TWI513496B - - Google Patents
Info
- Publication number
- TWI513496B TWI513496B TW103136432A TW103136432A TWI513496B TW I513496 B TWI513496 B TW I513496B TW 103136432 A TW103136432 A TW 103136432A TW 103136432 A TW103136432 A TW 103136432A TW I513496 B TWI513496 B TW I513496B
- Authority
- TW
- Taiwan
Links
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310505301.5A CN104576305A (en) | 2013-10-23 | 2013-10-23 | Self-cleaning vacuum treatment chamber |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201529141A TW201529141A (en) | 2015-08-01 |
| TWI513496B true TWI513496B (en) | 2015-12-21 |
Family
ID=53092097
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103136432A TW201529141A (en) | 2013-10-23 | 2014-10-22 | Self-cleaning vacuum processing chamber |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104576305A (en) |
| TW (1) | TW201529141A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111364027A (en) * | 2018-12-25 | 2020-07-03 | 广东聚华印刷显示技术有限公司 | Atomic layer deposition chamber component, preparation method thereof and atomic layer deposition equipment |
| CN110117779A (en) * | 2019-04-30 | 2019-08-13 | 信利(仁寿)高端显示科技有限公司 | A kind of regeneration method and device of vacuum coater inner part |
| CN111524785B (en) * | 2020-06-03 | 2023-03-14 | 上海邦芯半导体科技有限公司 | Processing method of dry etching cavity |
| CN113201718B (en) * | 2021-04-01 | 2022-07-12 | 深圳仕上电子科技有限公司 | Plating chamber inner wall component with sacrificial layer, preparation method and cleaning method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1739810A (en) * | 2005-09-16 | 2006-03-01 | 中国科学院上海硅酸盐研究所 | A kind of hydrion injects the method that improves bioactivity of nanometer titania coating |
| CN101838794A (en) * | 2010-05-31 | 2010-09-22 | 苏州羿日新能源有限公司 | Method for preparing titania film by using gas flow reaction sputtering under middle gas pressure and method for preparing solar cell |
| TW201324577A (en) * | 2011-12-08 | 2013-06-16 | Advanced Micro Fab Equip Inc | Plasma processing device and edge ring applicable to the plasma processing device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10340889A (en) * | 1997-06-06 | 1998-12-22 | Hitachi Ltd | Semiconductor manufacturing equipment |
| JP4661753B2 (en) * | 2006-09-29 | 2011-03-30 | 東京エレクトロン株式会社 | Substrate processing method, cleaning method, and storage medium |
| JP2009188257A (en) * | 2008-02-07 | 2009-08-20 | Tokyo Electron Ltd | Plasma etching method, plasma etching apparatus, and storage medium |
-
2013
- 2013-10-23 CN CN201310505301.5A patent/CN104576305A/en active Pending
-
2014
- 2014-10-22 TW TW103136432A patent/TW201529141A/en unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1739810A (en) * | 2005-09-16 | 2006-03-01 | 中国科学院上海硅酸盐研究所 | A kind of hydrion injects the method that improves bioactivity of nanometer titania coating |
| CN101838794A (en) * | 2010-05-31 | 2010-09-22 | 苏州羿日新能源有限公司 | Method for preparing titania film by using gas flow reaction sputtering under middle gas pressure and method for preparing solar cell |
| TW201324577A (en) * | 2011-12-08 | 2013-06-16 | Advanced Micro Fab Equip Inc | Plasma processing device and edge ring applicable to the plasma processing device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104576305A (en) | 2015-04-29 |
| TW201529141A (en) | 2015-08-01 |