TWI513396B - Electronic apparatus and shielding case of mobile device - Google Patents

Electronic apparatus and shielding case of mobile device Download PDF

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Publication number
TWI513396B
TWI513396B TW102146132A TW102146132A TWI513396B TW I513396 B TWI513396 B TW I513396B TW 102146132 A TW102146132 A TW 102146132A TW 102146132 A TW102146132 A TW 102146132A TW I513396 B TWI513396 B TW I513396B
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Taiwan
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layer
mobile device
protective
thermoelectric material
contact
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TW102146132A
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Chinese (zh)
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TW201524310A (en
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Yaowen Shiu
Chuyang Hsu
Chechuan Hu
Tzuchia Tan
Chanhung Liu
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Htc Corp
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Publication of TWI513396B publication Critical patent/TWI513396B/en

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Description

電子裝置及行動裝置之保護殼Protective case for electronic device and mobile device

本案係有關於一種保護結構,尤指一種配合行動裝置使用的可拆卸保護殼體。The present invention relates to a protective structure, and more particularly to a detachable protective casing for use with a mobile device.

現今可攜式消費電子產品日益普及,尤其是智慧型手機、平板電腦、行動上網裝置(Mobile Internet Device,MID)等行動裝置已成為現代人的隨身配件。目前行動裝置經常具有多樣化的功能(如瀏覽網頁、多媒體播放、行動通訊、3D繪圖、遊戲等)需要大量快速的運算,行動處理器的技術也日新月益,已逐漸接近一般固定式電子裝置的處理速度。Nowadays, portable consumer electronic products are becoming more and more popular, especially mobile devices such as smart phones, tablet computers, and mobile Internet devices (MIDs) have become portable accessories for modern people. At present, mobile devices often have diverse functions (such as browsing the web, multimedia playback, mobile communication, 3D graphics, games, etc.), which require a lot of fast calculations, and the technology of mobile processors is also becoming more and more popular, and has gradually approached the general fixed electronic The processing speed of the device.

隨著處理速度的需求,在行動裝置的設計上電池續航力與散熱能力便成為非常關鍵的課題。由於尺寸輕薄的行動裝置上的空間十分有限,難以設置大面積的電池模組,因此需要經常充電或攜帶額外的電池進行替換。此外,高速運算下的行動裝置亦經常發生大量的熱能,集中在高耗能/發熱元件附近(如中央處理器、繪圖晶片或電源管理晶片等),導致使用者握持行動裝置時手掌上感覺到灼熱及不 適感。With the demand for processing speed, battery life and heat dissipation capability have become a critical issue in the design of mobile devices. Due to the limited space on a small and thin mobile device, it is difficult to set up a large-area battery module, so it is necessary to charge or carry an extra battery for replacement. In addition, mobile devices under high-speed computing often generate a large amount of thermal energy, concentrated in the vicinity of high-energy/heating components (such as central processing units, graphics chips, or power management chips), causing the user to feel the palm when holding the mobile device. To the hot and not Feel the sense.

本案揭示內容之一態樣是在提供一種保護殼,其可拆卸地結合於行動裝置之外表面上,保護殼包含外保護層、導熱層以及熱電材料層。導熱層結合於該行動裝置之外表面。熱電材料層具有鄰接該導熱層之第一側面以及鄰接該外保護層之第二側面,熱電材料層根據第一側面與第二側面間的溫度差產生電流。One aspect of the present disclosure is to provide a protective casing that is detachably coupled to an outer surface of a mobile device that includes an outer protective layer, a thermally conductive layer, and a layer of thermoelectric material. A thermally conductive layer is bonded to the outer surface of the mobile device. The layer of thermoelectric material has a first side adjacent the thermally conductive layer and a second side adjacent the outer protective layer, and the layer of thermoelectric material generates a current according to a temperature difference between the first side and the second side.

