TWI513951B - Thickness detecting method - Google Patents

Thickness detecting method Download PDF

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TWI513951B
TWI513951B TW101144948A TW101144948A TWI513951B TW I513951 B TWI513951 B TW I513951B TW 101144948 A TW101144948 A TW 101144948A TW 101144948 A TW101144948 A TW 101144948A TW I513951 B TWI513951 B TW I513951B
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light
emitting device
light emitting
sensing device
light sensing
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TW101144948A
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TW201420992A (en
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Yu Chih Chang
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Primax Electronics Ltd
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Description

厚度檢測方法Thickness detection method

本發明關於一種厚度檢測方法,尤其是指一種非接觸式厚度檢測方法。The present invention relates to a thickness detecting method, and more particularly to a non-contact thickness detecting method.

一般產業界係利用游標尺或螺旋測微器來量測一待測物厚度,以下就習知之游標尺進行說明。The general industry uses a vernier scale or a spiral micrometer to measure the thickness of a test object. The following describes the conventional vernier scale.

首先請參照至圖1,圖1係顯示習知之游標尺之示意圖,游標尺1包括本體11以及測量部12。First, please refer to FIG. 1 , which is a schematic diagram showing a conventional vernier scale. The vernier scale 1 includes a body 11 and a measuring portion 12 .

本體11具有第一尺部111以及第二尺部112,第二尺部112套設於第一尺部111並可沿第一尺部111往復地線性位移。The body 11 has a first ruler 111 and a second ruler 112. The second ruler 112 is sleeved on the first ruler 111 and can be linearly displaced reciprocally along the first ruler 111.

此外,主刻度111a與副刻度112a分別刻劃於第一尺部111以及第二尺部112上,用以顯示游標尺1量測待測物後之量測尺寸數據。In addition, the main scale 111a and the sub-scale 112a are respectively scribed on the first ruler 111 and the second ruler 112 for displaying the measured size data after the vernier 1 measures the object to be tested.

測量部12具有第一爪部121以及第二爪部122。第一爪部121藉由固定座123固接於第一尺部111之一端。第二爪部122樞接於第二尺部112,可隨第二尺部112滑移改變其與第一爪部121間之相對距離,並得以於第一位置及第二位置間擺動以改變其與第一爪部121間之相對角度。The measuring unit 12 has a first claw portion 121 and a second claw portion 122. The first claw portion 121 is fixed to one end of the first ruler portion 111 by a fixing seat 123. The second claw portion 122 is pivotally connected to the second ruler 112, and can change the relative distance between the second claw portion 122 and the first claw portion 121, and can be swung between the first position and the second position to change. Its relative angle with the first claw portion 121.

具體而言,當第二爪部122位於第一位置時,其與第一爪部121間呈彼此平行對應之狀態,而當第二爪部122位於第二位置時,其與 第一爪部121間則相隔一銳角角度。Specifically, when the second claw portion 122 is in the first position, it is in a state of being parallel to each other with the first claw portion 121, and when the second claw portion 122 is located at the second position, The first claw portions 121 are separated by an acute angle.

此外,第一爪部121包括一圓弧狀之第一量端121a,第二爪部122則包括與第一量端121a相向對應之圓弧狀之第二量端122a。In addition, the first claw portion 121 includes a first end 121a of an arc shape, and the second claw portion 122 includes a second end 122a of an arc shape corresponding to the first end 121a.

使用者以第一爪部121與第二爪部122將待量測之待測物13夾制於其間,即可以藉由主刻度111a與副刻度112a所顯示之數據,獲得待測物13之厚度數據。The user can sandwich the object to be tested 13 between the first claw portion 121 and the second claw portion 122, that is, the object 13 can be obtained by the data displayed by the main scale 111a and the sub-scale 112a. Thickness data.

當使用者施力將第二爪部122自第一位置轉動至第二位置時,第二爪部122與第一爪部121之相對角度增加,第二量端122a與第一量端121a間之距離亦增加,使游標尺1得以輕易地自所量測之待測物13上取下。When the user applies a force to rotate the second claw portion 122 from the first position to the second position, the relative angle between the second claw portion 122 and the first claw portion 121 increases, and between the second quantity end 122a and the first quantity end 121a The distance is also increased, so that the vernier 1 can be easily removed from the measured object 13 to be measured.

由上述內容可知,習知的厚度檢測方法需使用游標尺1等工具直接地接觸待測物以測量待測物厚度,所以不適用於表面為軟性材質的待測物或是移動中的待測物。It can be seen from the above that the conventional thickness detecting method needs to directly contact the object to be tested by using a tool such as a vernier 1 to measure the thickness of the object to be tested, so it is not suitable for the object to be tested whose surface is a soft material or to be tested while moving. Things.

習知的厚度檢測方法更無法應用於產線上並達到快速篩選的目的。Conventional thickness detection methods are even less applicable to the production line and achieve rapid screening.

詳細的說,使用游標尺1時需要較為複雜的計算過程才能得出待測物的實際厚度,這將使整體檢測時間延長,況且產線中的某些程序並不需實際計算出待測物厚度,僅需判斷待測物厚度是否在預設厚度範圍內即可,因此游標尺1並不適用。In detail, the use of the vernier 1 requires a more complicated calculation process to obtain the actual thickness of the object to be tested, which will extend the overall detection time, and some programs in the production line do not need to actually calculate the object to be tested. For the thickness, it is only necessary to judge whether the thickness of the object to be tested is within the preset thickness range, so the vernier scale 1 is not applicable.

再者,操作員並無法由游標尺上的刻度立即判斷待測物的厚度是否在預設厚度範圍內,更可能因為計算錯誤等因素而造成誤判。Furthermore, the operator cannot immediately judge whether the thickness of the object to be tested is within the preset thickness range by the scale on the vernier scale, and is more likely to cause misjudgment due to factors such as calculation errors.

