TWI512816B - A composite structure and its manufacturing method - Google Patents
A composite structure and its manufacturing method Download PDFInfo
- Publication number
- TWI512816B TWI512816B TW101100313A TW101100313A TWI512816B TW I512816 B TWI512816 B TW I512816B TW 101100313 A TW101100313 A TW 101100313A TW 101100313 A TW101100313 A TW 101100313A TW I512816 B TWI512816 B TW I512816B
- Authority
- TW
- Taiwan
- Prior art keywords
- composite structure
- functional portion
- metal base
- base portion
- undercut grooves
- Prior art date
Links
- 239000002131 composite material Substances 0.000 title claims description 33
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 33
- 239000002184 metal Substances 0.000 claims description 33
- 238000000034 method Methods 0.000 claims description 18
- 238000005530 etching Methods 0.000 claims description 13
- 239000007769 metal material Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 9
- 238000000465 moulding Methods 0.000 claims description 8
- 239000004033 plastic Substances 0.000 claims description 5
- 229920003023 plastic Polymers 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 238000004070 electrodeposition Methods 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 238000001039 wet etching Methods 0.000 claims description 3
- 239000004925 Acrylic resin Substances 0.000 claims description 2
- 229920000178 Acrylic resin Polymers 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 238000005553 drilling Methods 0.000 claims description 2
- 229910052749 magnesium Inorganic materials 0.000 claims description 2
- 239000011777 magnesium Substances 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 claims description 2
- 229920001169 thermoplastic Polymers 0.000 claims description 2
- 229920001187 thermosetting polymer Polymers 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- 229910000831 Steel Inorganic materials 0.000 claims 1
- 239000000806 elastomer Substances 0.000 claims 1
- 229920001971 elastomer Polymers 0.000 claims 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims 1
- 239000010959 steel Substances 0.000 claims 1
- 239000000243 solution Substances 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M sodium hydroxide Inorganic materials [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 5
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 3
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- SNICXCGAKADSCV-JTQLQIEISA-N (-)-Nicotine Chemical compound CN1CCC[C@H]1C1=CC=CN=C1 SNICXCGAKADSCV-JTQLQIEISA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000003929 acidic solution Substances 0.000 description 1
- -1 acryl Chemical group 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 238000007743 anodising Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 229910001338 liquidmetal Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000010137 moulding (plastic) Methods 0.000 description 1
- 229960002715 nicotine Drugs 0.000 description 1
- SNICXCGAKADSCV-UHFFFAOYSA-N nicotine Natural products CN1CCCC1C1=CC=CN=C1 SNICXCGAKADSCV-UHFFFAOYSA-N 0.000 description 1
- 229920001197 polyacetylene Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
- B29C70/74—Moulding material on a relatively small portion of the preformed part, e.g. outsert moulding
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B17/00—Connecting constructional elements or machine parts by a part of or on one member entering a hole in the other and involving plastic deformation
- F16B17/006—Connecting constructional elements or machine parts by a part of or on one member entering a hole in the other and involving plastic deformation of rods or tubes to sheets or plates
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B37/00—Nuts or like thread-engaging members
- F16B37/04—Devices for fastening nuts to surfaces, e.g. sheets, plates
- F16B37/048—Non-releasable devices
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Composite Materials (AREA)
- Mechanical Engineering (AREA)
- ing And Chemical Polishing (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Telephone Set Structure (AREA)
Description
本發明是有關於一種複合結構及其製造方法，特別是關於一種具有一模造在一金屬基底部且形成有卡掣件或模造標記的功能部的複合結構。 BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a composite structure and a method of fabricating the same, and more particularly to a composite structure having a functional portion molded into a metal base portion and formed with a snap member or a molded mark.
