TWI514119B - Device for cooling electronic elements - Google Patents
Device for cooling electronic elements Download PDFInfo
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- TWI514119B TWI514119B TW099118735A TW99118735A TWI514119B TW I514119 B TWI514119 B TW I514119B TW 099118735 A TW099118735 A TW 099118735A TW 99118735 A TW99118735 A TW 99118735A TW I514119 B TWI514119 B TW I514119B
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Description
本發明涉及一種冷卻裝置,特別是一種對電子元件進行冷卻的裝置。 The present invention relates to a cooling device, and more particularly to a device for cooling electronic components.
目前,手持電子產業飛速發展,產品也更加趨向輕、薄、短、小化發展,這就對電子元件佈局設計工藝提出了更高的要求,從而導致產品維修難度的進一步增大。 At present, the handheld electronic industry is developing rapidly, and the products are becoming more light, thin, short, and small, which puts higher requirements on the layout process of electronic components, which leads to further difficulty in product maintenance.
一般來說,為了達到要求,在電子元件佈局(layout)中,根據規則PCBA元件因受到空間限制而採用背靠背(Back to Back)設計,同時為了增強產品的可靠度而導入Underfill工藝。在進行電子產品元件維修時,對位於PCB板一面的元器件進行維修的同時,很容易影響到位於PCB板另一面對應位置的元器件,例如對PCB板一面的元器件採用傳統的熱風槍手工維修時,極易造成PCB板另一面對應位置不需維修電子元件的溫度升高,從而導致二次熔錫,使得不需維修的元件出現偏位、連錫等不良現象,同時,在產品受熱後,還將導致填充膠水的膨脹係數增大,從而導致產品維修難度的增大而使得維修成功率降低。 In general, in order to meet the requirements, in the layout of electronic components, the back-to-back design of the PCBA components is limited by space, and the Underfill process is introduced to enhance the reliability of the product. When repairing electronic components, repairing components on one side of the PCB can easily affect the components located on the other side of the PCB. For example, the components on the PCB side are manually hand-warked. During maintenance, it is easy to cause the temperature of the other side of the PCB to be repaired without the need to repair the electronic components, resulting in secondary tinning, which causes the components that are not in need of maintenance to have misalignment, such as tin, and the like, and at the same time, the product is heated. After that, it will also cause the expansion coefficient of the filling glue to increase, which leads to an increase in the difficulty of product maintenance and a reduction in the maintenance success rate.
有鑒於此,有必要提供一種冷卻裝置,對需要冷卻的電子元件進行快速的冷卻處理。 In view of this, it is necessary to provide a cooling device for performing rapid cooling treatment of electronic components that require cooling.
該電子元件冷卻裝置,用於在對PCB板一側的某一電子元件加熱時,冷卻位於PCB板另一側對應位置上不需加熱的電子元件,該電子元件冷卻裝置包括載體、位於該載體上的電源以及冷卻模組,該冷卻模組包括散熱器、半導體冷卻片以及導熱底座,該散熱器包括若干位於載體之上的平行間隔排列的散熱鰭片,該半導體冷卻片位於散熱器之上,包括製冷面和發熱面,且該製冷面與導熱底座相互接觸,發熱面與散熱器相互接觸,該導熱底座位於半導體冷卻片的製冷面之上,用於承載需要冷卻的電子元件,同時在需要冷卻的電子元件與製冷面之間進行熱傳遞。當半導體冷卻片通電時,該半導體冷卻片的製冷面處於持續的低溫狀態,不斷地與導熱底座之間進行熱傳遞,從而降低導熱底座的溫度,進而降低承載於導熱底座之上的需要冷卻的電子元件的溫度,同時,該半導體冷卻片的發熱面產生熱量,並傳遞給散熱器,由散熱器進行散熱;該冷卻模組還包括一擋風簾,該擋風簾的大小與需要加熱的電子元件的大小相對應,用於集中熱量,對需要加熱的電子元件進行加熱。 The electronic component cooling device is configured to cool an electronic component that does not need to be heated at a corresponding position on the other side of the PCB when heating an electronic component on one side of the PCB. The electronic component cooling device includes a carrier and is located on the carrier a power supply and a cooling module, the cooling module comprising a heat sink, a semiconductor cooling fin and a heat conducting base, the heat sink comprising a plurality of parallel spaced fins located above the carrier, the semiconductor cooling fin being located above the heat sink The cooling surface and the heat generating surface are in contact with each other, and the heat generating surface is in contact with the heat sink. The heat conducting base is located above the cooling surface of the semiconductor cooling fin for carrying the electronic components to be cooled, and at the same time Heat transfer between the electronic components that require cooling and the cooling surface. When the semiconductor cooling fin is energized, the cooling surface of the semiconductor cooling fin is in a continuous low temperature state, and heat is continuously transmitted between the heat conducting base, thereby reducing the temperature of the heat conducting base, thereby reducing the cooling required to be carried on the heat conducting base. The temperature of the electronic component, at the same time, the heat generating surface of the semiconductor cooling fin generates heat and is transmitted to the heat sink for heat dissipation by the heat sink; the cooling module further includes a windshield, the size of the windshield and the need for heating The size of the electronic components corresponds to the heat used to heat the electronic components that need to be heated.