本案揭示內容之另一態樣是在提供一種電子裝置,其包含行動裝置以及保護殼。行動裝置包含外表面,外表面上設置有接點。保護殼其可拆卸地結合於行動裝置之外表面上,該保護殼包含外保護層、導熱層以及熱電材料層。導熱層結合於該行動裝置之外表面。熱電材料層具有鄰接該導熱層之第一側面以及鄰接外保護層之第二側面,熱電材料層根據第一側面與第二側面間的溫度差產生電流。其中當保護殼結合於行動裝置之外表面上,熱電材料層耦接接點,行動裝置經由接點接收電流。Another aspect of the present disclosure is to provide an electronic device including a mobile device and a protective case. The mobile device includes an outer surface with contacts on the outer surface. The protective case is detachably coupled to an outer surface of the mobile device, and the protective case includes an outer protective layer, a thermally conductive layer, and a layer of thermoelectric material. A thermally conductive layer is bonded to the outer surface of the mobile device. The layer of thermoelectric material has a first side adjacent to the thermally conductive layer and a second side adjacent the outer protective layer, and the layer of thermoelectric material generates a current according to a temperature difference between the first side and the second side. Wherein the protective shell is coupled to the outer surface of the mobile device, the layer of thermoelectric material is coupled to the contact, and the mobile device receives the current via the contact.

如上所述,本揭示內容之一實施例所提出的保護殼具有保護行動裝置之功能,並且透過保護殼中的熱電材料層,可回收行動裝置產生的廢熱,並產生電流回授至行動裝置。另一方面,透過保護殼中的導熱層可將行動裝置發散至該外表面之熱能均勻分散至該導熱層不同位置,藉此改善使用者握持時的不適感。As described above, the protective case proposed in one embodiment of the present disclosure has the function of protecting the mobile device, and through the layer of thermoelectric material in the protective case, the waste heat generated by the mobile device can be recovered and the current is returned to the mobile device. On the other hand, through the heat conducting layer in the protective case, the heat energy dissipated to the outer surface of the mobile device can be uniformly dispersed to different positions of the heat conducting layer, thereby improving the discomfort of the user when holding.

為讓本案之實施例能更明顯易懂,所附符號之說明如下:In order to make the embodiment of the present case more obvious and easy to understand, the attached symbols are as follows:

10、11‧‧‧電子裝置10, 11‧‧‧ electronic devices

100‧‧‧保護殼100‧‧‧protective shell

120‧‧‧熱電材料層120‧‧‧Thermal material layer

121‧‧‧第一側面121‧‧‧ first side

122‧‧‧第二側面122‧‧‧ second side

140‧‧‧外保護層140‧‧‧ outer protective layer

160‧‧‧導熱層160‧‧‧thermal layer

180‧‧‧電路180‧‧‧ circuits

200,300‧‧‧行動裝置200,300‧‧‧ mobile devices

240‧‧‧電源模組240‧‧‧Power Module

260‧‧‧處理單元260‧‧‧Processing unit

280‧‧‧顯示單元280‧‧‧ display unit

201,301,202‧‧‧外表面201,301,202‧‧‧ outer surface

220,320‧‧‧接點220,320‧‧‧Contacts

221,222,321,322‧‧‧充電接點221,222,321,322‧‧‧Charging contacts

V1‧‧‧第一電位V1‧‧‧ first potential

V2‧‧‧第二電位V2‧‧‧second potential

Vfb‧‧‧回授電壓Vfb‧‧‧ feedback voltage

A-A‧‧‧剖面線A-A‧‧‧ hatching

為讓本案能更明顯易懂,所附圖式之說明如下:第1A圖繪示根據本案之一實施例中一種電子裝置的示意圖;第1B圖繪示第1A圖中的電子裝置於另一視角的示意圖;第2圖繪示第1A圖之實施例中保護殼沿剖面線A-A的剖面示意圖;以及第3圖繪示第1A圖之實施例中電子裝置中的保護殼及其對應之行動裝置的示意圖。In order to make the present invention more obvious and understandable, the description of the drawings is as follows: FIG. 1A is a schematic diagram of an electronic device according to an embodiment of the present invention; FIG. 1B is a diagram showing the electronic device of FIG. 1A in another FIG. 2 is a schematic cross-sectional view of the protective case along the section line AA in the embodiment of FIG. 1A; and FIG. 3 is a view showing the protective case and its corresponding action in the electronic device in the embodiment of FIG. 1A. Schematic diagram of the device.

第4圖繪示根據本案之一實施例中一種保護殼及另一種行動裝置的示意圖。FIG. 4 is a schematic view showing a protective case and another mobile device according to an embodiment of the present invention.

以下將以圖式揭露本案之複數個實施方式,為明確說明起見,許多實務上的細節將在以下敘述中一併說明。然而,應瞭解到,這些實務上的細節不應用以限制本案。也就是說,在本案部分實施方式中,這些實務上的細節是非必要的。此外,為簡化圖式起見,一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。In the following, a plurality of embodiments of the present invention will be disclosed in the drawings, and for the sake of clarity, a number of practical details will be described in the following description. However, it should be understood that these practical details are not applied to limit the case. That is to say, in some implementations of this case, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.