機械工件上經常須要設有可用以結合外部元件或做為標示或裝飾的功能部。在固體-金屬的成形製程上，例如沖壓或鍛造，因其工件的材料的可成形性差，因此欲在工件上形成具有不均勻厚度的肋部，突部或裝置用的標示部是幾乎難以達成或須要昂貴的成本。雖然，液體-金屬的成形製程可被用來製造具有複雜構造的模鑄金屬工件。然而，如此形成的工件的結構及表面的品質會因含有孔洞及缺陷，而不能被接受。對於要求高品質及具有高複雜結構的產品而言，電腦數值控制(CNC)裝置可以被用來去除金屬工件上多餘或不要的部份。然而，冗長的機械加工循環時間及大量廢料的產生使得CNC製程產生昂貴的成本及對環境造成負面的影響。焊接方式雖然可以被用來結合多數元件至一金屬工件上，但使用該些元件所產生的費用，及焊接所產生的高耗能及燒焦污點使得焊接方式不具有競爭性。因此，有需要尋找一種工件的設計及製造方法是可以克服上述至少一種缺點。 Mechanical parts are often required to have functional parts that can be used in conjunction with external elements or as signs or decorations. In the solid-metal forming process, such as stamping or forging, because of the poor formability of the material of the workpiece, it is almost impossible to form a rib having a non-uniform thickness on the workpiece, and the indication portion for the protrusion or the device is almost impossible to achieve. Or it costs a lot of money. Although a liquid-metal forming process can be used to fabricate a die-cast metal workpiece having a complex configuration. However, the structure and surface quality of the workpiece thus formed may be unacceptable due to the inclusion of voids and defects. For products that require high quality and high complexity, computer numerical control (CNC) devices can be used to remove unwanted or unwanted parts of metal workpieces. However, lengthy machining cycle times and the generation of large amounts of waste make the CNC process costly and negatively impacting the environment. Although the welding method can be used to combine most components onto a metal workpiece, the cost of using these components, as well as the high energy consumption and scorch stain generated by the welding, make the welding method not competitive. Therefore, there is a need to find a design and manufacturing method for a workpiece that overcomes at least one of the above disadvantages.
本發明之目的，在提供一種複合結構及其製造方法。 該複合結構及其製造方法具有不損傷複合結構的金屬基底部及功能部的表面的優點。 It is an object of the present invention to provide a composite structure and a method of manufacturing the same. The composite structure and the method of manufacturing the same have the advantage of not damaging the surface of the metal base portion and the functional portion of the composite structure.
於是，本發明一種複合結構，包含：一金屬基底部，由一金屬材料所構成的，且具有至少一結合區，該結合區形成有多數底切凹槽；以及至少一功能部，模造且結合於該結合區上，並具有多數凸柱，該等凸柱分別填滿該等底切凹槽。 Thus, a composite structure of the present invention comprises: a metal base portion composed of a metal material and having at least one bonding region formed with a plurality of undercut grooves; and at least one functional portion molded and bonded And on the bonding zone, and having a plurality of studs, the pillars respectively filling the undercut grooves.
又，本發明一種製造一複合結構的方法，包含：提供一金屬基底部，該金屬基底部由一金屬材料所構成，且具有至少一結合區；在該金屬基底部上形成一蝕刻遮罩以遮蓋該結合區；在該蝕刻遮罩上形成多數穿孔，以曝露該結合區的多數蝕刻位置；在該等蝕刻位置進行蝕刻，以在該結合區內形成多數底切凹槽；以及在該結合區上模造一可模造材料，以在該結合區上形成一功能部，且該功能部具有多數分別填滿該等底切凹槽的凸柱。 Moreover, a method of fabricating a composite structure according to the present invention includes: providing a metal base portion composed of a metal material and having at least one bonding region; forming an etch mask on the metal substrate portion Covering the bonding region; forming a plurality of vias on the etch mask to expose a plurality of etched locations of the bonding regions; etching at the etch locations to form a plurality of undercut recesses in the bonding regions; and in the bonding A moldable material is molded over the region to form a functional portion on the bonding region, and the functional portion has a plurality of studs respectively filling the undercut grooves.
