TWI514119B - Device for cooling electronic elements - Google Patents

Description

Electronic component cooling device

The present invention relates to a cooling device, and more particularly to a device for cooling electronic components.

At present, the handheld electronic industry is developing rapidly, and the products are becoming more light, thin, short, and small, which puts higher requirements on the layout process of electronic components, which leads to further difficulty in product maintenance.

In general, in order to meet the requirements, in the layout of electronic components, the back-to-back design of the PCBA components is limited by space, and the Underfill process is introduced to enhance the reliability of the product. When repairing electronic components, repairing components on one side of the PCB can easily affect the components located on the other side of the PCB. For example, the components on the PCB side are manually hand-warked. During maintenance, it is easy to cause the temperature of the other side of the PCB to be repaired without the need to repair the electronic components, resulting in secondary tinning, which causes the components that are not in need of maintenance to have misalignment, such as tin, and the like, and at the same time, the product is heated. After that, it will also cause the expansion coefficient of the filling glue to increase, which leads to an increase in the difficulty of product maintenance and a reduction in the maintenance success rate.

In view of this, it is necessary to provide a cooling device for performing rapid cooling treatment of electronic components that require cooling.

The electronic component cooling device is configured to cool an electronic component that does not need to be heated at a corresponding position on the other side of the PCB when heating an electronic component on one side of the PCB. The electronic component cooling device includes a carrier and is located on the carrier a power supply and a cooling module, the cooling module comprising a heat sink, a semiconductor cooling fin and a heat conducting base, the heat sink comprising a plurality of parallel spaced fins located above the carrier, the semiconductor cooling fin being located above the heat sink The cooling surface and the heat generating surface are in contact with each other, and the heat generating surface is in contact with the heat sink. The heat conducting base is located above the cooling surface of the semiconductor cooling fin for carrying the electronic components to be cooled, and at the same time Heat transfer between the electronic components that require cooling and the cooling surface. When the semiconductor cooling fin is energized, the cooling surface of the semiconductor cooling fin is in a continuous low temperature state, and heat is continuously transmitted between the heat conducting base, thereby reducing the temperature of the heat conducting base, thereby reducing the cooling required to be carried on the heat conducting base. The temperature of the electronic component, at the same time, the heat generating surface of the semiconductor cooling fin generates heat and is transmitted to the heat sink for heat dissipation by the heat sink; the cooling module further includes a windshield, the size of the windshield and the need for heating The size of the electronic components corresponds to the heat used to heat the electronic components that need to be heated.

By using the electronic component cooling device of the present invention, it is possible to perform rapid cooling processing on an electronic component that requires cooling, and the structure is simple.

1‧‧‧Electronic component cooling device

10‧‧‧ Carrier

20‧‧‧Power supply

30‧‧‧Cooling module

40‧‧‧First switch

50‧‧‧second switch

60‧‧‧fan

70‧‧‧potentiometer

80‧‧‧Electronic display

90‧‧‧Ventilated area

301‧‧‧ radiator

302‧‧‧Semiconductor Cooling Film

303‧‧‧thermal base

304‧‧‧Upper cover

305‧‧‧wind curtain

306‧‧‧First silica gel

307‧‧‧Second silica gel

308‧‧‧Silicone Cream

3011‧‧‧heat fins

3021‧‧‧Refrigeration surface

3022‧‧‧Face noodles

1 is a schematic diagram of an electronic component cooling device in a first embodiment of the present invention.

2 is an exploded perspective view of a cooling module in the first embodiment of the present invention.

1 is a schematic diagram of an electronic component cooling device according to a first embodiment of the present invention. The electronic component cooling device 1 includes a carrier 10, a power source 20, and a cooling module 30. . The power source 20 and the cooling module 30 are respectively located on the carrier 10. The power source 20 is used to power the cooling module 30.

2 is a schematic exploded view of the cooling module 30 according to the first embodiment of the present invention. The cooling module 30 includes a heat sink 301, a semiconductor cooling fin 302, and a heat conducting base 303. The heat sink 301 includes a plurality of parallel spaced fins 3011 positioned above the carrier 10. The semiconductor cooling fins 302 are located between the heat sink 301 and the heat conducting base 303, and include a cooling surface 3021 and a heat generating surface 3022. The cooling surface 3021 of the semiconductor cooling fin 302 and the heat conducting base 303 are in contact with each other, and the heat generating surface 3022 and the heat sink 301 are in contact with each other. . The thermally conductive base 303 is located above the cooling surface 3021 of the semiconductor cooling fin 302 for carrying electronic components to be cooled, and performs heat transfer between the electronic components to be cooled and the cooling surface 3021 of the semiconductor cooling fins 302, for example, When repairing the components of the PCB board, the components that are not required to be repaired on the other side of the PCB board can be placed on the heat-conducting base, which is made of metal (iron, copper, etc.) with better thermal conductivity. In the embodiment, the heat conducting base 303 is made of red copper. After the semiconductor cooling fins 302 in the cooling module 30 are energized, the cooling surface 3021 of the semiconductor cooling fins 302 will be in a continuous low temperature state, and heat transfer is continuously performed with the heat conducting base 303, thereby reducing the temperature of the heat conducting base 303. Further, the temperature of the electronic component carried on the heat conducting base 303 is lowered, and at the same time, the heat generating surface 3022 of the semiconductor cooling fin 302 generates a continuous heat, and is transmitted to the heat sink 301, and then radiated by the heat sink 301.

