TWI519235B

TWI519235B - Heating structure

Info

Publication number: TWI519235B
Application number: TW102129213A
Authority: TW
Inventors: 陳博斌
Original assignee: 冠月實業有限公司
Priority date: 2013-08-14
Filing date: 2013-08-14
Publication date: 2016-01-21
Also published as: TW201507591A

Description

Heating structure

本發明係有關於一種發熱結構，特別是一種細線式發熱結構。The present invention relates to a heat generating structure, and more particularly to a thin wire type heat generating structure.

一般電子裝置內部具有許多的電子元件，而該些電子元件皆需在正常溫度下才能正常工作，例如不能在過熱或過冷的環境下工作，否則電子元件會損壞或是無法啟動工作。Generally, there are many electronic components inside the electronic device, and the electronic components need to work normally at normal temperatures, for example, they cannot work in an environment of overheating or undercooling, or the electronic components may be damaged or cannot be started.

因此，在寒冷的地帶或氣候下，遂發展出發熱裝置，藉以對電子裝置內部的電子元件加熱，使其溫度達到可正常工作的溫度。
Therefore, in a cold zone or climate, the enthalpy develops a thermal device to heat the electronic components inside the electronic device to a temperature at which it can operate normally.

然而，當發熱導線過細時，會造成焊接或壓合的困難度，容易造成發熱導線的損壞，此為目前習知的發熱裝置的缺點。
However, when the heat-generating wire is too thin, it may cause difficulty in soldering or press-fitting, which may easily cause damage of the heat-generating wire, which is a disadvantage of the conventional heat-generating device.

為改善上述習知技術之缺點，本發明之目的在於提供一種發熱結構，藉以克服當發熱導線過細時，造成焊接或壓合困難度的缺點。In order to improve the above disadvantages of the prior art, it is an object of the present invention to provide a heat generating structure which overcomes the disadvantage of difficulty in soldering or pressing when the heat generating wire is too fine.

為改善上述習知技術之缺點，本發明之又一目的在於提供一種發熱結構，藉以克服當發熱導線過細時，造成焊接或壓合困難度的缺點。
In order to improve the above disadvantages of the prior art, it is still another object of the present invention to provide a heat generating structure which overcomes the disadvantage of difficulty in soldering or pressing when the heat generating wire is too fine.

為改善上述習知技術之缺點，本發明之再一目的在於提供一種發熱結構，藉以克服當發熱導線過細時，造成焊接或壓合困難度的缺點。
In order to improve the above disadvantages of the prior art, it is still another object of the present invention to provide a heat generating structure which overcomes the disadvantage of difficulty in soldering or press-fitting when the heat-generating wire is too fine.

為達成本發明之上述目的，本發明之發熱結構包含：一導電層底板；至少一電源導體，該電源導體係設置於該導電層底板的上方且電性連接至該導電層底板；至少一發熱導線，該發熱導線係設置於該導電層底板的上方且電性連接至該導電層底板；及至少一導體片，該導體片係設置於該發熱導線的上方且電性連接至該發熱導線。
In order to achieve the above object of the present invention, the heat generating structure of the present invention comprises: a conductive layer bottom plate; at least one power supply conductor, the power guiding system is disposed above the conductive layer bottom plate and electrically connected to the conductive layer bottom plate; at least one heat is generated The conductive wire is disposed above the bottom layer of the conductive layer and electrically connected to the bottom layer of the conductive layer; and at least one conductor piece disposed above the heat generating wire and electrically connected to the heat generating wire.

為達成本發明之上述又一目的，本發明之發熱結構包含：一軟性電路板；至少一發熱導線，該發熱導線係設置於該軟性電路板的上方且電性連接至該軟性電路板；及至少一導體片，該導體片係設置於該發熱導線的上方且電性連接至該發熱導線。
The heat generating structure of the present invention comprises: a flexible circuit board; at least one heat generating wire disposed above the flexible circuit board and electrically connected to the flexible circuit board; At least one conductor piece is disposed above the heat generating wire and electrically connected to the heat generating wire.

為達成本發明之上述再一目的，本發明之發熱結構包含：一導電層底板；至少一發熱導線，該發熱導線係設置於該導電層底板的上方且電性連接至該導電層底板；及至少一導電端子，該導電端子係設置於該發熱導線及該導電層底板的上方且電性連接至該發熱導線及該導電層底板。
In order to achieve the above-mentioned other object of the present invention, the heat generating structure of the present invention comprises: a conductive layer bottom plate; at least one heat generating wire disposed above the bottom plate of the conductive layer and electrically connected to the bottom plate of the conductive layer; The conductive terminal is disposed on the heat generating wire and the bottom layer of the conductive layer and electrically connected to the heat generating wire and the conductive layer bottom plate.