本發明之功效在於：利用在一機械工件或電子工件的一金屬基底部上形成底切凹槽並於該等底切凹槽上模造而形成一具有卡掣或標記功能的功能部，如此而可避免所形成的複合結構的金屬基底部及功能部的表面損傷。 The invention has the advantages of forming an undercut groove on a metal base portion of a mechanical workpiece or an electronic workpiece and molding on the undercut grooves to form a functional portion having a card or mark function, thus The surface damage of the metal base portion and the functional portion of the formed composite structure can be avoided.
有關本發明之前述及其他技術內容、特點與功效，在以下配合參考圖式之較佳實施例的詳細說明中，將可清楚的呈現。 The foregoing and other objects, features, and advantages of the invention are set forth in the <RTIgt;
圖1-2顯示一種具有本發明之一第一較佳實施例之一種 複合結構2的電子裝置100，例如手機。該電子裝置100另包括一具有一螢幕31且與該複合結構2結合的前蓋3及至少一外部元件41，例如電路板及相機模組。 1-2 shows a type of a first preferred embodiment of the present invention The electronic device 100 of the composite structure 2, such as a mobile phone. The electronic device 100 further includes a front cover 3 having a screen 31 and combined with the composite structure 2 and at least one external component 41, such as a circuit board and a camera module.
本發明之一第一較佳實施例之複合結構2包含：一金屬基底部5，由一第一金屬材料所構成的，且具有一表面51，及多數自表面51凹陷之非貫穿的底切凹槽512；以及至少一功能部6，模造且結合於該金屬基底部5的表面51上，並具有一主體61及多數自該主體61的底面611往外凸出之凸柱62，主體61與凸柱62是一體成型，且主體61的底面611結合於金屬基底部5的表面51，該等凸柱62分別進入且填滿該等底切凹槽512，該主體61形成有一用以與該外部元件41卡掣的卡掣件612。 The composite structure 2 of the first preferred embodiment of the present invention comprises: a metal base portion 5 composed of a first metal material and having a surface 51 and a plurality of non-penetrating undercuts recessed from the surface 51 a recess 512; and at least one functional portion 6 molded and bonded to the surface 51 of the metal base portion 5, and having a main body 61 and a plurality of protrusions 62 projecting outward from the bottom surface 611 of the main body 61, the main body 61 and The protrusion 62 is integrally formed, and the bottom surface 611 of the main body 61 is coupled to the surface 51 of the metal base portion 5. The protrusions 62 respectively enter and fill the undercut grooves 512, and the main body 61 is formed with The outer member 41 is latched by the latch 612.
該等底切凹槽512分別具有一位在表面51的頂部開口及具有一自一最大截面位置朝其頂部開口位置逐漸縮小的截面，且該等底切凹槽512分別於不同截面位置時，具有不同大小的截面，使得該功能部6不易自該表面51上脫離。較佳下，該等底切凹槽512為圓弧狀(bulb-shaped)，且具有一範圍介於0.05-0.5mm的直徑。 The undercut grooves 512 respectively have a cross section at the top of the surface 51 and have a section which tapers from a maximum cross-sectional position toward the top opening thereof, and the undercut grooves 512 are respectively at different cross-sectional positions. The sections having different sizes make the functional portion 6 less prone to detachment from the surface 51. Preferably, the undercut grooves 512 are bulb-shaped and have a diameter ranging from 0.05 to 0.5 mm.
在第一較佳實施例中，該卡掣件612為一形成在該主體內的一螺孔。如此，藉由將一螺鎖件42穿過該外部元件41並與該螺孔螺鎖而可將該外部元件41固定在該功能部6的主體61上。可選擇地，該主體61的卡掣件612可以具有一結構是可以以凸凹卡合(tongue-and-groove)或壓入配合(press fit)的方式與該外部元件41卡掣的。 In the first preferred embodiment, the latch member 612 is a screw hole formed in the main body. Thus, the outer member 41 can be fixed to the main body 61 of the functional portion 6 by passing a screw member 42 through the outer member 41 and screwing with the screw hole. Alternatively, the latch member 612 of the body 61 may have a structure that is engageable with the outer member 41 in a tongue-and-groove or press fit manner.