因此需要一種改良的厚度檢測方法以改善習知的厚度檢測方法的問題。There is therefore a need for an improved thickness detection method to ameliorate the problems of conventional thickness detection methods.

本發明之目的在於提供一種快速且精準之厚度檢測方法。It is an object of the present invention to provide a fast and accurate method of thickness detection.

本發明之主要目的在於提供一種厚度檢測方法,該方法包括以下步驟:(A)將一待測物置於一水平基座上;(B)判斷一第一光感測裝置是否感測到一第一光發射裝置所發射之一第一光束並判斷一第二光感測裝置是否感測到一第二光發射裝置所發射之一第二光束,其中第二光發射裝置與第二光感測裝置之位置高於第一光發射裝置與第一光感測裝置之位置;以及(C)若第一光感測裝置未感測到第一光發射裝置所發射之第一光束且第二光感測裝置感測到第二光發射裝置所發射之第二光束,則顯示一第一訊號並判斷待測物之一厚度於一預設厚度範圍內。The main object of the present invention is to provide a thickness detecting method, which comprises the steps of: (A) placing a test object on a horizontal base; and (B) determining whether a first light sensing device senses a first a light emitting device emits a first light beam and determines whether a second light sensing device senses a second light beam emitted by a second light emitting device, wherein the second light emitting device and the second light sensing device The position of the device is higher than the position of the first light emitting device and the first light sensing device; and (C) if the first light sensing device does not sense the first light beam emitted by the first light emitting device and the second light The sensing device senses the second light beam emitted by the second light emitting device, and displays a first signal and determines that one of the thicknesses of the object to be tested is within a predetermined thickness range.

於一較佳實施例中,其中於步驟(B)之後更包括一步驟(C2):若第一光感測裝置與第二光感測裝置分別感測到第一光發射裝置所發射之第一光束與第二光發射裝置所發射之第二光束,則顯示一第二訊號並判斷待測物之厚度小於預設厚度範圍。In a preferred embodiment, after step (B), a step (C2) is further included: if the first light sensing device and the second light sensing device respectively sense the first light emitting device A light beam and a second light beam emitted by the second light emitting device display a second signal and determine that the thickness of the object to be tested is less than a predetermined thickness range.

於一較佳實施例中,其中於步驟(B)之後更包括一步驟(C3):若第一光感測裝置與第二光感測裝置皆未感測到第一光發射裝置所發射之第一光束與第二光發射裝置所發射之第二光束,則顯示一 第三訊號並判斷待測物之厚度大於預設厚度範圍。In a preferred embodiment, after step (B), a step (C3) is further included: if neither the first light sensing device nor the second light sensing device senses the first light emitting device The first light beam and the second light beam emitted by the second light emitting device display one The third signal determines that the thickness of the object to be tested is greater than a predetermined thickness range.

於一較佳實施例中,其中於步驟(C)、步驟(C2)以及步驟(C3)中係由一控制器依據第一光感測裝置與第二光感測裝置是否分別感測到第一光束與第二光束而令一訊號顯示器顯示第一訊號、第二訊號以及第三訊號。In a preferred embodiment, in step (C), step (C2), and step (C3), a controller senses whether the first light sensing device and the second light sensing device respectively sense A light beam and a second light beam cause a signal display to display the first signal, the second signal, and the third signal.

於一較佳實施例中,其中步驟(C)中之第一訊號包括一綠燈訊號以及一紅燈訊號。In a preferred embodiment, the first signal in step (C) includes a green light signal and a red light signal.

於一較佳實施例中,其中步驟(C2)中之第二訊號包括二紅燈訊號。In a preferred embodiment, the second signal in step (C2) includes two red light signals.

於一較佳實施例中,其中步驟(C3)中之第三訊號包括二綠燈訊號。In a preferred embodiment, the third signal in step (C3) includes a second green light signal.

於一較佳實施例中,其中於步驟(A)之前更包括一步驟:In a preferred embodiment, the method further includes a step before the step (A):

(A1)依據預設厚度範圍調整第一光感測裝置、第二光感測裝置、第一光發射裝置與第二光發射裝置之位置,使第一光束與水平基座的距離等於預設厚度範圍之一下限值,並令第二光束與水平基座的距離等於預設厚度範圍之一上限值。(A1) adjusting the positions of the first light sensing device, the second light sensing device, the first light emitting device and the second light emitting device according to the preset thickness range, so that the distance between the first light beam and the horizontal base is equal to the preset One of the thickness ranges is a lower limit value, and the distance between the second beam and the horizontal pedestal is equal to an upper limit value of one of the preset thickness ranges.

於一較佳實施例中,其中步驟(A1)中之第一光發射裝置與第二光發射裝置設置於一第一支柱上,第一光感測裝置與第二光感測裝置設置於一第二支柱上,其中,第一支柱與第二支柱平行。In a preferred embodiment, the first light emitting device and the second light emitting device in step (A1) are disposed on a first pillar, and the first light sensing device and the second light sensing device are disposed on the first light sensing device. In the second pillar, the first pillar is parallel to the second pillar.

於一較佳實施例中,其中步驟(A1)更包括: 依據預設厚度範圍調整第一支柱與第二支柱之長度。In a preferred embodiment, step (A1) further includes: The lengths of the first pillar and the second pillar are adjusted according to a preset thickness range.

於一較佳實施例中,其中步驟(B)中之第一光發射裝置與第二光發射裝置係發射雷射光束。In a preferred embodiment, the first light emitting device and the second light emitting device in step (B) emit a laser beam.

於一較佳實施例中,其中步驟(B)中之第一光感測裝置與第二光感測裝置係光電二極體或光敏電阻。In a preferred embodiment, the first photo sensing device and the second photo sensing device in step (B) are photodiodes or photoresistors.