通過使用本發明的電子元件冷卻裝置,能夠對需要冷卻的電子元件進行快速的冷卻處理,且結構簡單。 By using the electronic component cooling device of the present invention, it is possible to perform rapid cooling processing on an electronic component that requires cooling, and the structure is simple.
1‧‧‧電子元件冷卻裝置 1‧‧‧Electronic component cooling device
10‧‧‧載體 10‧‧‧ Carrier
20‧‧‧電源 20‧‧‧Power supply
30‧‧‧冷卻模組 30‧‧‧Cooling module
40‧‧‧第一開關 40‧‧‧First switch
50‧‧‧第二開關 50‧‧‧second switch
60‧‧‧風扇 60‧‧‧fan
70‧‧‧電位調節器 70‧‧‧potentiometer
80‧‧‧電子顯示屏 80‧‧‧Electronic display
90‧‧‧通風區域 90‧‧‧Ventilated area
301‧‧‧散熱器 301‧‧‧ radiator
302‧‧‧半導體冷卻片 302‧‧‧Semiconductor Cooling Film
303‧‧‧導熱底座 303‧‧‧thermal base
304‧‧‧上蓋 304‧‧‧Upper cover
305‧‧‧擋風簾 305‧‧‧wind curtain
306‧‧‧第一硅膠片 306‧‧‧First silica gel
307‧‧‧第二硅膠片 307‧‧‧Second silica gel
308‧‧‧硅膠膏 308‧‧‧Silicone Cream
3011‧‧‧散熱鰭片 3011‧‧‧heat fins
3021‧‧‧製冷面 3021‧‧‧Refrigeration surface
3022‧‧‧發熱面 3022‧‧‧Face noodles
圖1為本發明第一實施方式中電子元件冷卻裝置的原理圖。 1 is a schematic diagram of an electronic component cooling device in a first embodiment of the present invention.
圖2為本發明第一實施方式中冷卻模組的分解示意圖。 2 is an exploded perspective view of a cooling module in the first embodiment of the present invention.
請參閱圖1,為本發明第一實施方式中電子元件冷卻裝置的原理圖。該電子元件冷卻裝置1包括載體10、電源20以及冷卻模組30 。其中,該電源20和冷卻模組30分別位於載體10上。電源20用於為冷卻模組30供電。 1 is a schematic diagram of an electronic component cooling device according to a first embodiment of the present invention. The electronic component cooling device 1 includes a carrier 10, a power source 20, and a cooling module 30. . The power source 20 and the cooling module 30 are respectively located on the carrier 10. The power source 20 is used to power the cooling module 30.
