TWM469711U

TWM469711U - Heating structure

Info

Publication number: TWM469711U
Application number: TW102215292U
Authority: TW
Inventors: Po-Pin Chen
Original assignee: Perm Top Co Ltd
Priority date: 2013-08-14
Filing date: 2013-08-14
Publication date: 2014-01-01

Description

Heating structure

本創作係有關於一種發熱結構，特別是一種細線式發熱結構。This creation is about a heat-generating structure, especially a thin-line heating structure.

一般電子裝置內部具有許多的電子元件，而該些電子元件皆需在正常溫度下才能正常工作，例如不能在過熱或過冷的環境下工作，否則電子元件會損壞或是無法啟動工作。Generally, there are many electronic components inside the electronic device, and the electronic components need to work normally at normal temperatures, for example, they cannot work in an environment of overheating or undercooling, or the electronic components may be damaged or cannot be started.

因此，在寒冷的地帶或氣候下，遂發展出發熱裝置，藉以對電子裝置內部的電子元件加熱，使其溫度達到可正常工作的溫度。
Therefore, in a cold zone or climate, the enthalpy develops a thermal device to heat the electronic components inside the electronic device to a temperature at which it can operate normally.

然而，當發熱導線過細時，會造成焊接或壓合的困難度，容易造成發熱導線的損壞，此為目前習知的發熱裝置的缺點。
However, when the heat-generating wire is too thin, it may cause difficulty in soldering or press-fitting, which may easily cause damage of the heat-generating wire, which is a disadvantage of the conventional heat-generating device.

為改善上述習知技術之缺點，本創作之目的在於提供一種發熱結構，藉以克服當發熱導線過細時，造成焊接或壓合困難度的缺點。In order to improve the above-mentioned shortcomings of the prior art, the object of the present invention is to provide a heat-generating structure for overcoming the disadvantages of difficulty in soldering or pressing when the heat-generating wire is too thin.

為改善上述習知技術之缺點，本創作之又一目的在於提供一種發熱結構，藉以克服當發熱導線過細時，造成焊接或壓合困難度的缺點。
In order to improve the above-mentioned shortcomings of the prior art, another object of the present invention is to provide a heat-generating structure, thereby overcoming the disadvantage of difficulty in soldering or pressing when the heat-generating wire is too thin.

為改善上述習知技術之缺點，本創作之再一目的在於提供一種發熱結構，藉以克服當發熱導線過細時，造成焊接或壓合困難度的缺點。
In order to improve the above-mentioned shortcomings of the prior art, it is a further object of the present invention to provide a heat-generating structure for overcoming the disadvantages of difficulty in soldering or pressing when the heat-generating wire is too thin.

為達成本創作之上述目的，本創作之發熱結構包含：一導電層底板；至少一電源導體，該電源導體係設置於該導電層底板的上方且電性連接至該導電層底板；至少一發熱導線，該發熱導線係設置於該導電層底板的上方且電性連接至該導電層底板；及至少一導體片，該導體片係設置於該發熱導線的上方且電性連接至該發熱導線。
In order to achieve the above object of the present invention, the heat generating structure of the present invention comprises: a conductive layer bottom plate; at least one power supply conductor, the power guiding system is disposed above the conductive layer bottom plate and electrically connected to the conductive layer bottom plate; at least one heat is generated The conductive wire is disposed above the bottom layer of the conductive layer and electrically connected to the bottom layer of the conductive layer; and at least one conductor piece disposed above the heat generating wire and electrically connected to the heat generating wire.

為達成本創作之上述又一目的，本創作之發熱結構包含：一軟性電路板；至少一發熱導線，該發熱導線係設置於該軟性電路板的上方且電性連接至該軟性電路板；及至少一導體片，該導體片係設置於該發熱導線的上方且電性連接至該發熱導線。
In order to achieve the above-mentioned other object of the present invention, the heat generating structure of the present invention comprises: a flexible circuit board; at least one heat generating wire disposed above the flexible circuit board and electrically connected to the flexible circuit board; At least one conductor piece is disposed above the heat generating wire and electrically connected to the heat generating wire.

