TWI512434B - Electronic device casing including coupling structure and method of manufacturing same - Google Patents

Description

Method for preparing electronic device housing with joint structure and structure thereof

The present invention relates to a method for fabricating a housing of an electronic device having a joint structure and a structure thereof, and more particularly to a method for assembling a shell forming a joint structure on a first thermoplastic substrate by a hot pressing process in combination with a plastic injection process and structure.

In addition to the pursuit of excellent work performance, today's industrial products enhance product identification. Today, manufacturers are all designing products, which can increase the added value of products with innovative design appearance and increase consumers' willingness to purchase. In the case of an electronic device housing, the early housings are all formed by injection molding of plasticized materials. Although the plasticized material has the advantages of light material and high plasticity, the plasticized material still has poor heat dissipation. And easy to bring consumers a poor quality perception. Therefore, some shell manufacturers changed the material made of metal instead of plasticized material, such as magnesium alloy, aluminum alloy or titanium alloy. However, the shell made of metal can not be directly in the shell. Forming a joint structure for combination with an external structure (such as a circuit board, a frame, etc.), the joint structure needs to be placed on the casing by bonding or welding, and a more specific embodiment is as in the Republic of China No. M331441, Patent No. 420969 and Patent Law No. 201134366, 201134653 of the Republic of China are disclosed. Although the embodiments disclosed in the above cases can overcome the problem that the joint structure cannot be directly formed, the bonding or welding of the joint structure requires very precise positioning, so that the external structure can be surely assembled in the casing, thus causing The process of the housing becomes quite cumbersome, increasing the number of man-hours.

The main object of the present invention is to overcome the problem that the electronic device casing made of metal material cannot directly form the joint structure, resulting in complicated process.

To achieve the above object, the present invention provides a method of fabricating an electronic device housing having a bonded structure, the method comprising the steps of:

a) providing a housing material step: the housing material comprises a supporting substrate and a first thermoplastic substrate stacked on the surface of the supporting substrate;

b) a hot press molding step: hot pressing the first thermoplastic substrate with a first hot press mold having at least one thermoplastic portion, bonding the first thermoplastic substrate to the support substrate, and Forming a primary connection portion relative to the location of the thermoplastic portion;

c) an in-mold ejection step: placing the shell material into an injection molding die by performing a hot press molding step, the injection molding die ejecting at least a molding plastic to the primary joint portion of the first thermoplastic substrate, and ejecting The molded plastic is fitted to the primary connecting portion to form a secondary connecting portion for connection to a connecting member.

In an embodiment of the method, in the step of providing the casing material, the other surface of the casing material stacked with the first thermoplastic substrate is further provided with a second thermoplastic substrate. Further, the second thermoplastic substrate is selected from the group consisting of polyethylene terephthalate, polyethylene naphthalate, glycol modified polyethylene terephthalate, thermoplastic polyurethane Ester, polyurethane, polypropylene, polycarbonate, amorphous polybutyl terephthalate, polyvinyl chloride, acrylic, styrene methyl methacrylate, acrylonitrile-butadiene-styrene copolymer One of a group of polystyrene, polycondensation, and nylon. The thickness of the second thermoplastic substrate can be between 0.1 mm and 0.5 mm. In addition, in the hot press molding step, the second thermoplastic substrate is further pressed by a second hot pressing mold to bond the second thermoplastic substrate to the supporting substrate.

In an embodiment of the method, the first thermoplastic substrate may be selected from polyethylene terephthalate, polyethylene naphthalate, glycol modified polyethylene terephthalate, and thermoplastic poly Urethane, polyurethane, polypropylene, polycarbonate, non-crystalline polybutyl terephthalate, polyvinyl chloride, acrylic, styrene methyl methacrylate, acrylonitrile-butadiene- One of a group consisting of styrene copolymer, polystyrene, polycondensation, and nylon.

In an embodiment of the method, the first thermoplastic substrate may have a thickness between 0.2 mm and 0.5 mm. Further, the support substrate is selected from the group consisting of a metal material, a fiber material, a carbon fiber material, a plant fiber, and a cortical material, and the thickness thereof may be between 0.1 mm and 1 mm.

In addition, the present invention further provides an electronic device housing having a joint structure, wherein the electronic device housing is made of a casing material, the housing material includes a supporting substrate and a bonding base. a first thermoplastic substrate on the surface of the material, and the so-called joint structure includes a primary connecting portion extending from the first thermoplastic substrate and a fitting portion of the primary connecting portion to form a connection for a connecting member Level connection.

Further, the secondary connecting portion has a screwing end screwed to the connecting component, or a riveting end riveted to the connecting component, or a plugging end that is inserted into the connecting component . Further, the support substrate may have a thickness of between 0.1 mm and 1 mm.

The method for preparing an electronic device housing having a joint structure, wherein the primary connection portion is formed on the first thermoplastic substrate by the hot compression molding step, and the in-mold ejection step is further performed on the primary connection portion A molding plastic is injected, and after the molding plastic is cooled, a secondary connecting portion is formed to be engaged with the primary connecting portion to form a joint structure, so that the joint structure can be formed directly in the preparation process of the electronic device housing. There is no need to set the joint structure through additional machining programs, which simplifies the process, shortens the manufacturing man-hours, and is more suitable for mass production.

