TWI512273B - Fiber optic sensor manufacturing method and structure thereof - Google Patents

Description

Optical fiber sensor manufacturing method and its structure

The present invention relates to a method of fabricating a fiber optic sensor and its construction; and more particularly to a method of fabricating a multi-function fiber optic sensor and its construction.

A fiber optic sensor, such as the fiber optic sensing system of the Republic of China Patent No. I304881, discloses a fiber optic sensing system using a fiber grating sensor for measuring A physical parameter such as temperature or pressure. The fiber grating sensor comprises a Bragg fiber grating, a long period fiber grating and an external force long period fiber grating.

Another conventional fiber optic sensor, such as the 〝 fiber grating sensor of the Republic of China Patent No. I346772, is an invention patent, which discloses a fiber grating sensor comprising: a circular elastic sheet and one or two fiber gratings, The fiber grating is disposed on a bottom surface of the circular elastic sheet, and two ends of the fiber grating are connected to an optical fiber for transmitting signals. The fiber grating sensor is used as a distributed stress meter, dynamometer, pressure gauge and displacement meter.

Another conventional fiber optic sensor, such as the strain sensing system of the double fiber grating of the Republic of China Patent No. 542899, discloses a dual fiber Bragg grating strain sensor system. The invention comprises: a broadband source, a power reading unit, and a sensor. The sensor has a first fiber Bragg grating and a second fiber Bragg grating; wherein the light of the broadband source is transmitted to the light source via the power receiver The first fiber Bragg grating and the second fiber Bragg grating, and the first fiber Bragg grating and the second fiber Bragg grating generate a first reflection band and a second reflection band, and are transmitted back to the power receiver.

In short, in addition to the aforementioned fiber optic sensors of No. I304881, No. I346772, and No. 542899, there is still a need to further provide various other improved conventional fiber optic sensors. The above-mentioned patents and patent applications are merely for the purpose of the technical background of the present invention and are not intended to limit the scope of the present invention.

In view of the above, the present invention provides a method for fabricating a fiber optic sensor and a structure thereof, which form a groove portion on a substrate, and a fiber optic sensor is disposed by the groove portion for packaging Forming a fiber optic sensor configuration; or stacking a plurality of substrates and a plurality of fiber optic sensors to form a composite fiber optic sensor to meet the needs of a modified conventional fiber optic sensor.

The main purpose of the preferred embodiment of the present invention is to provide a method for fabricating a fiber optic sensor and a structure thereof, wherein a groove portion is formed on a substrate, and a fiber optic sensor is disposed by the groove portion for packaging to form an optical fiber. Sensors for the purpose of simplifying the overall construction.

Another object of the preferred embodiment of the present invention is to provide a method for fabricating a fiber optic sensor and a configuration thereof, which combines a plurality of substrates and a plurality of fiber optic sensor stacks to form a composite fiber optic sensor structure to achieve Simplify the overall structure and ease of use.

In order to achieve the above object, a method for manufacturing a fiber optic sensor according to a preferred embodiment of the present invention comprises: forming a predetermined film by using a pedestal, and converting the predetermined film into a predetermined molding structure; forming a first substrate by using the susceptor a layer, and since the susceptor has the predetermined molding structure, the first substrate layer forms a groove structure; Inserting a fiber optic sensor into the recess structure of the first substrate layer; and covering the first substrate layer with a second substrate layer to package a fiber optic sensor configuration.

A preferred embodiment of the invention further comprises: pre-cleaning the susceptor prior to forming the predetermined film.

A preferred embodiment of the invention further includes applying a photoresist material to the susceptor to form the predetermined film.

In the preferred embodiment of the present invention, the coating of the photoresist material is formed by spin coating to form the predetermined film, and after exposure and development, a predetermined molding structure of the predetermined film is formed.

The preferred embodiment of the present invention further comprises: soft baking the predetermined film and the first substrate layer.

In a preferred embodiment of the present invention, the first substrate layer is surface-modified in a corona manner.

In order to achieve the above object, a fiber optic sensor structure according to a preferred embodiment of the present invention includes: a first substrate having a first recess portion; and a first fiber optic sensor disposed on the first substrate a second substrate having a second recessed portion, the second substrate being stacked on the first substrate; a second optical fiber sensor disposed on the second recess of the second substrate a third substrate stacked on the second substrate; wherein the first fiber sensor is embedded between the first substrate and the second substrate, and the second fiber sensor is embedded Between the second substrate and the third substrate to form a two-layer fiber optic sensor configuration.

The first substrate and the second substrate of the preferred embodiment of the present invention The third substrate is made of a polymer organic bismuth compound material.

In the preferred embodiment of the present invention, the polymer organic bismuth compound material is selected from the group consisting of polydimethyl siloxane (PDMS).