隨著,行動裝置的設計趨向輕薄且具備高可攜性,行動裝置的內部元件通常極為精細,容易因外力撞擊而損壞。因此,使用者經常會在行動裝置外部進一步套設保護 殼,來達到保護行動裝置的效果。此外,保護殼也可以防止行動裝置的表面被刮傷或損壞,並可具備多樣化且個性化的設計(如具有不同的圖案、顏色或造型),因此,目前保護殼也逐漸成為行動裝置的重要配件之一。As mobile devices are designed to be thin and highly portable, the internal components of the mobile device are typically extremely delicate and easily damaged by external impact. Therefore, users often further protect the outside of the mobile device. The shell is used to achieve the effect of protecting the mobile device. In addition, the protective case can also prevent the surface of the mobile device from being scratched or damaged, and can have a variety of personalized designs (such as having different patterns, colors or shapes), so that the protective case is gradually becoming a mobile device. One of the important accessories.

請參閱第1A圖,其繪示根據本案之一實施例中一種電子裝置10的示意圖。如第1A圖所示,電子裝置10包含保護殼100及其對應之行動裝置200的示意圖。保護殼100可拆卸地(removably)結合於行動裝置200之外表面201上。於此實施例中,如第1A圖所示外表面201為行動裝置200的背表面,請一併參照第1B圖,其繪示第1A圖中的電子裝置10於另一視角的示意圖。如第1B圖所示行動裝置200另一側的外表面202為正表面,於此例中,外表面202上設置有顯示單元280。Please refer to FIG. 1A, which illustrates a schematic diagram of an electronic device 10 according to an embodiment of the present invention. As shown in FIG. 1A, the electronic device 10 includes a schematic view of the protective case 100 and its corresponding mobile device 200. The protective case 100 is removably coupled to the outer surface 201 of the mobile device 200. In this embodiment, as shown in FIG. 1A, the outer surface 201 is the back surface of the mobile device 200. Referring to FIG. 1B together, the electronic device 10 in FIG. 1A is schematically viewed from another perspective. The outer surface 202 on the other side of the mobile device 200 is a front surface as shown in FIG. 1B. In this example, the outer surface 202 is provided with a display unit 280.

如第1A圖所示,保護殼100形狀配合行動裝置200之外表面201,保護殼100的形狀與行動裝置200的外表面201為對稱且互補之設計。保護殼100的內側形成一個容置空間(如第1B圖所示)用以容納行動裝置200,保護殼100是套設在外表面201,保護殼100所套設的外表面201之面向與顯示單元280所設置的外表面202之面向相反。As shown in FIG. 1A, the protective case 100 is shaped to fit the outer surface 201 of the mobile device 200, and the shape of the protective case 100 is symmetric and complementary to the outer surface 201 of the mobile device 200. The inner side of the protective casing 100 forms an accommodating space (as shown in FIG. 1B ) for accommodating the mobile device 200 . The protective casing 100 is sleeved on the outer surface 201 , and the outer surface 201 of the protective casing 100 faces and the display unit The outer surface 202 provided by 280 faces in the opposite direction.

當使用者將保護殼100套設在行動裝置200外表面201時,保護殼100可透過特定的卡合結構而緊密結合於行動裝置200上。舉例來說,保護殼100的容置空間開口處可略為收窄,使行動裝置200的殼體夾止於保護殼100的容置空間內,但本揭示文件並不以此為限,實際應用中有 許多其他方式(利用卡榫扣合、利用螺絲鎖合或其他相等性方式)可用來結合行動裝置200與保護殼100,此為習知技藝之人所熟知,在此不另贅述。When the user sets the protective case 100 on the outer surface 201 of the mobile device 200, the protective case 100 can be tightly coupled to the mobile device 200 through a specific engaging structure. For example, the opening of the accommodating space of the protective casing 100 may be slightly narrowed, so that the housing of the mobile device 200 is clamped in the accommodating space of the protective casing 100, but the disclosure is not limited thereto. In Many other means (with snap fit, screw lock or other equivalent means) can be used in conjunction with the mobile device 200 and the protective casing 100, which are well known to those skilled in the art and will not be further described herein.