請一併參閱圖2,為本發明第一實施方式中冷卻模組30的分解示意圖。該冷卻模組30包括散熱器301、半導體冷卻片302以及導熱底座303。該散熱器301包括若干位於載體10之上的平行間隔排列的散熱鰭片3011。該半導體冷卻片302位於散熱器301和導熱底座303之間,包括製冷面3021和發熱面3022,該半導體冷卻片302的製冷面3021和導熱底座303相互接觸,發熱面3022和散熱器301相互接觸。該導熱底座303位於半導體冷卻片302的製冷面3021之上,用於承載需要冷卻的電子元件,且在需要冷卻的電子元件和半導體冷卻片302的製冷面3021之間進行熱傳遞,例如,在對PCB板的元器件進行維修時,可將位於PCB板另一側的不需要維修的元器件放置於導熱底座上,該導熱底座303由導熱性能較好的金屬(鐵,銅等)製成,在本實施方式中,該導熱底座303由紅銅製成。在對冷卻模組30中的半導體冷卻片302通電後,該半導體冷卻片302的製冷面3021將處於持續的低溫狀態,不斷地與導熱底座303之間進行熱傳遞,從而降低導熱底座303的溫度,進而降低承載於該導熱底座303上的電子元件的溫度,同時,該半導體冷卻片302的發熱面3022產生持續的熱量,並傳遞給散熱器301後,由散熱器301進行散熱。 2 is a schematic exploded view of the cooling module 30 according to the first embodiment of the present invention. The cooling module 30 includes a heat sink 301, a semiconductor cooling fin 302, and a heat conducting base 303. The heat sink 301 includes a plurality of parallel spaced fins 3011 positioned above the carrier 10. The semiconductor cooling fins 302 are located between the heat sink 301 and the heat conducting base 303, and include a cooling surface 3021 and a heat generating surface 3022. The cooling surface 3021 of the semiconductor cooling fin 302 and the heat conducting base 303 are in contact with each other, and the heat generating surface 3022 and the heat sink 301 are in contact with each other. . The thermally conductive base 303 is located above the cooling surface 3021 of the semiconductor cooling fin 302 for carrying electronic components to be cooled, and performs heat transfer between the electronic components to be cooled and the cooling surface 3021 of the semiconductor cooling fins 302, for example, When repairing the components of the PCB board, the components that are not required to be repaired on the other side of the PCB board can be placed on the heat-conducting base, which is made of metal (iron, copper, etc.) with better thermal conductivity. In the embodiment, the heat conducting base 303 is made of red copper. After the semiconductor cooling fins 302 in the cooling module 30 are energized, the cooling surface 3021 of the semiconductor cooling fins 302 will be in a continuous low temperature state, and heat transfer is continuously performed with the heat conducting base 303, thereby reducing the temperature of the heat conducting base 303. Further, the temperature of the electronic component carried on the heat conducting base 303 is lowered, and at the same time, the heat generating surface 3022 of the semiconductor cooling fin 302 generates a continuous heat, and is transmitted to the heat sink 301, and then radiated by the heat sink 301.
請繼續參閱圖1,該電子元件冷卻裝置1還包括位於載體10之上的風扇60,在本實施方式中,該載體10上形成有包括多個通風孔的通風區域90。該風扇60與電源20之間進行電連接。該風扇60和形成於載體10上的通風區域90分別置於冷卻模組30的兩側,風扇60 吹出的氣流經過冷卻模組30後,經由通風區域90的通風孔排出,從而將分佈在冷卻模組30中散熱器301的散熱鰭片3011上的熱量吹走,從而提高散熱鰭片3011的散熱效率。可以想像到的是,當散熱器301中散熱鰭片3011所在平面與風扇60所在平面和通風區域90所在平面分別垂直時,更加易於風扇60吹出的氣流的流通,從而散熱效果為最佳。 With continued reference to FIG. 1, the electronic component cooling device 1 further includes a fan 60 located above the carrier 10. In the present embodiment, the carrier 10 is formed with a venting region 90 including a plurality of venting holes. The fan 60 is electrically connected to the power source 20. The fan 60 and the ventilation area 90 formed on the carrier 10 are respectively placed on both sides of the cooling module 30, and the fan 60 After the blown airflow passes through the cooling module 30, it is discharged through the ventilation holes of the ventilation area 90, so that the heat distributed on the heat dissipation fins 3011 of the heat sink 301 in the cooling module 30 is blown away, thereby improving the heat dissipation of the heat dissipation fins 3011. effectiveness. It can be imagined that when the plane of the heat sink fins 3011 in the heat sink 301 is perpendicular to the plane of the fan 60 and the plane of the ventilation area 90, the airflow blown by the fan 60 is more easily circulated, so that the heat dissipation effect is optimal.
