composition further contains [E] polyfunctional (meth) acrylate as a suitable component. Since the composition further contains an [E] polyfunctional (meth) acrylate compound, the transmittance and heat-resistant transparency of the interlayer insulating film for display elements can be improved. Examples of the [E] polyfunctional (meth) acrylate include a bifunctional (meth) acrylate, a trifunctional or higher (meth) acrylate, and the like.

As a bifunctional (meth) acrylate, for example, ethylene glycol di(meth) acrylate, propylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, tetraethylene glycol di (a) Acrylate, 1,6-hexanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, and the like.

Commercially available products of bifunctional (meth) acrylate, such as Aronix M-210, M-240, M-6200 (above, manufactured by Toagosei), KAYARAD HDDA, HX-220, and R-604 ( The above are made by Nippon Kayaku Co., Ltd., Biscoat 260, H. 312, Higashi 335HP (above, Osaka Organic Chemical Industry Co., Ltd.), Light Acrylate 1, 9-NDA (Kyoeisha Chemical Co., Ltd.), and the like.

Examples of the trifunctional or higher (meth) acrylate include trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, pentaerythritol triacrylate, and pentaerythritol trimethyl. Acrylate, neopentyl alcohol tetraacrylate, neopentyl alcohol tetramethacrylate, dipentaerythritol pentaacrylate, dipentaerythritol pentamethacrylate, dipentaerythritol hexaacrylate , a mixture of dipentaerythritol pentaacrylate and dipentaerythritol hexaacrylate, dipentaerythritol hexamethacrylate, ethylene oxide modified dipentaerythritol hexaacrylate, three (2 - propylene methoxyethyl) phosphate, tris(2-methylpropenyloxyethyl) phosphate, succinic acid modified pentaerythritol triacrylate, having a linear alkyl group and an alicyclic A polyfunctional urethane obtained by reacting a compound having two or more isocyanate groups and a compound having one or more hydroxyl groups in the molecule and having three to five (meth)acryloxy groups. An acrylate compound or the like.

Examples of commercially available products of a trifunctional or higher (meth) acrylate include Aronix M-309, M-400, M-405, M-450, M-7100, and M-8030. Same as M-8060, same as TO-1450 (above is East Asian Synthetic System), KAYARAD TMPTA, same DPHA, same DPCA-20, same DPCA-30, same DPCA-60, same DPCA-120, same DPEA-12 (above Nippon Kayaku Co., Ltd., Biscoat 295, Tsing 300, Tsing 360, GPT, 3PA, and 400 (above, Osaka Organic Chemical Industry). For example, New Forntier R-1150 (manufactured by Daiichi Kogyo Co., Ltd.), KAYARAD DPHA-40H (manufactured by Nippon Kasei Co., Ltd.), and the like are mentioned as a commercial product containing a polyfunctional urethane acrylate-based compound.

Among these [E] polyfunctional (meth) acrylates, ethylene glycol di(meth)acrylate, ω-carboxypolycaprolactone monoacrylate, and 1,9-nonanediol are preferably contained. Dimethacrylate, diethylene glycol dimethacrylate, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, neopentyl alcohol triacrylate, neopentyl alcohol tetraacrylate Ester, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, a mixture of dipentaerythritol pentaacrylate and dipentaerythritol hexaacrylate, ethylene oxide modified dipentaerythritol Commercially available product of alcohol hexaacrylate, succinic acid modified neopentyl alcohol triacrylate, and polyfunctional urethane acrylate compound.

The [E] polyfunctional (meth) acrylate type may be used alone or in combination of two or more. The content of the [E] polyfunctional (meth) acrylate in the composition is preferably 1 part by mass to 30 parts by mass, more preferably 5 parts by mass, per 100 parts by mass of the [A] polymer. 15 parts by mass. By setting the content of the [E] polyfunctional (meth) acrylate to the above specific range, the transmittance and heat-resistant transparency of the interlayer insulating film for a display element can be further improved.

<[F]antioxidant>

The composition may further contain [F] an antioxidant as a suitable component. Since the composition further contains [F] an antioxidant, the transmittance and heat-resistant transparency of the interlayer insulating film for a display element can be improved. The [F] antioxidant in the present specification means a phenol compound, a compound having a hindered phenol structure, a compound having a hindered amine structure, a compound having an alkyl phosphate structure, and a compound having a thioether structure.

Examples of the phenol compound include 4-methoxyphenol and 4-ethoxyphenol.

Examples of the compound having a hindered phenol structure include 2,6-di-t-butyl-4-methylphenol and neopentyltetrakis[3-(3,5-di-t-butyl-4- Hydroxyphenyl)propionate], thiodiethylidene bis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate], octadecyl-3-(3, 5-di-t-butyl-4-hydroxyphenyl)propionate, 1,3,5-trimethyl-2,4,6-tris(3,5-di-t-butyl-4- Hydroxybenzyl)benzene, N,N'-hexane-1,6-diylbis[3-(3,5-di-t-butyl-4-hydroxyphenylpropionamide), 3,3',3",5',5"-hexa-t-butyl-a,a',a"-( -2,4,6-triyl)tri-p-cresol, 4,6-bis(octylthiomethyl)-o-cresol, 4,6-bis(dodecylthiomethyl)-o-cresol Ethyl bis(ethylene oxide) bis[3-(5-tert-butyl-4-hydroxy-m-tolyl)propionate, hexamethylene bis[3-(3,5-di-third Butyl-4-hydroxyphenyl)propionate], 1,3,5-tris(3,5-di-t-butyl-4-hydroxybenzyl)-1,3,5-tri -2,4,6(1H,3H,5H)-trione, 1,3,5-tri[(4-t-butyl-3-hydroxy-2,6-dimethylphenyl)methyl]-1 , 3,5-three -2,4,6(1H,3H,5H)-trione, 2,6-di-t-butyl-4-(4,6-bis(octylthio)-1,3,5-three -2-ylamine) phenol, tris-(3,5-di-t-butyl-4-hydroxybenzyl)-isocyanate, and the like.

Examples of commercially available compounds having a hindered phenol structure include Adkstab AO-20, the same AO-30, the same AO-40, the same O-50, the same AO-60, the same AO-70, and the same AO-80. Same as AO-330 (above ADEKA), sumilizer GM, same GS, same MDP-S, same as BBM-S, same WX-R, same GA-80 (above Sumitomo Chemical), IRGANOX 1010, same 1035 Same as 1076, 1098, 1135, 1330, 1726, 1425WL, 1520L, 245, 259, 3114, 565, IRGAMOD 295 (above CIBA Japan), Yoshinox BHT, BB, Same as 2246G, 425, 250, 930, SS, TT, 917, 314 (above, API Corporation).