With continued reference to FIG. 1, the electronic component cooling device 1 further includes a fan 60 located above the carrier 10. In the present embodiment, the carrier 10 is formed with a venting region 90 including a plurality of venting holes. The fan 60 is electrically connected to the power source 20. The fan 60 and the ventilation area 90 formed on the carrier 10 are respectively placed on both sides of the cooling module 30, and the fan 60 After the blown airflow passes through the cooling module 30, it is discharged through the ventilation holes of the ventilation area 90, so that the heat distributed on the heat dissipation fins 3011 of the heat sink 301 in the cooling module 30 is blown away, thereby improving the heat dissipation of the heat dissipation fins 3011. effectiveness. It can be imagined that when the plane of the heat sink fins 3011 in the heat sink 301 is perpendicular to the plane of the fan 60 and the plane of the ventilation area 90, the airflow blown by the fan 60 is more easily circulated, so that the heat dissipation effect is optimal.

The electronic component cooling device 1 further includes a potential adjuster 70 and an electronic display screen 80. The potential adjuster 70 is located between the power supply 20 and the semiconductor cooling fins 302 in the cooling module 30, and is electrically connected thereto. In order to adjust the operating voltage applied to the semiconductor cooling fins 302 provided by the power source 20, when it is necessary to adjust the cooling effect of the semiconductor cooling fins 302, it is only necessary to properly adjust the potential adjuster 70 under normal use conditions so as to be loaded on the semiconductor. The operating voltage on the cooling fins 302 is correspondingly increased or decreased, so that the temperature of the cooling surface 3021 of the semiconductor cooling fins 302 is correspondingly lowered or increased, and the temperature of the heat generating surface 3022 is correspondingly increased or decreased, so that the cooling surface 3021 The heat transfer effect of the thermally conductive base 303 is increased or decreased correspondingly, so that the temperature of the electronic component carried on the thermally conductive base 303 is lowered faster or slower. The electronic display screen 80 is connected to the potential adjuster 70 for displaying the voltage value outputted by the potential adjuster 70 to the semiconductor cooling fins 302 in the cooling module 30. It is not difficult to imagine that in other embodiments, both the potential adjuster 70 and the electronic display 80 can be omitted.

The electronic component cooling device 1 further includes a first switch 40 and a second switch 50, and the first switch 40 is located between the power source 20 and the fan 60 for turning on or off the connection circuit of the power source 20 and the fan 60, thereby The fan 60 is in a working or inoperative state. The second switch 50 is located between the power source 20 and the semiconductor cooling fins 302 in the cooling module 30 for turning on or off the connection circuit between the power source 20 and the semiconductor cooling fins 302, thereby The semiconductor cooling fins 302 are in a working or inoperative state. It is not difficult to imagine that in other embodiments, the first switch 40 and the second switch 50 can be omitted, and the operating state of the semiconductor cooling fins 302 and the fan 60 in the cooling module 30 is directly controlled by the power source 20.

Referring to FIG. 2 , the cooling module 30 further includes an upper cover 304 and a windshield 305 . The upper cover 304 is made of a high temperature resistant material for covering the other electronic components in the vicinity of the electronic component to be heated. In the present embodiment, the upper cover 304 is made of synthetic stone (from glass fiber and high temperature resistant, high mechanical). Made of sintered resin. The size of the windshield 305 corresponds to the size of the electronic component to be heated, for concentrating heat and heating the electronic component to be heated. It is not difficult to imagine that in other embodiments, both the upper cover 304 and the windshield 305 may be omitted.