為達成本創作之上述再一目的，本創作之發熱結構包含：一導電層底板；至少一發熱導線，該發熱導線係設置於該導電層底板的上方且電性連接至該導電層底板；及至少一導電端子，該導電端子係設置於該發熱導線及該導電層底板的上方且電性連接至該發熱導線及該導電層底板。
In order to achieve the above-mentioned further object of the present invention, the heat generating structure of the present invention comprises: a conductive layer bottom plate; at least one heat generating wire disposed above the bottom plate of the conductive layer and electrically connected to the bottom plate of the conductive layer; The conductive terminal is disposed on the heat generating wire and the bottom layer of the conductive layer and electrically connected to the heat generating wire and the conductive layer bottom plate.

10‧‧‧發熱結構
102‧‧‧第一非導體膜
104‧‧‧導體片
106‧‧‧發熱導線
108‧‧‧電源導體
110‧‧‧防焊片
112‧‧‧第二非導體膜
114‧‧‧連接器
118‧‧‧軟性電路板
120‧‧‧導電層底板
122‧‧‧導電端子10‧‧‧Fever structure
102‧‧‧First non-conductor film
104‧‧‧Conductor
106‧‧‧heating wire
108‧‧‧Power conductor
110‧‧‧ solder mask
112‧‧‧Second non-conductor film
114‧‧‧Connector
118‧‧‧Soft circuit board
120‧‧‧ Conductive layer bottom plate
122‧‧‧Electrical terminals

第一圖為本創作之發熱結構之第一實施例示意圖。The first figure is a schematic diagram of the first embodiment of the heat generating structure of the present invention.

第二圖為本創作之發熱結構之第一實施例側視剖視圖。
The second figure is a side cross-sectional view of a first embodiment of the heat generating structure of the present invention.

第三圖為本創作之發熱結構之第二實施例示意圖。
The third figure is a schematic view of a second embodiment of the heat generating structure of the present invention.

第四圖為本創作之發熱結構之第一實施例局部示意圖。
The fourth figure is a partial schematic view of the first embodiment of the heat generating structure of the present invention.

第五圖為本創作之發熱結構之第四實施例示意圖。
The fifth figure is a schematic view of a fourth embodiment of the heat generating structure of the present invention.

第六圖為本創作之發熱結構之第五實施例示意圖。
The sixth figure is a schematic view of the fifth embodiment of the heat generating structure of the present invention.

第七圖為本創作之發熱結構之第六實施例示意圖。
The seventh figure is a schematic view of a sixth embodiment of the heat generating structure of the present invention.

第八圖為本創作之發熱結構之第七實施例示意圖。
The eighth figure is a schematic view of a seventh embodiment of the heat generating structure of the present invention.

第九圖為本創作之發熱結構之第二實施例側視剖視圖。
Figure 9 is a side cross-sectional view showing a second embodiment of the heat generating structure of the present invention.

第十圖為本創作之發熱結構之第二實施例局部示意圖。
The tenth figure is a partial schematic view of a second embodiment of the heat generating structure of the present invention.

第十一圖為本創作之發熱結構之第三實施例側視剖視圖。

Figure 11 is a side cross-sectional view showing a third embodiment of the heat generating structure of the present invention.

第十二圖為本創作之發熱結構之第三實施例局部示意圖。Figure 12 is a partial schematic view showing a third embodiment of the heat generating structure of the present invention.

請參考第一圖，其係為本創作之發熱結構之第一實施例示意圖；並請同時參考第二圖，其係為本創作之發熱結構之第一實施例側視剖視圖；並請同時參考第四圖，其係為本創作之發熱結構之第一實施例局部示意圖。Please refer to the first figure, which is a schematic view of the first embodiment of the heat generating structure of the present invention; and also refers to the second drawing, which is a side cross-sectional view of the first embodiment of the heat generating structure of the present invention; The fourth figure is a partial schematic view of the first embodiment of the heat generating structure of the present invention.

一發熱結構10包含一導電層底板120、至少一電源導體108、至少一發熱導線106、至少一導體片104、一第一非導體膜102、一防焊片110、一第二非導體膜112及一連接器114。
A heat generating structure 10 includes a conductive layer bottom plate 120, at least one power conductor 108, at least one heat generating wire 106, at least one conductor piece 104, a first non-conductor film 102, a solder resist 110, and a second non-conductor film 112. And a connector 114.

