TWI518568B - Touch substrate and manufacturing method thereof - Google Patents

Description

Touch substrate and manufacturing method thereof

The present invention relates to a touch substrate and a method of fabricating the same, and more particularly to a touch substrate having the same effect of reducing (or simplifying) a process process and a low resistance value, and thereby effectively increasing the effect of the wiring space. method.

The touch panel has been widely used in the current life. By integrating the touch panel into the display panel, one can control the electronic device to execute the corresponding command through the touch operation of the display screen. At present, the conductive film of the touch panel is, for example, an indium tin oxide (ITO) film or a nano silver film, and the conductive film (or a transparent electrode layer) is formed on a transparent substrate, such as a glass plate. Or polyethylene terephthalate (PET) plate. Wherein the nanosilver film is composed of a plurality of nanowires.

The conventionally known conductive film (such as an indium tin oxide film or a nano-silver film) is formed on a transparent substrate by substantially: after the conductive film on the surface of the transparent substrate is subjected to photoresist, and then Baking the conductive film on the surface of the substrate, and after performing baking, performing an exposure and development process to form a transparent electrode layer having an electrode pattern on the surface of the substrate, wherein a nano-silver film is formed. For example, the transparent electrode layer on the surface of the substrate is composed of a plurality of nanowires; and then the transparent electrode layer on the surface of the substrate is sequentially cleaned, etched, cleaned, baked, etc., and then The transparent electrode layer on the surface of the substrate is screen-printed, and a wiring layer is electrically connected to the adjacent transparent electrode layer around the surface of the substrate, and then baked to obtain a touch substrate.

Although it is known that the touch substrate for manufacturing the touch panel can be manufactured through the above-described process steps, it extends another problem that the touch substrate must be manufactured through the above-mentioned multiple complicated steps. In addition, the low-side resistance of the nano-silver film is about 50 ohm/□, and the low-surface resistance of the ITO film is about 150 ohms/□, and the surface resistance of the indium tin oxide film is low. The conductivity will be better, but the thick film of the indium tin oxide film must be increased to cause the penetration of the indium tin oxide film to decrease, so the surface resistance of the indium tin oxide film affects the thickness of the indium tin oxide film. And the degree of penetration, therefore, the smaller the surface resistance value, the higher the cost and the higher the technical threshold, so that the surface resistance value remains high.

In addition, since the wiring layer is formed by screen printing, the wiring space on the surface of the substrate is limited. As described above, the conventional disadvantages have the following disadvantages: 1. The manufacturing process is complicated and complicated; 2. The cost is increased; 3. The wiring space is limited.

Therefore, how to solve the above problems and problems in the past, that is, the inventors of this case and the relevant manufacturers engaged in this industry are eager to study the direction of improvement.

Accordingly, in order to effectively solve the above problems, the main object of the present invention is to provide a touch substrate having a reduced (or simplified) manufacturing process and a low surface resistance value.

Another object of the present invention is to provide a touch substrate having an increased wiring space.

Another object of the present invention is to provide a method of manufacturing a touch substrate having a reduced (or simplified) manufacturing process and a low sheet resistance value.

Another object of the present invention is to provide a method of manufacturing a touch substrate having an increased wiring space.

To achieve the above objective, the present invention provides a touch substrate for use in a touch device, and the touch substrate includes a substrate, at least one opaque sensing electrode layer, and an opaque electrode routing layer, the substrate having a a first surface and a second surface opposite to the first surface, the opaque sensing electrode layer is formed on the first surface of the substrate, and has a plurality of nano silver particles and a plurality of opaque sensing blocks, the opaque sensing The block is formed by arranging the nano silver particles in a grid shape, and the opaque electrode trace layer is formed on the periphery of the first surface of the substrate, and the adjacent connection corresponds to the opaque sensing electrode layer; The structural design of the touch substrate of the invention can effectively achieve the effects of simplifying the process process and low surface resistance, and further effectively achieving the effect of increasing the wiring layout space.

The invention further provides a method for manufacturing a touch substrate. First, a substrate is provided. A photosensitive nano silver film is formed on the surface of the substrate, and a mask having a grid and an electrode trace pattern is further provided. The nano-silver film on the surface of the substrate is subjected to an exposure process to transfer the grid and electrode trace pattern on the mask to the nano-silver film, and then a developing process is performed on the substrate. A grid-shaped opaque sensing electrode layer and an opaque electrode wiring layer are formed on the surface, and finally the opaque sensing electrode layer on the surface of the substrate is highly conductive and stable; therefore, the design of the method by the present invention It is effective to achieve the effect of simplifying the process and low-face resistance, and thus effectively achieving the effect of increasing the layout space.