As a commercial item of the compound having a hindered amine structure, Adkstab LA-52, the same LA57, the same LA-62, the same LA-67, the same LA-63P, the same LA-68LD, the same LA-77, the same are mentioned. LA-82, same as LA-87 (above is made by Adeka), sumilizer 9A (manufactured by Sumitomo Chemical Co., Ltd.), CHIMASSORB 119FL, 2020FDL, 944FDL, TINUVIN 622LD, 144, 765, and 770DF (the above is CIBA Japan) .

As a commercial item of the compound having a phosphate alkyl ester structure, for example, Adkstab PEP-4C, the same PEP-8, the same PEP-8W, the same PEP-24G, the same PEP-36, the same HP-10, the same 2112, Same as 260, 522A, 1178, 1500, C, 135A, 3010, TPP (above ADEKA), IRGAFOS 168 (CIBA Japan).

Examples of commercially available products having a thioether structure include Adkstab AO-412S, AO-503 (above, ADEKA), sumilizer TPL-R, TPM, TPS, TP-D, and MB. (The above is manufactured by Sumitomo Chemical Co., Ltd.), IRGANOX PS800FD, the same as PS802FD (above is CIBA Japan), DLTP, DSTP, DMTP, DTTP (above, manufactured by API Corporation).

Among these [F] antioxidants, preferred are compounds having a phenol compound or a hindered phenol structure, more preferably 4-methoxyphenol, 2,6-di-t-butyl-4-cresol, 1,3,5-trimethyl-2,4,6-tris(3,5-di-t-butyl-4-hydroxybenzyl)benzene, tris-(3,5-di-t-butyl 4-hydroxybenzyl)-isocyanate, neopentyltetrakis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate].

[F] The antioxidant may be used singly or in combination of two or more. The content of the [F] antioxidant in the composition is preferably 0.1 parts by mass to 10 parts by mass, more preferably 0.2 parts by mass to 5 parts by mass, per 100 parts by mass of the [A] polymer. By setting the content of the [F] antioxidant to the above specific range, the transmittance and heat-resistant transparency of the interlayer insulating film for a display element can be further improved.

<[G]epoxy compound>

The composition may further contain [G] a compound having two or more epoxy groups in one molecule as a suitable component. Since this composition further contains a [G] epoxy compound, the transmittance and heat-resistant transparency of the interlayer insulating film for display elements can be improved.

The [G] epoxy compound is not particularly limited as long as it is a compound having two or more epoxy groups in one molecule, except for the [A] polymer. Examples of the epoxy group include an oxiranyl group (1,2-epoxy structure), an oxetanyl group (1,3-epoxy structure), and a 3,4-epoxycyclohexyl group.

Examples of the compound having two or more oxirane groups in one molecule include bisphenol A diepoxypropyl ether (4,4'-isopropylidene diphenol and 1-chloro-2). , polycondensate of 3-epoxypropane), bisphenol F diglycidyl ether, bisphenol S diglycidyl ether, hydrogenated bisphenol A diglycidyl ether, hydrogenated bisphenol F bicyclic Oxypropyl propyl ether, hydrogenated bisphenol AD diglycidyl ether, brominated bisphenol A diglycidyl ether, brominated bisphenol F diglycidyl ether, brominated bisphenol S diglycidyl Di-epoxypropyl ether of bisphenol compound such as ether; 1,4-butanediol diepoxypropyl ether, 1,6-hexanediol diepoxypropyl ether, glycerol triepoxypropyl ether, a polyepoxypropyl ether of a polyhydric alcohol such as trimethylolpropane triepoxypropyl ether, polyethylene glycol diepoxypropyl ether or polypropylene glycol diepoxypropyl ether; a polyepoxy propyl ether of a polyether polyol obtained by adding one or more kinds of alkylene oxides to an aliphatic polyol such as propylene glycol or glycerin; a phenol novolak type epoxy resin; and a cresol novolak type Epoxy resin; polyphenol epoxy resin; cyclic aliphatic epoxy resin Diglycidyl esters of aliphatic long-chain dibasic propyl acid; glycidyl esters of higher fatty acids; epoxidized soybean oil, epoxidized linseed oil and the like.

Examples of the compound having two or more oxetanyl groups (1,3-epoxy structure) in one molecule include 1,4-bis[(3-ethyl-3-oxetan). Alkyloxy)methyl]benzene, bis{[1-ethyl(3-oxetane)]methyl}ether, and the like.

Examples of the compound having two or more 3,4-epoxycyclohexyl groups in one molecule include 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexane. Carboxylic acid ester, 2-(3,4-epoxycyclohexyl-5,5-spiro-3,4-epoxy)cyclohexane-intermediate Alkane, bis(3,4-epoxycyclohexylmethyl)adipate, bis(3,4-epoxy-6-methylcyclohexylmethyl)adipate, 3,4-ring Oxy-6-methylcyclohexyl-3',4'-epoxy-6'-methylcyclohexanecarboxylate, methylenebis(3,4-epoxycyclohexane), two Cyclopentadiene diepoxide, di(3,4-epoxycyclohexylmethyl)ether of ethylene glycol, ethyl bis(3,4-epoxycyclohexanecarboxylate), internal The ester is modified with 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexanecarboxylate or the like.

Examples of the commercially available product of the [G] epoxy compound include, as a bisphenol A type epoxy resin, Epicoat 1001, 1002, 1003, 1004, 1007, 1009, and 1010. The same as 828 (the above is made of Japanese epoxy resin), etc., the bisphenol F type epoxy resin, Epicoat 807 (made by Nippon epoxy resin), etc., and the phenol novolak type epoxy resin, Epicoat 152 is mentioned. 154, the same as 157S65 (the above is made of Japanese epoxy resin), EPPN201, the same 202 (the above is made by Nippon Chemical Co., Ltd.), etc.; as the cresol novolac type epoxy resin, EOCN102, the same 103S, the same 104S , 1020, 1025, 1027 (the above are manufactured by Nippon Kasei Co., Ltd.), Epicoat 180S75 (made by Nippon Epoxy Resin), etc.; as the polyphenol type epoxy resin, Epicoat 1032H60 and XY-4000 (the above is Japan Epoxy) Examples of the cyclic aliphatic epoxy resin include CY-175, 177, 179, Araldite CY-182, 192, 184 (above, CIBA Specialty Chemicals), and ERL-4234. 4299, 4221, 4206 (above is UCC), Shodyne 509 (made by Showa Denko), Epiclon 200, and 400 (above is Japanese oil) Ink), Epicoat 871, 872 (the above is made of Japanese epoxy resin), ED-5661, and 5662 (above, manufactured by Celanese Coating); and as the aliphatic polyepoxypropyl ether, Epolight 100MF (Epolight 100MF) Co., Ltd., Epiol TMP (made by Nippon Oil & Fats Co., Ltd.), 1,4-bis[(3-ethyl-3-oxetanylmethoxy)methyl]benzene, bis{[1-ethyl (3-oxetane)]methyl}ether or the like.