The detailed description and technical contents of the present invention will now be described as follows:

Referring to FIG. 1-1 and FIG. 2, the electronic device housing with the joint structure of the present invention is used for assembling a circuit board (not shown) or a frame board (not shown) in the electronic device. The bonding structure on the electronic device casing of the present invention is directly disposed on the surface of the electronic device casing, and the conventional electronic device casing needs to be welded or pasted to be disposed on the electronic device casing. problem. The housing of the electronic device is made of a casing material 1. The casing material 1 includes a supporting substrate 11 and a first thermoplastic substrate 12 stacked on the surface of the supporting substrate 11. The support substrate 11 may be a metal material, a fiber material or a carbon fiber material, and the first thermoplastic substrate 12 may be selected from the group consisting of polyethylene terephthalate and polyethylene naphthalate. , diol-denatured polyethylene terephthalate, thermoplastic polyurethane, polyurethane, polypropylene, polycarbonate, amorphous polybutyl terephthalate, polyvinyl chloride, acrylic, One of a group consisting of styrene methyl methacrylate, acrylonitrile-butadiene-styrene copolymer, polystyrene, polycondensation, and nylon. Further, the thickness of the support substrate 11 may be between 0.1 mm and 1 mm, and the thickness of the first thermoplastic substrate 12 may be between 0.2 mm and 0.5 mm. In addition, in addition to the above-mentioned general materials, the support substrate 11 of the present invention may further be a plant fiber or a cortical material, such as bamboo skin or bark, and the leather material is synthetic leather or the like.

The specific implementation method for preparing the electronic device casing by using the casing material 1 is as follows:

a) providing a shell material step S01: providing the shell material 1 comprising the support substrate 11 and the first thermoplastic substrate 12;

b) hot press molding step S02: Referring to FIG. 1-2, the first thermoplastic substrate 12 is hot pressed by a first thermoplastic mold 2, and the first thermoplastic mold 2 has at least one The thermoplastic portion 21, the aspect of the thermoplastic portion 21 can be appropriately adjusted according to requirements, and is not limited to the present invention as illustrated in FIG. During the hot pressing process, the first thermoplastic substrate 12 is thermally fused to the support substrate 11 and can be heat-pressed to form a shape of the electronic device casing, and the first thermoplastic substrate 12 is heated. A primary connecting portion 121 is protruded from the position of the thermoplastic portion 21. The state of the shell material 1 after the hot press demoulding is completed in the hot press molding step is as shown in FIG. 1-3;

c) In-mold injection step S03: Please refer to FIG. 1-4, FIG. 1-5 and FIG. 3 together, and the shell material 1 is placed in an injection molding die 3 by performing the hot press molding step S02, and the injection molding is performed. The mold 3 emits at least a molding plastic to the primary connecting portion 121 of the first thermoplastic substrate 12, and the cooled molding plastic forms a primary-stage connecting portion 122 on the primary connecting portion 121, and the secondary connecting portion 122 further The connection structure is formed in the primary connection portion 121 to be connected to an attachment member (not shown). After the mold material 1 is released from the mold in step S03, the electronic device housing is formed. body. Further, the secondary connecting portion 122 can be formed according to different connecting elements. When the connecting component is a screwing component, the secondary connecting portion 122 can be screwed. The screwing end, the connecting component is a riveting component, and the secondary connecting portion 122 can be a riveting end for riveting. Further, when the connecting component is a connecting component, the secondary component The connecting portion 122 can be a plug-in end that can be plugged in. In addition, the primary connecting portion 121 can provide a connecting component on the primary connecting portion 121 before performing the in-mold emitting step S03, and in the in-mold emitting step S03, the molding plastic covers the connecting component, so that The secondary connection portion 122 includes the connection element, and the connection element can be combined.

1-1 to 1-5, the housing material 1 of the present invention may further have a second thermoplastic substrate 13 stacked on the support substrate 11 The other surface of the first thermoplastic substrate 12 is provided, and more specifically, the second thermoplastic substrate 13 may be selected from polyethylene terephthalate or polyethylene naphthalate. Glycol-denatured polyethylene terephthalate, thermoplastic polyurethane, polyurethane, polypropylene, polycarbonate, amorphous polybutyl terephthalate, polyvinyl chloride, acrylic, benzene One of a group consisting of ethylene methyl methacrylate, acrylonitrile-butadiene-styrene copolymer, polystyrene, polycondensation, and nylon. Further, the thickness of the second thermoplastic substrate 13 may be between 0.1 mm and 0.5 mm. When the electronic device casing is prepared, the second thermoplastic substrate 13 is hot-pressed by a second hot pressing die 4 in the hot press molding step S02 to be thermally fused to the supporting substrate 11. In this way, the first thermoplastic substrate 12 and the second thermoplastic substrate 13 can respectively form a decorative surface and an assembly surface of the electronic housing.