10‧‧‧發熱結構
102‧‧‧第一非導體膜
104‧‧‧導體片
106‧‧‧發熱導線
108‧‧‧電源導體
110‧‧‧防焊片
112‧‧‧第二非導體膜
114‧‧‧連接器
118‧‧‧軟性電路板
120‧‧‧導電層底板
122‧‧‧導電端子10‧‧‧Fever structure
102‧‧‧First non-conductor film
104‧‧‧Conductor
106‧‧‧heating wire
108‧‧‧Power conductor
110‧‧‧ solder mask
112‧‧‧Second non-conductor film
114‧‧‧Connector
118‧‧‧Soft circuit board
120‧‧‧ Conductive layer bottom plate
122‧‧‧Electrical terminals

第一圖為本發明之發熱結構之第一實施例示意圖。The first figure is a schematic view of a first embodiment of the heat generating structure of the present invention.

第二圖為本發明之發熱結構之第一實施例側視剖視圖。
The second figure is a side cross-sectional view of a first embodiment of the heat generating structure of the present invention.

第三圖為本發明之發熱結構之第二實施例示意圖。
The third figure is a schematic view of a second embodiment of the heat generating structure of the present invention.

第四圖為本發明之發熱結構之第一實施例局部示意圖。
The fourth figure is a partial schematic view of a first embodiment of the heat generating structure of the present invention.

第五圖為本發明之發熱結構之第四實施例示意圖。
Figure 5 is a schematic view showing a fourth embodiment of the heat generating structure of the present invention.

第六圖為本發明之發熱結構之第五實施例示意圖。
Figure 6 is a schematic view showing a fifth embodiment of the heat generating structure of the present invention.

第七圖為本發明之發熱結構之第六實施例示意圖。
Figure 7 is a schematic view showing a sixth embodiment of the heat generating structure of the present invention.

第八圖為本發明之發熱結構之第七實施例示意圖。
Figure 8 is a schematic view showing a seventh embodiment of the heat generating structure of the present invention.

第九圖為本發明之發熱結構之第二實施例側視剖視圖。
Figure 9 is a side cross-sectional view showing a second embodiment of the heat generating structure of the present invention.

第十圖為本發明之發熱結構之第二實施例局部示意圖。
Figure 11 is a partial schematic view showing a second embodiment of the heat generating structure of the present invention.

第十一圖為本發明之發熱結構之第三實施例側視剖視圖。
Figure 11 is a side cross-sectional view showing a third embodiment of the heat generating structure of the present invention.

第十二圖為本發明之發熱結構之第三實施例局部示意圖。
Figure 12 is a partial schematic view showing a third embodiment of the heat generating structure of the present invention.

請參考第一圖，其係為本發明之發熱結構之第一實施例示意圖；並請同時參考第二圖，其係為本發明之發熱結構之第一實施例側視剖視圖；並請同時參考第四圖，其係為本發明之發熱結構之第一實施例局部示意圖。Please refer to the first drawing, which is a schematic view of a first embodiment of the heat generating structure of the present invention; and also refers to the second drawing, which is a side cross-sectional view of the first embodiment of the heat generating structure of the present invention; The fourth figure is a partial schematic view of a first embodiment of the heat generating structure of the present invention.

一發熱結構10包含一導電層底板120、至少一電源導體108、至少一發熱導線106、至少一導體片104、一第一非導體膜102、一防焊片110、一第二非導體膜112及一連接器114。

A heat generating structure 10 includes a conductive layer bottom plate 120, at least one power conductor 108, at least one heat generating wire 106, at least one conductor piece 104, a first non-conductor film 102, a solder resist 110, and a second non-conductor film 112. And a connector 114.

該電源導體108係設置於該導電層底板120的上方且電性連接至該導電層底板120；該發熱導線106係設置於該導電層底板120的上方且電性連接至該導電層底板120；該導體片104係設置於該發熱導線106的上方且電性連接至該發熱導線106；該第一非導體膜102係設置於該導體片104及該發熱導線106的上方；該防焊片110係設置於該導電層底板120的下方；該第二非導體膜112係設置於該防焊片110及該發熱導線106的下方；該連接器114電連接至該電源導體108。

The power supply conductor 108 is disposed above the conductive layer bottom plate 120 and is electrically connected to the conductive layer bottom plate 120; the heat generating wire 106 is disposed above the conductive layer bottom plate 120 and electrically connected to the conductive layer bottom plate 120; The conductor piece 104 is disposed above the heat-generating wire 106 and electrically connected to the heat-generating wire 106; the first non-conductor film 102 is disposed above the conductor piece 104 and the heat-generating wire 106; the solder resist 110 The second non-conductor film 112 is disposed under the solder resist 110 and the heat-generating wire 106; the connector 114 is electrically connected to the power conductor 108.