Among these, bisphenol A diepoxypropyl ether (polycondensate of 4,4'-isopropylidenediphenol and 1-chloro-2,3-epoxypropane), double Phenol F diepoxypropyl ether, 1,4-bis[(3-ethyl-3-oxetanylmethoxy)methyl]benzene, bis{[1-ethyl(3-oxocyclo) Butane)] methyl}ether, 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexanecarboxylate.

The [G] epoxy compound may be used alone or in combination of two or more. The content of the [G] epoxy compound in the composition is preferably from 1 part by mass to 30 parts by mass, more preferably from 3 parts by mass to 15 parts by mass, per 100 parts by mass of the [A] polymer. By setting the content of the [G] epoxy compound to the above specific range, the transmittance and heat-resistant transparency of the interlayer insulating film for a display element can be further improved.

<Other optional ingredients>

The composition may contain [H] adhesion aid, [I] basic compound, [J]醌, in addition to the above-mentioned [A] to [G] components, within a range that does not impair the desired effect. Other optional components such as a diazide compound. These other optional components may be used singly or in combination of two or more. Hereinafter, each component will be described in detail.

[[H] adhesion aid]

In order to improve the inorganic substance as the substrate, for example, an antimony compound such as ruthenium, iridium oxide or tantalum nitride, or a metal such as gold, copper or aluminum and an insulating film, an adhesion aid can be used. As the adhesion aid, a functional decane coupling agent is preferred. Examples of the functional decane coupling agent include a decane coupling agent having a reactive substituent such as a carboxyl group, a methacryl group, an isocyanate group, an epoxy group (preferably an oxiran group), or a thiol group. .

Examples of the functional decane coupling agent include trimethoxydecyl benzoic acid, γ-methyl propylene methoxy propyl trimethoxy decane, vinyl triethoxy decane, and vinyl trimethoxy decane. γ-Isocyanatepropyltriethoxydecane, γ-glycidoxypropyltrimethoxydecane, γ-glycidoxypropylalkyldialkoxydecane, γ-chloropropyltrialkoxide Basear, γ-mercaptopropyltrialkoxydecane, β-(3,4-epoxycyclohexyl)ethyltrimethoxydecane, and the like. Among these, γ-glycidoxypropylalkyldialkoxydecane, β-(3,4-epoxycyclohexyl)ethyltrimethoxydecane, and γ-methyl are preferred. Propylene methoxypropyltrimethoxydecane.

The content of the [H] adhesion aid in the composition is preferably 0.5 parts by mass or more and 20 parts by mass or less, more preferably 1 part by mass or more and 10 parts by mass or less based on 100 parts by mass of the [A] polymer. the following. By setting the content of the [H] adhesion aid to the above specific range, the adhesion between the formed interlayer insulating film for a display element and the substrate can be further improved.

[[I] basic compound]

As the [I] basic compound, it can be arbitrarily selected from those used in chemically amplified photoresists. For example, an aliphatic amine, an aromatic amine, a heterocyclic amine, a quaternary ammonium hydroxide, a quaternary ammonium carboxylic acid salt, etc. are mentioned. By including the [1] basic compound in the composition, the diffusion length of the acid generated from the [B] compound by exposure can be appropriately controlled, and the pattern developability can be improved.

Examples of the aliphatic amine include trimethylamine, diethylamine, triethylamine, di-n-propylamine, tri-n-propylamine, di-n-pentylamine, tri-n-pentylamine, diethanolamine, triethanolamine, dicyclohexylamine, and Cyclohexylmethylamine.

Examples of the aromatic amine include aniline, benzylamine, N,N-dimethylaniline, and diphenylamine.

Examples of the heterocyclic amine include pyridine, 2-methylpyridine, 4-methylpyridine, 2-ethylpyridine, 4-ethylpyridine, 2-phenylpyridine, 4-phenylpyridine, and N-. Methyl-4-phenylpyridine, 4-dimethylaminopyridine, imidazole, benzimidazole, 4-methylimidazole, 2-phenylbenzimidazole, 2,4,5-triphenylimidazole, smoke Alkali, nicotinic acid, nicotinamide, quinoline, 8-hydroxyquinoline, pyridyl , pyrazole, hydrazine , hydrazine, pyrrolidine, piperidine, piperidine , morpholine, 4-methylmorpholine, 1,5-diazabicyclo[4,3,0]-5-pinene, 1,8-diazabicyclo[5,3,0]-7- Undecene and the like.

Examples of the quaternary ammonium hydroxide include tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetra-n-butylammonium hydroxide, and tetra-n-hexylammonium hydroxide.

Examples of the carboxylic acid quaternary ammonium salt include tetramethylammonium acetate, ammonium tetramethylbenzoate, tetra-n-butylammonium acetate, and tetra-n-butylbenzoic acid ammonium.

Among these [I] basic compounds, a heterocyclic amine is preferred, and more preferably 4-dimethylaminopyridine or 1,5-diazabicyclo[4,3,0]-5- Terpene.

The content of the [I] basic compound in the composition is preferably 0.001 part by mass to 1 part by mass, more preferably 0.005 part by mass to 0.2 part by mass, per 100 parts by mass of the [A] polymer. The pattern development property is further improved by setting the content of the [I] basic compound to the above specific range.

[[J] quinone azide compound]

[J] The quinonediazide compound is a compound which generates a carboxylic acid by irradiation with radiation. As the [J] quinone diazide compound, a condensate of a phenolic compound or an alcoholic compound (hereinafter also referred to as "mother core") and 1,2-naphthoquinonediazidesulfonium halide can be used.

Examples of the mother nucleus include trihydroxydiphenyl ketone, tetrahydroxydiphenyl ketone, pentahydroxydiphenyl ketone, hexahydroxydiphenyl ketone, (polyhydroxyphenyl) alkane, and other mother nucleus.

Examples of the trihydroxydiphenyl ketone include 2,3,4-trihydroxydiphenyl ketone and 2,4,6-trihydroxydiphenyl ketone.