於一較佳實施例中,其中步驟(B)中之第一光發射裝置與第一光感測裝置互相面對,第二光發射裝置與第二光感測裝置互相面對。In a preferred embodiment, the first light emitting device and the first light sensing device in step (B) face each other, and the second light emitting device and the second light sensing device face each other.

以下說明本發明一第一較佳實施例之厚度檢測方法。A thickness detecting method according to a first preferred embodiment of the present invention will now be described.

請參照圖2,圖2係顯示本發明一第一較佳實施例之厚度檢測方法中之水平基座、第一光發射裝置、第二光發射裝置、第一光感測裝置、第二光感測裝置、第一支柱以及第二支柱之示意圖。Referring to FIG. 2, FIG. 2 shows a horizontal pedestal, a first light emitting device, a second light emitting device, a first light sensing device, and a second light in a thickness detecting method according to a first preferred embodiment of the present invention. Schematic diagram of the sensing device, the first pillar, and the second pillar.

首先,第一支柱21以及第二支柱22皆設置於水平基座23上,且第一支柱21與第二支柱22平行。First, the first strut 21 and the second strut 22 are both disposed on the horizontal base 23, and the first strut 21 is parallel to the second strut 22.

接下來,第一光發射裝置24與第二光發射裝置25設置於第一支柱21上,且第二光發射裝置25位於第一光發射裝置24上方,第一光感測裝置26以及第二光感測裝置27則設置於第二支柱22上,且第二光感測裝置27位於第一光感測裝置26上方。Next, the first light emitting device 24 and the second light emitting device 25 are disposed on the first pillar 21, and the second light emitting device 25 is located above the first light emitting device 24, the first light sensing device 26 and the second The light sensing device 27 is disposed on the second pillar 22 , and the second light sensing device 27 is located above the first light sensing device 26 .

於本例中,第一光發射裝置24與第二光發射裝置25可沿第一支柱21上下移動,第一光感測裝置26與第二光感測裝置27則可沿第二支柱22上下移動。In this example, the first light emitting device 24 and the second light emitting device 25 can move up and down along the first pillar 21, and the first light sensing device 26 and the second light sensing device 27 can be moved up and down along the second pillar 22 mobile.

此外,第一光發射裝置24與第一光感測裝置26互相面對,第二光發射裝置25則與第二光感測裝置27互相面對。Further, the first light emitting device 24 and the first light sensing device 26 face each other, and the second light emitting device 25 and the second light sensing device 27 face each other.

於本例中,第一光發射裝置24與第二光發射裝置25用於發射雷射光束,第一光感測裝置26以及第二光感測裝置27為光電二極體或光敏電阻,用於感測第一光發射裝置24與第二光發射裝置25所發射之雷射光束。In this example, the first light emitting device 24 and the second light emitting device 25 are used to emit a laser beam, and the first light sensing device 26 and the second light sensing device 27 are photodiodes or photoresistors. The laser beam emitted by the first light emitting device 24 and the second light emitting device 25 is sensed.

再者,於本例中另外包括一控制器28以及一訊號顯示器29,請同時參照圖2以及圖3,圖3係顯示本發明一第一較佳實施例之控制器之方塊圖。Furthermore, in this example, a controller 28 and a signal display 29 are additionally included. Referring to FIG. 2 and FIG. 3 simultaneously, FIG. 3 is a block diagram showing a controller of a first preferred embodiment of the present invention.

第一光感測裝置26以及第二光感測裝置27分別連接至控制器28,控制器28則連接至訊號顯示器29,控制器28依據第一光感測裝置26以及第二光感測裝置27是否感測到第一光發射裝置24與第二光發射裝置25所發射之光束而令訊號顯示器29顯示第一訊號b1(圖5)或第二訊號b2(圖6)或第三訊號b3(圖7)。The first light sensing device 26 and the second light sensing device 27 are respectively connected to the controller 28, and the controller 28 is connected to the signal display 29, and the controller 28 is based on the first light sensing device 26 and the second light sensing device. 27 whether the light beam emitted by the first light emitting device 24 and the second light emitting device 25 is sensed to cause the signal display 29 to display the first signal b1 (FIG. 5) or the second signal b2 (FIG. 6) or the third signal b3 (Figure 7).

以下說明本發明一第一較佳實施例之厚度檢測方法之流程,請參照圖3、圖4以及圖5,圖4係顯示本發明一第一較佳實施例之厚度檢測方法之流程圖,圖5係顯示本發明一第一較佳實施例之厚度檢測方法中之待測物之第一示意圖。The flow of the thickness detecting method of a first preferred embodiment of the present invention is described below. Referring to FIG. 3, FIG. 4 and FIG. 5, FIG. 4 is a flow chart showing a thickness detecting method according to a first preferred embodiment of the present invention. Fig. 5 is a first schematic view showing an object to be tested in a thickness detecting method according to a first preferred embodiment of the present invention.

首先執行步驟(A1),依據預設厚度範圍n~m調整第一光感測裝置26、第二光感測裝置27、第一光發射裝置24與第二光發射裝置25之位置。First, step (A1) is performed to adjust the positions of the first light sensing device 26, the second light sensing device 27, the first light emitting device 24, and the second light emitting device 25 according to the preset thickness range n~m.

詳細的說,第一光發射裝置24將沿第一支柱21被移動至其所發射之第一光束24a與水平基座23之距離等於預設厚度範圍n~m之下限值n為止,第二光發射裝置25則將沿第一支柱21被移動至其所發射之第二光束25a與水平基座23之距離等於預設厚度範圍n~m之上限值m為止。In detail, the first light emitting device 24 will be moved along the first strut 21 until the distance between the first light beam 24a emitted by the first light beam 21 and the horizontal base 23 is equal to the lower limit value n of the preset thickness range n~m, The two light emitting device 25 is moved along the first strut 21 until the distance between the second light beam 25a emitted by the second light beam 21 and the horizontal base 23 is equal to the upper limit m of the predetermined thickness range n~m.