In the preferred embodiment of the invention, the first fiber optic sensor and the second fiber optic sensor are selected from a fiber Bragg grating.

In a preferred embodiment of the present invention, the third substrate has a third recessed portion, a third optical fiber sensor is disposed in the third recessed portion of the third substrate, and a fourth substrate is stacked on the third substrate. Three substrates are formed to form a three-layer fiber sensor construction.

In the preferred embodiment of the present invention, the third substrate has an opening portion for exposing the second fiber optic sensor to the opening portion.

100‧‧‧Base

101‧‧‧Predetermined film

102‧‧‧Predetermined molding structure

103‧‧‧First substrate layer

104‧‧‧ Groove structure

105‧‧‧Fiber optic sensor

106‧‧‧Second substrate layer

1‧‧‧Three-layer fiber optic sensor construction

1'‧‧‧ Double-layer fiber optic sensor construction

1"‧‧‧ Double-layer fiber optic sensor construction

11‧‧‧First substrate

110‧‧‧First groove

12‧‧‧second substrate

120‧‧‧second groove

13‧‧‧ Third substrate

130‧‧‧ Third groove

14‧‧‧fourth substrate

141‧‧‧ openings

21‧‧‧First fiber optic sensor

22‧‧‧Second fiber optic sensor

23‧‧‧ Third Fiber Sensor

Figure 1 is a schematic illustration of a method of fabricating a fiber optic sensor in accordance with a preferred embodiment of the present invention.

Fig. 2 is a perspective exploded view showing the structure of the optical fiber sensor of the first preferred embodiment of the present invention.

Fig. 3 is a perspective view showing the three-dimensional assembly of the optical fiber sensor of the first preferred embodiment of the present invention.

Fig. 4 is a perspective view showing the three-dimensional assembly of the optical fiber sensor of the second preferred embodiment of the present invention.

Fig. 5 is a perspective view showing the three-dimensional assembly of the optical fiber sensor of the third preferred embodiment of the present invention.

In order to fully understand the present invention, the preferred embodiments of the present invention are described in detail below, and are not intended to limit the invention.

The optical fiber sensor manufacturing method and the configuration thereof according to the preferred embodiment of the present invention are suitable for packaging and manufacturing various optical fiber sensors, such as a single optical fiber sensor or a multifunctional optical fiber sensor, but are not intended to limit the present invention. range. In addition, the optical fiber sensor manufacturing method and the structure thereof according to the preferred embodiment of the present invention are suitable for various process technologies, such as spin coating, exposure and development, or soft baking. However, it is not intended to limit the scope of the invention.

1 is a schematic view showing a method of manufacturing a fiber optic sensor according to a preferred embodiment of the present invention, which mainly includes six schematic steps. Referring to FIG. 1 , a method for manufacturing a bio-dissolved fiber sensor according to a preferred embodiment of the present invention includes the step S1 of providing a base 100 having a surface [upper surface]. At the same time, the surface of the susceptor 100 is washed in advance in an appropriate manner before the work is performed.

Referring to FIG. 1 again, the optical fiber sensor manufacturing method of the preferred embodiment of the present invention further includes the step S2: then, using the cleaning surface of the susceptor 100, a predetermined film 101 is formed in an appropriate manner, and The predetermined film 101 is converted on the surface of the susceptor 100 in a suitable manner to form a predetermined shaped structure 102.

Referring again to FIG. 1, for example, the susceptor 100 is selected from a wafer or other material. In addition, the predetermined film 101 is formed by applying a photoresist material on the surface of the susceptor 100, and the photoresist material is coated by spin coating to form the predetermined film 101, and is formed. To a predetermined thickness. Next, the predetermined film 101 is subjected to appropriate soft baking, exposure and development operations, and a predetermined molding structure 102 of the predetermined film 101 is formed on the surface of the susceptor 100 after exposure and development.

Referring to FIG. 1 again, the optical fiber sensor manufacturing method of the preferred embodiment of the present invention further includes the step S3: subsequently, a first substrate layer 103 is formed by using the surface of the susceptor 100, and The susceptor 100 has the predetermined molding structure 102, and thus a groove structure 104 is formed on the first substrate layer 103, as shown in step S4.

Referring to FIG. 1 again, the shape of the first substrate layer 103 is The polymer organic bismuth compound material (also referred to as: organic bismuth material) is appropriately coated (for example, spin coating method) to a predetermined thickness, and the polymer organic bismuth compound material is selected from polydimethyl siloxane. [Polydimethylsiloxane, PDMS]. In addition, the first substrate layer 103 is subjected to appropriate soft baking and other subsequent processing operations.

Referring to FIG. 1 again, the optical fiber sensor manufacturing method of the preferred embodiment of the present invention further includes the step S4: subsequently, the first substrate layer 103 is delaminated from the surface of the susceptor 100, and is performed. Properly turn over to use. In addition, the first substrate layer 103 is appropriately cut to a predetermined size as needed.