Examples of the tetrahydroxydiphenyl ketone include 2,2',4,4'-tetrahydroxydiphenyl ketone, 2,3,4,3'-tetrahydroxydiphenyl ketone, and 2,3,4. , 4'-tetrahydroxydiphenyl ketone, 2,3,4,2'-tetrahydroxy-4'-methyldiphenyl ketone, 2,3,4,4'-tetrahydroxy-3'-methoxy Diphenyl ketone and the like.

Examples of the pentahydroxydiphenyl ketone include 2,3,4,2',6'-pentahydroxydiphenyl ketone.

Examples of the hexahydroxydiphenyl ketone include 2,4,6,3',4',5'-hexahydroxydiphenyl ketone, 3,4,5,3',4',5'-hexa. Hydroxydiphenyl ketone and the like.

Examples of the (polyhydroxyphenyl)alkane include bis(2,4-dihydroxyphenyl)methane, bis(p-hydroxyphenyl)methane, tris(p-hydroxyphenyl)methane, 1,1,1- Tris(p-hydroxyphenyl)ethane, bis(2,3,4-trihydroxyphenyl)methane, 2,2-bis(2,3,4-trihydroxyphenyl)propane, 1,1,3- Tris(2,5-dimethyl-4-hydroxyphenyl)-3-phenylpropane, 4,4'-[1-[4-[1-[4-hydroxyphenyl]-1-methyl-ethyl Phenyl]ethylidene]bisphenol, bis(2,5-dimethyl-4-hydroxyphenyl)-2-hydroxyphenylmethane, 3,3,3',3'-tetramethyl- 1,1'-spirobi-5,6,7,5',6',7'-hexanol, 2,2,4-trimethyl-7,2',4'-trihydroxyflavan, etc. As other parent cores, for example, 2-methyl-2-(2,4-dihydroxyphenyl)-4-(4-hydroxyphenyl)-7-hydroxychroman, 1-[1-( 3-{1-(4-hydroxyphenyl)-1-methylethyl}-4,6-dihydroxyphenyl)-1-methylethyl]-3-(1-(3-{1- (4-hydroxyphenyl)-1-methylethyl}-4,6-dihydroxyphenyl)-1-methylethyl)benzene, 4,6-bis{1-(4-hydroxyphenyl) -1-methylethyl}-1,3-dihydroxybenzene and the like.

Among these cores, 2,3,4,4'-tetrahydroxydiphenyl ketone, 1,1,1-tris(p-hydroxyphenyl)ethane, 4,4'-[1 -[4-[1-[4-Hydroxyphenyl]-1-methylethyl]phenyl]ethylidene]bisphenol.

As the 1,2-naphthoquinonediazidesulfonium halide, 1,2-naphthoquinonediazidesulfonium chloride is preferred. Examples of the 1,2-naphthoquinonediazidesulfonium chloride include 1,2-naphthoquinonediazide-4-sulfonyl chloride, 1,2-naphthoquinonediazide-5-sulfonyl chloride, and the like. . Among these, 1,2-naphthoquinonediazide-5-sulfonyl chloride is preferred.

As a condensate of a phenolic compound or an alcoholic compound and 1,2-naphthoquinonediazidesulfonium halide, 1,1,1-tris(p-hydroxyphenyl)ethane and 1,2-naphthoquinone are preferred. Condensate of diazide-5-sulfonyl chloride, 4,4'-[1-[4-[1-[4-hydroxyphenyl]-1-methylethyl]phenyl]ethylidene] a condensate of phenol with 1,2-naphthoquinonediazide-5-sulfonyl chloride.

In the condensation reaction of the phenolic compound or the parent nucleus with the 1,2-naphthoquinonediazide sulfonium halide, the number of OH groups in the phenolic compound or the alcoholic compound can be preferably used in an amount of preferably 30 to 85 moles. More preferably, the ear is more preferably 50 to 70 mol% of 1,2-naphthoquinonediazide sulfonium halide. The condensation reaction can be carried out by a well-known method.

As the [J] quinone diazide compound, it is also suitable to use 1,2-naphthoquinonediazidesulfonamide which has been changed from the ester bond of the above-exemplified parent core to a guanamine bond, for example, 2,3,4- Triaminodiphenyl ketone-1,2-naphthoquinonediazide-4-sulfonamide and the like.

<Modulation method of positive type radiation sensitive composition for discharge nozzle type coating method>

This composition is prepared by mixing [A] polymer, [B] compound, optionally a suitable component, and other optional components in a [C] organic solvent to dissolve or disperse. For example, in [C] an organic solvent, the composition can be prepared by mixing the components in a specified ratio.

<Method of Forming Interlayer Insulation Film for Display Element>

In the present invention, it is also suitable to contain an interlayer insulating film for a display element formed of the composition. The method for forming an interlayer insulating film for a display element of the present invention has:

(1) a step of forming a coating film by applying the composition onto a substrate while moving the discharge nozzle relative to the substrate.

(2) a step of irradiating at least a part of the coating film formed as described above,

(3) a step of developing a coating film irradiated with the above radiation, and

(4) A step of heating the above-described developed coating film.

According to this formation method, it is possible to form a cured film having excellent film thickness uniformity by coating at a high speed and having excellent radiation sensitivity, and forming a pattern by radiation-sensitive exposure, illumination, and heating. An interlayer insulating film for a display element having a fine and delicate pattern can be easily formed. In addition, the interlayer insulating film for a display element thus formed has high flatness without coating unevenness, and is applicable to display elements such as liquid crystal display elements and organic EL display elements.

[step 1)]

In this step, while the discharge nozzle is moved relative to the substrate, the composition is applied onto the substrate to form a coating film. It is preferred to remove the [C] organic solvent by prebaking the coated surface.

Examples of the substrate include glass, quartz, polyfluorene, and resin. Examples of the resin include open-loop polymers of polyethylene terephthalate, polybutylene terephthalate, polyether oxime, polycarbonate, polyimine, and cyclic olefin, and hydrogenated products thereof. Wait. The pre-baking conditions vary depending on the type and blending ratio of each component, and can be carried out at 70 to 120 ° C for about 1 to 10 minutes.

[Step (2)]

In this step, at least a part of the coating film formed as described above is irradiated with radiation to perform exposure. Exposure is typically performed via a photomask having a specified pattern. The radiation used for the exposure is preferably a radiation having a wavelength in the range of 190 nm to 450 nm, and more preferably a radiation containing ultraviolet rays of 365 nm. The exposure amount is a value obtained by measuring the intensity of radiation at a wavelength of 365 nm by an illuminometer (OAI model 356, manufactured by OAI Optical Associates Inc.), preferably 500 J/m ² to 6,000 J/m ² , more preferably 1,500. J/m ² to 1,800 J/m ² .