該發熱導線106的線徑可為例如小於100微米；該電源導體108可為例如一電源導線或一導電端子。

The wire of the heat generating wire 106 can be, for example, less than 100 microns; the power conductor 108 can be, for example, a power lead or a conductive terminal.

請參考第三圖，其係為本發明之發熱結構之第二實施例示意圖；並請同時參考第九圖，其係為本發明之發熱結構之第二實施例側視剖視圖；並請同時參考第十圖，其係為本發明之發熱結構之第二實施例局部示意圖。

Please refer to the third drawing, which is a schematic view of a second embodiment of the heat generating structure of the present invention; and also refers to the ninth drawing, which is a side cross-sectional view of the second embodiment of the heat generating structure of the present invention; Figure 10 is a partial schematic view showing a second embodiment of the heat generating structure of the present invention.

一發熱結構10包含一軟性電路板118、至少一發熱導線106、至少一導體片104、一第一非導體膜102及一第二非導體膜112。

A heat generating structure 10 includes a flexible circuit board 118, at least one heat generating wire 106, at least one conductor piece 104, a first non-conductor film 102, and a second non-conductor film 112.

該發熱導線106係設置於該軟性電路板118的上方且電性連接至該軟性電路板118；該導體片104係設置於該發熱導線106的上方且電性連接至該發熱導線106；該第一非導體膜102係設置於該導體片104及該發熱導線106的上方；該第二非導體膜112係設置於該軟性電路板118及該發熱導線106的下方。

The heating wire 106 is disposed above the flexible circuit board 118 and electrically connected to the flexible circuit board 118; the conductor piece 104 is disposed above the heating wire 106 and electrically connected to the heating wire 106; A non-conductor film 102 is disposed above the conductor piece 104 and the heat generating wire 106. The second non-conductor film 112 is disposed under the flexible circuit board 118 and the heat generating wire 106.

該發熱導線106的線徑可為例如小於100微米。

The wire diameter of the heat generating wire 106 can be, for example, less than 100 microns.

請參考第十一圖，其係為本發明之發熱結構之第三實施例側視剖視圖；並請同時參考第十二圖，其係為本發明之發熱結構之第三實施例局部示意圖。

Please refer to FIG. 11 , which is a side cross-sectional view of a third embodiment of the heat generating structure of the present invention; and also refers to FIG. 12 , which is a partial schematic view of a third embodiment of the heat generating structure of the present invention.

一發熱結構10包含一導電層底板120、至少一發熱導線106、至少一導電端子122、一第一非導體膜102及一第二非導體膜112。

A heat generating structure 10 includes a conductive layer bottom plate 120, at least one heat generating wire 106, at least one conductive terminal 122, a first non-conductor film 102, and a second non-conductor film 112.

該發熱導線106係設置於該導電層底板120的上方且電性連接至該導電層底板120；該導電端子122係設置於該發熱導線106及該導電層底板120的上方且電性連接至該發熱導線106及該導電層底板120；該第一非導體膜係102設置於該導電端子122及該發熱導線106的上方；該第二非導體膜112係設置於該導電層底板120及該發熱導線106的下方。

The heat-generating wire 106 is disposed above the conductive layer bottom plate 120 and electrically connected to the conductive layer bottom plate 120. The conductive terminal 122 is disposed above the heat-generating wire 106 and the conductive layer bottom plate 120 and electrically connected thereto. The first non-conductor film system 102 is disposed above the conductive terminal 122 and the heat-generating wire 106; the second non-conductor film 112 is disposed on the conductive layer bottom plate 120 and the heat is generated. Below the wire 106.

請參考第五圖，其係為本發明之發熱結構之第四實施例示意圖；請參考第六圖，其係為本發明之發熱結構之第五實施例示意圖；請參考第七圖，其係為本發明之發熱結構之第六實施例示意圖；請參考第八圖，其係為本發明之發熱結構之第七實施例示意圖。

Please refer to the fifth figure, which is a schematic view of a fourth embodiment of the heat generating structure of the present invention; please refer to the sixth figure, which is a schematic diagram of a fifth embodiment of the heat generating structure of the present invention; A schematic view of a sixth embodiment of the heat generating structure of the present invention; please refer to the eighth drawing, which is a schematic view of a seventh embodiment of the heat generating structure of the present invention.