須特別說明的是,本實施例中的保護殼100為獨立於行動裝置200本身殼體之外的額外保護外殼,可由行動裝置200自由拆卸且可便利地更換。保護殼100本身結構簡單且便於大量製造。當保護殼100損壞時,使用者可便利地購入新的保護殼100並安裝至行動裝置200上。It should be particularly noted that the protective case 100 in this embodiment is an additional protective cover that is independent of the housing of the mobile device 200 itself, and is detachable by the mobile device 200 and can be conveniently replaced. The protective case 100 itself has a simple structure and is easy to manufacture in large quantities. When the protective case 100 is damaged, the user can conveniently purchase a new protective case 100 and mount it to the mobile device 200.

請一併參閱第1A圖及第2圖,第2圖繪示第1A圖之實施例中保護殼100的剖面示意圖。如圖所示,保護殼100包含依序設置的外保護層140、熱電材料(Thermoelectric Material)層120以及導熱層160。其中,外保護層140設置於最外側(即遠離行動裝置200之一側),而導熱層160設置於最內側(即鄰近行動裝置200之一側)。於此揭示文件中,熱電材料層120用以回收行動裝置200產生的廢熱,並回授至行動裝置200以提高行動裝置200的電池續航力,詳細作法敘述於後續段落。Please refer to FIG. 1A and FIG. 2 together. FIG. 2 is a schematic cross-sectional view showing the protective case 100 in the embodiment of FIG. 1A. As shown, the protective case 100 includes an outer protective layer 140, a thermoelectric material layer 120, and a heat conductive layer 160. The outer protective layer 140 is disposed on the outermost side (ie, away from one side of the mobile device 200), and the heat conductive layer 160 is disposed on the innermost side (ie, adjacent to one side of the mobile device 200). In the disclosure, the thermoelectric material layer 120 is used to recover the waste heat generated by the mobile device 200 and is fed back to the mobile device 200 to improve the battery life of the mobile device 200. The detailed description is described in the following paragraphs.

外保護層140用以緩衝外部應力並保護行動裝置200。當結合了保護殼100的行動裝置200掉落或受外力撞擊時,外保護層140為首先與外界碰撞或接觸的表面。於一實施例中,外保護層140可為具有一定彈性的塑料層,藉由外保護層140的彈性以緩衝外部應力。此外,外保護層140亦可為隔熱材料層,如此一來,當使用者握持外保護層140較不會直接感覺到行動裝置200所產生的熱能, 以提升使用者的操作手感。The outer protective layer 140 serves to buffer external stress and protect the mobile device 200. When the mobile device 200 incorporating the protective case 100 is dropped or impacted by an external force, the outer protective layer 140 is a surface that first collides or comes into contact with the outside. In an embodiment, the outer protective layer 140 may be a plastic layer having a certain elasticity, and the outer protective layer 140 is elasticized to buffer external stress. In addition, the outer protective layer 140 can also be a layer of heat insulating material, so that when the user holds the outer protective layer 140, the thermal energy generated by the mobile device 200 is not directly felt. To enhance the user's operational feel.

導熱層160結合於行動裝置200之外表面201。於此實施例中,導熱層160可為金屬材料層,用以使行動裝置200發散至外表面201之熱能均勻分散至導熱層160不同位置。以第2圖所例,導熱層160使外表面201之熱能水平傳導,並分散至不同的水平位置。導熱層160可採用鎂、鋁、其他高導熱金屬材料或上述材料之合金。The thermally conductive layer 160 is bonded to the outer surface 201 of the mobile device 200. In this embodiment, the heat conductive layer 160 may be a metal material layer for uniformly dispersing the thermal energy of the mobile device 200 to the outer surface 201 to different positions of the heat conductive layer 160. As illustrated in Fig. 2, the thermally conductive layer 160 conducts the thermal energy of the outer surface 201 horizontally and is dispersed to different horizontal positions. The heat conductive layer 160 may be made of magnesium, aluminum, other highly thermally conductive metal materials or alloys of the above materials.

如此一來,行動裝置200之中發熱元件附近(如中央處理器、繪圖晶片或電源管理晶片等)所產生的高度集中廢熱,可藉由導熱層160平均分散至不同位置。如此一來,當使用者握持保護殼100較不會感覺到保護殼100某一特定區塊溫度特別高,藉以提升使用者的操作手感。As a result, the highly concentrated waste heat generated in the vicinity of the heat generating component (such as the central processing unit, the drawing chip, or the power management chip, etc.) in the mobile device 200 can be evenly dispersed to different positions by the heat conducting layer 160. In this way, when the user holds the protective case 100, it does not feel that the temperature of a certain block of the protective case 100 is particularly high, thereby improving the user's operating feeling.