另外,第一光感測裝置26將沿第二支柱22被移動至可感測到第一光束24a之位置,第二光感測裝置27則將沿第二支柱22被移動至可感測到第二光束25a之位置。Additionally, the first light sensing device 26 will be moved along the second post 22 to a position where the first light beam 24a can be sensed, and the second light sensing device 27 will be moved along the second leg 22 to be sensible The position of the second light beam 25a.

接下來執行步驟(A),將待測物a1置於水平基座23上,如圖5所示。Next, step (A) is performed to place the object to be tested a1 on the horizontal base 23 as shown in FIG.

而後執行步驟(B),由控制器28判斷第一光感測裝置26是否感測到第一光發射裝置24所發射之第一光束24a並判斷第二光感測裝置27是否感測到第二光發射裝置25所發射之第二光束25a。Then, the step (B) is performed, and the controller 28 determines whether the first light sensing device 26 senses the first light beam 24a emitted by the first light emitting device 24 and determines whether the second light sensing device 27 senses the first light beam. The second light beam 25a emitted by the two light emitting devices 25.

由於待測物a1擋住第一光束24a而未擋住第二光束25a,亦即第一光感測裝置26未感測到第一光發射裝置24所發射之第一光束24a(於圖4中以S1=0表示第一光感測裝置26未感測到第一光發射裝置24所發射之第一光束24a),而第二光感測裝置27感測到第二光發射裝置25所發射之第二光束25a(於圖4中以S2=1表示第二光感測裝置27感測到第二光發射裝置25所發射之第二光束25a),因此接著執行步驟(C),控制器28令訊號顯示器29顯示第一訊號b1(一綠燈訊號c以及一紅燈訊號d),操作員即依此判斷待 測物a1之厚度於預設厚度範圍n~m內,於是待測物a1通過檢測。Since the object to be detected a1 blocks the first light beam 24a and does not block the second light beam 25a, that is, the first light sensing device 26 does not sense the first light beam 24a emitted by the first light emitting device 24 (in FIG. 4 S1=0 indicates that the first light sensing device 26 does not sense the first light beam 24a) emitted by the first light emitting device 24, and the second light sensing device 27 senses that the second light emitting device 25 emits The second light beam 25a (in FIG. 4, S2=1 indicates that the second light sensing device 27 senses the second light beam 25a emitted by the second light emitting device 25), and thus step (C) is performed, and the controller 28 The signal display 29 displays the first signal b1 (a green light signal c and a red light signal d), and the operator judges accordingly The thickness of the measuring object a1 is within a preset thickness range n~m, so that the object to be tested a1 passes the detection.

以下說明與待測物a1相同之待測物a2的檢測情形,請參照圖3以及圖6,圖6係顯示本發明一第一較佳實施例之厚度檢測方法中之待測物之第二示意圖。The following describes the detection situation of the object to be tested a2 which is the same as the object to be tested a1. Referring to FIG. 3 and FIG. 6, FIG. 6 shows the second object to be tested in the thickness detecting method according to a first preferred embodiment of the present invention. schematic diagram.

需要說明的是,由於待測物a2與待測物a1為同一種類的待測物並具有同一預設厚度範圍n~m,因此不必再進行步驟(A1)。It should be noted that since the object to be tested a2 and the object to be tested a1 are the same type of object to be tested and have the same preset thickness range n~m, the step (A1) is not necessary.

首先執行步驟(A),將圖6中之待測物a2置於水平基座23上。First, step (A) is performed, and the object to be tested a2 in Fig. 6 is placed on the horizontal base 23.

而後執行步驟(B),由控制器28判斷第一光感測裝置26是否感測到第一光發射裝置24所發射之第一光束24a並判斷第二光感測裝置27是否感測到第二光發射裝置25所發射之第二光束25a。Then, the step (B) is performed, and the controller 28 determines whether the first light sensing device 26 senses the first light beam 24a emitted by the first light emitting device 24 and determines whether the second light sensing device 27 senses the first light beam. The second light beam 25a emitted by the two light emitting devices 25.

由於待測物a2未擋住第一光束24a與第二光束25a,亦即第一光感測裝置26與第二光感測裝置27分別感測到第一光發射裝置24所發射之第一光束24a與第二光發射裝置25所發射之第二光束25a(於圖4中以S1=1以及S2=1表示第一光感測裝置26以及第二光感測裝置27分別感測到第一光束24a以及第二光束25a),因此接著執行步驟(C2),控制器28令訊號顯示器29顯示第二訊號b2(二紅燈訊號d),操作員即依此判斷待測物a2之厚度小於預設厚度範圍n~m,於是待測物a2未通過檢測。Since the object to be tested a2 does not block the first light beam 24a and the second light beam 25a, that is, the first light sensing device 26 and the second light sensing device 27 sense the first light beam emitted by the first light emitting device 24, respectively. 24a and the second light beam 25a emitted by the second light emitting device 25 (the first light sensing device 26 and the second light sensing device 27 respectively sense the first in S1=1 and S2=1 in FIG. 4) The light beam 24a and the second light beam 25a) are thus subjected to the step (C2), and the controller 28 causes the signal display 29 to display the second signal b2 (two red light signals d), and the operator judges that the thickness of the object to be tested a2 is smaller than The preset thickness range is n~m, so the object to be tested a2 does not pass the detection.

以下說明與待測物a1相同之待測物a3的檢測情形,請參照圖7,圖7係顯示本發明一第一較佳實施例之厚度檢測方法中之待測物之第三示意圖。The following describes the detection of the object to be tested a3 which is the same as the object to be tested a1. Referring to FIG. 7, FIG. 7 is a third schematic view showing the object to be tested in the thickness detecting method according to a first preferred embodiment of the present invention.

需要說明的是,由於待測物a3與待測物a1為同一種類的待測物並具有同一預設厚度範圍n~m,因此不必再進行步驟(A1)。It should be noted that since the object to be tested a3 and the object to be tested a1 are the same type of object to be tested and have the same preset thickness range n~m, the step (A1) is not necessary.