本發明的功效為克服發熱導線過細時，造成焊接或壓合困難度的缺點。

The effect of the present invention is to overcome the disadvantages of difficulty in soldering or pressing when the heat-generating wire is too fine.

然以上所述者，僅為本發明之較佳實施例，當不能限定本發明實施之範圍，即凡依本發明申請專利範圍所作之均等變化與修飾等，皆應仍屬本發明之專利涵蓋範圍意圖保護之範疇。綜上所述，當知本發明已具有產業利用性、新穎性與進步性，又本發明之構造亦未曾見於同類產品及公開使用，完全符合發明專利申請要件，爰依專利法提出申請。

However, the above is only a preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the equivalent changes and modifications made by the scope of the present invention should still be covered by the patent of the present invention. The scope of the scope is intended to protect. In summary, it is known that the present invention has industrial applicability, novelty and advancement, and the structure of the present invention has not been seen in similar products and public use, and fully complies with the requirements of the invention patent application, and is filed according to the patent law.

10‧‧‧發熱結構 10‧‧‧Fever structure

102‧‧‧第一非導體膜 102‧‧‧First non-conductor film

104‧‧‧導體片 104‧‧‧Conductor

106‧‧‧發熱導線 106‧‧‧heating wire

108‧‧‧電源導體 108‧‧‧Power conductor

110‧‧‧防焊片 110‧‧‧ solder mask

112‧‧‧第二非導體膜 112‧‧‧Second non-conductor film

120‧‧‧導電層底板 120‧‧‧ Conductive layer bottom plate

Claims

A heat generating structure comprising: a conductive layer bottom plate; at least one power supply conductor, a part of the power supply conductor is disposed above one side of the conductive layer bottom plate and electrically connected to the conductive layer bottom plate, and another part of the power supply conductor is The heat-generating wire is disposed on the other side of the bottom layer of the conductive layer opposite to the power supply conductor and electrically connected to the conductive layer bottom plate, and the heat is not disposed. The other part of the wire is not disposed above the bottom layer of the conductive layer, and the heat-generating wire is not directly connected to the power conductor; and at least one conductor piece, a part of the conductor piece is disposed above the heat-generating wire and electrically connected to The heat-generating wire, the other part of the conductor piece is not disposed above the heat-generating wire but disposed above the bottom layer of the conductive layer and electrically connected to the bottom plate of the conductive layer, and the conductor piece is not directly connected to the power supply conductor.

The heat generating structure according to claim 1, wherein the heat generating wire has a wire diameter of less than 100 μm; and the power guiding system is a power wire or a conductive terminal.

The heat generating structure of claim 2, further comprising: a first non-conductor film disposed on the conductor piece and the heat generating wire; a solder mask, the solder resist The film is disposed under the bottom of the conductive layer; and a second non-conductive film is disposed on the solder resist and the hair Below the hot wire.

The heat generating structure of claim 3, further comprising: a connector electrically connected to the power conductor.

A heat generating structure comprising: a flexible circuit board; at least one heat generating wire, a part of the heat generating wire is disposed above the flexible circuit board and electrically connected to the flexible circuit board, and another part of the heat generating wire is not disposed on Above the flexible circuit board; and at least one conductor piece, a part of the conductor piece is disposed above the heat-generating wire and electrically connected to the heat-generating wire, and another part of the conductor piece is not disposed above the heat-generating wire However, it is disposed above the flexible circuit board and electrically connected to the flexible circuit board.

The heat generating structure of claim 5, wherein the heat generating wire has a wire diameter of less than 100 μm.

The heat generating structure of claim 6, further comprising: a first non-conductor film disposed on the conductor piece and the heat generating wire; and a second non-conductor film, The second non-conductor film is disposed under the flexible circuit board and the heat generating wire.

A heat generating structure comprising: a conductive layer bottom plate; at least one heat generating wire, a part of the heat generating wire being disposed at the bottom of the conductive layer An upper portion of the board is electrically connected to the bottom layer of the conductive layer, and another part of the heat generating wire is not disposed above the bottom layer of the conductive layer; and at least one conductive terminal, the first portion of the conductive terminal is disposed above the heat generating wire And electrically connected to the heating wire, the second portion of the conductive terminal is disposed above the bottom layer of the conductive layer and electrically connected to the bottom plate of the conductive layer, and the third portion of the conductive terminal is not disposed on the heat generating wire and Above the bottom layer of the conductive layer.

The heat generating structure of claim 8, wherein the heat generating wire has a wire diameter of less than 100 μm.

The heat generating structure of claim 9, further comprising: a first non-conductor film disposed on the conductive terminal and the heat generating wire; and a second non-conductor film, The second non-conductor film is disposed under the conductive layer bottom plate and the heat generating wire.