於此實施例中,熱電材料層120設置於外保護層140與導熱層160之間。熱電材料層120具有鄰接導熱層160之第一側面121以及鄰接外保護層140之第二側面122。由於熱電材料(Thermoelectric Material)本身的特性,當熱電材料層120的第一側面121與第二側面122之間具有溫度差時,熱電材料將在第一側面121與第二側面122之間形成相對應的熱電轉換電壓差,熱電材料層120所形成電壓差用以產生電流,並回送至行動裝置200。In this embodiment, the thermoelectric material layer 120 is disposed between the outer protective layer 140 and the heat conductive layer 160. The layer of thermoelectric material 120 has a first side 121 adjacent the thermally conductive layer 160 and a second side 122 adjacent the outer protective layer 140. Due to the nature of the thermoelectric material itself, when there is a temperature difference between the first side 121 and the second side 122 of the layer of thermoelectric material 120, the thermoelectric material will form a phase between the first side 121 and the second side 122. Corresponding to the thermoelectric conversion voltage difference, the voltage difference formed by the thermoelectric material layer 120 is used to generate a current and is sent back to the mobile device 200.

於實際應用中,由於熱電材料層120的第一側面121鄰接導熱層160且較貼近行動裝置200(即熱源所在),當行動裝置200運行時,熱電材料層120的第一側面121的溫度通常較高;於此同時,熱電材料層120的第二側面 122鄰接外保護層140,熱電材料層120的第二側面122的溫度較接近於當時周遭的環境溫度(ambient temperature)。熱電材料層120的第一側面121上形成第一電位V1,並且第二側面122上形成第二電位V2。如此一來,熱電材料層120便根據第一側面121與第二側面122的溫度差形成相對應的熱電轉換電壓差Vg(圖中未示),其中Vg=|V2-V1|,此熱電轉換電壓差,用以形成電流回送至行動裝置200。In a practical application, since the first side 121 of the thermoelectric material layer 120 is adjacent to the heat conducting layer 160 and is closer to the mobile device 200 (ie, the heat source is located), when the mobile device 200 is in operation, the temperature of the first side 121 of the thermoelectric material layer 120 is usually Higher; at the same time, the second side of the layer of thermoelectric material 120 122 abuts the outer protective layer 140, and the temperature of the second side 122 of the layer of thermoelectric material 120 is closer to the ambient temperature at that time. A first potential V1 is formed on the first side 121 of the thermoelectric material layer 120, and a second potential V2 is formed on the second side 122. In this way, the thermoelectric material layer 120 forms a corresponding thermoelectric conversion voltage difference Vg (not shown) according to the temperature difference between the first side surface 121 and the second side surface 122, wherein Vg=|V2-V1|, the thermoelectric conversion The voltage difference is used to form a current back to the mobile device 200.

須補充說明的是,第1A圖所示的熱電材料層120的設置範圍僅為例示性說明,實際應用中熱電材料層120的範圍可涵蓋保護殼100整體,或是選擇性地涵蓋行動裝置200中主要發熱元件的相對應位置,並不以第1A圖所示的範圍為限。It should be noted that the setting range of the thermoelectric material layer 120 shown in FIG. 1A is merely an illustrative description. In practical applications, the range of the thermoelectric material layer 120 may cover the entire protective casing 100 or selectively cover the mobile device 200. The corresponding position of the main heating element is not limited to the range shown in Fig. 1A.

如第1A圖及第2圖所示,行動裝置200之外表面201設置有接點220。於此實施例中,接點220為外表面201上的複數個金屬接點,接點220的金屬接點可分別用於充/放電、檔案傳輸、狀態訊號確認等用途。其中,接點220包含正電壓準位(如V+)的充電接點221以及負電壓準位(如V-)的充電接點222。As shown in FIGS. 1A and 2, the outer surface 201 of the mobile device 200 is provided with a contact 220. In this embodiment, the contacts 220 are a plurality of metal contacts on the outer surface 201, and the metal contacts of the contacts 220 can be used for charging/discharging, file transmission, status signal confirmation, and the like, respectively. The contact 220 includes a charging contact 221 of a positive voltage level (such as V+) and a charging contact 222 of a negative voltage level (such as V-).