1‧‧‧ touch device

10‧‧‧ touch substrate

101‧‧‧Substrate

1011‧‧‧ first surface

1012‧‧‧ second surface

11‧‧‧Opacity sensing electrode layer

111‧‧‧Neon Silver

113‧‧‧Opacity sensing block

115‧‧‧opaque, non-sensing block

13‧‧‧opaque electrode trace layer

14‧‧‧ touch area

15‧‧‧The surrounding area

16‧‧‧Grid

161‧‧‧Small grid

17‧‧‧Optical adhesive

d‧‧‧Line width

X‧‧‧ first direction

Y‧‧‧second direction

1A is a perspective view of a first preferred embodiment of the present invention; FIG. 1B is a partially enlarged schematic view of a first embodiment of the present invention; FIG. 1C is a partially enlarged schematic view of a first embodiment of the present invention; 2 is a perspective view of a first preferred embodiment of the present invention; FIG. 3 is a perspective view of a touch device according to a first preferred embodiment of the present invention; and FIG. 4 is a first preferred embodiment of the present invention. A schematic cross-sectional view of a touch device; Figure 5 is a schematic flow chart of a second preferred embodiment of the present invention.

The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.

The present invention provides a touch substrate and a method of fabricating the same. Referring to FIG. 1A, a perspective view of a first preferred embodiment of the present invention is shown, and reference is made to FIGS. 1B, 3, and 4; The substrate 10 is applied to a touch device 1 (or a touch panel). In a specific implementation, the touch substrate 10 of the present invention can be applied to various touch devices 1 of a stacked structure, such as GFF (Glass-Film). -Film), G1F (Glass-Film), GG (Glass-Glass), etc., that is, the touch substrate 10 of the present invention is formed with a sensing electrode (such as an indium tin oxide film or a nano silver) instead of the touch device 1. A substrate 101 of a silk film (such as polyethylene terephthalate or glass).

In addition, the touch substrate 10 includes a substrate 101, at least one opaque (but optionally permeable or non-transmissive) sensing electrode layer 11 and an opaque layer (but may be transparent or opaque). Any of the electrode wiring layers 13, the substrate 101 is made of a flexible material, and the substrate 101 of the preferred embodiment is described by polyethylene terephthalate (PET), but The substrate 101 has a first surface 1011, a second surface 1012 opposite to the first surface 1011, a touch area 14 and a peripheral area 15. The touch area 14 is located on the first surface 1011. The central area 15 is located outside the touch area 14 .

Furthermore, the opaque sensing electrode layer 11 is formed on the first surface 1011 of the substrate 101, and has a plurality of nano silver particles 111 and a plurality of opaque layers (but may be selected to be transparent or non-transparent) In the sensing block 113, the opaque sensing blocks 113 are formed by arranging the nano silver particles 111 in a grid shape, that is, a photosensitive nano silver film is formed on the substrate 101 by chemical sintering. On the first surface 1011, and then sequentially exposed and developed to make the The opaque sensing block 113 is formed in a grid shape on the touch area 14 of the first surface 1011 (such as the dashed portion of the label 113 in FIG. 1A or 2); in short, the opaque sensing electrode layer The 11 series is formed on the first surface 1011 of the substrate 101.

In addition, the diameter of each of the nano silver particles 111 is between several nanometers and several tens of nanometers, and the line width d of the mesh 16 in the opaque sensing block 113 is between 1 μm and 10 μm. The preferred embodiment is illustrated by a preferred 7 μm. And each of the small grids 161 in the grid 16 in the opaque sensing block 113 is illustrated in a diamond shape, but is not limited thereto, and may be selected as a rectangle or other shapes to change the transmittance. That is, the transmittance is changed by the shape of the small mesh 161; therefore, in a specific implementation, the user can adjust the grid 16 of the opaque sensing electrode layer 11 according to the required surface resistance value and the transmittance. The line width d is thick, and the shape of the small mesh 161 in the grid 16 is changed to achieve a low surface resistance value (about 25 ohms/□) and a high light transmittance.

Continuing to refer to FIGS. 1A, 1B, and 2, the opaque sensing blocks 113 have an opaque (but may be permeable or non-transmissive) adjacent to each other without an inductive block 115, such opaque The non-sensing block 115 is formed by arranging a plurality of nano silver particles in a grid shape, that is, the opaque non-sensing blocks 115 are formed in a grid shape on the touch area 14 of the first surface 1011 (eg, The imaginary opaque sensing block 113 and the adjacent opaque sensing block 113 are unpowered. The sexual connection, in other words, is that the opaque non-sensing block 115 has no current passing through, so that it does not have the effect of sensing electrodes. The opaque non-sensing blocks 115 are used to prevent the opaque sensing block 113 from being easily observed, thereby effectively achieving a balanced visual effect. The opaque non-sensing block 115 and the adjacent opaque sensing block 113 of the preferred embodiment are disconnected by 7 μm (as shown in FIG. 1C) to reach an electrically non-electrical connection, but In the specific implementation, the distance of the above disconnection is not limited to 7 μm, and the user can perform the visual sensory and the sensing sensitivity in advance. Appropriate adjustments, combined with Chen Ming.