首先執行步驟(A),將圖7中之待測物a3置於水平基座23上。First, step (A) is performed, and the object to be tested a3 in Fig. 7 is placed on the horizontal base 23.

而後執行步驟(B),由控制器28判斷第一光感測裝置26是否感測到第一光發射裝置24所發射之第一光束24a並判斷第二光感測裝置27是否感測到第二光發射裝置25所發射之第二光束25a。Then, the step (B) is performed, and the controller 28 determines whether the first light sensing device 26 senses the first light beam 24a emitted by the first light emitting device 24 and determines whether the second light sensing device 27 senses the first light beam. The second light beam 25a emitted by the two light emitting devices 25.

由於待測物a3擋住第一光束24a與第二光束25a,亦即第一光感測裝置26與第二光感測裝置27皆未感測到第一光發射裝置24所發射之第一光束24a與第二光發射裝置25所發射之第二光束25a(於圖4中以S1=0以及S2=0表示第一光感測裝置26以及第二光感測裝置27皆未感測到第一光束24a以及第二光束25a),因此接著執行步驟(C3),控制器28令訊號顯示器29顯示第三訊號b3(二綠燈訊號c),操作員即依此判斷待測物a3之厚度大於預設厚度範圍n~m,於是待測物a3未通過檢測。Since the object to be tested a3 blocks the first light beam 24a and the second light beam 25a, that is, neither the first light sensing device 26 nor the second light sensing device 27 senses the first light beam emitted by the first light emitting device 24. The second light beam 25a emitted by the second light emitting device 25 and the second light emitting device 25 (the first light sensing device 26 and the second light sensing device 27 are not sensed by S1=0 and S2=0 in FIG. 4). a light beam 24a and a second light beam 25a), so that step (C3) is subsequently performed, and the controller 28 causes the signal display 29 to display the third signal b3 (two green light signals c), and the operator judges that the thickness of the object to be tested a3 is greater than The preset thickness range is n~m, so the object to be tested a3 does not pass the detection.

最後說明本發明一第二較佳實施例之厚度檢測方法之流程,請參照圖2以及圖8,圖8係顯示本發明一第二較佳實施例之厚度檢測方法之流程圖。Finally, a flow chart of a thickness detecting method according to a second preferred embodiment of the present invention will be described. Referring to FIG. 2 and FIG. 8, FIG. 8 is a flow chart showing a thickness detecting method according to a second preferred embodiment of the present invention.

首先進行步驟(A1’),依據預設厚度範圍n~m調整第一支柱21與第二支柱22的長度,並調整第一光感測裝置26、第二光感測裝置27、第一光發射裝置24與第二光發射裝置25之位置。First, the step (A1') is performed, and the lengths of the first pillar 21 and the second pillar 22 are adjusted according to the preset thickness range n~m, and the first light sensing device 26, the second light sensing device 27, and the first light are adjusted. The position of the transmitting device 24 and the second light emitting device 25.

詳細的說,第一光發射裝置24將沿第一支柱21被移動至其所發 射之第一光束24a與水平基座23的距離等於預設厚度範圍n~m之下限值n為止,第二光發射裝置25則將沿第一支柱21被移動至其所發射之第二光束25a與水平基座23的距離等於預設厚度範圍n~m之上限值m為止。In detail, the first light emitting device 24 will be moved along the first pillar 21 to be issued thereto. The distance between the first beam 24a and the horizontal pedestal 23 is equal to the lower limit n of the predetermined thickness range n~m, and the second light emitting device 25 is moved along the first pillar 21 to the second emitted by it. The distance between the light beam 25a and the horizontal pedestal 23 is equal to the upper limit value m of the predetermined thickness range n~m.

另外,第一光感測裝置26將沿第二支柱22被移動至可感測到第一光束24a之位置,第二光感測裝置27則將沿第二支柱22被移動至可感測到第二光束25a之位置。Additionally, the first light sensing device 26 will be moved along the second post 22 to a position where the first light beam 24a can be sensed, and the second light sensing device 27 will be moved along the second leg 22 to be sensible The position of the second light beam 25a.

與第一較佳實施例不同的是,若第二光發射裝置25已無法再沿第一支柱21移動,但其所發射之第二光束25a與水平基座23之距離仍未等於預設厚度範圍n~m之上限值m時,則可調整第一支柱21之長度,以令第二光發射裝置25可繼續向上移動。Different from the first preferred embodiment, if the second light emitting device 25 can no longer move along the first pillar 21, the distance between the second light beam 25a emitted by the second light emitting device 25 and the horizontal base 23 is still not equal to the preset thickness. When the limit n is above the range n~m, the length of the first strut 21 can be adjusted so that the second light emitting device 25 can continue to move upward.

而第二支柱22的長度亦將同時被調整,以令第二光感測裝置27可沿第二支柱22向上移動至可感測到第二光束25a之位置。The length of the second post 22 will also be adjusted at the same time to allow the second light sensing device 27 to move up the second post 22 to a position where the second beam 25a can be sensed.

需要補充說明的是,若第一光束24a與第二光束25a的距離已等於預設厚度範圍n~m,則僅需藉由調整第一支柱21與第二支柱22的長度而改變第一光束24a與第二光束25a與水平基座23的距離,而不需調整第一光發射裝置24與第二光發射裝置25之位置。It should be noted that if the distance between the first beam 24a and the second beam 25a is equal to the preset thickness range n~m, only the first beam needs to be changed by adjusting the lengths of the first pillar 21 and the second pillar 22 The distance between the second light beam 25a and the horizontal base 23 is 24a, and the positions of the first light emitting device 24 and the second light emitting device 25 need not be adjusted.

