TWI513856B - - Google Patents

Info

Publication number
TWI513856B
TWI513856B TW103145589A TW103145589A TWI513856B TW I513856 B TWI513856 B TW I513856B TW 103145589 A TW103145589 A TW 103145589A TW 103145589 A TW103145589 A TW 103145589A TW I513856 B TWI513856 B TW I513856B
Authority
TW
Taiwan
Application number
TW103145589A
Other languages
Chinese (zh)
Other versions
TW201615887A (zh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Application granted granted Critical
Publication of TWI513856B publication Critical patent/TWI513856B/zh
Publication of TW201615887A publication Critical patent/TW201615887A/zh

Links

TW103145589A 2014-10-20 2014-12-25 電漿體加工設備 TW201615887A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410557082.XA CN105590824B (zh) 2014-10-20 2014-10-20 一种等离子体加工设备

Publications (2)

Publication Number Publication Date
TWI513856B true TWI513856B (ja) 2015-12-21
TW201615887A TW201615887A (zh) 2016-05-01

Family

ID=55407859

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103145589A TW201615887A (zh) 2014-10-20 2014-12-25 電漿體加工設備

Country Status (2)

Country Link
CN (1) CN105590824B (ja)
TW (1) TW201615887A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI633572B (zh) * 2015-12-31 2018-08-21 大陸商中微半導體設備（上海）有限公司 Plasma processing device
TWI820374B (zh) * 2020-12-23 2023-11-01 台灣積體電路製造股份有限公司 感應耦合電漿設備及其操作方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102330098B1 (ko) * 2017-04-24 2021-11-23 주성엔지니어링(주) 기판 처리 장치
CN109994359B (zh) * 2017-12-29 2022-11-18 中微半导体设备(上海)股份有限公司 一种等离子体处理腔室
CN108768335A (zh) * 2018-05-25 2018-11-06 张琴 气密性声表面波元件封装结构及制作方法
CN110231063A (zh) * 2019-05-30 2019-09-13 江阴市富仁高科股份有限公司 一种检测油气的气体流量计
CN113808898B (zh) * 2020-06-16 2023-12-29 中微半导体设备(上海)股份有限公司 耐等离子体腐蚀零部件和反应装置及复合涂层形成方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI292440B (ja) * 2005-09-23 2008-01-11 Atomic Energy Council
TWI319594B (en) * 2004-10-12 2010-01-11 Applied Materials Inc Magnetic-field concentration in inductively coupled plasma reactors
US20100109532A1 (en) * 2006-07-12 2010-05-06 Jacques Pelletier Device and method for producing and/or confining a plasma
TW201132783A (en) * 2010-03-26 2011-10-01 Univ Nat Sun Yat Sen Magnetron sputtering apparatus
EP1675139B1 (en) * 2004-12-23 2014-07-23 Lincoln Global, Inc. High Frequency Transformer and Plasma Device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3077623B2 (ja) * 1997-04-02 2000-08-14 日本電気株式会社 プラズマ化学気相成長装置
CN1907514A (zh) * 2005-03-22 2007-02-07 巨佰－雪莱公司 具有用于磁起动开关的窗口的磁屏蔽aimd外壳
US20110207332A1 (en) * 2010-02-25 2011-08-25 Taiwan Semiconductor Manufacturing Co., Ltd. Thin film coated process kits for semiconductor manufacturing tools
CN202164352U (zh) * 2011-06-10 2012-03-14 北京北方微电子基地设备工艺研究中心有限责任公司 一种半导体加工设备
US20140262044A1 (en) * 2013-03-15 2014-09-18 Applied Materials, Inc. Mu metal shield cover

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI319594B (en) * 2004-10-12 2010-01-11 Applied Materials Inc Magnetic-field concentration in inductively coupled plasma reactors
EP1675139B1 (en) * 2004-12-23 2014-07-23 Lincoln Global, Inc. High Frequency Transformer and Plasma Device
TWI292440B (ja) * 2005-09-23 2008-01-11 Atomic Energy Council
US20100109532A1 (en) * 2006-07-12 2010-05-06 Jacques Pelletier Device and method for producing and/or confining a plasma
TW201132783A (en) * 2010-03-26 2011-10-01 Univ Nat Sun Yat Sen Magnetron sputtering apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI633572B (zh) * 2015-12-31 2018-08-21 大陸商中微半導體設備（上海）有限公司 Plasma processing device
TWI820374B (zh) * 2020-12-23 2023-11-01 台灣積體電路製造股份有限公司 感應耦合電漿設備及其操作方法

Also Published As

Publication number Publication date
CN105590824A (zh) 2016-05-18
TW201615887A (zh) 2016-05-01
CN105590824B (zh) 2017-11-03

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