TWI522293B - Tray for containing wafers - Google Patents

Description

Wafer placement tray

The present invention relates to a wafer placement tray, and more particularly to a wafer placement tray that prevents a wafer placed in a lower tray from jumping off the accommodating groove due to violent shaking or vibration when the two placement trays are stacked one on another.

Wafer placement trays are commonly used to store wafers such as wafers, optical lenses, etc. In the prior art, a wafer placement tray has been disclosed, on which a plurality of accommodating grooves are planned for wafer placement.

Generally, after the wafer is loaded on the wafer, based on the convenience of transportation, the wafer is transported through a large number of stacked trays; however, in the prior art, although the two trays are stacked one on top of the other, The stability of the placement of the discs can be maintained by the corresponding snapping structure. However, since there is no limit structure at the bottom of the disc, the volume is very small in case of severe vibration or shaking. The wafer will have the risk of jumping away from the receiving slot.

The main object of the present invention is to provide a wafer placement tray that prevents a wafer placed in a receiving groove from jumping off the accommodating groove due to violent shaking or vibration.

In order to achieve the above object, the wafer placement disk of the present invention is used for placing a plurality of wafers, and the wafer placement disk comprises a body, a plurality of receiving grooves and a plurality of limiting members. The body has an upper surface and a lower surface, wherein the upper surface corresponds to the upper surface of the small surface. The plurality of accommodating slots are located on the upper surface of the body, and each of the accommodating slots is for accommodating the wafers. The plurality of limiting members are located on the lower surface of the body, and the limiting member is configured to be inserted into the receiving slots when the two wafer placing trays are stacked one on another to reduce the movable of each wafer in each receiving slot. Space, avoiding each wafer jumping out of each accommodating slot.

According to an embodiment of the present invention, each of the accommodating grooves has a long strip shape, and the plurality of limiting members are a plurality of bumps; when the two wafer placing trays are stacked one on another, they are snapped into the accommodating grooves. The number of bumps is plural, and the plurality of bumps stuck in the same accommodating groove are arranged in a straight line every time separated by a fixed distance.

According to another embodiment of the present invention, each of the accommodating grooves has a long strip shape, and the plurality of limiting members are a plurality of ribs; when the two wafer placing trays are stacked one on another, they are snapped into the accommodating grooves. The number of ribs is a single strip.

According to still another embodiment of the present invention, each of the accommodating grooves has a rectangular shape, and the plurality of limiting members are a plurality of bumps; when the two wafer placing trays are stacked one on another, they are snapped into the accommodating grooves. The number of bumps is plural, and the plurality of bumps stuck in the same accommodating groove are arranged in a rectangular shape.

According to still another embodiment of the present invention, each of the accommodating grooves has a rectangular shape, and the plurality of limiting members are each a convex block; when the two wafer placing disks are stacked one on another, they are inserted into the accommodating grooves. The number of the bumps is single, and the shape of each bump is substantially the same as the shape of each of the accommodating grooves.

In order to enable the reviewing committee to better understand the technical contents of the present invention, the preferred embodiments are described below.

Hereinafter, please refer to FIG. 1 to FIG. 3 for a schematic structural view of a first embodiment of the wafer placement tray of the present invention.

As shown in FIG. 1 and FIG. 3, in the first embodiment of the present invention, each wafer placement tray 1 is used to provide a plurality of wafers 90. The wafer placement tray 1 includes a body 10 and a plurality of receiving slots 20 The plurality of limiting members 30 and the fixing member 40. The body 10 has an upper surface 11 (shown in FIG. 1) and a lower surface 12 (shown in FIG. 2), wherein the upper surface 11 and the lower surface 12 correspond to each other.

In the first embodiment of the present invention, the accommodating groove 20 has a strip shape as shown in FIG. 1 , and the accommodating groove 20 is located on the upper surface 11 of the body 10. Each of the accommodating grooves 20 is for accommodating each of the wafers 90.

As shown in FIG. 2, in the first embodiment of the present invention, the plurality of limiting members 30 are complex bumps, each of the bumps is located on the lower surface 12 of the body 10, and the plurality of bumps are arranged in a plurality of straight lines. The limiting member 30 is configured to be inserted into each of the accommodating slots 20 when the two wafer placing trays 1 are stacked one on another. The number of the bumps that are inserted into the accommodating slots 20 is plural, and the same is stuck. The plurality of bumps in the accommodating groove are arranged in a straight line at a fixed distance from each other, thereby utilizing the bumps to reduce the movable space of each of the wafers 90 in each of the accommodating grooves 20, thereby preventing the wafer 90 from being severely affected. Shake or shake and jump out of the discharge slot 20.

As shown in FIG. 2 and FIG. 3, the fixing member 40 is formed by the lower surface 12 of the body 10. When the two wafer placing disks 1 are stacked one on another, the upper wafer placing disk 1 can be fixed by the fixing member 40. The card is placed against the lower body 10 of the wafer 1 so that the wafer placement tray 1 can remain stable when stacked.

As shown in FIG. 3, when the two wafer placement trays 1 are stacked one on top of the other, the positional member 30 of the upper wafer placement tray 1 is correspondingly inserted into the receiving groove 20 of the lower wafer placement tray 1. The movable space of the wafer 90 in the groove 20 is thus reduced, so that even if a sudden slosh or vibration suddenly occurs, the wafer 90 does not easily jump out of the accommodating groove 20, effectively improving the lack of the prior art.

Next, please refer to FIG. 4 to FIG. 6 for a schematic structural view of a second embodiment of the wafer placement tray of the present invention.