In the preferred embodiment, the plurality of opaque sensing blocks 113 are formed on the first surface 1011 of the substrate 101 in a first direction X (ie, the X-axis direction) (as indicated by the reference numeral 113 in FIG. 1A). In the embodiment of the present invention, the second opaque sensing block 113 is formed in the second direction Y (ie, the Y-axis direction) on the substrate 101. On a surface 1011 (such as the dashed portion of the reference numeral 113 in the second figure), or as shown in FIGS. 3 and 4, the two substrates 101 of the touch device 1 are respectively formed in the first direction X and the second direction Y. There is an opaque sensing block 113 with an optical glue 17 (such as OCR) between the two substrates.

Furthermore, the opaque electrode trace layer 13 is formed on the periphery of the first surface 1011, and the adjacent connection corresponds to the opaque sensing electrode layer 11, that is, the opaque electrode trace layer 13 is formed on the first surface 1011. The peripheral area 15 is connected to the opaque sensing electrode layer 11 corresponding to the touch area 14.

Therefore, through the design of the touch substrate 10 of the present invention, the effect of simplifying the process process and the low surface resistance value is effectively achieved, and the effect of increasing the wiring layout space is effectively achieved.

5 is a schematic flow chart showing a second preferred embodiment of the present invention, and is supplemented with reference to FIGS. 1A and 1B; the preferred embodiment is the touch substrate of the first preferred embodiment. Manufacturing method, the method comprising the following steps:

(S1) providing a substrate on which a photosensitive nano-silver grain film is formed; a substrate 101 is provided, and the surface of the substrate 101 (ie, the first surface 1011 described in the first preferred embodiment) A photosensitive nano-silver film is formed thereon. The substrate 101 is made of a flexible material, and the substrate 101 of the preferred embodiment is described by polyethylene terephthalate (PET); and the nano silver film is composed of plural a film composed of nano silver particles, and the diameter of each nano silver particle is between several nanometers and several tens of nanometers.

(S2) providing a mask having a grid and an electrode trace pattern to perform an exposure process on the nano-silver film on the surface of the substrate to transfer the grid and electrode trace pattern on the mask to Providing a reticle having a grid and an electrode trace pattern, and covering the surface of the substrate 101 (ie, the first surface 1011) with a reticle on the nano silver film to perform an exposure process After the exposure process is completed, the grid and the electrode trace pattern on the mask are transferred to the surface of the substrate 101 (ie, the first surface 1011) to have a nano-silver film.

(S3) performing a developing process to form a grid-shaped opaque sensing electrode layer and an opaque electrode wiring layer on the surface of the substrate; The developing process is performed to leave a desired grid pattern and a trace pattern on the surface of the substrate 101 (ie, the first surface 1011) of the nano silver film, and the unnecessary portion is developed, and a warm water is used. After the opaque sensing electrode layer 11 and the opaque electrode wiring layer 13 on the surface of the substrate 101 (ie, the first surface 1011) are cleaned, blackening treatment is performed to make the surface of the substrate 101 (ie, the first surface 1011) The opaque sensing electrode layer 11 and the opaque electrode wiring layer 13 are less noticeable, and the blackening liquid remaining on the surface of the substrate 101 (ie, the first surface 1011) is washed away again by warm water, so that the substrate 101 is first. An opaque sensing electrode layer 11 in a grid shape and an opaque electrode wiring layer 13 electrically connected to the opaque sensing electrode layer 11 are formed on the surface 1011; wherein the opaque sensing electrode layer 11 has a plurality of grid-shaped opaque sensing layers. The opaque sensing block 113 is formed on the touch area 14 of the first surface 1011, and the opaque electrode trace layer 13 is formed on the peripheral area 15 of the first surface 1011.

(S4) performing high-conductivity and stabilization processing on the opaque sensing electrode layer on the surface of the substrate; performing opaque sensing electrode layer 11 on the first surface 1011 of the substrate 101 The high conductivity processing operation is performed to increase the conductive effect of the opaque sensing electrode layer 11 on the first surface 1011, and then the high conductive processing liquid remaining on the surface (ie, the first surface 1011) is washed away with warm water, and then stabilized. The processing operation is such that the conductivity of the opaque sensing electrode layer 11 on the first surface 1011 is stabilized; then, the stabilization solvent remaining on the surface (ie, the first surface 1011) is washed again with warm water.