該第一金屬材料係選自鋁、鎳、鎂、鈦、銅、其等的合金及不鏽鋼。 The first metal material is selected from the group consisting of aluminum, nickel, magnesium, titanium, copper, alloys thereof, and stainless steel.
該功能部6是由一第二金屬材料或一塑膠材料所構成的，該塑膠材料係選自熱塑性塑脂、熱固性樹脂、彈性體聚合物及塑鋼(plastic plus carbon/glass fiber)。該第二金屬材料可為上述第一金屬材料所列舉之任一者。較佳下，該塑膠材料係選自聚碳酸酯及聚乙炔之一者。 The functional portion 6 is composed of a second metal material or a plastic material selected from the group consisting of thermoplastic plastics, thermosetting resins, elastomeric polymers, and plastic plus carbon/glass fibers. The second metal material may be any of the above-mentioned first metal materials. Preferably, the plastic material is selected from the group consisting of polycarbonate and polyacetylene.
圖3A-3E說明本發明製造第一較佳實施例之複合結構2的方法的連續步驟。該方法包含：提供一金屬基底部5(如圖3A所示)，該金屬基底部5由一金屬材料所構成的，且具有至少一表面51；在該金屬基底部5上形成一蝕刻遮罩71以遮蓋該表面51(如圖3A所示)；在該蝕刻遮罩71上形成多數穿孔710，以曝露該表面51的多數蝕刻位置(如圖3B所示)；在該等蝕刻位置進行蝕刻，以在該表面51內形成多數底切凹槽512(如圖3C所示)；可選擇地自金屬基底部5移除該蝕刻遮罩71(如圖3D所示)；以及在該表面51上模造一可模造材料，以在該表面51上形成一功能部6(如圖3E所示)，且該功能部6具有一主體61及多數自該主體61底面611凸出且分別填滿該等底切凹槽512的凸柱62。該功能部6的模造可以是塑膠模造(plastic molding)或金屬模鑄模造(die-cast molding)。 3A-3E illustrate successive steps of a method of making a composite structure 2 of the first preferred embodiment of the present invention. The method includes: providing a metal base portion 5 (shown in FIG. 3A), the metal base portion 5 being formed of a metal material and having at least one surface 51; an etch mask formed on the metal base portion 5 71 to cover the surface 51 (as shown in FIG. 3A); a plurality of perforations 710 are formed on the etch mask 71 to expose a plurality of etched locations of the surface 51 (as shown in FIG. 3B); etching is performed at the etched locations Forming a plurality of undercut grooves 512 (shown in FIG. 3C) in the surface 51; optionally removing the etch mask 71 (as shown in FIG. 3D) from the metal base portion 5; and on the surface 51 The upper mold forms a moldable material to form a functional portion 6 (shown in FIG. 3E) on the surface 51, and the functional portion 6 has a main body 61 and a plurality of protrusions from the bottom surface 611 of the main body 61 and respectively fill the surface. The post 62 of the groove 512 is undercut. The molding of the functional portion 6 may be plastic molding or die-cast molding.
較佳下，該蝕刻遮罩71的形成可以以電沉積方式進行。可選擇地，該蝕刻遮罩71的形成也可以以印刷或微影一光阻的方式進行或以陽極氧化該金屬基底部5的方式進 行。 Preferably, the formation of the etch mask 71 can be performed by electrodeposition. Alternatively, the formation of the etch mask 71 may also be performed by printing or lithography-resistance or by anodizing the metal base portion 5. Row.
較佳下，該蝕刻遮罩71是由一種樹脂所構成，該樹脂是選自環氧樹脂及壓克力樹脂之其中之一者。做為舉例用，該蝕刻遮罩71的形成是由下列步驟所完成：先將該金屬基底部5浸入一電沉積浴(未顯示)中，該電沉積浴含10-30wt%環氧樹脂溶液或3-20wt%壓克力溶液，再通入一80-120V的直流電於該沉積浴並持續約6-120秒，以形成約5-40μm的電積塗層。該電積塗層再以85℃經第一次烘乾10分鐘，隨後再以180℃經第二次烘乾60分鐘，以形成該蝕刻遮罩71。 Preferably, the etching mask 71 is composed of a resin selected from one of epoxy resin and acrylic resin. By way of example, the etching mask 71 is formed by immersing the metal substrate portion 5 in an electrodeposition bath (not shown) containing 10-30% by weight of an epoxy resin solution. Or a 3-20 wt% acryl solution, and then a direct current of 80-120 V is applied to the deposition bath for about 6-120 seconds to form an electrodeposited coating of about 5-40 μm. The electrodeposited coating was further dried at 85 ° C for 10 minutes, followed by a second drying at 180 ° C for 60 minutes to form the etch mask 71.
