TWI517278B - - Google Patents
Info
- Publication number
- TWI517278B TWI517278B TW103117703A TW103117703A TWI517278B TW I517278 B TWI517278 B TW I517278B TW 103117703 A TW103117703 A TW 103117703A TW 103117703 A TW103117703 A TW 103117703A TW I517278 B TWI517278 B TW I517278B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Drying Of Semiconductors (AREA)
- Plasma Technology (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310193644.2A CN104183514B (en) | 2013-05-22 | 2013-05-22 | Improve the system and etching terminal monitoring method of TSV etching technics |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201508852A TW201508852A (en) | 2015-03-01 |
| TWI517278B true TWI517278B (en) | 2016-01-11 |
Family
ID=51964466
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103117703A TW201508852A (en) | 2013-05-22 | 2014-05-21 | System to improve the TSV etching process and etching endpoint monitoring method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104183514B (en) |
| TW (1) | TW201508852A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107644811B (en) * | 2016-07-20 | 2020-05-22 | 中微半导体设备(上海)股份有限公司 | Bosch process etching end point monitoring method and Bosch etching method |
| CN106504971B (en) * | 2017-01-03 | 2018-03-16 | 京东方科技集团股份有限公司 | A kind of plasma etching method and plasma etching device |
| CN107359132A (en) * | 2017-07-24 | 2017-11-17 | 深圳市华星光电技术有限公司 | The supervising device and lithographic method of etching apparatus |
| CN108519559A (en) * | 2018-03-27 | 2018-09-11 | 上海尼诺电子设备有限公司 | Radio-frequency power supply detection device |
| CN117373917B (en) * | 2023-12-07 | 2024-03-08 | 天津吉兆源科技有限公司 | Semiconductor device processing method and system and electronic equipment |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4101280B2 (en) * | 2006-07-28 | 2008-06-18 | 住友精密工業株式会社 | Plasma etching method and plasma etching apparatus capable of detecting end point |
| JP5329167B2 (en) * | 2007-11-21 | 2013-10-30 | 東京エレクトロン株式会社 | Inductively coupled plasma processing apparatus, inductively coupled plasma processing method, and storage medium |
| CN103117203B (en) * | 2013-03-08 | 2016-08-10 | 中微半导体设备(上海)有限公司 | The processing means of a kind of plasma etch process and method |
-
2013
- 2013-05-22 CN CN201310193644.2A patent/CN104183514B/en active Active
-
2014
- 2014-05-21 TW TW103117703A patent/TW201508852A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW201508852A (en) | 2015-03-01 |
| CN104183514A (en) | 2014-12-03 |
| CN104183514B (en) | 2017-08-11 |