該電子元件冷卻裝置1還包括電位調節器70以及電子顯示屏80,其中,該電位調節器70位於電源20和冷卻模組30中的半導體冷卻片302之間,並分別與之電連接,用於調節由電源20提供的加載於半導體冷卻片302上的工作電壓,當需要調節半導體冷卻片302的製冷效果時,只需要在正常使用情況下,適當地調節電位調節器70,使得加載於半導體冷卻片302上的工作電壓相應地增大或減小,從而使得半導體冷卻片302的製冷面3021的溫度相應地降低或升高,發熱面3022的溫度相應地升高或降低,使得製冷面3021與導熱底座303的熱傳遞效果相應地增大或減小,從而使得承載於導熱底座303上的電子元件的溫度降低得快或慢。該電子顯示屏80與電位調節器70連接,用於顯示電位調節器70輸出至冷卻模組30中半導體冷卻片302上的電壓值。不難想像,在其他實施方式中,該電位調節器70和電子顯示屏80均可以省略。 The electronic component cooling device 1 further includes a potential adjuster 70 and an electronic display screen 80. The potential adjuster 70 is located between the power supply 20 and the semiconductor cooling fins 302 in the cooling module 30, and is electrically connected thereto. In order to adjust the operating voltage applied to the semiconductor cooling fins 302 provided by the power source 20, when it is necessary to adjust the cooling effect of the semiconductor cooling fins 302, it is only necessary to properly adjust the potential adjuster 70 under normal use conditions so as to be loaded on the semiconductor. The operating voltage on the cooling fins 302 is correspondingly increased or decreased, so that the temperature of the cooling surface 3021 of the semiconductor cooling fins 302 is correspondingly lowered or increased, and the temperature of the heat generating surface 3022 is correspondingly increased or decreased, so that the cooling surface 3021 The heat transfer effect of the thermally conductive base 303 is increased or decreased correspondingly, so that the temperature of the electronic component carried on the thermally conductive base 303 is lowered faster or slower. The electronic display screen 80 is connected to the potential adjuster 70 for displaying the voltage value outputted by the potential adjuster 70 to the semiconductor cooling fins 302 in the cooling module 30. It is not difficult to imagine that in other embodiments, both the potential adjuster 70 and the electronic display 80 can be omitted.
該電子元件冷卻裝置1還包括第一開關40和第二開關50,該第一開關40位於電源20和風扇60之間,用於導通或斷開電源20與風扇60的連接回路,從而使得該風扇60處於工作或不工作狀態。該第二開關50位於電源20和冷卻模組30中的半導體冷卻片302之間,用於導通或斷開電源20與半導體冷卻片302的連接回路,從而使 得該半導體冷卻片302處於工作或不工作狀態。不難想像,在其他實施方式中,該第一開關40和第二開關50均可以省略,而由電源20直接對冷卻模組30中的半導體冷卻片302和風扇60的工作狀態進行控制。 The electronic component cooling device 1 further includes a first switch 40 and a second switch 50, and the first switch 40 is located between the power source 20 and the fan 60 for turning on or off the connection circuit of the power source 20 and the fan 60, thereby The fan 60 is in a working or inoperative state. The second switch 50 is located between the power source 20 and the semiconductor cooling fins 302 in the cooling module 30 for turning on or off the connection circuit between the power source 20 and the semiconductor cooling fins 302, thereby The semiconductor cooling fins 302 are in a working or inoperative state. It is not difficult to imagine that in other embodiments, the first switch 40 and the second switch 50 can be omitted, and the operating state of the semiconductor cooling fins 302 and the fan 60 in the cooling module 30 is directly controlled by the power source 20.