接下來的步驟(A’)至步驟(C3’)皆與第一較佳實施例之步驟(A)至步驟(C3)相同,故於此不再贅述。The subsequent steps (A') to (C3') are the same as steps (A) to (C3) of the first preferred embodiment, and thus will not be described again.

根據以上較佳實施例之說明可知,本發明之厚度檢測方法係依據第一光發射裝置24與第二光發射裝置25所發射之第一光束24a與 第二光束25a被遮擋與否,於訊號顯示器29顯示相應之第一訊號或第二訊號或第三訊號,使操作員可立即判斷待測物之厚度是否於預設厚度範圍內。According to the description of the above preferred embodiments, the thickness detecting method of the present invention is based on the first light beam 24a emitted by the first light emitting device 24 and the second light emitting device 25. Whether the second light beam 25a is blocked or not, the corresponding first signal or the second signal or the third signal is displayed on the signal display 29, so that the operator can immediately determine whether the thickness of the object to be tested is within a preset thickness range.

本發明提供了一種非接觸式厚度檢測方法,可適用於各種材質的待測物且不需要進行任何計算,使得操作員可立即判斷且不會因計算錯誤等因素而誤判。The invention provides a non-contact thickness detecting method, which can be applied to various materials of the object to be tested and does not need to perform any calculation, so that the operator can immediately judge and not be misjudged due to factors such as calculation errors.

再者,本發明之厚度檢測方法於檢測待測物厚度前,可藉由改變第一光發射裝置24與第二光發射裝置25的位置或者改變第一支柱21的長度而調整第一光束24a與第二光束25a與水平基座23的距離,以符合不同的預設厚度範圍,而能適用於各種不同的待測物。Furthermore, the thickness detecting method of the present invention can adjust the first light beam 24a by changing the position of the first light emitting device 24 and the second light emitting device 25 or changing the length of the first pillar 21 before detecting the thickness of the object to be tested. The distance from the second light beam 25a and the horizontal base 23 is adapted to different preset thickness ranges, and can be applied to various different objects to be tested.

以上所述僅為本發明之較佳實施例,並非用以限定本發明之申請專利範圍,因此凡其他未脫離本發明所揭示之精神下所完成之等效改變或修飾,均應包含於本案之申請專利範圍內。The above are only the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention. Therefore, other equivalent changes or modifications which are not departing from the spirit of the present invention should be included in the present invention. Within the scope of the patent application.

1‧‧‧游標尺1‧‧‧ vernier ruler

11‧‧‧本體11‧‧‧Ontology

111‧‧‧第一尺部111‧‧‧ first foot

111a‧‧‧主刻度111a‧‧‧ main scale

112‧‧‧第二尺部112‧‧‧Second foot

112a‧‧‧副刻度112a‧‧‧Subscale

12‧‧‧測量部12‧‧‧Measurement Department

121‧‧‧第一爪部121‧‧‧First claw

121a‧‧‧第一量端121a‧‧‧first quantity

122‧‧‧第二爪部122‧‧‧second claw

122a‧‧‧第二量端122a‧‧‧second end

123‧‧‧固定座123‧‧‧ fixed seat

13‧‧‧待測物13‧‧‧Test object

21‧‧‧第一支柱21‧‧‧ first pillar

22‧‧‧第二支柱22‧‧‧Second pillar

23‧‧‧水平基座23‧‧‧Horizontal base

24‧‧‧第一光發射裝置24‧‧‧First light emitting device

24a‧‧‧第一光束24a‧‧‧First beam

25‧‧‧第二光發射裝置25‧‧‧Second light emitting device

25a‧‧‧第二光束25a‧‧‧second beam

26‧‧‧第一光感測裝置26‧‧‧First light sensing device

27‧‧‧第二光感測裝置27‧‧‧Second light sensing device

28‧‧‧控制器28‧‧‧ Controller

29‧‧‧訊號顯示器29‧‧‧Signal Display

n~m‧‧‧預設厚度範圍N~m‧‧‧preset thickness range

n‧‧‧下限值N‧‧‧lower limit

m‧‧‧上限值M‧‧‧ upper limit

(A1)‧‧‧步驟(A1) ‧ ‧ steps

(A)‧‧‧步驟(A) ‧ ‧ steps

(B)‧‧‧步驟(B) ‧ ‧ steps

(C)、(C2)、(C3)‧‧‧步驟(C), (C2), (C3) ‧ ‧ steps

a1‧‧‧待測物A1‧‧‧Test object

a2‧‧‧待測物A2‧‧‧Test object

a3‧‧‧待測物A3‧‧‧Test object

b1‧‧‧第一訊號B1‧‧‧ first signal

b2‧‧‧第二訊號B2‧‧‧second signal

b3‧‧‧第三訊號B3‧‧‧third signal

c‧‧‧綠燈訊號c‧‧‧Green light signal

d‧‧‧紅燈訊號d‧‧‧Red light signal

(A1’)‧‧‧步驟(A1’) ‧ ‧ steps

(A’)‧‧‧步驟(A’) ‧ ‧ steps

(B’)‧‧‧步驟(B’) ‧ ‧ steps

(C’)、(C2’)、(C3’)‧‧‧步驟(C’), (C2’), (C3’) ‧ ‧ steps

圖1係顯示習知之游標尺之示意圖。Figure 1 is a schematic diagram showing a conventional vernier scale.

圖2係顯示本發明一第一較佳實施例之厚度檢測方法中之水平基座、第一光發射裝置、第二光發射裝置、第一光感測裝置、第二光感測裝置、第一支柱以及第二支柱之示意圖。2 is a horizontal pedestal, a first light emitting device, a second light emitting device, a first light sensing device, a second light sensing device, and a first light emitting device in a thickness detecting method according to a first preferred embodiment of the present invention. A schematic view of a pillar and a second pillar.

圖3係顯示本發明一第一較佳實施例之控制器之方塊圖。Figure 3 is a block diagram showing a controller of a first preferred embodiment of the present invention.