Referring to FIG. 1 again, the optical fiber sensor manufacturing method of the preferred embodiment of the present invention further includes step S5: Next, a fiber optic sensor 105 is placed in the recess structure 104 of the first substrate layer 103. . Further, the first substrate layer 103 is subjected to surface modification by corona treatment or other appropriate treatment.

For example, in the present invention, the surface of the first substrate layer 103 can be surface-modified by a corona treater with a energy intensity of 48000 V to 10000 V, that is, a hydrophobic material is converted into a hydrophilic material. The surface of the first substrate layer 103 is suitable for bonding with other materials.

Referring to FIG. 1 again, the optical fiber sensor manufacturing method of the preferred embodiment of the present invention further includes the step S6. Finally, the first substrate layer 103 is covered by a second substrate layer 106 to form an optical fiber. Sensor construction. At this time, the optical fiber sensor 105 is sealed between the first substrate layer 103 and the second substrate layer 106.

2 is a perspective exploded view showing the structure of the optical fiber sensor according to the first preferred embodiment of the present invention, which discloses a three-layer structure, and FIG. 3 discloses a three-dimensional combination of the optical fiber sensor structure of the first preferred embodiment of the present invention. Schematic, which corresponds to Figure 2. Please refer to Figures 2 and 3 for the present invention. The optical fiber sensor structure of the preferred embodiment comprises a first substrate 11, a first fiber sensor 21, a second substrate 12, a second fiber sensor 22, a third substrate 13, and a third fiber. The sensor 23 and a fourth substrate 14 are provided. The first substrate 11 , the second substrate 12 , the third substrate 13 , and the fourth substrate 14 are sequentially stacked and combined, and may be selected from the same material or different materials to reduce manufacturing costs.

Referring to FIGS. 2 and 3 , for example, the first fiber optic sensor 21 is embedded between the first substrate 11 and the second substrate 12 , and the second fiber optic sensor 22 is embedded in Between the second substrate 12 and the third substrate 13, the third fiber sensor 23 is embedded between the third substrate 13 and the fourth substrate 14 to complete the encapsulation of the first fiber sensor 21, Two fiber optic sensors 22 and a third fiber optic sensor 23. In addition, the first optical fiber sensor 21, the second optical fiber sensor 22, and the third optical fiber sensor 23 are disposed on the first substrate 11 and the second substrate 12 in a vertical direction correspondingly or in a misaligned manner. On the three substrates 13.

Referring to FIG. 2 and FIG. 3 again, for example, the first substrate 11 is made of a polymer organic bismuth compound, and the polymer organic bismuth compound material is preferably selected from the group consisting of polydimethyl siloxane. [PDMS], or other suitable material for human skin. The surface of the first substrate 11 has a first groove portion (for example, a long groove or other shaped groove) 110.

Referring to FIGS. 2 and 3 again, for example, the first fiber optic sensor 21 is selected from a fiber Bragg grating (FBG) or other fiber optic sensor, and the first fiber optic sensor 21 is adapted to Measure body temperature, blood pressure, strain or pressure. One end of the first fiber optic sensor 21 is disposed in the first groove portion 110 of the first substrate 11 and is stacked on the first substrate 11 by using the second substrate 12 . The other end of the first fiber optic sensor 21 is coupled to a fiber optic sensing system or other system.

Referring to FIGS. 2 and 3 again, for example, the second substrate 12 is made of a polymer organic bismuth compound, and the polymer has The material of the organic compound is preferably selected from the group consisting of polydimethylsiloxane (PDMS). The surface of the second substrate 12 has a second groove portion (for example, a long groove or other shaped groove) 120. When assembled, the second substrate 12 is stacked on the first substrate 11 such that the first fiber sensor 21 is buried between the upper surface of the first substrate 11 and the lower surface of the second substrate 12.

Referring to FIGS. 2 and 3 again, for example, the second fiber optic sensor 22 is selected from a fiber Bragg grating (FBG) or other fiber optic sensor, and the second fiber optic sensor 22 is adapted to Measure body temperature, blood pressure, strain or pressure. One end of the second fiber optic sensor 22 is disposed in the second groove portion 120 of the second substrate 12 and is stacked on the second substrate 12 by using the third substrate 13 . The other end of the second fiber optic sensor 22 is coupled to a fiber optic sensing system or other system.

Referring to FIGS. 2 and 3, for example, the third substrate 13 is made of a polymer organic bismuth compound, and the polymer organic bismuth compound material is preferably selected from the group consisting of polydimethyl siloxane. [PDMS]. The surface of the third substrate 13 has a third groove portion (for example, a long groove or other shaped groove) 130. When assembled, the third substrate 13 is stacked on the second substrate 12 such that the second fiber sensor 22 is buried between the upper surface of the second substrate 12 and the lower surface of the third substrate 13.