[Step (3)]

In this step, the above-mentioned coated film of the irradiated radiation is developed. By developing the exposed coating film, unnecessary portions (irradiated portions of radiation) are removed to form a predetermined pattern. As the developing liquid used in the developing step, an alkaline aqueous solution is preferred. Examples of the base include inorganic bases such as sodium hydroxide, potassium hydroxide, sodium carbonate, sodium citrate, sodium metasilicate, and ammonia; and quaternary ammonium salts such as tetramethylammonium hydroxide and tetraethylammonium hydroxide. Wait.

An appropriate amount of a water-soluble organic solvent such as methanol or ethanol or a surfactant may be added to the aqueous alkali solution. The concentration of the alkali in the aqueous alkali solution is preferably from 0.1% by mass to 5% by mass, from the viewpoint of obtaining appropriate development properties. Examples of the development method include a liquid-filling method, a dipping method, a shaking dipping method, and a shower method. The development time varies depending on the composition of the composition, but is about 10 to 180 seconds. After such development processing, for example, after washing with running water for 30 to 90 seconds, for example, by air drying with compressed air or compressed nitrogen, a desired pattern can be formed.

[Step (4)]

In this step, the above-described developed coating film is heated. During heating, the patterned film is heated by a heating device such as a hot plate or an oven to promote the hardening reaction of the [A] polymer to obtain a cured product. The heating temperature is, for example, about 120 ° C to 250 ° C. The heating time varies depending on the type of the heating device, and is, for example, about 5 minutes to 30 minutes on a hot plate and about 30 minutes to 90 minutes in an oven. Further, a stage baking method in which two or more heating steps are performed may be used. Thus, a pattern-like film corresponding to the intended interlayer insulating film can be formed on the surface of the substrate.

The thickness of the interlayer insulating film for a display element to be formed is preferably 0.1 μm to 8 μm, more preferably 0.1 μm to 6 μm, particularly preferably 0.1 μm to 4 μm.

[Examples]

Hereinafter, the present invention will be described in detail based on the examples, but the present invention is not limited by the description of the examples.

<[A] Synthesis of Polymers> [Synthesis Example 1]

In a flask equipped with a cooling tube and a stirrer, 7 parts by mass of ADVN as a polymerization initiator and 200 parts by mass of diethylene glycol ethyl methyl ether as a solvent were added. Next, 40 parts by mass of 1-ethoxyethyl methacrylate to the structural unit (I), 40 parts by mass of glycidyl methacrylate to the epoxy group-containing structural unit, and 5 parts by mass of the other structure are added. a unit of methacrylic acid, 5 parts by mass of styrene, 10 parts by mass of 2-hydroxyethyl methacrylate, and 3 parts by mass of an α-methylstyrene dimer as a molecular weight modifier, which is slowly replaced by nitrogen. Start stirring. The temperature of the solution was raised to 70 ° C and maintained at this temperature for 5 hours to obtain a polymer solution containing the polymer (A-1). The Mw of the polymer (A-1) was 9,000. The solid content concentration of the polymer solution was 32.1% by mass.

[Synthesis Example 2]

In a flask equipped with a cooling tube and a stirrer, 7 parts by mass of ADVN as a polymerization initiator and 200 parts by mass of diethylene glycol ethyl methyl ether as a solvent were added. Next, 40 parts by mass of 2-tetrahydropyranyl methacrylate to which structural unit (I) is administered, 40 parts by mass of glycidyl methacrylate to which an epoxy group-containing structural unit is administered, and 5 parts by mass are added to other structures. 3 parts by mass of methacrylic acid, 5 parts by mass of styrene, 10 parts by mass of 2-hydroxyethyl methacrylate, and 3 parts by mass of α-methylstyrene dimer as a molecular weight modifier, after nitrogen substitution Slowly start stirring. The temperature of the solution was raised to 70 ° C and maintained at this temperature for 5 hours to obtain a polymer solution containing the polymer (A-2). The Mw of the polymer (A-2) was 9,000. The solid content concentration of the polymer solution was 31.3% by mass.

[Synthesis Example 3]

In a flask equipped with a cooling tube and a stirrer, 8 parts by mass of 2,2'-azobis(methyl 2-methylpropionate) as a polymerization initiator and 300 parts by mass of methyl isobutylene as a solvent were added. Ketone. Next, 40 parts by mass of 2-tetrahydropyranyl methacrylate to the structural unit (I) and 40 parts by mass of 3-(methacryloxymethyl)-3-ethyloxetane are added. 5 parts by mass of methacrylic acid to other structural units and 15 parts by mass of 2-hydroxyethyl methacrylate were added, and after nitrogen substitution, stirring was started slowly. The temperature of the solution was raised to 80 ° C and maintained at this temperature for 6 hours to obtain a polymer solution. Next, the obtained polymer solution was poured into excess heptane to reprecipitate the polymer. The supernatant of heptane was removed by decantation. Then, filtration was carried out, and the obtained polymer was vacuum dried for 24 hours to obtain a polymer (A-3). The Mw of the polymer (A-3) was 8,000. The solid content concentration of the polymer solution was 29.8% by mass.

[Synthesis Example 4]

In a flask equipped with a cooling tube and a stirrer, 7 parts by mass of ADVN as a polymerization initiator and 200 parts by mass of diethylene glycol ethyl methyl ether as a solvent were added. Next, 35 parts by mass of 1-n-butoxyethyl methacrylate to the structural unit (I), 30 parts by mass of the epoxy methacrylate to the epoxy group-containing structural unit, and 35 parts by mass are added to the other. The benzyl methacrylate of the structural unit was slowly stirred after the nitrogen was replaced. The temperature of the solution was raised to 80 ° C and maintained at this temperature for 6 hours to obtain a polymer solution containing the polymer (A-4). The Mw of the polymer (A-4) was 10,000. The solid content concentration of the polymer solution was 32.3% by mass.

[Synthesis Example 5]

In a flask equipped with a cooling tube and a stirrer, 7 parts by mass of 2,2'-azobis(methyl 2-methylpropionate) as a polymerization initiator and 200 parts by mass of propylene glycol monomethyl as a solvent were added. Ether acetate. Next, 67 parts by mass of 1-n-butoxyethyl methacrylate to the structural unit (I), 10 parts by mass of methacrylic acid to be given to other structural units, and 23 parts by mass of benzyl methacrylate were added, after nitrogen substitution. Slowly start stirring. The temperature of the solution was raised to 80 ° C and maintained at this temperature for 6 hours to obtain a polymer solution containing the polymer (a-1). The Mw of the polymer (a-1) was 9,000. The solid content concentration of the polymer solution was 30.3% by mass.