請繼續參閱圖2,該冷卻模組30還包括上蓋304和擋風簾305。該上蓋304的成分為耐高溫的的材料,用於對需要加熱電子元件附近的其他電子元件進行上蓋保護,在本實施方式中,該上蓋304由合成石(由玻璃纤维和耐高温、高机械强度树脂烧结而成)製成。該擋風簾305的大小與需要加熱的電子元件的大小相對應,用於集中熱量,對需要加熱的電子元件進行加熱。不難想像,在其他實施方式中,該上蓋304和擋風簾305均可以省略。 Referring to FIG. 2 , the cooling module 30 further includes an upper cover 304 and a windshield 305 . The upper cover 304 is made of a high temperature resistant material for covering the other electronic components in the vicinity of the electronic component to be heated. In the present embodiment, the upper cover 304 is made of synthetic stone (from glass fiber and high temperature resistant, high mechanical). Made of sintered resin. The size of the windshield 305 corresponds to the size of the electronic component to be heated, for concentrating heat and heating the electronic component to be heated. It is not difficult to imagine that in other embodiments, both the upper cover 304 and the windshield 305 may be omitted.
該冷卻模組30還包括第一硅膠片306、第二硅膠片307和硅膠膏308。該第一硅膠片306放置於需要冷卻的電子元件與導熱底座303之間,用於提高需要冷卻的電子元件與導熱底座303之間的熱傳遞性能。該第二硅膠片307置於導熱底座303與半導體冷卻片的製冷面3021之間,用於提高導熱底座303與半導體冷卻片的製冷面3021之間的熱傳遞性能。硅膠膏308可適當塗抹於第一硅膠片306和第二硅膠片307的表面,使得第一硅膠片306和第二硅膠片307的表面更加容易被全面接觸,從而提高硅膠片的熱傳遞效率。不難想像,在其他實施方式中,該第一硅膠片306、第二硅膠片307和硅膠膏308均可以省略。 The cooling module 30 further includes a first silicone sheet 306, a second silicone sheet 307, and a silicone paste 308. The first silicone sheet 306 is placed between the electronic component to be cooled and the heat conducting base 303 for improving the heat transfer performance between the electronic component to be cooled and the heat conducting base 303. The second silicone sheet 307 is disposed between the heat conducting base 303 and the cooling surface 3021 of the semiconductor cooling fin for improving the heat transfer performance between the heat conducting base 303 and the cooling surface 3021 of the semiconductor cooling fin. The silicone paste 308 can be suitably applied to the surfaces of the first silica gel sheet 306 and the second silica gel sheet 307, so that the surfaces of the first silica gel sheet 306 and the second silica gel sheet 307 are more easily contacted, thereby improving the heat transfer efficiency of the silica gel sheet. . It is not difficult to imagine that in other embodiments, the first silica gel sheet 306, the second silica gel sheet 307, and the silica gel paste 308 may be omitted.
通過本發明的電子元件冷卻裝置,能夠對需要冷卻的電子元件進行快速冷卻,且結構簡單。 With the electronic component cooling device of the present invention, it is possible to rapidly cool an electronic component that needs to be cooled, and the structure is simple.
1‧‧‧電子元件冷卻裝置 1‧‧‧Electronic component cooling device
10‧‧‧載體 10‧‧‧ Carrier
20‧‧‧電源 20‧‧‧Power supply
30‧‧‧冷卻模組 30‧‧‧Cooling module
40‧‧‧第一開關 40‧‧‧First switch
50‧‧‧第二開關 50‧‧‧second switch
60‧‧‧風扇 60‧‧‧fan
70‧‧‧電位調節器 70‧‧‧potentiometer
80‧‧‧電子顯示屏 80‧‧‧Electronic display
90‧‧‧通風區域 90‧‧‧Ventilated area
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TW099118735A TWI514119B (en) | 2010-06-09 | 2010-06-09 | Device for cooling electronic elements |
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TW099118735A TWI514119B (en) | 2010-06-09 | 2010-06-09 | Device for cooling electronic elements |
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TW200605767A (en) * | 2004-05-03 | 2006-02-01 | Parker Hannifin Corp | Lightweight heat sink |
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CN1203512A (en) * | 1997-05-08 | 1998-12-30 | 松下电器产业株式会社 | Electronic unit soldering apparatus |
CN1591844A (en) * | 2003-08-29 | 2005-03-09 | 吕声木 | Semiconductor CPU radiator |
TW200605767A (en) * | 2004-05-03 | 2006-02-01 | Parker Hannifin Corp | Lightweight heat sink |
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TW201144989A (en) | 2011-12-16 |
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