The cooling module 30 further includes a first silicone sheet 306, a second silicone sheet 307, and a silicone paste 308. The first silicone sheet 306 is placed between the electronic component to be cooled and the heat conducting base 303 for improving the heat transfer performance between the electronic component to be cooled and the heat conducting base 303. The second silicone sheet 307 is disposed between the heat conducting base 303 and the cooling surface 3021 of the semiconductor cooling fin for improving the heat transfer performance between the heat conducting base 303 and the cooling surface 3021 of the semiconductor cooling fin. The silicone paste 308 can be suitably applied to the surfaces of the first silica gel sheet 306 and the second silica gel sheet 307, so that the surfaces of the first silica gel sheet 306 and the second silica gel sheet 307 are more easily contacted, thereby improving the heat transfer efficiency of the silica gel sheet. . It is not difficult to imagine that in other embodiments, the first silica gel sheet 306, the second silica gel sheet 307, and the silica gel paste 308 may be omitted.

With the electronic component cooling device of the present invention, it is possible to rapidly cool an electronic component that needs to be cooled, and the structure is simple.

1‧‧‧Electronic component cooling device

10‧‧‧ Carrier

20‧‧‧Power supply

30‧‧‧Cooling module

40‧‧‧First switch

50‧‧‧second switch

60‧‧‧fan

70‧‧‧potentiometer

80‧‧‧Electronic display

90‧‧‧Ventilated area

Claims (10)

An electronic component cooling device for cooling an electronic component that does not need to be heated at a corresponding position on the other side of the PCB when heating an electronic component on one side of the PCB. The electronic component cooling device includes a carrier and is located The power supply on the carrier is improved in that the electronic component cooling device further includes: a cooling module, the cooling module includes a heat sink, a semiconductor cooling fin, and a heat conducting base; the heat sink includes a plurality of carriers The heat dissipating fins are arranged in parallel; the semiconductor cooling fins are disposed on the heat sink, and include a cooling surface and a heat generating surface, and the cooling surface of the semiconductor cooling fin is in contact with the heat conducting base, and the heat generating surface and the heat sink are in contact with each other; The base is located above the cooling surface of the semiconductor cooling fin for carrying the electronic component to be cooled, and performs heat transfer between the electronic component to be cooled and the cooling surface of the semiconductor cooling fin; wherein, when the semiconductor cooling fin is energized, The cooling surface is in a continuous low temperature state, and the heat transfer between the cooling surface and the heat conducting base is continuously performed to reduce the heat conduction bottom. The temperature of the electronic component to be cooled, which is carried on the heat-conducting base, and the heat-generating surface generates heat and is transmitted to the heat sink for heat dissipation by the heat sink; the cooling module further includes a windshield. The size of the windshield corresponds to the size of the electronic components to be heated, for concentrating heat and heating the electronic components that need to be heated. The electronic component cooling device of claim 1, wherein the component of the thermally conductive base is iron or copper. The electronic component cooling device of claim 1, wherein the electronic component cooling device further comprises a fan and a ventilation area respectively located on the carrier, the ventilation area being paralleled by several The venting holes are arranged, and the fan and the ventilation area are respectively located on both sides of the heat dissipation fins. The electronic component cooling device of claim 3, wherein the plane of the heat dissipating fins is perpendicular to a plane of the fan and the ventilation area, respectively. The electronic component cooling device of claim 3, wherein the electronic component cooling device further comprises a first switch located between the power source and the fan for controlling the opening and stopping of the fan. The electronic component cooling device of claim 1, wherein the electronic component cooling device further comprises a potential adjuster and an electronic display screen, the potential adjuster being located between the power supply and the semiconductor cooling fins in the cooling module And adjusting an operating voltage applied to the semiconductor cooling fin, thereby adjusting a temperature of the cooling surface and the heat generating surface of the semiconductor cooling fin, thereby adjusting a cooling effect of the semiconductor cooling fin correspondingly, wherein the electronic display screen is connected to the potential adjuster, Used to display the operating voltage applied to the semiconductor cooling fins in the cooling module. The electronic component cooling device of claim 1, wherein the electronic component cooling device further comprises a second switch located between the power supply and the semiconductor cooling fin of the cooling module for conducting or Disconnect the connection between the semiconductor cooling fin and the power supply. The electronic component cooling device of claim 1, wherein the cooling module further comprises a movable upper cover, wherein the upper cover component is a high temperature resistant material for heating other electronic components in the vicinity of the electronic component. Protect the top cover. The electronic component cooling device of claim 1, wherein the cooling module further comprises a first silica gel sheet and a second silica gel sheet, wherein the first silicon wafer sheet is placed on the electronic component and the heat conducting base to be cooled. For improving the heat transfer performance between the electronic component and the heat conducting base, the second silicone sheet is disposed between the heat conducting base and the cooling surface of the semiconductor cooling fin for improving the cooling surface of the heat conducting base and the semiconductor cooling fin. Heat transfer performance between. The electronic component cooling device of claim 9, wherein the first silica gel sheet and the second silica gel sheet are coated with a silicone paste for further improving the heat of the silica gel sheet. Passed performance.