As shown in FIG. 4 and FIG. 5, in the second embodiment of the present invention, unlike the first embodiment, the shape of each of the limiting members 30 on the lower surface 12 of the body 10 and the shape of the receiving groove 20 are The ribs are substantially the same, that is, the strips are ribs, and each of the ribs is used to be inserted into each of the accommodating grooves 20 when the two wafer placing trays are stacked one on another. As shown in FIG. 6, the ribs are inserted into the accommodating groove 20, so that the movable space of the wafer 90 in the accommodating groove 20 can be reduced, and the same effect as that of the first embodiment can be achieved.

Further, please refer to FIG. 7 to FIG. 9 together with a schematic structural view of a third embodiment of the wafer placement tray of the present invention.

As shown in FIG. 7 and FIG. 8 , in the third embodiment of the present invention, unlike the first and second embodiments, the shape of each of the accommodating grooves 20 is a rectangular shape as shown in FIG. 8 . Each of the limiting members 30 is a bump. Each of the bumps is inserted into each of the accommodating slots 20 when the two wafer placing discs 1 are stacked one on another; wherein the shape of each of the bumps is substantially the same as the shape of each accommodating groove 20, and is convex. The area of the upper surface area of the block is only slightly smaller than the area of the receiving groove 20. As shown in FIG. 9, the bumps are inserted into the accommodating groove 20 to reduce the movable space of the wafer 90 in the accommodating groove 20, and the same effects as those of the first and second embodiments can be achieved.

Finally, please refer to FIG. 10 to FIG. 12 for a schematic structural view of a fourth embodiment of the wafer placement tray of the present invention.

As shown in FIGS. 10, 11 and 12, in the fourth embodiment of the present invention, unlike the foregoing third embodiment, the stopper 30 is not a bump but is the same bump as the first embodiment. The manner in which the bumps are formed is slightly different from that of the first embodiment. In the fourth embodiment of the present invention, when the two wafer placement discs 1 are stacked one on another, the number of the bumps that are inserted into the same accommodating groove 20 is plural, and the plurality of bumps are inserted into the same accommodating groove 20. The bumps are arranged in a rectangular shape to enhance the effect of limiting the activity of the wafer 90.

The above-described embodiments are merely illustrative of the principles of the invention and its advantages, and are not intended to limit the scope of the invention. Modifications and variations of the embodiments can be made by those skilled in the art without departing from the spirit and scope of the invention. The scope of protection of the present invention should be as described in the scope of the patent application to be described later.

1‧‧‧ wafer placement tray
10‧‧‧ Ontology
11‧‧‧ upper surface
12‧‧‧ Lower surface
20‧‧‧ accommodating slots
30‧‧‧Limited parts
40‧‧‧Fixed parts
90‧‧‧ wafer

1 is a top plan view of a first embodiment of a wafer placement tray of the present invention. Figure 2 is a bottom plan view of a first embodiment of a wafer placement tray of the present invention. Figure 3 is a cross-sectional view taken along line A-A of Figure 1. 4 is a top plan view of a second embodiment of a wafer placement tray of the present invention. Figure 5 is a bottom plan view of a second embodiment of the wafer placement tray of the present invention. Figure 6 is a cross-sectional view taken along line A-A of Figure 4 . Figure 7 is a plan view of a third embodiment of the wafer placement tray of the present invention. Figure 8 is a bottom plan view of a third embodiment of the wafer placement tray of the present invention. Figure 9 is a cross-sectional view taken along line A-A of Figure 7. Figure 10 is a plan view showing a fourth embodiment of the wafer placement tray of the present invention. Figure 11 is a bottom plan view of a fourth embodiment of the wafer placement tray of the present invention. Figure 12 is a cross-sectional view taken along line A-A of Figure 10.

1‧‧‧ wafer placement tray

10‧‧‧ Ontology

11‧‧‧ upper surface

12‧‧‧ Lower surface

20‧‧‧ accommodating slots

30‧‧‧Limited parts

40‧‧‧Fixed parts

90‧‧‧ wafer

Claims (10)

A wafer placement tray for placing a plurality of wafers, the wafer placement tray comprising: a body having an upper surface and a lower surface, wherein the upper surface corresponds to the lower surface; wherein a plurality of receiving slots are located The upper surface is configured to receive the plurality of wafers; and the plurality of limiting members are located on the lower surface, and when the two wafer placement trays are stacked one on another, the corresponding insertion slots are respectively inserted into the receiving slots to reduce each The wafer is movable in each of the accommodating grooves. The wafer placement tray of claim 1, wherein each of the accommodating grooves has a shape of a strip. The wafer placement tray of claim 2, wherein the plurality of limiting members are a plurality of bumps, and when the two wafer placement trays are stacked one on another, the bumps that are inserted into each of the receiving slots are The number is plural. The wafer placement tray of claim 3, wherein the plurality of bumps that are inserted into the same receiving groove are arranged in a straight line at a fixed distance. The wafer placement tray of claim 2, wherein the plurality of limiting members are plural ribs, and when two wafer placement trays are stacked one on another, the number of ribs that are inserted into each of the receiving slots is Single. The wafer placement tray of claim 1, wherein each of the accommodating grooves has a rectangular shape. The wafer placement tray of claim 6, wherein the plurality of limiting members are a plurality of bumps, and when the two wafer placement trays are stacked one on another, the bumps that are inserted into each of the receiving slots are The number is plural. The wafer placement tray of claim 7, wherein the plurality of bumps that are snapped into the same receiving groove are arranged in a rectangular shape. The wafer placement tray of claim 6, wherein the plurality of limiting members are bumps, and when two wafer placement trays are stacked one on another, the number of the bumps stuck in each of the receiving slots is Be single. The wafer placement tray of claim 9, wherein each of the protrusions has a shape substantially the same as a shape of each of the accommodating grooves.