較佳下，該蝕刻遮罩71的該等穿孔710是以雷射鑽孔方式進行。 Preferably, the perforations 710 of the etch mask 71 are performed by laser drilling.
較佳下，在該表面51的該等蝕刻位置所進行的蝕刻是以等方向濕式蝕刻方式進行，以使得該等底切凹槽512的形狀為球狀。 Preferably, the etching performed at the etching locations of the surface 51 is performed in an isotropically wet etching manner such that the undercut grooves 512 are spherical in shape.
較佳下，該濕式蝕刻所使用的蝕刻液可以是氯化鐵溶液(ferric chloride solution)或鹼液(NaOHso1ution)。當該金屬基底部5的材料是鋁時，該氯化鐵溶液的波美(Baume)比重較佳為10-48．Be。當該金屬基底部5的材料是不鏽鋼時，該氯化鐵溶液的波美比重較佳為30-48．Be。 Preferably, the etching solution used in the wet etching may be a ferric chloride solution or a lye (NaOH). When the material of the metal base portion 5 is aluminum, the Baume specific gravity of the ferric chloride solution is preferably from 10 to 48 . Be. When the material of the metal base portion 5 is stainless steel, the ferric chloride solution preferably has a Baume specific gravity of 30-48 . Be.
該蝕刻遮罩71的移除可以藉由將塗有該蝕刻遮罩71的金屬基底部5浸泡在一酸性溶液，例如磷酸、硝煙及硫酸，而完成。 The removal of the etch mask 71 can be accomplished by immersing the metal base portion 5 coated with the etch mask 71 in an acidic solution, such as phosphoric acid, nicotine, and sulfuric acid.
較佳下，在該表面51上模造該功能部6是以埋入模造 (insertion molding)方式進行。如此形成的該功能部6可以具有模造的卡掣件612，而不須要再進一步加工該功能部6以形成該卡掣件612. Preferably, the functional portion 6 is molded on the surface 51 to be molded by embedding. (insertion molding) method. The functional portion 6 thus formed may have a molded latch member 612 without the need to further process the functional portion 6 to form the latch member 612.
圖4-5顯示本發明之一第二較佳實施例之一種用於機械部件之複合結構2的構造。與第一較佳實施例不同的是第二較佳實施例之該複合結構2是用於機械工件而非電子工件以及第二較佳實施例之該複合結構2的該功能部6的主體61是形成有一具有一H-型凹槽的模造標記65而非該卡掣件612。該模造標記65可選自商標圖形、預定圖案、裝飾圖像、文字或其等的組合之一者。 4-5 show the construction of a composite structure 2 for a mechanical component in accordance with a second preferred embodiment of the present invention. Different from the first preferred embodiment, the composite structure 2 of the second preferred embodiment is a body 61 of the functional portion 6 for a mechanical workpiece rather than an electronic workpiece and the composite structure 2 of the second preferred embodiment. Instead of the latch member 612, a molded mark 65 having an H-shaped groove is formed. The molding mark 65 may be selected from one of a trademark graphic, a predetermined pattern, a decorative image, a character, or the like.