該電源導體108係設置於該導電層底板120的上方且電性連接至該導電層底板120；該發熱導線106係設置於該導電層底板120的上方且電性連接至該導電層底板120；該導體片104係設置於該發熱導線106的上方且電性連接至該發熱導線106；該第一非導體膜102係設置於該導體片104及該發熱導線106的上方；該防焊片110係設置於該導電層底板120的下方；該第二非導體膜112係設置於該防焊片110及該發熱導線106的下方；該連接器114電連接至該電源導體108。
The power supply conductor 108 is disposed above the conductive layer bottom plate 120 and is electrically connected to the conductive layer bottom plate 120; the heat generating wire 106 is disposed above the conductive layer bottom plate 120 and electrically connected to the conductive layer bottom plate 120; The conductor piece 104 is disposed above the heat-generating wire 106 and electrically connected to the heat-generating wire 106; the first non-conductor film 102 is disposed above the conductor piece 104 and the heat-generating wire 106; the solder resist 110 The second non-conductor film 112 is disposed under the solder resist 110 and the heat-generating wire 106; the connector 114 is electrically connected to the power conductor 108.

該發熱導線106的線徑可為例如小於100微米；該電源導體108可為例如一電源導線或一導電端子。
The wire of the heat generating wire 106 can be, for example, less than 100 microns; the power conductor 108 can be, for example, a power lead or a conductive terminal.

請參考第三圖，其係為本創作之發熱結構之第二實施例示意圖；並請同時參考第九圖，其係為本創作之發熱結構之第二實施例側視剖視圖；並請同時參考第十圖，其係為本創作之發熱結構之第二實施例局部示意圖。
Please refer to the third figure, which is a schematic view of the second embodiment of the heat generating structure of the present invention; and also refers to the ninth drawing, which is a side cross-sectional view of the second embodiment of the heat generating structure of the present invention; The tenth figure is a partial schematic view of a second embodiment of the heat generating structure of the present invention.

一發熱結構10包含一軟性電路板118、至少一發熱導線106、至少一導體片104、一第一非導體膜102及一第二非導體膜112。
A heat generating structure 10 includes a flexible circuit board 118, at least one heat generating wire 106, at least one conductor piece 104, a first non-conductor film 102, and a second non-conductor film 112.

該發熱導線106係設置於該軟性電路板118的上方且電性連接至該軟性電路板118；該導體片104係設置於該發熱導線106的上方且電性連接至該發熱導線106；該第一非導體膜102係設置於該導體片104及該發熱導線106的上方；該第二非導體膜112係設置於該軟性電路板118及該發熱導線106的下方。
The heating wire 106 is disposed above the flexible circuit board 118 and electrically connected to the flexible circuit board 118; the conductor piece 104 is disposed above the heating wire 106 and electrically connected to the heating wire 106; A non-conductor film 102 is disposed above the conductor piece 104 and the heat generating wire 106. The second non-conductor film 112 is disposed under the flexible circuit board 118 and the heat generating wire 106.

該發熱導線106的線徑可為例如小於100微米。
The wire diameter of the heat generating wire 106 can be, for example, less than 100 microns.

請參考第十一圖，其係為本創作之發熱結構之第三實施例側視剖視圖；並請同時參考第十二圖，其係為本創作之發熱結構之第三實施例局部示意圖。
Please refer to FIG. 11 , which is a side cross-sectional view of a third embodiment of the heat generating structure of the present invention; and also refers to FIG. 12 , which is a partial schematic view of a third embodiment of the heat generating structure of the present invention.

一發熱結構10包含一導電層底板120、至少一發熱導線106、至少一導電端子122、一第一非導體膜102及一第二非導體膜112。
A heat generating structure 10 includes a conductive layer bottom plate 120, at least one heat generating wire 106, at least one conductive terminal 122, a first non-conductor film 102, and a second non-conductor film 112.

該發熱導線106係設置於該導電層底板120的上方且電性連接至該導電層底板120；該導電端子122係設置於該發熱導線106及該導電層底板120的上方且電性連接至該發熱導線106及該導電層底板120；該第一非導體膜係102設置於該導電端子122及該發熱導線106的上方；該第二非導體膜112係設置於該導電層底板120及該發熱導線106的下方。
The heat-generating wire 106 is disposed above the conductive layer bottom plate 120 and electrically connected to the conductive layer bottom plate 120. The conductive terminal 122 is disposed above the heat-generating wire 106 and the conductive layer bottom plate 120 and electrically connected thereto. The first non-conductor film system 102 is disposed above the conductive terminal 122 and the heat-generating wire 106; the second non-conductor film 112 is disposed on the conductive layer bottom plate 120 and the heat is generated. Below the wire 106.