於此實施例中,保護殼100可進一步包含電路180,電路180耦接至接點220以及熱電材料層120。電路180可包含升壓電路、穩壓電路、濾波電路等電力訊號調整元件(圖中未示)。電路180用以取出熱電材料層120兩側的熱電轉換電壓差所形成之電流IFB ,並將熱電轉換電壓差處理後形成電流IFB 回授至接點220的充電接點221與充電接 點222。In this embodiment, the protective case 100 may further include a circuit 180 coupled to the contact 220 and the thermoelectric material layer 120. The circuit 180 can include a power signal adjusting component (not shown) such as a boosting circuit, a voltage stabilizing circuit, and a filtering circuit. The circuit 180 is configured to take out the current I FB formed by the thermoelectric conversion voltage difference on both sides of the thermoelectric material layer 120, and process the thermoelectric conversion voltage difference to form a current I FB to the charging contact 221 and the charging contact of the contact 220. 222.

但本揭示文件並不以保護殼100包含電路180為限,實際應用中,熱電材料層120(藉由兩側的熱電轉換電壓差)所感應形成之電流IFB 亦可透過連接線路直接回授至接點220的充電接點221與充電接點222,供行動裝置200中的充電電路加以利用並進行相關處理。如此一來可省下在保護殼100中設置電路180的製造與設計成本。However, the present disclosure is not limited to the case where the protective case 100 includes the circuit 180. In practical applications, the current I FB induced by the thermoelectric material layer 120 (by the thermoelectric conversion voltage difference between the two sides) can also be directly fed back through the connection line. The charging contact 221 to the contact 220 and the charging contact 222 are utilized by the charging circuit in the mobile device 200 for correlation processing. As a result, the manufacturing and design cost of the circuit 180 disposed in the protective case 100 can be saved.

請一併參閱第3圖,其繪示根據第1A圖之實施例中行動裝置200的功能方塊圖。如第3圖所示,第1A圖中的行動裝置200可包含電源模組240、處理單元260和顯示單元280。電源模組240耦接處理單元260、顯示單元280與接點220。電源模組240提供電源至處理單元260與顯示單元280。顯示單元280用以顯示處理單元260產生的顯示畫面。Please refer to FIG. 3, which is a functional block diagram of the mobile device 200 according to the embodiment of FIG. 1A. As shown in FIG. 3, the mobile device 200 in FIG. 1A may include a power module 240, a processing unit 260, and a display unit 280. The power module 240 is coupled to the processing unit 260, the display unit 280, and the contact 220. The power module 240 provides power to the processing unit 260 and the display unit 280. The display unit 280 is configured to display a display screen generated by the processing unit 260.

同時參考第2圖與第3圖之實施例,熱電材料層120透過電路180經由接點220耦接電源模組240(或於另一實施例中熱電材料層120亦可不透過電路180直接經由接點220耦接電源模組240),如第3圖所示,熱電材料層120利用產生的電流IFB 對電源模組240進行充電。電源模組240可包含蓄電池、充電電池或各種儲電元件。Referring to the embodiments of FIG. 2 and FIG. 3 , the thermoelectric material layer 120 is coupled to the power module 240 via the contact 220 via the circuit 180 (or the thermoelectric material layer 120 in another embodiment may also be directly connected through the circuit 180 ) The point 220 is coupled to the power module 240). As shown in FIG. 3, the thermoelectric material layer 120 charges the power module 240 by using the generated current I FB . The power module 240 can include a battery, a rechargeable battery, or various electrical storage components.

於第1A圖的實施例中,行動裝置200的接點220係設置於行動裝置200的背面,但本揭示文件並不以此為限,請參閱第4圖,其繪示根據本案之一實施例中一種電子裝置11的示意圖。於第4圖之實施例中,電子裝置11 包含先前實施例所述之保護殼100及另一種行動裝置300。於第4圖之實施例中,行動裝置300的接點320是設置於外表面301的側邊邊框上的金屬接腳。於第4圖的實施例中,保護殼100中的電路180(或是熱電材料層120的兩側)可透過連接線路182連接至行動裝置300的接點320(如充電接點321與充電接點322)上。In the embodiment of FIG. 1A, the contact 220 of the mobile device 200 is disposed on the back of the mobile device 200, but the disclosure is not limited thereto. Please refer to FIG. 4, which is implemented according to one of the embodiments. A schematic diagram of an electronic device 11 in an example. In the embodiment of FIG. 4, the electronic device 11 The protective case 100 and another mobile device 300 described in the previous embodiments are included. In the embodiment of FIG. 4, the contacts 320 of the mobile device 300 are metal pins disposed on the side borders of the outer surface 301. In the embodiment of FIG. 4, the circuit 180 (or both sides of the thermoelectric material layer 120) in the protective case 100 can be connected to the contact 320 of the mobile device 300 through the connection line 182 (such as the charging contact 321 and the charging connection). Point 322).