(S5) inspecting the opaque sensing electrode layer and the opaque electrode wiring layer on the surface of the substrate; inspecting the opaque sensing electrode layer 11 and the opaque electrode wiring layer 13 on the surface of the substrate 101 (ie, the first surface 1011) Work, such as electrical and visual inspection, for broken wires, short circuits, or poor appearance.

(S6) bonding the surface of the inspected substrate to a protective film for covering the opaque sensing electrode layer and the opaque electrode wiring layer on the surface of the substrate.

The first surface 1011 of the inspected substrate 101 is bonded to a protective film (not shown) for covering the opaque sensing electrode layer 11 and the opaque electrode wiring layer 13 on the first surface 1011 of the substrate 101. To achieve the effect of protection.

Therefore, the design of the method of the present invention makes it possible to directly form the opaque sensing electrode layer 11 and the opaque electrode wiring layer 13 on the surface of the substrate 101, thereby effectively reducing (or simplifying) the manufacturing process, and further Effectively achieve low surface resistance and increase the effect of routing space. As described above, the present invention has the following advantages as compared with the prior art: 1. It has the effect of reducing (or simplifying) the manufacturing process and the low surface resistance value; 2. It has the effect of increasing the wiring space.

The above description is only a preferred embodiment of the present invention, but the features of the present invention are not limited thereto, and any change or repair that can be easily considered in the field of the present invention is familiar to those skilled in the art. The decoration should be covered by the following patent application scope of the present invention.

10‧‧‧ touch substrate

101‧‧‧Substrate

1011‧‧‧ first surface

1012‧‧‧ second surface

11‧‧‧Opacity sensing electrode layer

113‧‧‧Opacity sensing block

115‧‧‧opaque, non-sensing block

13‧‧‧opaque electrode trace layer

14‧‧‧ touch area

15‧‧‧The surrounding area

16‧‧‧Grid

161‧‧‧Small grid

X‧‧‧ first direction

Claims (10)

A touch substrate includes: a substrate having a first surface and a second surface opposite to the first surface; at least one opaque sensing electrode layer formed on the first surface of the substrate, and having a plurality of nano silver particles and a plurality of opaque sensing blocks, wherein the opaque sensing blocks are formed by arranging the nano silver particles in a grid shape, and the opaque sensing blocks have an opacity between adjacent ones. Inductive block, the opaque non-sensing block is formed by arranging a plurality of nano silver particles in a grid, and the opaque non-sensing blocks are not electrically connected to adjacent opaque sensing blocks; An opaque electrode routing layer is formed on the periphery of the first surface of the substrate, and the adjacent connections correspond to the opaque sensing electrode layer. The touch substrate of claim 1, wherein the opaque sensing blocks are formed on the first surface of the substrate in a first direction. The touch substrate of claim 1, wherein the opaque sensing blocks are formed on the first surface of the substrate in a second direction. The touch substrate of claim 1, wherein the substrate is a polyethylene terephthalate (PET). The touch substrate of claim 1, wherein the substrate is made of a flexible material. The touch substrate of claim 1, wherein the diameter of each nano silver particle is between several nanometers and several tens of nanometers. A method for manufacturing a touch substrate includes: providing a substrate having a photosensitive nano-silver film formed on a surface thereof; and providing a mask having a grid and an electrode trace pattern on the surface of the substrate Thin nano silver particles Performing an exposure process to transfer the grid and electrode trace pattern on the mask to the nano silver film; performing a developing process to form a grid on the surface of the substrate An opaque sensing electrode layer and an opaque electrode routing layer electrically connected to the opaque sensing electrode layer; and a high conductivity and stabilization operation on the opaque sensing electrode layer on the surface of the substrate; wherein the developing process comprises using one Warming the opaque sensing electrode layer and the opaque electrode wiring layer on the surface of the substrate, and performing blackening treatment, so that the opaque sensing electrode layer and the opaque electrode wiring layer on the surface of the substrate are less obvious, and are reused. Warm water washes away the blackening liquid remaining on the surface of the substrate. The method for manufacturing a touch substrate according to claim 7, wherein after the step of performing high conductivity and stabilization processing on the opaque sensing electrode layer on the surface of the substrate, the method further comprises: on the surface of the substrate The opaque sensing electrode layer and the opaque electrode wiring layer are inspected; and the surface of the inspected substrate is bonded to a protective film to cover the opaque sensing electrode layer and the opaque electrode wiring layer on the surface of the substrate . The method of manufacturing a touch substrate according to claim 7, wherein the substrate is made of a flexible material. The method for manufacturing a touch substrate according to claim 7, wherein the nano silver film is composed of a plurality of nano silver particles, and each nano silver particle has a diameter of several nanometers to Between dozens of nanometers.