[Synthesis Example 6]

In a flask equipped with a cooling tube and a stirrer, 7 parts by mass of 2,2'-azobis(methyl 2-methylpropionate) as a polymerization initiator and 200 parts by mass of propylene glycol monomethyl as a solvent were added. Ether acetate. Next, 90 parts by mass of 1-benzyloxyethyl methacrylate to the structural unit (I), 6 parts by mass of 2-hydroxyethyl methacrylate to other structural units, and 4 parts by mass of methacrylic acid, nitrogen are added. After the replacement, the stirring was started slowly. The temperature of the solution was raised to 80 ° C and maintained at this temperature for 6 hours to obtain a polymer solution containing the polymer (a-2). The polymer (a-2) Mw was 9,000. The solid content concentration of the polymer solution was 31.2% by mass.

[Synthesis Example 7]

In a flask equipped with a cooling tube and a stirrer, 7 parts by mass of 2,2'-azobis(methyl 2-methylpropionate) as a polymerization initiator and 200 parts by mass of propylene glycol monomethyl as a solvent were added. Ether acetate. Next, 85 parts by mass of 2-tetrahydropyranyl methacrylate to the structural unit (I), 7 parts by mass of 2-hydroxyethyl methacrylate to other structural units, and 8 parts by mass of methacrylic acid, nitrogen are added. After the replacement, the stirring was started slowly. The temperature of the solution was raised to 80 ° C and maintained at this temperature for 6 hours to obtain a polymer solution containing the polymer (a-3). The polymer (a-3) had a Mw of 10,000. The solid content concentration of the polymer solution was 29.2% by mass.

[Synthesis Example 8]

In a flask equipped with a cooling tube and a stirrer, 7 parts by mass of ADVN as a polymerization initiator and 200 parts by mass of diethylene glycol ethyl methyl ether as a solvent were added. Next, 52 parts by mass of glycidyl methacrylate to which an epoxy group-containing structural unit was added and 48 parts by mass of benzyl methacrylate to other structural units were added, and after nitrogen substitution, stirring was slowly started. The temperature of the solution was raised to 80 ° C and maintained at this temperature for 6 hours to obtain a polymer solution containing the polymer (a-4). The polymer (a-4) had a Mw of 10,000. The solid content concentration of the polymer solution was 32.3% by mass.

[Synthesis Example 9]

In a flask equipped with a cooling tube and a stirrer, 7 parts by mass of ADVN as a polymerization initiator and 200 parts by mass of diethylene glycol ethyl methyl ether as a solvent were added. Next, 45 parts by mass of 3,4-epoxycyclohexylmethyl methacrylate to which an epoxy group-containing structural unit is administered, 45 parts by mass of benzyl methacrylate to be given to other structural units, and 10 parts by mass of methyl group are added. Acrylic acid, after nitrogen replacement, slowly started stirring. The temperature of the solution was raised to 80 ° C, and maintained at this temperature for 6 hours to obtain a polymer solution containing the polymer (a-5). The polymer (a-5) had a Mw of 10,000. The solid content concentration of the polymer solution was 33.2% by mass.

<Preparation of positive-type radiation-sensitive linear composition by spouting nozzle coating method>

Hereinafter, the components used in the preparation of the radiation sensitive composition of the examples and the comparative examples will be described in detail.

<[B] compound>

B-1 to B-5 are oxime sulfonate compounds. B-6 and B-7 are sulfonium salts (B-6-based tetrahydrothiophene sulfonium salt, B-7 sulfonium salt).

B-1: (5-propylsulfonyloxyimino-5H-thienylene-2-yl)-(2-methylphenyl)acetonitrile represented by the above compound (i) (manufactured by CIBA Specialty Chemicals) ,IRGACURE PAG 103)

B-2: (5-octylsulfonyloxyimino-5H-thienylene-2-yl)-(2-methylphenyl)acetonitrile represented by the above compound (ii) (manufactured by CIBA Specialty Chemicals) ,IRGACURE PAG 108)

B-3: (5-p-toluenesulfonyloxyimino-5H-thienylene-2-yl)-(2-methylphenyl)acetonitrile represented by the above compound (iv) (manufactured by CIBA Specialty Chemicals) ,IRGACURE PAG 121)

B-4: (camphorsulfonyloxyimino-5H-thienylene-2-yl)-(2-methylphenyl)acetonitrile represented by the above compound (iii) (manufactured by CIBA Specialty Chemicals, CGI 1380) )

B-5: (5-octylsulfonyloxyimino)-(4-methoxyphenyl)acetonitrile represented by the above compound (v) (manufactured by CIBA Specialty Chemicals, CGI 725)

B-6: 4,7-di-n-butoxy-1-naphthyltetrahydrothiophene trifluoromethanesulfonate

B-7: benzyl-4-hydroxyphenylmethylphosphonium hexafluorophosphate

<[C]organic solvent>

(C1) organic solvent (vapor pressure at 20 ° C is 0.1 mmHg or more and less than 1 mmHg)

C-1-1: diethylene glycol ethyl methyl ether (20 ° C, 0.75 mmHg)

C-1-2: dipropylene glycol dimethyl ether (20 ° C, 0.38 mmHg)

(C2) Organic solvent (vapor pressure at 20 ° C is 1 mmHg or more and 20 mmHg or less)

C-2-1: Diethylene glycol dimethyl ether (20 ° C, 1.3 mmHg)

C-2-2: Propylene glycol monomethyl ether acetate (20 ° C, 3.75 mmHg)

C-2-3: cyclohexanone (20 ° C, 3.4 mmHg)

Solvent used in the comparative example

1,4-two Alkane (20 ° C, 29 mm Hg)

Ethylene glycol (20 ° C, 0.08 mmHg)

<[D] surfactant]

D-1: Polyoxo-based surfactant (Dolly Dow Corning ‧ Polyoxane, SH 8400 FLUID)

D-2: Fluorine-based surfactant (manufactured by NEOS, Ftergent FTX-218)

<[E] polyfunctional (meth) acrylate compound>

E-1: ethylene glycol dimethacrylate

E-2: Trimethylolpropane trimethacrylate

E-3: neopentyl alcohol tetraacrylate

<[F]antioxidant>

F-1: 2,6-di-t-butyl-4-cresol

F-2: 4-methoxyphenol

<[G]epoxy compound>

G-1: 2 bisphenol A diglycidyl ether (polycondensate of 4,4'-isopropylidene diphenol and 1-chloro-2,3-epoxypropane)