Referring to FIGS. 2 and 3 again, for example, the third fiber sensor 23 is selected from a fiber Bragg grating (FBG) or other fiber sensor, and the third fiber sensor 23 is suitable for Measure body temperature, blood pressure, blood concentration, refractive index, strain or pressure. One end of the third fiber optic sensor 23 is disposed in the third groove portion 130 of the third substrate 13 and is stacked on the third substrate 13 by using the fourth substrate 14 . The other end of the third fiber optic sensor 23 is coupled to a fiber optic sensing system or other system.

Referring to FIGS. 2 and 3 again, for example, the fourth substrate 14 is made of a polymer organic germanium compound material, and the polymer has The material of the organic compound is preferably selected from the group consisting of polydimethylsiloxane (PDMS). The fourth substrate 14 has an opening portion 141. When assembled, the fourth substrate 14 is stacked on the third substrate 13, such that the third fiber sensor 23 is located between the upper surface of the third substrate 13 and the lower surface of the fourth substrate 14 to form a Three-layer fiber optic sensor construction 1. In addition, one end of the third fiber sensor 23 is exposed in the opening portion 141 of the fourth substrate 14 to allow dropping of the sample to be detected.

Fig. 4 is a perspective view showing a three-dimensional combination of the configuration of the optical fiber sensor of the second preferred embodiment of the present invention, which discloses a two-layer architecture. Referring to Figure 4, with respect to the first embodiment, the fiber optic sensor configuration of the second preferred embodiment of the present invention is selected to form a dual layer fiber optic sensor configuration 1'.

Fig. 5 is a perspective view showing a three-dimensional combination of the configuration of the optical fiber sensor of the third preferred embodiment of the present invention, which discloses another two-layer architecture. Referring to FIG. 5, with respect to the second embodiment, the fiber optic sensor configuration of the third preferred embodiment of the present invention is selected to form another dual layer fiber optic sensor configuration 1".

The foregoing preferred embodiments are merely illustrative of the invention and the technical features thereof, and the techniques of the embodiments can be carried out with various substantial equivalent modifications and/or alternatives; therefore, the scope of the invention is subject to the appended claims. The scope defined by the scope shall prevail. The copyright limitation of this case is used for the purpose of patent application in the Republic of China.

11‧‧‧First substrate

110‧‧‧First groove

12‧‧‧second substrate

120‧‧‧second groove

13‧‧‧ Third substrate

130‧‧‧ Third groove

14‧‧‧fourth substrate

141‧‧‧ openings

21‧‧‧First fiber optic sensor

22‧‧‧Second fiber optic sensor

23‧‧‧ Third Fiber Sensor

Claims (10)

A method for manufacturing a fiber optic sensor, comprising: forming a predetermined film by using a pedestal, and converting the predetermined film into a predetermined molding structure; forming a first substrate layer by using the pedestal, and Forming the molding structure, so that the first substrate layer forms a groove structure; placing a fiber sensor into the groove structure of the first substrate layer; and covering the first substrate layer with a second substrate layer so as to The package forms a fiber optic sensor construction. The method for manufacturing a fiber optic sensor according to claim 1, further comprising: pre-cleaning the susceptor before forming the predetermined film. The method of manufacturing a fiber optic sensor according to claim 1, further comprising: coating a photoresist material on the susceptor to form the predetermined film. The optical fiber sensor manufacturing method according to claim 3, wherein the coating of the photoresist material is formed by spin coating to form the predetermined film, and the predetermined molding structure of the predetermined film is formed after exposure and development. The method for manufacturing a fiber optic sensor according to claim 1, further comprising: surface modifying the first substrate layer by corona. A fiber optic sensor structure comprising: a first substrate having a first groove portion; a first fiber optic sensor disposed in the first groove portion of the first substrate; a second substrate The second substrate is stacked on the first substrate; a second fiber sensor is disposed in the second groove portion of the second substrate; and a third substrate is disposed. Stacked on the second substrate; the first fiber sensor is embedded between the first substrate and the second substrate, and the second fiber sensor is embedded in the second substrate and the third substrate Between so as to form a two-layer fiber optic sensor construction. The optical fiber sensor structure according to claim 6, wherein the first substrate, the second substrate and the third substrate are made of a polymer organic germanium compound material. The fiber optic sensor construction of claim 6, wherein the first fiber optic sensor and the second fiber optic sensor are selected from a fiber Bragg grating. The optical fiber sensor structure of claim 6, wherein the third substrate has a third groove portion, and a third fiber sensor is disposed in the third groove portion of the third substrate. A fourth substrate is then stacked on the third substrate to form a three-layer fiber sensor configuration. The optical fiber sensor structure of claim 6, wherein the third substrate has an opening portion for exposing the second fiber optic sensor to the opening.