也就是說,本揭示文件的保護殼100可應用於具有各種接點設計(背面的金屬接點、側邊邊框上的金屬接腳或其他各種相似接點)的行動裝置上。That is, the protective case 100 of the present disclosure can be applied to a mobile device having various contact designs (metal contacts on the back side, metal pins on the side borders, or other various similar contacts).

綜上所述,本揭示內容之一實施例所提出的保護殼具有保護行動裝置之功能,並且透過保護殼中的熱電材料層,可回收行動裝置產生的廢熱,並產生轉換電壓回授至行動裝置。另一方面,透過保護殼中的導熱層可將行動裝置發散至該外表面之熱能均勻分散至不同的水平位置,使得熱能最終能夠較均勻地分散至保護殼的外表面上,藉此改善使用者握持時的不適感。In summary, the protective case proposed in one embodiment of the present disclosure has the function of protecting the mobile device, and through the layer of thermoelectric material in the protective case, the waste heat generated by the mobile device can be recovered, and the converted voltage is returned to the action. Device. On the other hand, the heat transfer layer in the protective case can disperse the heat energy of the mobile device to the outer surface to be uniformly dispersed to different horizontal positions, so that the heat energy can be more uniformly dispersed to the outer surface of the protective shell, thereby improving the use. Discomfort when holding.

雖然本案已以實施方式揭露如上,然其並非用以限定本案,任何熟習此技藝者,在不脫離本案之精神和範圍內,當可作各種之更動與潤飾,因此本案之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present case. Anyone skilled in the art can make various changes and refinements without departing from the spirit and scope of the case. Therefore, the scope of protection of this case is considered. The scope defined in the patent application is subject to change.

10‧‧‧電子裝置10‧‧‧Electronic devices

100‧‧‧保護殼100‧‧‧protective shell

120‧‧‧熱電材料層120‧‧‧Thermal material layer

180‧‧‧電路180‧‧‧ circuits

200‧‧‧行動裝置200‧‧‧ mobile device

201‧‧‧外表面201‧‧‧ outer surface

220‧‧‧接點220‧‧‧Contacts

221,222‧‧‧充電接點221,222‧‧‧Charging contacts

A-A‧‧‧剖面線A-A‧‧‧ hatching

Claims (14)