G-2: 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexanecarboxylate

<[H] adhesion aid>

H-1: γ-glycidoxypropyltrimethoxydecane

H-2: β-(3,4-epoxycyclohexyl)ethyltrimethoxydecane

H-3: γ-methacryloxypropyltrimethoxydecane

<[1] Basic Compound>

I-1: 4-dimethylaminopyridine

I-2: 1,5-diazabicyclo[4,3,0]-5-nonene

[Example 1]

In the solution containing the polymer (A-1) (corresponding to 100 parts by mass (solid content) of the polymer (A-1)), 3 parts by mass of (B-1) which is a compound of [B] is added, (C-1-1) which is (C1) organic solvent is added so as to have a desired solid content concentration, and 0.2 parts by mass of (D-1) as a [D] surfactant is mixed, and a pore diameter of 0.2 μm is used. The membrane filter was filtered to prepare a positive-type radiation-sensitive composition for the discharge nozzle coating method.

[Examples 2 to 16 and Comparative Examples 1 to 4]

Each composition was prepared in the same manner as in Example 1 except that the types and amounts of the respective components were as described in Table 1. Further, the value of the [C] organic solvent in Table 1 is the mass% ratio of the (C1) organic solvent to the (C2) organic solvent. Further, "-" in Table 1 means that the component is not used.

<evaluation>

The following evaluation was carried out using each of the prepared compositions. The results are shown in combination in Table 1.

[viscosity (mPa‧s)]

The viscosity (mPa‧s) of the composition at 25 ° C was measured using an E-type viscometer (VISCONIC ELD.R).

[solid content concentration (% by mass)]

0.3 g of each composition was weighed in an aluminum dish, and about 1 g of diethylene glycol dimethyl ether was added, and then dried on a hot plate at 175 ° C for 60 minutes, and the composition was determined from the mass before and after drying. Solid content concentration (% by mass).

[Appearance of film]

Each of the prepared compositions was applied onto a 550 × 650 mm chrome-film-forming glass using a slit die coater (manufactured by Tokyo Chemical Industry Co., Ltd., TR632105-CL), dried under reduced pressure at 0.5 Torr, and then placed on a hot plate. The coating film was prebaked at 100 ° C for 2 minutes, and exposed to an exposure amount of 2,000 J/m ² to form a film having a film thickness of 4 μm from the upper surface of the chromium film-forming glass. The appearance of the coating film was visually observed under a sodium lamp. At this time, the unevenness of the ribs in the entire coating film (the line of the one or a plurality of lines formed in the coating direction or the direction intersecting therewith is uneven), the unevenness of the mist (uneven clouds), and the needle marks are not investigated. The occurrence of both (dot unevenness formed on the substrate supporting needle). The case where you have seen almost no such unevenness is regarded as "A" (good judgment), and the situation of slightly seeing either one is regarded as "B" (slightly bad judgment), and it will be clearly seen. The situation is considered good "C" (bad judgment).

[Thickness uniformity (%)]

The film thickness of the coating film on the chromium film-forming glass produced as described above was measured using a film thickness measuring device (Lambda Ace, manufactured by Daicel SCREEN). The film thickness uniformity was measured by the film thickness of nine measurement points, and was calculated by the following formula. The nine measurement points are regarded as X in the short axis direction of the substrate, Y as the long axis direction, and (275, 20), (275, 30), (275, (X, mm, Y, [mm]). 60), (275, 100), (275, 325), (275, 550), (275, 590), (275, 620), (275, 630). When the film thickness uniformity was more than 1.80% and 2% or less, it was judged to be slightly good, and when the film thickness uniformity was 1.80% or less, it was judged to be good.

Film thickness uniformity (%) = {FT (X, Y) max - FT (X, Y) min} × 100 / {2 × FT (X, Y) avg.}

In the above formula, FT(X, Y)max is the maximum of the film thicknesses of the nine measurement points, and FT(X, Y)min is the minimum of the film thicknesses of the nine measurement points, FT(X, Y) Avg. is the average of the film thicknesses of the nine measurement points.

[High speed coating property (mm/sec.)]

On a 550 × 650 mm alkali-free glass substrate, a slit die coater was used, and the coating conditions were such that the distance between the substrate and the nozzle was 150 μm, and the film thickness after the exposure was 2.5 μm, and the coating liquid was discharged from the nozzle to form a nozzle. The moving speed is changed in the range of 120 mm/sec. to 220 mm/sec., and the maximum speed of the unevenness due to the liquid breakage is not obtained. At this time, even if the rib-like unevenness did not occur even at a speed of 180 mm/sec or more, it was judged that the high-speed coating property was good.

[radiation sensitivity (J/m ² )]

On 550 x 650 mm chromium film-forming glass, hexamethyldioxane was applied and heated at 60 ° C for 1 minute. Using a slit die coater (manufactured by Tokyo Chemical Industry Co., Ltd., TR632105-CL), each composition was coated on the hexamethyldiazane treated chromium film-forming glass, and the reaching pressure was set at 100 Pa in vacuum. After removing the solvent, it was prebaked at 90 ° C for 2 minutes to form a coating film having a film thickness of 3.0 μm. Next, using a exposure machine (manufactured by CANON, MPA-600FA), a mask having a pattern of lines and gaps (10 to 1) of 60 μm was used, and the exposure amount of the coating film was measured as a variable, and then the radiation was irradiated as shown in Table 1. The concentration of the aqueous solution of tetramethylammonium hydroxide was visualized by a liquid-holding method at 25 °C. The development time was 80 seconds when a developer having a concentration of tetramethylammonium hydroxide was 0.40% by mass, and 50 seconds when a developer of 2.38 mass% was used. Subsequently, it was washed with ultrapure water for 1 minute, and then dried to form a pattern on the HMDS-treated chrome-film-formed glass substrate. At this time, the amount of exposure necessary for completely dissolving the gap pattern of 6 μm was investigated. When the value is 500 J/m ² or less, the sensitivity is judged to be good.

[Transmission rate (%)]

Each of the prepared compositions was applied onto a glass substrate by a spin coater, and then prebaked on a hot plate at 90 ° C for 2 minutes to form a coating film having a film thickness of 3.0 μm. After the coating film was exposed to an exposure amount of 700 J/m ² , it was heated at 220 ° C for 1 hour in a clean oven to obtain a cured film. Next, the transmittance at a wavelength of 400 nm was measured using a spectrophotometer (Double Beam, Model 150-20, manufactured by Hitachi, Ltd.). The measured value (%) was taken as the transmittance, and the closer the value was to 100%, the better the transmittance, and the case where the value was less than 90% was judged to be poor in transparency.