In summary, the bonding structure on the electronic device housing of the present invention does not need to be attached to the electronic device housing by adhesion or soldering, but the hot pressing molding step and the in-mold emitting step are The joint structure is directly formed on the first thermoplastic substrate, which simplifies the process and is more suitable for mass production.

The present invention has been described in detail above, but the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Variations and modifications are still within the scope of the patents of the present invention.

1. . . Housing material

11. . . Support substrate

12. . . First thermoplastic substrate

121. . . Primary connection

122. . . Secondary connection

13. . . Second thermoplastic substrate

2. . . First thermoplastic mold

twenty one. . . Thermoplastic department

3. . . Injection molding die

4. . . Second thermoplastic mold

S01, S02, S03. . . step

1-1 is a schematic cross-sectional view showing the material composition of a housing of an electronic device housing having a joint structure according to the present invention.

1-2 is a schematic view showing the implementation of a thermocompression molding method for preparing an electronic device housing having a joint structure according to the present invention.

1-3 are schematic cross-sectional views showing the housing material of the electronic device housing having the joint structure after the thermocompression molding.

1-4 are schematic views showing the in-mold injection implementation of the electronic device housing with the joint structure of the present invention.

1-5 are schematic cross-sectional views showing the housing material of the electronic device housing having the joint structure after being injected in the mold.

2 is a flow chart showing the implementation of the electronic device housing with the joint structure of the present invention.

FIG. 3 is a schematic view showing the appearance of an electronic device housing having a joint structure according to the present invention.

S01, S02, S03. . . step

Claims (14)

A method of fabricating an electronic device housing having a bonded structure, comprising the steps of:
Providing a shell material step: the shell material comprises a support substrate and a first thermoplastic substrate stacked on the surface of the support substrate;
a hot press molding step: hot pressing the first thermoplastic substrate with a first hot press mold having at least one thermoplastic portion, bonding the first thermoplastic substrate to the support substrate, and The thermoplastic portion is formed to form a primary connection portion; and an in-mold ejection step is: placing the housing material in the hot press molding step into an injection molding die, the injection molding die being at least the first thermoplastic substrate The primary connecting portion projects a molded plastic, and the molded plastic that is injected is fitted into the primary connecting portion to form a secondary connecting portion for connecting a connecting member. A method of preparing an electronic device housing having a bonded structure according to the first aspect of the invention, wherein the supporting substrate is stacked with the other surface of the first thermoplastic substrate There is a second thermoplastic substrate. a method for preparing an electronic device casing having a joint structure according to the second aspect of the invention, wherein in the hot press molding step, the second thermoplastic substrate is hot pressed by a second hot press mold. The second thermoplastic substrate is bonded to the support substrate. The method for preparing an electronic device casing having a joint structure according to the second aspect of the invention, wherein the second thermoplastic substrate is selected from the group consisting of polyethylene terephthalate and polyethylene naphthalate. , diol-denatured polyethylene terephthalate, thermoplastic polyurethane, polyurethane, polypropylene, polycarbonate, amorphous polybutyl terephthalate, polyvinyl chloride, acrylic, One of a group consisting of styrene methyl methacrylate, acrylonitrile-butadiene-styrene copolymer, polystyrene, polycondensation, and nylon. A method of preparing an electronic device housing having a joined structure as described in claim 2, wherein the second thermoplastic substrate has a thickness of between 0.1 mm and 0.5 mm. The method for preparing an electronic device casing having a joint structure according to claim 1, wherein the first thermoplastic substrate is selected from the group consisting of polyethylene terephthalate and polyethylene naphthalate. , diol-denatured polyethylene terephthalate, thermoplastic polyurethane, polyurethane, polypropylene, polycarbonate, amorphous polybutyl terephthalate, polyvinyl chloride, acrylic, One of a group consisting of styrene methyl methacrylate, acrylonitrile-butadiene-styrene copolymer, polystyrene, polycondensation, and nylon. The method for preparing an electronic device casing having a joint structure according to the first aspect of the invention, wherein the support substrate is selected from the group consisting of a metal material, a fiber material, a carbon fiber material, a plant fiber, and a cortical material. One of the groups. A method of manufacturing an electronic device housing having a joined structure as described in claim 1, wherein the support substrate has a thickness of between 0.1 mm and 1 mm. A method of preparing an electronic device housing having a joined structure as described in claim 1, wherein the first thermoplastic substrate has a thickness of between 0.2 mm and 0.5 mm. An electronic device housing having an engaging structure, the electronic device housing being made of a casing material, the housing material comprising a supporting substrate and a first thermoplastic substrate bonded to the surface of the supporting substrate, The joint structure includes:
a primary connection portion extending from the first thermoplastic substrate; and a primary connection portion to be formed to form a secondary connection portion for connection of an attachment member. The electronic device housing having the joint structure according to claim 10, wherein the secondary connecting portion has a screwing end screwed to the connecting member. The electronic device housing having the joint structure according to claim 10, wherein the secondary connecting portion has a riveted end riveted to the connecting member. The electronic device housing having the joint structure according to claim 10, wherein the secondary connecting portion has a plug end that is inserted into the connecting member. The electronic device housing having the joint structure according to claim 10, wherein the support substrate has a thickness of between 0.1 mm and 1 mm.