圖4係顯示本發明一第一較佳實施例之厚度檢測方法之流程圖。4 is a flow chart showing a thickness detecting method according to a first preferred embodiment of the present invention.

圖5係顯示本發明一第一較佳實施例之厚度檢測方法中之待測物之第一示意圖。Fig. 5 is a first schematic view showing an object to be tested in a thickness detecting method according to a first preferred embodiment of the present invention.

圖6係顯示本發明一第一較佳實施例之厚度檢測方法中之待測物之第二示意圖。Fig. 6 is a second schematic view showing the object to be tested in the thickness detecting method of a first preferred embodiment of the present invention.

圖7係顯示本發明一第一較佳實施例之厚度檢測方法中之待測物之第三示意圖。Fig. 7 is a third schematic view showing the object to be tested in the thickness detecting method of a first preferred embodiment of the present invention.

圖8係顯示本發明一第二較佳實施例之厚度檢測方法之流程圖。Figure 8 is a flow chart showing a thickness detecting method according to a second preferred embodiment of the present invention.

23‧‧‧水平基座23‧‧‧Horizontal base

24‧‧‧第一光發射裝置24‧‧‧First light emitting device

24a‧‧‧第一光束24a‧‧‧First beam

25‧‧‧第二光發射裝置25‧‧‧Second light emitting device

25a‧‧‧第二光束25a‧‧‧second beam

26‧‧‧第一光感測裝置26‧‧‧First light sensing device

27‧‧‧第二光感測裝置27‧‧‧Second light sensing device

n~m‧‧‧預設厚度範圍N~m‧‧‧preset thickness range

(A1)‧‧‧步驟(A1) ‧ ‧ steps

(A)‧‧‧步驟(A) ‧ ‧ steps

(B)‧‧‧步驟(B) ‧ ‧ steps

(C)、(C2)、(C3)‧‧‧步驟(C), (C2), (C3) ‧ ‧ steps

b1‧‧‧第一訊號B1‧‧‧ first signal

b2‧‧‧第二訊號B2‧‧‧second signal

b3‧‧‧第三訊號B3‧‧‧third signal

Claims (15)