請參考第五圖，其係為本創作之發熱結構之第四實施例示意圖；請參考第六圖，其係為本創作之發熱結構之第五實施例示意圖；請參考第七圖，其係為本創作之發熱結構之第六實施例示意圖；請參考第八圖，其係為本創作之發熱結構之第七實施例示意圖。
Please refer to the fifth figure, which is a schematic diagram of a fourth embodiment of the heat generating structure of the present invention; please refer to the sixth figure, which is a schematic diagram of the fifth embodiment of the heat generating structure of the present invention; A schematic diagram of a sixth embodiment of the heat generating structure of the present invention; please refer to the eighth figure, which is a schematic diagram of a seventh embodiment of the heat generating structure of the present invention.

本創作的功效為克服發熱導線過細時，造成焊接或壓合困難度的缺點。
The effect of this creation is to overcome the disadvantages of difficulty in welding or pressing when the heating wire is too thin.

然以上所述者，僅為本創作之較佳實施例，當不能限定本創作實施之範圍，即凡依本創作申請專利範圍所作之均等變化與修飾等，皆應仍屬本創作之專利涵蓋範圍意圖保護之範疇。綜上所述，當知本創作已具有產業利用性、新穎性與進步性，又本創作之構造亦未曾見於同類產品及公開使用，完全符合創作專利申請要件，爰依專利法提出申請。
However, the above is only a preferred embodiment of the present invention, and the scope of the present invention cannot be limited, that is, the equal changes and modifications made by the scope of the patent application of the present invention should still be covered by the patent of the present invention. The scope of the scope is intended to protect. In summary, when the creation of this book has industrial utilization, novelty and progressiveness, and the structure of this creation has not been seen in similar products and public use, it fully meets the requirements for the creation of patent applications, and applies for the application according to the patent law.

10‧‧‧發熱結構 10‧‧‧Fever structure

102‧‧‧第一非導體膜 102‧‧‧First non-conductor film

104‧‧‧導體片 104‧‧‧Conductor

106‧‧‧發熱導線 106‧‧‧heating wire

108‧‧‧電源導體 108‧‧‧Power conductor

110‧‧‧防焊片 110‧‧‧ solder mask

112‧‧‧第二非導體膜 112‧‧‧Second non-conductor film

120‧‧‧導電層底板 120‧‧‧ Conductive layer bottom plate

Claims

A heating structure comprising:
a conductive layer bottom plate;
At least one power supply conductor, the power guiding system is disposed above the bottom layer of the conductive layer and electrically connected to the bottom layer of the conductive layer;
At least one heat-generating wire is disposed above the bottom plate of the conductive layer and electrically connected to the bottom plate of the conductive layer; and at least one conductor piece disposed on the heat-generating wire and electrically connected to the wire Heating wire.

The heat generating structure according to claim 1, wherein the heat generating wire has a wire diameter of less than 100 μm; and the power guiding system is a power wire or a conductive terminal.

For example, the heating structure described in claim 2 of the patent scope further includes:
a first non-conductor film, the first non-conductor film is disposed above the conductor piece and the heating wire;
a solder mask, the solder mask is disposed under the bottom of the conductive layer; and a second non-conductor film disposed under the solder resist and the heat-generating wire.

For example, the heating structure described in claim 3 of the patent scope further includes:
A connector electrically connected to the power conductor.

A heating structure comprising:
a flexible circuit board;
At least one heat-generating wire is disposed above the flexible circuit board and electrically connected to the flexible circuit board; and at least one conductor piece is disposed above the heat-generating wire and electrically connected to the Heating wire.

The heat generating structure of claim 5, wherein the heat generating wire has a wire diameter of less than 100 μm. .

For example, the heating structure described in claim 6 of the patent scope further includes:
a first non-conductor film disposed on the conductor piece and the heat generating wire; and a second non-conductor film disposed on the flexible circuit board and the heat Below the wire.

A heating structure comprising:
a conductive layer bottom plate;
At least one heat-generating wire is disposed above the bottom plate of the conductive layer and electrically connected to the bottom plate of the conductive layer; and at least one conductive terminal disposed on the heat-generating wire and the bottom plate of the conductive layer Electrically connected to the heat generating wire and the conductive layer bottom plate.

The heat generating structure of claim 8, wherein the heat generating wire has a wire diameter of less than 100 μm.

For example, the heating structure described in claim 9 of the patent scope further includes:
a first non-conductor film disposed on the conductive terminal and the heat-generating wire; and a second non-conductor film disposed on the bottom plate of the conductive layer and the heat-generating Below the wire.