本發明利用在一機械工件或電子工件的一金屬基底部5上形成底切凹槽512並於該等底切凹槽512上模造而形成一具有卡掣件612或模造標記65的功能部6，如此而可避免所形成的複合結構2的金屬基底部5及功能部6的表面損傷，並且所形成的卡掣件612可被用以將一外部元件41結合到機械工件或電子工件的金屬基底部5上，及/或所形成的模造標記65可以產生具有標示或辨示或裝飾的功能。 The present invention utilizes an undercut recess 512 formed in a metal base portion 5 of a mechanical or electronic workpiece and is molded over the undercut recess 512 to form a functional portion 6 having a latch member 612 or a molded mark 65. Thus, the surface damage of the metal base portion 5 and the functional portion 6 of the formed composite structure 2 can be avoided, and the formed latch member 612 can be used to bond an external member 41 to the metal of the mechanical workpiece or the electronic workpiece. The base portion 5, and/or the formed molding indicia 65, can produce a function of marking or identifying or decorating.
惟以上所述者，僅為本發明之較佳實施例而已，當不能以此限定本發明實施之範圍，即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾，皆仍屬本發明專利涵蓋之範圍內。 The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.
100‧‧‧電子裝置 100‧‧‧Electronic devices
2‧‧‧複合結構 2‧‧‧Composite structure
3‧‧‧前蓋 3‧‧‧ front cover
31‧‧‧螢幕 31‧‧‧ screen
41‧‧‧外部元件 41‧‧‧External components
42‧‧‧螺鎖件 42‧‧‧ Screw locks
5‧‧‧金屬基底部 5‧‧‧Metal base
51‧‧‧表面 51‧‧‧ surface
512‧‧‧底切凹槽 512‧‧‧ undercut groove
6‧‧‧功能部 6‧‧‧ functional department
61‧‧‧主體 61‧‧‧ Subject
611‧‧‧底面 611‧‧‧ bottom
612‧‧‧卡掣件 612‧‧‧ Cards
62‧‧‧凸柱 62‧‧‧Bump
65‧‧‧模造標記 65‧‧‧Molded mark
71‧‧‧蝕刻遮罩 71‧‧‧ etching mask
710‧‧‧穿孔 710‧‧‧Perforation
圖1是一立體分解圖，說明本發明一具有一第一較佳實施例的一種複合結構的電子裝置； 圖2是一沿圖1中的剖線Ⅱ-Ⅱ的剖面圖，說明本發明第一較佳實施例的構造；圖3A-3E是示意圖，說明本發明一較佳實施例之一製造該複合結構的方法的連續步驟；圖4是一立體圖，說明本發明一具有一第二較佳實施例的一種複合結構的機械部件；以及圖5是一沿圖4中的剖線V-V的剖面圖。 1 is an exploded perspective view of an electronic device having a composite structure according to a first preferred embodiment of the present invention; Figure 2 is a cross-sectional view taken along line II-II of Figure 1, illustrating the construction of a first preferred embodiment of the present invention; and Figures 3A-3E are schematic views showing the manufacture of the composite according to a preferred embodiment of the present invention. Figure 4 is a perspective view showing a mechanical component of a composite structure having a second preferred embodiment of the present invention; and Figure 5 is a cross-sectional view taken along line VV of Figure 4;
100‧‧‧電子裝置 100‧‧‧Electronic devices
2‧‧‧複合結構 2‧‧‧Composite structure
3‧‧‧前蓋 3‧‧‧ front cover
31‧‧‧螢幕 31‧‧‧ screen
41‧‧‧內部元件 41‧‧‧Internal components
42‧‧‧螺鎖件 42‧‧‧ Screw locks
5‧‧‧金屬基底部 5‧‧‧Metal base
511‧‧‧結合區 511‧‧‧ combination zone
6‧‧‧功能部 6‧‧‧ functional department
612‧‧‧卡掣件 612‧‧‧ Cards
Claims (21)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161430555P | 2011-01-07 | 2011-01-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201303993A TW201303993A (en) | 2013-01-16 |
| TWI512816B true TWI512816B (en) | 2015-12-11 |
Family
ID=46457732
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101100313A TWI512816B (en) | 2011-01-07 | 2012-01-04 | A composite structure and its manufacturing method |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN103403370B (en) |
| TW (1) | TWI512816B (en) |
| WO (1) | WO2012094640A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2510453B (en) | 2012-10-29 | 2018-11-14 | Vestatec U K Ltd | Lighted trim assembly and perforated member therefor |
| US10016921B2 (en) | 2015-05-01 | 2018-07-10 | Apple Inc. | Apparatus and method of forming a compound structure |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6913666B1 (en) * | 1997-03-21 | 2005-07-05 | Woodwelding Ag | Process for anchoring connecting elements in a material with pores or cavities and connecting elements therefor |