一種保護殼,其可拆卸地結合於一行動裝置之一外表面上,包含:一外保護層;一導熱層,結合於該行動裝置之外表面;以及一熱電材料層,具有鄰接該導熱層之一第一側面以及鄰接該外保護層之一第二側面,該熱電材料層根據該第一側面與該第二側面間的溫度差產生一電流。 a protective casing detachably coupled to an outer surface of a mobile device, comprising: an outer protective layer; a heat conducting layer coupled to the outer surface of the mobile device; and a layer of thermoelectric material having the adjacent heat conducting layer And a first side and a second side adjacent to the outer protective layer, the thermoelectric material layer generates a current according to a temperature difference between the first side and the second side. 如請求項1所述之保護殼,其中該導熱層為一金屬材料層,用以使該行動裝置發散至該外表面之熱能均勻分散至該導熱層不同位置。 The protective case of claim 1, wherein the heat conducting layer is a metal material layer for uniformly dispersing thermal energy of the mobile device to the outer surface to different positions of the heat conducting layer. 如請求項2所述之保護殼,其中該導熱層採用鎂、鋁、其他高導熱金屬材料或上述材料之合金。 The protective case according to claim 2, wherein the heat conductive layer is made of magnesium, aluminum, other high thermal conductive metal materials or an alloy of the above materials. 如請求項1所述之保護殼,其中該行動裝置之該外表面設置有一接點,該保護殼更包含:一電路,耦接至該接點與該熱電材料層之間,該電路用以傳輸該電流至該接點。 The protective case of claim 1, wherein the outer surface of the mobile device is provided with a contact, the protective cover further comprising: a circuit coupled between the contact and the layer of thermoelectric material, the circuit is used for This current is transmitted to the contact. 如請求項1所述之保護殼,其中該外保護層為一塑料層或一隔熱材料層。 The protective shell of claim 1, wherein the outer protective layer is a plastic layer or a heat insulating material layer. 如請求項1所述之保護殼,其中該保護殼之形狀配合該行動裝置之該外表面,使該保護殼緊密結合於該行動裝置上,該外保護層用以緩衝外部應力並保護該行動裝置。 The protective case of claim 1, wherein the protective case has a shape matching the outer surface of the mobile device, so that the protective case is tightly coupled to the mobile device, the outer protective layer is used to buffer external stress and protect the action Device. 一種電子裝置,包含:一行動裝置,包含一外表面,該外表面上設置有一接點;一保護殼,其可拆卸地結合於該行動裝置之該外表面上,該保護殼包含:一外保護層;一導熱層,結合於該行動裝置之外表面;以及一熱電材料層,具有鄰接該導熱層之一第一側面以及鄰接該外保護層之一第二側面,該熱電材料層根據該第一側面與該第二側面間的溫度差產生一電流;其中當該保護殼結合於該行動裝置之該外表面上,該熱電材料層耦接該接點,該行動裝置經由該接點接收該電流。 An electronic device comprising: a mobile device comprising an outer surface, the outer surface is provided with a joint; a protective shell detachably coupled to the outer surface of the mobile device, the protective shell comprising: an outer a protective layer; a thermally conductive layer coupled to the outer surface of the mobile device; and a layer of thermoelectric material having a first side adjacent to the thermally conductive layer and a second side adjacent to the outer protective layer, the thermoelectric material layer being a temperature difference between the first side and the second side generates a current; wherein when the protective shell is coupled to the outer surface of the mobile device, the layer of thermoelectric material is coupled to the contact, and the mobile device receives the contact via the contact This current. 如請求項7所述之電子裝置,其中該導熱層為一金屬材料層,用以使該行動裝置發散至該外表面之熱能均勻分散至該導熱層不同位置。 The electronic device of claim 7, wherein the heat conducting layer is a metal material layer for uniformly dispersing thermal energy of the mobile device to the outer surface to different positions of the heat conducting layer. 如請求項8所述之電子裝置,其中該導熱層採用鎂、鋁、其他高導熱金屬材料或上述材料之合金。 The electronic device of claim 8, wherein the thermally conductive layer is made of magnesium, aluminum, other highly thermally conductive metallic materials or alloys of the foregoing. 如請求項8所述之電子裝置,其中該保護殼更包含:一電路,耦接至該接點與該熱電材料層之間,該電路用以傳輸該電流至該接點。 The electronic device of claim 8, wherein the protective casing further comprises: a circuit coupled between the contact and the layer of thermoelectric material, the circuit for transmitting the current to the contact. 如請求項8所述之電子裝置,其中該外保護層為一塑料層或一隔熱材料層。 The electronic device of claim 8, wherein the outer protective layer is a plastic layer or a heat insulating material layer. 如請求項8所述之電子裝置,其中該保護殼之形狀配合該行動裝置之該外表面,使該保護殼緊密結合於該行動裝置上,該外保護層用以緩衝外部應力並保護該行動裝置。 The electronic device of claim 8, wherein the protective casing is shaped to fit the outer surface of the mobile device such that the protective casing is tightly coupled to the mobile device, the outer protective layer is configured to buffer external stress and protect the action Device. 如請求項8所述之電子裝置,其中該行動裝置更包含一電源模組、一處理單元和一顯示單元,該電源模組耦接該處理單元,該顯示單元與該接點,該電源模組提供一電源至該處理單元與該顯示單元,當該熱電材料層經由該接點耦接該電源模組,該熱電材料層利用產生的電流對該電源模組進行充電。 The electronic device of claim 8, wherein the mobile device further comprises a power module, a processing unit and a display unit, the power module is coupled to the processing unit, the display unit and the contact, the power module The group provides a power source to the processing unit and the display unit. When the thermoelectric material layer is coupled to the power module via the contact, the thermoelectric material layer charges the power module by using the generated current. 如請求項13所述之電子裝置,其中該外表面的面向與該顯示單元的面向相反。The electronic device of claim 13, wherein the outer surface faces the opposite side of the display unit.
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201042789A (en) * 2009-04-02 2010-12-01 Basf Se Thermoelectric material coated with a protective layer
CN102201761A (en) * 2010-03-24 2011-09-28 岳凡恩 Power supply module, system and method thereof
TWM443366U (en) * 2012-06-15 2012-12-11 jia-de Huang Electronic device cover structure

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201042789A (en) * 2009-04-02 2010-12-01 Basf Se Thermoelectric material coated with a protective layer
CN102201761A (en) * 2010-03-24 2011-09-28 岳凡恩 Power supply module, system and method thereof
TWM443366U (en) * 2012-06-15 2012-12-11 jia-de Huang Electronic device cover structure

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