TWI511626B - Complex circuit board and the manufacturing method thereof - Google Patents

Description

Composite circuit board and manufacturing method thereof

The present invention relates to a circuit board and a method of fabricating the same, and more particularly to a composite circuit board and a method of fabricating the same.

In general, electronic components such as a microprocessor and an antenna are disposed on a circuit board of a communication device. The electronic components are connected by a circuit board to carry out data transmission.

Because the amount of data to be transferred between electronic components is different, the number of lines between electronic components will be different, that is, the distribution density of the wiring on the circuit board is uneven, for example, the microprocessor handles most data transmission and control actions. Therefore, the wiring area of the microprocessor line area is very large so that a large amount of data can be processed, and the wiring density of the line area of the antenna is relatively low.

As the functionality of microprocessors and the variety of electronic components on the board increase, the number of lines between microprocessors or other electronic components increases, allowing more data to be processed, resulting in increased wiring density. However, because the area of the circuit area on the board is fixed, when the line density exceeds a certain limit, more layers of boards must be used to complete the line layout.

However, not all of the boards require high wiring density. If the board is replaced by a larger number of boards, such as a six-layer board or an eight-layer board, the manufacturing cost will increase and the manufacturing process will be more complicated.

The present invention provides a composite circuit board that provides different layers of circuit layers on a circuit board to meet the needs of the circuit layout of various electronic components, and to simplify the process and reduce the cost.

The present invention provides a method of manufacturing a composite circuit board that can produce the above-described composite circuit board.

The invention provides a composite circuit board comprising two first cladding layers, a plurality of sub-circuit boards and a first connection line. The sub-circuit boards are sandwiched between two first cladding layers which are side by side and separated from each other, and the two first cladding layers are joined to each other at positions other than the sub-circuit boards. The first connection line is located on at least one of the two first cladding layers and is electrically connected to the sub-circuit boards.

The invention further provides a method for manufacturing a composite circuit board, comprising providing a plurality of sub-circuit boards. These sub-circuit boards are sandwiched using two first semi-cured layers, wherein the sub-circuit boards are side by side and separated from each other. The two first semi-cured layers are cured to form two first cladding layers, wherein the two first cladding layers are joined to each other at locations other than the sub-circuit boards. Forming a first connection line on at least one of the two first cladding layers to electrically connect the sub-circuit boards.

Based on the above, the composite circuit board of the present invention and the method of manufacturing the same utilize a plurality of sub-circuit boards and a first connection line on the first cladding layer to provide the composite circuit board with a plurality of layers of circuit layers to respond to various The need for line layout of different electronic components. In addition, since the composite circuit board does not need to have a high wiring density as a whole, the process can be simplified and the cost can be reduced.

The above described features and advantages of the present invention will be more apparent from the following description.

The invention provides a composite circuit board. 1A is a side elevational view of a composite circuit board in accordance with an embodiment of the present invention.

Referring to FIG. 1A , the composite circuit board 100 of the present embodiment includes two first cladding layers 110 , a plurality of sub-circuit boards 120 , and a first connection line 130 . The sub-circuit boards 120 are sandwiched between two first cladding layers 110 which are side by side and separated from each other, and the two first cladding layers 110 are joined to each other at positions other than the sub-circuit boards 120. The first connection line 130 is located on at least one of the two first cladding layers 110 and is electrically connected to the sub-circuit boards 120.

In this embodiment, the sub-circuit boards 120 are respectively different number of layers of circuit boards. The sub-board 120 includes a two-layer board 122, a four-layer board 124, and a six-layer board 126. Of course, the number of layers of the sub-board 120 is not limited thereto. In addition, the first connection line 130 of the embodiment includes two first circuit layers 132 respectively located on the two first cladding layers 110.

1B is a schematic cross-sectional view of the composite circuit board of FIG. 1A. Referring to FIG. 1B, each sub-board 120 is composed of a plurality of second wiring layers 128 and at least one insulating layer 129 for isolating the second wiring layers 128. In the present embodiment, the material of the insulating layer 129 is different from the material of the first cladding layer 110. However, in other embodiments, the insulating layer 129 and the first cladding layer 110 may have the same material.

Further, in the present embodiment, a depressed portion 150 is formed on the surface of the composite circuit board 100 to lower the height of a portion of the composite circuit board 100. The recess 150 may correspond to the outline of the housing in which the composite circuit board 100 is placed, or may be placed for electronic components to reduce the overall height. In the embodiment, the composite circuit board 100 can form the recess 150 on the surface of the first cladding layer 110 through the mold, or can form the recess 150 by digging the surface of the first cladding layer 110. . In addition, although the recessed portion 150 is located at the edge of the composite circuit board 100 in FIG. 1B, the recessed portion 150 may also be located between the sub-circuit boards 120 (as shown in FIG. 2). In the embodiment of FIG. 2, the composite type The two first cladding layers 110 of the circuit board 100b cover the sub-circuit boards 120 up and down and are recessed between the two adjacent sub-circuit boards 120 to form the recesses 150. In other words, as shown in FIG. 2, the orthographic projection of the recess 150 and the orthographic projection of the sub-boards 120 do not overlap. In manufacturing, the position and number of recesses 150 required on the surface of the composite circuit board 100b of view 2 can be selected to select a suitable mold. The mold (not shown) may have a plurality of protrusions corresponding to the recesses 150 of the composite circuit board 100b, so that the first cladding layer 110 can form a desired number of depressions at a specific position when being formed. Department 150. Of course, the position, the number, and the manner in which the recesses 150 are formed are not limited to the above.

1C is a top plan view of the composite circuit board of FIG. 1A. Referring to FIG. 1A and FIG. 1C, the composite circuit board 100 has a plurality of mutually independent functional areas 140, which respectively correspond to different functional areas 140, so that the functional areas 140 can provide different layers of lines. layout. The functional area 140 of the composite circuit board 100 of the present embodiment has a first functional area 142, a second functional area 144, a third functional area 146 and a fourth functional area 148 to provide two layers and four layers. Six and eight floor layouts, It can meet the needs of the circuit layout of various electronic components.

The number of circuit layers of the sub-board 120 can be adjusted with the configured electronic components. For example, the circuit layout of the microprocessor may require the use of an eight-layer board, and the antenna layout requires only two layers. Manufacturers can first consider the line requirements of each electronic component and plan the line area of each electronic component to configure the appropriate sub-board.

3 is a side elevational view of a composite circuit board in accordance with another embodiment of the present invention. Referring to FIG. 3, the composite circuit board 200 of the embodiment of FIG. 3 further includes two second cladding layers 260 and a second connection line 270.

The sub-circuit layer 220 and the first cladding layer 210 are sandwiched between the two second cladding layers 260. The second connection line 270 includes two third circuit layers 272 respectively located on the two second cladding layers 260 and electrically connected to the sub-circuit boards 220 and the first connection lines 232. The composite circuit board 200 of FIG. 3 has two more third circuit layers 272 than the composite circuit board 100 of FIG. 1A, providing more layers of circuitry for layout.

In this embodiment, the sub-circuit boards 220 include a two-layer board 222, a four-layer board 224, and a six-layer board 226. The electrical connection between the sub-circuit board 220 and the second connection line 270 is performed through the first connection line 230. The composite circuit board 200 has a plurality of mutually independent functional areas 240. The sub-circuit boards 220 respectively correspond to different functional areas 240. So that these functional areas 240 can provide different levels of line layout.

The functional area 240 of the composite circuit board 200 of the embodiment has a first functional area 242, a second functional area 244, a third functional area 246, and a The fourth functional area 248, therefore, the composite circuit board 200 can provide four, six, eight, and ten layers of line layout. The manufacturer can select the number of circuit layers of the sub-board 220, the corresponding position and the range size according to the wiring conditions required for the composite circuit board 200 to create a line layout conforming to each electronic component.

Of course, in other embodiments, the manufacturer can also use the sub-boards of the two-layer board, the four-layer board, the six-layer board, and the eight-layer board to form the four-layer, six-layer, and eight-layer layers together with the first connection line. And ten floors of the layout. That is, the manufacturer can adjust the number of layers of the sub-board and the connection line to achieve the same result.

4 is a flow chart showing a method of fabricating a composite circuit board in accordance with an embodiment of the present invention. Referring to FIG. 4, the manufacturing method 300 of the composite circuit board of this embodiment is as follows. First, a plurality of sub-boards are provided (step 310).

Next, the sub-circuit boards are sandwiched using two first semi-cured layers (step 320), wherein the sub-circuit boards are side by side and separated from each other. In this embodiment, the first semi-cured layer is a prepreg, but the type of the first semi-cured layer is not limited thereto. Since the first semi-cured layer has fluidity, it can completely fill the gap between the sub-circuit boards. When the number of layers of these sub-boards is different and the thickness is different, selecting the first semi-cured layer of appropriate thickness will completely fill the gap between the sub-circuit boards.

Further, the two first semi-cured layers are cured to form two first cladding layers (step 330), wherein the two first cladding layers are joined to each other at locations other than the sub-circuit boards. Since the two first semi-cured layers have fluidity, FIG. 1A The medium composite circuit board 100 is thick. In more detail, taking FIG. 1A as an example, the thickness of the two first cladding layers of the composite circuit board 100 at the portions other than the sub-circuit boards is the largest, and secondly, the first cladding layer 110 covers the two-layer board 122. The portion is, in turn, the portion where the first cladding layer 110 covers the four-layer panel 124, and the thickness of the portion of the first cladding layer 110 covering the six-layer panel 126 is the smallest.

Finally, a first connection line is formed on at least one of the two first cladding layers to electrically connect the sub-circuit boards (step 340). In this embodiment, the first connection line may be formed on the first cladding layer using a lamination process or a built-up process. Of course, the method of forming the first connection line on the first cladding layer is not limited to the above.

If the outline of the casing in which the composite circuit board 100 is placed is limited to the height of a portion of the composite circuit board 100, or the electronic components are disposed on the composite circuit board 100, the overall height is limited. After step 340, a recess can be formed on the surface of the composite circuit board to fabricate the composite circuit board 100 of FIG. 1A, wherein the recess can be used to conform to the outline of the casing or to carry electronic components.

In addition, if the composite circuit board 200 of FIG. 3 is to be fabricated, after the step 340, the two first cladding layers may be sandwiched by the two second semi-cured layers. Next, the two second semi-cured layers are cured to form two second cladding layers. Finally, a second connection line is formed on at least one of the two second cladding layers to electrically connect the sub-circuit boards and the first connection lines to form the composite circuit board 200. In this embodiment, the second semi-cured layer is a prepreg, but the type of the second semi-cured layer is not limited thereto.

Since the number of circuit layers required for each electronic component is different, the manufacturer can Each of the electronic components disposed on the composite circuit board is selected to have a suitable number of sub-boards and connection lines to fabricate the composite circuit board of the present invention.

In summary, the composite circuit board of the present invention utilizes a plurality of sub-circuit boards and connection lines on the cladding layer so that the composite circuit board can provide a plurality of layers of line layout. The composite circuit board of the present invention has the advantages of cost saving and simplification of the process, compared to conventional electronic boards that require a large number of circuit layers, such as a microprocessor, and a circuit board having a larger number of layers.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

100, 100b‧‧‧Composite circuit board

110‧‧‧First coating

120‧‧‧Sub Board

122‧‧‧Two-layer board

124‧‧‧ four-layer board

126‧‧‧Six-layer board

128‧‧‧Second circuit layer

129‧‧‧Insulation

130‧‧‧First connection line

132‧‧‧First circuit layer

140‧‧‧Functional area

142‧‧‧First functional area

144‧‧‧Second functional area

146‧‧‧ third functional area

148‧‧‧Fourth functional area

150‧‧‧Depression

200‧‧‧Composite board

210‧‧‧First coating

220‧‧‧Sub Board

222‧‧‧Two-layer board

224‧‧‧ four-layer board

226‧‧‧Six-layer board

230‧‧‧First connection line

232‧‧‧First line layer

240‧‧‧ functional area

242‧‧‧First functional area

244‧‧‧Second functional area

246‧‧‧ third functional area

248‧‧‧Fourth functional area

260‧‧‧second coating

270‧‧‧Second connection line

272‧‧‧ third circuit layer

300‧‧‧Manufacturing method of composite circuit board

310 to 340‧‧ steps

1A is a side elevational view of a composite circuit board in accordance with an embodiment of the present invention.

1B is a schematic cross-sectional view of the composite circuit board of FIG. 1A.

1C is a top plan view of the composite circuit board of FIG. 1A.

2 is a cross-sectional view of a composite circuit board in accordance with another embodiment of the present invention.

3 is a side elevational view of a composite circuit board in accordance with another embodiment of the present invention.

4 is a flow chart showing a method of fabricating a composite circuit board in accordance with an embodiment of the present invention.

100‧‧‧Composite board

110‧‧‧First coating

120‧‧‧Sub Board

122‧‧‧Two-layer board

124‧‧‧ four-layer board

126‧‧‧Six-layer board

130‧‧‧First connection line

132‧‧‧First circuit layer

140‧‧‧Functional area

142‧‧‧First functional area

144‧‧‧Second functional area

146‧‧‧ third functional area

148‧‧‧Fourth functional area

Claims (14)

A composite circuit board comprising: two first cladding layers; a plurality of sub-circuit boards sandwiched between the two first cladding layers, the sub-circuit boards being side by side and separated from each other, and the two first coatings The cladding layers are bonded to each other at positions other than the sub-circuit boards, wherein the sub-circuit boards are respectively different number of circuit boards; a first connection line is located on at least one of the two first cladding layers, and Electrically connected to the sub-circuit boards; and a recess formed on a surface of the composite circuit board, the orthographic projection of the recesses and the orthographic projections of the sub-circuit boards do not overlap, wherein the composite circuit board has A plurality of mutually independent functional areas, the sub-circuit boards respectively corresponding to different functional areas, to provide different layer layouts for the functional areas. The composite circuit board of claim 1, wherein the first connection line comprises two first circuit layers respectively located on the two first cladding layers. The composite circuit board of claim 1, wherein each of the sub-circuit boards comprises a plurality of second circuit layers and at least one insulating layer for isolating the second circuit layers. The composite circuit board of claim 3, wherein each of the insulating layers is different in material from the two first cladding layers. For example, the composite circuit board described in claim 1 of the patent scope further includes: Two second covering layers and a second connecting line, the sub-circuit boards and the two first covering layers are sandwiched between the two second covering layers, and the second connecting lines are located at the two second layers At least one of the cladding layers is electrically connected to the sub-circuit boards and the first connection line. The composite circuit board of claim 5, wherein the second connecting line comprises two third circuit layers respectively located on the two second covering layers. A method for manufacturing a composite circuit board, comprising: providing a plurality of sub-circuit boards, each of which is a different number of circuit boards; and the two sub-hard layers are used to sandwich the sub-circuit boards, wherein the sub-boards are The circuit boards are side by side and separated from each other; the two first semi-cured layers are cured to form two first cladding layers, wherein the two first cladding layers are joined to each other at positions other than the sub-circuit boards; forming a first connection line And electrically connecting the sub-boards on at least one of the two first cladding layers; and forming a recess on the surface of the composite circuit board, the orthographic projection of the recesses and the sub-boards The orthographic projections do not overlap, wherein the composite circuit board has a plurality of mutually independent functional areas, and the sub-circuit boards respectively correspond to different functional areas to provide different layer layouts for the functional areas. The method of manufacturing a composite circuit board according to claim 7, wherein the first connection line comprises two first circuit layers respectively located on the two first cladding layers. The method of manufacturing a composite circuit board according to claim 7, wherein each of the sub-circuit boards comprises a plurality of second circuit layers and at least one insulating layer for isolating the second circuit layers. The method of manufacturing a composite circuit board according to claim 9, wherein each of the insulating layers is different in material from the two first cladding layers. The method of manufacturing a composite circuit board according to claim 7, wherein each of the first semi-cured layers is a prepreg. The method of manufacturing a composite circuit board according to claim 7, wherein when forming a first connecting line on at least one of the two first covering layers, the method comprises: using a lamination process or A built-up process forms the first connection line on at least one of the two first cladding layers. The method for manufacturing a composite circuit board according to claim 7, further comprising: sandwiching the two first coating layers by using two second semi-cured layers; curing the two second semi-cured layers to form two second a coating layer; and forming a second connection line on the at least one of the two second cladding layers to electrically connect the sub-circuit boards and the first connection line. The method of manufacturing a composite circuit board according to claim 13, wherein the second connecting line comprises two third circuit layers respectively located on the two second covering layers.