一種厚度檢測方法,該方法包括以下步驟:(A)將一待測物置於一水平基座上;(B)判斷一第一光感測裝置是否感測到一第一光發射裝置所發射之一第一光束並判斷一第二光感測裝置是否感測到一第二光發射裝置所發射之一第二光束,其中該第二光發射裝置與該第二光感測裝置之位置高於該第一光發射裝置與該第一光感測裝置之位置,該第一光發射裝置與該第一光感測裝置互相面對,該第二光發射裝置與該第二光感測裝置互相面對;以及(C)若該第一光感測裝置未感測到該第一光發射裝置所發射之該第一光束且該第二光感測裝置感測到該第二光發射裝置所發射之該第二光束,則顯示一第一訊號並判斷該待測物之一厚度於一預設厚度範圍內。 A thickness detecting method, the method comprising the steps of: (A) placing a test object on a horizontal pedestal; and (B) determining whether a first light sensing device senses a first light emitting device a first light beam and determining whether a second light sensing device senses a second light beam emitted by a second light emitting device, wherein the second light emitting device and the second light sensing device are positioned higher than a position of the first light emitting device and the first light sensing device, the first light emitting device and the first light sensing device face each other, the second light emitting device and the second light sensing device are mutually Facing; and (C) if the first light sensing device does not sense the first light beam emitted by the first light emitting device and the second light sensing device senses the second light emitting device The second light beam is emitted, and a first signal is displayed and a thickness of one of the objects to be tested is determined to be within a predetermined thickness range. 如申請專利範圍第1項所述之厚度檢測方法,其中於該步驟(B)之後更包括一步驟:(C2)若該第一光感測裝置與該第二光感測裝置分別感測到該第一光發射裝置所發射之該第一光束與該第二光發射裝置所發射之該第二光束,則顯示一第二訊號並判斷該待測物之該厚度小於該預設厚度範圍。 The thickness detecting method of claim 1, wherein after the step (B), the method further comprises: (C2) if the first light sensing device and the second light sensing device respectively sense The first light beam emitted by the first light emitting device and the second light beam emitted by the second light emitting device display a second signal and determine that the thickness of the object to be tested is less than the predetermined thickness range. 如申請專利範圍第2項所述之厚度檢測方法,其中於該步驟(B)之後更包括一步驟: (C3)若該第一光感測裝置與該第二光感測裝置皆未感測到該第一光發射裝置所發射之該第一光束與該第二光發射裝置所發射之該第二光束,則顯示一第三訊號並判斷該待測物之該厚度大於該預設厚度範圍。 The thickness detecting method according to claim 2, wherein the step (B) further comprises a step: (C3) if the first light sensing device and the second light sensing device neither sense the first light beam emitted by the first light emitting device and the second light emitted by the second light emitting device The light beam displays a third signal and determines that the thickness of the object to be tested is greater than the predetermined thickness range. 如申請專利範圍第3項所述之厚度檢測方法,其中於該步驟(C)、該步驟(C2)以及該步驟(C3)中係由一控制器依據該第一光感測裝置與該第二光感測裝置是否分別感測到該第一光束與該第二光束而令一訊號顯示器顯示該第一訊號、該第二訊號以及該第三訊號。 The thickness detecting method according to claim 3, wherein in the step (C), the step (C2), and the step (C3), the controller is based on the first light sensing device and the first Whether the first light beam and the second light beam are respectively sensed by the two light sensing devices, so that a signal display displays the first signal, the second signal, and the third signal. 如申請專利範圍第1項所述之厚度檢測方法,其中該步驟(C)中之該第一訊號包括一綠燈訊號以及一紅燈訊號。 The thickness detecting method according to claim 1, wherein the first signal in the step (C) comprises a green light signal and a red light signal. 如申請專利範圍第2項所述之厚度檢測方法,其中該步驟(C2)中之該第二訊號包括二紅燈訊號。 The thickness detecting method of claim 2, wherein the second signal in the step (C2) comprises two red light signals. 如申請專利範圍第3項所述之厚度檢測方法,其中該步驟(C3)中之該第三訊號包括二綠燈訊號。 The thickness detecting method according to claim 3, wherein the third signal in the step (C3) comprises a green light signal. 如申請專利範圍第1項所述之厚度檢測方法,其中於該步驟(A)之前更包括一步驟:(A1)依據該預設厚度範圍調整該第一光感測裝置、該第二光感測裝置、該第一光發射裝置與該第二光發射裝置之位置,使該第一光束與該水平基座的距離等於該預設厚度範圍之一下限值,並令該第二光束與該水平基座的距離等於該預設厚度範圍之一上限值。 The thickness detecting method of claim 1, wherein the step (A) further comprises a step of: (A1) adjusting the first light sensing device according to the preset thickness range, the second light sensation Positioning the first light emitting device and the second light emitting device such that the distance between the first light beam and the horizontal base is equal to a lower limit value of the predetermined thickness range, and the second light beam is The distance of the horizontal pedestal is equal to one of the preset thickness ranges. 如申請專利範圍第8項所述之厚度檢測方法,其中該步驟(A1) 中之該第一光發射裝置與該第二光發射裝置設置於一第一支柱上,該第一光感測裝置與該第二光感測裝置設置於一第二支柱上,其中,該第一支柱與該第二支柱平行。 The method for detecting thickness according to item 8 of the patent application, wherein the step (A1) The first light emitting device and the second light emitting device are disposed on a first pillar, and the first light sensing device and the second light sensing device are disposed on a second pillar, wherein the first A pillar is parallel to the second pillar. 如申請專利範圍第9項所述之厚度檢測方法,其中該步驟(A1)更包括:依據該預設厚度範圍調整該第一支柱與該第二支柱之長度。 The thickness detecting method of claim 9, wherein the step (A1) further comprises: adjusting a length of the first pillar and the second pillar according to the predetermined thickness range. 如申請專利範圍第1項所述之厚度檢測方法,其中該步驟(B)中之該第一光發射裝置與該第二光發射裝置係發射雷射光束。 The thickness detecting method according to claim 1, wherein the first light emitting device and the second light emitting device in the step (B) emit a laser beam. 如申請專利範圍第1項所述之厚度檢測方法,其中該步驟(B)中之該第一光感測裝置與該第二光感測裝置係光電二極體或光敏電阻。 The thickness detecting method according to claim 1, wherein the first light sensing device and the second light sensing device in the step (B) are a photodiode or a photoresistor. 一種厚度檢測方法,該方法包括以下步驟:(A)將一待測物置於一水平基座上;(B)判斷一第一光感測裝置是否感測到一第一光發射裝置所發射之一第一光束並判斷一第二光感測裝置是否感測到一第二光發射裝置所發射之一第二光束,其中該第二光發射裝置與該第二光感測裝置之位置高於該第一光發射裝置與該第一光感測裝置之位置;以及(C)若該第一光感測裝置未感測到該第一光發射裝置所發射之該第一光束且該第二光感測裝置感測到該第二光發射裝置所發射之該第二光束,則顯示一第一訊號並判斷該待測物之一厚度於一預設厚度範圍內;其中於該步驟(A)之前更包括一步驟: (A1)依據該預設厚度範圍調整該第一光感測裝置、該第二光感測裝置、該第一光發射裝置與該第二光發射裝置之位置,使該第一光束與該水平基座的距離等於該預設厚度範圍之一下限值,並令該第二光束與該水平基座的距離等於該預設厚度範圍之一上限值。 A thickness detecting method, the method comprising the steps of: (A) placing a test object on a horizontal pedestal; and (B) determining whether a first light sensing device senses a first light emitting device a first light beam and determining whether a second light sensing device senses a second light beam emitted by a second light emitting device, wherein the second light emitting device and the second light sensing device are positioned higher than a position of the first light emitting device and the first light sensing device; and (C) if the first light sensing device does not sense the first light beam emitted by the first light emitting device and the second The light sensing device senses the second light beam emitted by the second light emitting device, and displays a first signal and determines that one of the objects to be tested has a thickness within a predetermined thickness range; wherein the step (A) ) Also includes a step before: (A1) adjusting the positions of the first light sensing device, the second light sensing device, the first light emitting device, and the second light emitting device according to the preset thickness range, so that the first light beam and the level The distance of the pedestal is equal to one of the preset thickness ranges, and the distance between the second beam and the horizontal pedestal is equal to one of the preset thickness ranges. 如申請專利範圍第13項所述之厚度檢測方法,其中該步驟(A1)中之該第一光發射裝置與該第二光發射裝置設置於一第一支柱上,該第一光感測裝置與該第二光感測裝置設置於一第二支柱上,其中,該第一支柱與該第二支柱平行。 The thickness detecting method of claim 13, wherein the first light emitting device and the second light emitting device in the step (A1) are disposed on a first pillar, the first light sensing device And the second light sensing device is disposed on a second pillar, wherein the first pillar is parallel to the second pillar. 如申請專利範圍第14項所述之厚度檢測方法,其中該步驟(A1)更包括:依據該預設厚度範圍調整該第一支柱與該第二支柱之長度。 The thickness detecting method of claim 14, wherein the step (A1) further comprises: adjusting the length of the first pillar and the second pillar according to the predetermined thickness range.
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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5531104A (en) * 1994-03-21 1996-07-02 Sia Schweizer Schmirgel Device and method for automatic detection of the height of sedimentation in a sedimentometer

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5531104A (en) * 1994-03-21 1996-07-02 Sia Schweizer Schmirgel Device and method for automatic detection of the height of sedimentation in a sedimentometer

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