[heat-resistant transparency (%)]

The substrate measured in the above evaluation of the transmittance was further heated in a clean oven at 250 ° C for 1 hour, and the light transmittance before and after the heating was measured in the same manner as the evaluation of the transmittance, and then the heat resistance transparency was calculated by the following formula. (%). The closer the value is to 0%, the better the heat-resistant transparency is, and when it exceeds 4%, it is judged that the heat-resistant transparency is poor.

Heat-resistant transparency (%) = transmittance before heating - transmittance after heating

As is clear from the results of Table 1, in Examples 1 to 16 using the composition, a coating film having high radiation sensitivity and excellent film thickness uniformity can be formed as compared with the compositions of Comparative Examples 1 to 4, and High-speed coating, the appearance of the film is also good.

Further, Examples 3 to 16 in which (C1) an organic solvent and (C2) an organic solvent were combined as the [C] organic solvent were compared with Examples 1 and 2 using only the (C1) organic solvent, and it was found that the film was observed. Thickness uniformity is more excellent. Further, with respect to the total amount of the (C1) organic solvent and the (C2) organic solvent, (C2) the organic solvent content is 50% by mass or less of Examples 3 to 11, and the (C1) organic solvent and (C2) In comparison with Example 12 in which the total amount of the organic solvent was (C2), the content of the organic solvent was 70% by mass, it was found that the appearance of the coating film and the film thickness uniformity were particularly excellent.

On the other hand, Examples 13 to 16 containing the [E] polyfunctional (meth) acrylate compound, [F] antioxidant, and [G] epoxy compound, which are suitable components of the composition, do not contain these components. In comparison with Examples 1 to 12, it was found that the transmittance and the heat-resistant transparency were more excellent.

[Industrial availability]

The positive-type radiation-sensitive composition for a discharge nozzle type coating method of the present invention has high radiation sensitivity, and can form an interlayer insulating film for display elements having high flatness (thickness uniformity) without coating unevenness, and And can be coated at high speed. Therefore, the composition is suitable as a material for forming an interlayer insulating film for a display element such as a liquid crystal display element or an organic EL display element.

Claims (10)

A positive-type radiation-sensitive linear composition for a discharge nozzle coating method comprising: [A] a structural unit (I) having a group represented by the following formula (1) in the same or different polymer molecules and containing a polymer of a structural unit of an epoxy group, [B] at least one compound selected from the group consisting of an oxime sulfonate compound and a phosphonium salt compound, [C] an organic solvent, and [E] polyfunctional (methyl) An acrylate compound having a solid content concentration of 10% by mass or more and 30% by mass or less, and a viscosity at 25 ° C of 2.0 mPa. s above 12mPa. s or less, and the [C] organic solvent contains at least (C1) an organic solvent having a vapor pressure at 20 ° C of 0.1 mmHg or more and less than 1 mmHg; (In the formula (1), R ¹ and R ² each independently represent a hydrogen atom, an alkyl group, a cycloalkyl group or an aryl group; however, part or all of the hydrogen atom possessed by the above alkyl group, cycloalkyl group or aryl group And may be substituted; in the case where R ¹ and R ^{2 are} simultaneously a hydrogen atom; R ³ is an alkyl group, a cycloalkyl group, an arylalkyl group, an aryl group or a group represented by -M(R ^3m ) ₃ , Some or all of the hydrogen atoms possessed by such groups may be substituted; M is Si, Ge or Sn; R ^3m is an alkyl group; however, R ¹ and R ³ may be attached, and these may be bonded to the carbon The atoms together form a cyclic ether). The positive-type radiation-sensitive composition for a discharge nozzle coating method according to the first aspect of the invention, wherein the [C] organic solvent further contains (C2) an organic solvent having a vapor pressure at 20 ° C of 1 mmHg or more and 20 mmHg or less. The content of the (C2) organic solvent is 10% by mass or more and 90% by mass or less based on the total amount of the (C1) organic solvent and the (C2) organic solvent. The positive-type radiation-sensitive composition for a discharge nozzle coating method according to the first aspect of the invention, wherein the [C] organic solvent further contains (C2) an organic solvent having a vapor pressure at 20 ° C of 1 mmHg or more and 20 mmHg or less. The content of the (C2) organic solvent is 10% by mass or more and 50% by mass or less based on the total amount of the (C1) organic solvent and the (C2) organic solvent. The positive-type radiation-sensitive linear composition for a discharge nozzle coating method according to the first aspect of the invention, further comprising [D] at least one selected from the group consisting of a fluorine-based surfactant and a polyfluorene-based surfactant. A surfactant is a content of the [D] surfactant in an amount of 0.01 part by mass or more and 2 parts by mass or less based on 100 parts by mass of the [A] polymer. The positive-type radiation-sensitive composition for a discharge nozzle coating method according to the first aspect of the invention is further characterized in that it further contains [F] an antioxidant. The positive-type radiation-sensitive composition for a discharge nozzle coating method according to the first aspect of the invention, which further comprises [G] a compound having two or more epoxy groups in one molecule. Extrusion nozzle coating as claimed in any one of claims 1 to 6 The method uses a positive-type radiation linear composition, wherein the (C1) organic solvent is selected from the group consisting of diethylene glycol ethyl methyl ether, diethylene glycol diethyl ether, dipropylene glycol dimethyl ether, benzyl alcohol, dipropylene glycol. At least one organic solvent in the group consisting of monomethyl ether. A positive-type radiation-sensitive linear composition for a discharge nozzle coating method according to the second or third aspect of the patent application, wherein the (C2) organic solvent is selected from the group consisting of diethylene glycol dimethyl ether and ethylene glycol monomethyl ether Acid ester, ethylene glycol monoethyl ether acetate, ethylene glycol monopropyl ether acetate, propylene glycol monomethyl ether acetate, cyclohexanone, n-butyl acetate, methyl isobutyl ketone, At least one organic solvent in the group consisting of methyl 3-methoxypropionate. An interlayer insulating film for a display element, which is formed by a positive-type radiation-sensitive composition for a discharge nozzle coating method according to any one of claims 1 to 8. A method for forming an interlayer insulating film for a display device, comprising: (1) using a discharge nozzle coating method according to any one of claims 1 to 8 while moving the discharge nozzle relative to the substrate a step of applying a radiation-sensitive composition on a substrate to form a coating film, (2) a step of irradiating at least a part of the coating film formed, and (3) developing a coating film irradiated with the radiation. a step, and (4) a step of heating the above-described developed coating film.