| US20060281222A1 (en) * | 2005-06-08 | 2006-12-14 | Teruo Shoji | Manufacturing method of semiconductor integrated circuit device |
| US20100215938A1 (en) * | 2009-02-20 | 2010-08-26 | Taiwan Green Point Enterprises Co., Ltd. | Method of selective plastic insert molding on metal component |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4004774A (en) * | 1975-01-08 | 1977-01-25 | Du Pont Of Canada Limited | Coated panel |
| CN201149674Y (en) * | 2007-12-24 | 2008-11-12 | 全康精密工业股份有限公司 | Adapting card fixed device |
-
2012
- 2012-01-04 TW TW101100313A patent/TWI512816B/en not_active IP Right Cessation
- 2012-01-06 WO PCT/US2012/020552 patent/WO2012094640A1/en active Application Filing
- 2012-01-06 CN CN201280009833.3A patent/CN103403370B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6913666B1 (en) * | 1997-03-21 | 2005-07-05 | Woodwelding Ag | Process for anchoring connecting elements in a material with pores or cavities and connecting elements therefor |
| US20060281222A1 (en) * | 2005-06-08 | 2006-12-14 | Teruo Shoji | Manufacturing method of semiconductor integrated circuit device |
| US20100215938A1 (en) * | 2009-02-20 | 2010-08-26 | Taiwan Green Point Enterprises Co., Ltd. | Method of selective plastic insert molding on metal component |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201303993A (en) | 2013-01-16 |
| WO2012094640A1 (en) | 2012-07-12 |
| CN103403370B (en) | 2015-11-25 |
| CN103403370A (en) | 2013-11-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102069672B (en) | Preparation method of decorative shell | |
| CN104685794A (en) | Components of electronic device and methods for their assembly | |
| US20130280550A1 (en) | Device housing and method for making the same | |
| CN105764269B (en) | A kind of processing method and PCB of PCB | |
| TWI512816B (en) | A composite structure and its manufacturing method | |
| US20110005797A1 (en) | Device housing and method for making device housing | |
| CN112752439A (en) | Method for manufacturing high-density interconnection circuit board | |
| CN108093569A (en) | A kind of processing method for reducing super thick copper circuit board welding resistance difficulty | |
| CN104247582B (en) | Printed circuit board and manufacturing methods | |
| TWI441589B (en) | A composite structure and its manufacturing method | |
| CN104816429A (en) | Metal surface and plastic integral injection molding and firm adhering process | |
| CN103717014B (en) | Method for manufacturing substrate structure | |
| KR20100072740A (en) | Method for joining metal and resin | |
| JP2008235655A (en) | Substrate and method for manufacturing substrate | |
| CN113131185B (en) | Method for manufacturing shell of electronic equipment and shell of electronic equipment | |
| JP2007240416A (en) | Index with foot, manufacturing method therefor, and display panel using the index with foot | |
| KR101009157B1 (en) | A carrier member for forming circuit and a manufacturing method of a printed circuit board using the same | |
| JP5627177B2 (en) | How to create a metal design mockup and metal design mockup | |
| CN202085394U (en) | PCB with blind hole structure | |
| CN107820360B (en) | Circuit boring guiding structure and board, printed circuit board manufacturing method with it | |
| US20140202747A1 (en) | Circuit board and manufacturing method thereof | |
| JP2012213901A (en) | Imprint mold and method for manufacturing the same | |
| CN109348629B (en) | Processing method for manufacturing boss PCB | |
| JP6345957B2 (en) | Metal-ceramic circuit board and manufacturing method thereof | |
| TW201400323A (en) | Decoration film and manufacturing method for decorated article |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |