TWI509268B - Double-feed circuit board testing method and system - Google Patents
Double-feed circuit board testing method and system Download PDFInfo
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Description
本發明係關於一種電路板檢測方法及其系統，更特別的是關於一種由單進料可直接升級為雙進料之電路板檢測方法及其系統。The present invention relates to a circuit board detecting method and system thereof, and more particularly to a circuit board detecting method and system thereof that can be directly upgraded from a single feed to a double feed.
基於光電業及電子業對於生產線速度的要求亦日漸嚴苛，品質檢測所耗用的時間成本就顯得相當重要。Based on the optoelectronics industry and the electronics industry, the requirements for line speed are becoming more stringent, and the time cost of quality inspection is very important.
一般來說，用以檢測電子元件之外觀及表面瑕疵的技術可藉由自動化光學檢測技術(Automatic Optical Inspection, AOI)來達成，透過此一技術不僅可在電子產品的製作流程中做為終端產品的品管，也能協助製程監控，以及早採取補救的措施。In general, the technology for detecting the appearance and surface defects of electronic components can be achieved by Automated Optical Inspection (AOI), which can be used as a terminal product in the production process of electronic products. The quality control can also assist with process monitoring and early remedial measures.
然而，目前的自動光學檢測系統在機台可接納的電路板尺寸下皆是以單片進料方式進行檢測，無論在可接納尺寸範圍內的最大或最小尺寸下之待測電路板，皆是被以單片進料的方式來送檢。當某批欲送檢之待測電路板之尺寸係屬於較小的情況時，檢測系統仍以符合最大尺寸下之檢測規格對該小尺寸之待測電路板進行檢測即會產生成本上的浪費且無法有效提高檢測速度及檢測量，更使得檢測系統的使用效益低落。However, current automated optical inspection systems are tested in a single-chip feed format at board-receivable board sizes, regardless of the maximum or minimum size of the board under the acceptable size range. It is sent for inspection in a single piece. When the size of a certain circuit board to be inspected for inspection is a small one, the detection system still detects the small-sized circuit board to be tested according to the detection specification of the maximum size, which is wasteful in cost. Moreover, the detection speed and the detection amount cannot be effectively improved, and the use efficiency of the detection system is lowered.
本發明之一目的在於倍增既有之電路板檢測系統的檢測量。One of the objects of the present invention is to multiply the amount of detection of an existing circuit board inspection system.
本發明之另一目的在於提高檢測系統的使用效益。Another object of the present invention is to improve the use efficiency of the detection system.
為達上述目的及其他目的，本發明提出一種雙進料之電路板檢測方法，係應用於具有一影像擷取裝置及藉由該影像擷取裝置擷取具有一預定寬度之待測電路板的單進料檢測系統，該電路板檢測方法包含：於進料區堆疊兩堆經篩選的第一堆待測電路板及第二堆待測電路板，該兩堆待測電路板係相隔一預定距離；自該兩堆待測電路板各提取一待測電路板置放於該檢測系統之輸送帶上，且基於該預定距離係使該二待測電路板於該輸送帶上彼此具有一間隔；該影像擷取裝置擷取該二待測電路板的影像以產生一檢測影像資料；及基於該預定距離的資訊，將該檢測影像資料分割為分別對應該二待測電路板的第一檢測結果及第二檢測結果，其中，經篩選的該兩堆待測電路板係用於使位於該輸送帶上的該二待測電路板的寬度總和加上該預定距離係小於該預定寬度。In order to achieve the above and other objects, the present invention provides a method for detecting a dual-feed circuit board, which is applied to an image capturing device and the image capturing device having a predetermined width is obtained by the image capturing device. The single feed detection system, the circuit board detection method comprises: stacking two piles of the screened first pile of the circuit board to be tested and the second pile of the circuit board to be tested in the feeding area, the two piles of the circuit board to be tested are separated by a predetermined a distance from each of the two stacks of circuit boards to be tested is placed on a conveyor belt of the detection system, and based on the predetermined distance, the two boards to be tested have a space on the conveyor belt The image capturing device captures the image of the two boards to be tested to generate a detection image data; and based on the information of the predetermined distance, the detection image data is divided into first detections corresponding to the two boards to be tested respectively And a result of the second detection, wherein the two stacked circuit boards to be tested are used to add a sum of widths of the two circuit boards to be tested on the conveyor belt to the predetermined distance.
為達上述目的及其他目的，本發明復提出一種雙進料之電路板檢測系統，係應用於具有一影像擷取裝置及藉由該影像擷取裝置擷取具有一預定寬度之待測電路板的單進料檢測系統，該電路板檢測系統包含：一進料區堆疊裝置，係設置一定位靠邊板以將進料區分為兩區域，用以供兩堆經篩選的第一堆待測電路板及第二堆待測電路板置放，並用於使該兩堆待測電路板係相隔一預定距離；一進料提取裝置，係用於自該進料區之該兩堆待測電路板各提取一待測電路板置放於該檢測系統之輸送帶上，且基於該預定距離係使該二待測電路板於該輸送帶上彼此具有一間隔；及一檢測結果產生裝置，係連接該影像擷取裝置以接收所擷取產生的一檢測影像資料，並用於基於該預定距離的資訊，將該檢測影像資料分割為分別對應該二待測電路板的第一檢測結果及第二檢測結果，其中，經篩選的該兩堆待測電路板係用於使位於該輸送帶上的該二待測電路板的寬度總和加上該預定距離係小於該預定寬度。To achieve the above and other objects, the present invention provides a dual-input circuit board inspection system for use in an image capture device and by the image capture device to capture a circuit board having a predetermined width. The single feed detection system, the circuit board detection system comprises: a feed zone stacking device, which is provided with a positioning edge plate to divide the feed into two regions for two piles of screened first piles of circuit to be tested The board and the second stack of circuit boards to be tested are placed and used to separate the two stacks of circuit boards to be tested by a predetermined distance; a feed extracting device is used for the two stacks of circuit boards to be tested from the feeding area Each of the circuit boards to be tested is placed on the conveyor belt of the detection system, and the two circuit boards to be tested have an interval on the conveyor belt based on the predetermined distance; and a detection result generating device is connected The image capturing device receives a detected image data generated by the captured image, and is configured to divide the detected image data into corresponding first detection results and second inspections respectively corresponding to the second circuit board to be tested based on the information of the predetermined distance As a result, wherein the circuit board through the piles in the screening test for the sum of the widths of the two test board positioned on the conveyor system plus the predetermined distance is less than the predetermined width.
為達上述目的及其他目的，本發明再提出一種雙進料之電路板檢測系統，係應用於具有一影像擷取裝置及藉由該影像擷取裝置擷取具有一預定寬度之待測電路板的單進料檢測系統，該單進料檢測系統並具有一輸送帶、一進料區堆疊裝置及一檢測結果產生裝置，其特徵在於：該進料區堆疊裝置係設置一定位靠邊板以將進料區分為兩區域，用以供兩堆經篩選的第一堆待測電路板及第二堆待測電路板置放，並用於使該兩堆待測電路板係相隔一預定距離，該檢測結果產生裝置係連接該影像擷取裝置以接收所擷取產生的一檢測影像資料，並用於藉由該預定距離的資訊，將該檢測影像資料分割為分別對應該輸送帶上之二待測電路板的第一檢測結果及第二檢測結果，其中經篩選的該兩堆待測電路板係用於使該二待測電路板的寬度總和加上該預定距離係小於該預定寬度。In order to achieve the above and other objects, the present invention further provides a dual-input circuit board detecting system for use in an image capturing device and for capturing a circuit board having a predetermined width by the image capturing device. Single feed detection system, the single feed detection system has a conveyor belt, a feed zone stacking device and a test result generating device, wherein the feed zone stacking device is provided with a positioning edge plate to The feed is divided into two regions for placing two sets of the screened first stack of the circuit board to be tested and the second stack of the circuit board to be tested, and for separating the two stacks of the circuit boards to be tested by a predetermined distance. The detection result generating device is connected to the image capturing device to receive a detected image data generated by the capturing, and is used for dividing the detected image data into two corresponding to be tested on the conveyor belt by the information of the predetermined distance. a first detection result of the circuit board and a second detection result, wherein the two piles of the circuit board to be tested are used to increase the total width of the two circuit boards to be tested plus the predetermined distance is less than the predetermined Degree.
於本發明之一實施例中，該預定距離係相等於該間隔。In an embodiment of the invention, the predetermined distance is equal to the interval.
於本發明之一實施例中，該兩堆待測電路板之不同堆間的電路板寬度值係互相相等。In an embodiment of the invention, the board width values between the different stacks of the two stacks of circuit boards to be tested are equal to each other.
於本發明之一實施例中，該影像擷取裝置包含至少一影像擷取器，該至少一影像擷取器係配置來擷取可涵蓋該預定寬度的影像資料。In an embodiment of the invention, the image capturing device includes at least one image capturing device configured to capture image data that can cover the predetermined width.
於本發明之一實施例中，該影像擷取裝置包含二影像擷取器，該二影像擷取器係配置來擷取可涵蓋該預定寬度的影像資料。In an embodiment of the invention, the image capturing device includes two image capturing devices configured to capture image data that can cover the predetermined width.
藉此，本發明藉由對於進料區之兩堆堆疊之待測電路板間之預定距離的設定，以及待測電路板之寬度總和的篩選，使得原本僅用於單進料的檢測系統僅需改變進料區之配置及檢測影像資料的辨識規則，進而無須改變其他裝置即可直接升級成雙進料的檢測系統，不但可使進料量倍增更可大幅縮減整批待測電路板所需的檢測時間，進一步地更可使檢測系統的使用效益大幅提高。Thereby, the present invention makes the detection system originally used only for single feed only by setting the predetermined distance between the boards to be tested stacked in the two stacks of the feed zone and the sum of the widths of the boards to be tested. It is necessary to change the configuration of the feed zone and the identification rules of the detected image data, so that it can be directly upgraded into a double feed detection system without changing other devices, which not only can double the feed amount, but also greatly reduce the entire batch of circuit boards to be tested. The required detection time further enhances the use efficiency of the detection system.
為充分瞭解本發明之目的、特徵及功效，茲藉由下述具體之實施例，並配合所附之圖式，對本發明做一詳細說明，說明如後：In order to fully understand the objects, features and advantages of the present invention, the present invention will be described in detail by the following specific embodiments and the accompanying drawings.
本發明係藉由對既有之電路板檢測系統進行最小幅度的設定與更改來達到最大的效益提升。The present invention achieves maximum benefit by minimally setting and changing existing circuit board inspection systems.
首先請參閱第1及2圖，第1圖係為本發明一實施例中之電路板檢測方法的流程圖，第2圖係為本發明一實施例中之電路板檢測系統的系統示意圖。既有之電路板檢測系統係包含：進料區堆疊裝置100、進料提取裝置200、輸送帶300、影像擷取裝置400及檢測結果產生裝置500。電路板檢測系統係搭載有一影像擷取裝置400，用以勝任各種尺寸之電路板的檢測，該影像擷取裝置400依檢測系統的檢測能力而可分為具有單一影像擷取器、兩個影像擷取器、或多於兩個之影像擷取器的影像擷取裝置400，一般來說係採用具有兩個影像擷取器401、402的影像擷取裝置400(可參閱第3圖)，然本發明亦可應用於包含單個或三個以上之影像擷取器的檢測系統。First, please refer to FIG. 1 and FIG. 2, FIG. 1 is a flowchart of a circuit board detecting method according to an embodiment of the present invention, and FIG. 2 is a system diagram of a circuit board detecting system according to an embodiment of the present invention. The existing circuit board inspection system includes a feed zone stacking device 100, a feed extracting device 200, a conveyor belt 300, an image capturing device 400, and a detection result generating device 500. The circuit board detection system is equipped with an image capturing device 400 for performing detection of circuit boards of various sizes. The image capturing device 400 can be divided into a single image capturing device and two images according to the detection capability of the detection system. The image capturing device 400 of the image capturing device or the image capturing device having two image capturing devices 401 and 402 is generally used (see FIG. 3). However, the invention is also applicable to detection systems comprising single or more than three image capture devices.
首先，步驟S101：於進料區堆疊兩堆待測電路板，且相隔一預定距離。接著，步驟S103：自該兩堆待測電路板各提取一待測電路板置放於該檢測系統之輸送帶上。接著，步驟S105：擷取該二待測電路板的影像以產生一檢測影像資料。接著，步驟S107：將該檢測影像資料分割為分別對應該二待測電路板的第一檢測結果及第二檢測結果。First, in step S101, two stacks of circuit boards to be tested are stacked in the feeding zone and separated by a predetermined distance. Next, in step S103, a circuit board to be tested is extracted from the two stacks of circuit boards to be tested and placed on the conveyor belt of the detection system. Next, in step S105, the images of the two boards to be tested are captured to generate a detected image data. Next, in step S107, the detected image data is divided into a first detection result and a second detection result respectively corresponding to the two boards to be tested.
接著將以具有兩個影像擷取器之影像擷取裝置的示例搭配圖式來做說明，請同時參閱第1及3圖，第1圖係為本發明一實施例中之電路板檢測方法的流程圖，第3圖係為本發明另一實施例中具二影像擷取器之電路板檢測系統的系統示意圖。本實施例係以應用於具有二影像擷取器(第一影像擷取器401、第二影像擷取器402)的單進料檢測系統為示例，用於擷取具有一預定寬度W之待測電路板PCB(可參閱第4A圖)的影像資料。所謂具有該預定寬度W之待測電路板PCB係指既有之單進料檢測系統所能檢測之最大寬度(即該預定寬度W)的電路板，該預定寬度W的長度位置即如圖所示。Next, an example of an image capturing device having two image capturing devices will be described with reference to the drawings. Please refer to FIGS. 1 and 3 together. FIG. 1 is a circuit board detecting method according to an embodiment of the present invention. Flowchart, FIG. 3 is a schematic diagram of a system for detecting a circuit board with two image capture devices according to another embodiment of the present invention. This embodiment is applied to a single feed detection system having two image capture devices (the first image capture device 401 and the second image capture device 402) for capturing a predetermined width W. Measure the image data of the PCB (see Figure 4A). The circuit board PCB to be tested having the predetermined width W refers to a circuit board of a maximum width (ie, the predetermined width W) that can be detected by the existing single feed detection system, and the length position of the predetermined width W is as shown in the figure. Show.
同樣地，首先，步驟S101：於進料區堆疊兩堆待測電路板，且相隔一預定距離。Similarly, first, in step S101, two stacks of circuit boards to be tested are stacked in the feeding zone and separated by a predetermined distance.
此步驟係在進料區堆疊裝置100之進料區堆疊兩堆經篩選過的第一堆待測電路板PCB1及第二堆待測電路板PCB2，該兩堆待測電路板係相隔一預定距離PD。該進料區堆疊裝置100係藉由一定位靠邊板102來將進料區分為兩區域，用以供兩堆經篩選的第一堆待測電路板PCB1及第二堆待測電路板PCB2置放，並使其相隔該預定距離PD。該預定距離PD係用於供後續之影像資料判斷上的依據，以分割出兩待測電路板PCB1、PCB2個別的影像資料，該預定距離PD係可根據所搭配之影像擷取器的攝像解析能力來決定該預定距離PD的長短，同樣地，該預定距離PD亦會影響著雙進料時可供進料之待測電路板的尺寸，於後續將有更詳細的說明。In this step, two sets of the screened first stack of circuit board PCB1 and the second board to be tested PCB2 are stacked in the feeding area of the feeding zone stacking device 100, and the two stacks of the circuit boards to be tested are separated by a predetermined schedule. Distance PD. The feeding zone stacking device 100 divides the feeding into two regions by a positioning edge plate 102 for supplying two piles of the screened first stack of the circuit board to be tested PCB1 and the second stack of the circuit board to be tested PCB2. Release and separate them by the predetermined distance PD. The predetermined distance PD is used for judging the subsequent image data to segment the image data of the two PCBs to be tested, PCB1 and PCB2, and the predetermined distance PD can be imaged according to the image capturing device of the matched image. The ability to determine the length of the predetermined distance PD, similarly, the predetermined distance PD also affects the size of the circuit board to be tested for feeding during double feed, as will be described in more detail later.
接著，步驟S103：自該兩堆待測電路板各提取一待測電路板置放於該檢測系統之輸送帶上。Next, in step S103, a circuit board to be tested is extracted from the two stacks of circuit boards to be tested and placed on the conveyor belt of the detection system.
此步驟係進料提取裝置200自該兩堆待測電路板PCB1、PCB2各提取一待測電路板置放於該檢測系統之輸送帶300上，且基於該預定距離PD，該進料提取裝置200係使該二待測電路板PCB1、PCB2於該輸送帶300上彼此具有一間隔D。檢測系統之該進料提取裝置200通常係藉由複數真空吸嘴來提取待測電路板，因此該等真空吸嘴會均勻地遍佈在預設最大尺寸之可檢測電路板的面積上，因此，既有之進料提取裝置200係可對應用在小於該預設最大尺寸的電路板上。進一步地，縱然該進料提取裝置200會有震動等因素來影響其置放電路板在該輸送帶300上的位置，然較佳的情況係通過對該等因素的克服來使其穩定，進而使該預定距離PD相等於該間隔D，亦即該進料提取裝置200係維持該二待測電路板PCB1、PCB2於進料區堆疊裝置100上的相對距離並將其置放於運輸帶300上。In this step, the feed extraction device 200 extracts a circuit board to be tested from the two stacks of circuit boards PCB1 and PCB2, and places it on the conveyor belt 300 of the detection system, and based on the predetermined distance PD, the feed extraction device The 200 series causes the two circuit boards PCB1, PCB2 to have a space D on the conveyor belt 300. The feed extraction device 200 of the detection system generally extracts the circuit board to be tested by a plurality of vacuum nozzles, so that the vacuum nozzles are evenly distributed over the area of the detectable circuit board of the preset maximum size, therefore, The existing feed extraction device 200 can be applied to a circuit board that is smaller than the preset maximum size. Further, although the feed extraction device 200 may have vibration or the like to affect the position of the placement board on the conveyor belt 300, it is preferable to stabilize the factors by overcoming the factors. The predetermined distance PD is made equal to the interval D, that is, the feed extraction device 200 maintains the relative distance between the two circuit boards PCB1, PCB2 on the feed zone stacking device 100 and places it on the transport belt 300. on.
接著，步驟S105：擷取該二待測電路板的影像以產生一檢測影像資料。此步驟係該第一影像擷取器401、該第二影像擷取器402依據原設定(即最大可檢測尺寸)之擷取面積擷取該預定寬度W下之影像資料並產生一檢測影像資料。檢測系統之檢測能力係相關於電路板的寬度(可參閱本案第2-4圖的標示與定義)，至於電路板的長度(平面上垂直該寬度的方向)則不會影響既定檢測系統的檢測能力。Next, in step S105, the images of the two boards to be tested are captured to generate a detected image data. In this step, the first image capturing device 401 and the second image capturing device 402 capture the image data of the predetermined width W according to the captured area of the original setting (ie, the maximum detectable size) and generate a detected image data. . The detection capability of the detection system is related to the width of the board (refer to the markings and definitions in Figure 2-4 of this case). As for the length of the board (the direction perpendicular to the width on the plane), it will not affect the detection of the established inspection system. ability.
接著，步驟S107：將該檢測影像資料分割為分別對應該二待測電路板的第一檢測結果及第二檢測結果。此步驟係檢測結果產生裝置500藉由該預定距離PD的資訊，將該檢測影像資料分割為分別對應該二待測電路板PCB1、PCB2的第一檢測結果及第二檢測結果。Next, in step S107, the detected image data is divided into a first detection result and a second detection result respectively corresponding to the two boards to be tested. In this step, the detection result generating device 500 divides the detected image data into the first detection result and the second detection result respectively corresponding to the two circuit boards PCB1 and PCB2 to be tested by the information of the predetermined distance PD.
上述的檢測流程中，經篩選的該兩堆待測電路板係用於使位於該輸送帶300上的該二待測電路板PCB1、PCB2的寬度總和(PW1+PW2)加上該預定距離PD係小於該預定寬度W。In the above detection process, the two stacked circuit boards to be tested are used to add the total width (PW1+PW2) of the two circuit boards PCB1 and PCB2 located on the conveyor belt 300 to the predetermined distance PD. It is smaller than the predetermined width W.
接著請參閱第4A-4C圖，係為電路板檢測系統於各種待測電路板尺寸下的使用示意圖。Next, please refer to Figure 4A-4C, which is a schematic diagram of the use of the board inspection system under various circuit board sizes to be tested.
如第4A圖所示，其係檢測系統在檢測預設之最大尺寸(亦可稱之為最大檢測能力)下之電路板的示意圖。影像擷取裝置400之第一影像擷取器401及第二影像擷取器402的影像擷取寬度分別為C1及C2，其中，為確保檢測之影像資料能完整涵蓋具該預定寬度W之待測電路板PCB，其影像擷取寬度係會設計成有一小部分的重疊區，然熟悉該項技術者應了解的是在更精密的控制下亦可使該重疊區非常窄或甚至不需要。第4A圖之第一影像擷取器401及第二影像擷取器402係顯示了檢測系統所能檢測之最大寬度(即該預定寬度W)的電路板。As shown in FIG. 4A, it is a schematic diagram of a circuit board in which the detection system detects a preset maximum size (also referred to as maximum detection capability). The image capturing widths of the first image capturing device 401 and the second image capturing device 402 of the image capturing device 400 are respectively C1 and C2, wherein the image data to be detected can completely cover the predetermined width W. The circuit board PCB has an image capture width that is designed to have a small overlap area. Those skilled in the art should understand that under more precise control, the overlap area can be made very narrow or even unnecessary. The first image capturer 401 and the second image capturer 402 of FIG. 4A show a circuit board that detects the maximum width (ie, the predetermined width W) that the system can detect.
就影像擷取裝置400之影像擷取器數量來說，可配置至少一影像擷取器，該至少一影像擷取器擷取之整併在一起的的影像資料係必須涵蓋該預定寬度W，以確保檢測之影像資料能完整涵蓋具該預定寬度W之待測電路板PCB。For the number of image capture devices of the image capture device 400, at least one image capture device can be configured, and the image data collected by the at least one image capture device must cover the predetermined width W. In order to ensure that the detected image data can completely cover the circuit board PCB to be tested with the predetermined width W.
接著參閱第4B圖，係雙進料設計下之兩待測電路板PCB1、PCB2的示意圖，且該二待測電路板PCB1、PCB2的寬度PW1及PW2係為相同。由圖式可知在該檢測系統所能檢測之最大寬度(即該預定寬度W)下，只要該二待測電路板PCB1、PCB2的寬度總和(PW1+PW2)加上該間隔D(基於該預定距離PD而來)係小於該預定寬度W即可讓原本單進料之檢測系統直接升級為兩倍檢測量的檢測系統。Referring to FIG. 4B, it is a schematic diagram of two circuit boards PCB1 and PCB2 under the dual feed design, and the widths PW1 and PW2 of the two circuit boards PCB1 and PCB2 to be tested are the same. It can be seen from the drawing that the maximum width (ie, the predetermined width W) that can be detected by the detection system is as long as the total width (PW1+PW2) of the two boards to be tested PCB1 and PCB2 is added to the interval D (based on the predetermined The distance from the PD is less than the predetermined width W, so that the detection system of the original single feed can be directly upgraded to a detection system with twice the detection amount.
接著參閱第4C圖，亦為雙進料設計下之兩待測電路板PCB1、PCB2的示意圖，然該二待測電路板PCB3、PCB4的寬度PW3及PW4係為不相同。同樣地，基於該檢測系統所能檢測之最大寬度(即該預定寬度W)下，只要該二待測電路板PCB3、PCB4的寬度總和(PW3+PW4)加上該間隔D(基於該預定距離PD而來)係小於該預定寬度W即可讓原本單進料之檢測系統直接升級為兩倍檢測量的檢測系統。Referring to FIG. 4C, it is also a schematic diagram of two circuit boards PCB1 and PCB2 to be tested under the double feed design. However, the widths PW3 and PW4 of the two circuit boards PCB3 and PCB4 to be tested are different. Similarly, based on the maximum width (ie, the predetermined width W) that the detection system can detect, the sum of the widths of the two boards to be tested PCB3 and PCB4 (PW3+PW4) plus the interval D (based on the predetermined distance) The PD is less than the predetermined width W to directly upgrade the detection system of the original single feed to the detection system of twice the detection amount.
綜上所述，本發明在原有之檢測系統下針對進料區堆疊裝置的改良與檢測結果產生裝置的設定，即可讓原本單進料之檢測系統直接升級為兩倍檢測量的檢測系統，不但可使進料量倍增更可大幅縮減整批待測電路板所需的檢測時間，進一步地更可使檢測系統的使用效益大幅提高。In summary, the invention improves the detection device of the feed zone stacking device and the detection result generating device under the original detection system, so that the original single feed detection system can be directly upgraded to a detection system with twice the detection amount. Not only can the feed volume be doubled, but the inspection time required for the entire batch of boards to be tested can be greatly reduced, and the use efficiency of the detection system can be greatly improved.
本發明在上文中已以較佳實施例揭露，然熟習本項技術者應理解的是，該實施例僅用於描繪本發明，而不應解讀為限制本發明之範圍。應注意的是，舉凡與該實施例等效之變化與置換，均應設為涵蓋於本發明之範疇內。因此，本發明之保護範圍當以申請專利範圍所界定者為準。The invention has been described above in terms of the preferred embodiments, and it should be understood by those skilled in the art that the present invention is not intended to limit the scope of the invention. It should be noted that variations and permutations equivalent to those of the embodiments are intended to be included within the scope of the present invention. Therefore, the scope of protection of the present invention is defined by the scope of the patent application.
100‧‧‧進料區堆疊裝置
102‧‧‧定位靠邊板
200‧‧‧進料提取裝置
300‧‧‧輸送帶
400‧‧‧影像擷取裝置
401‧‧‧第一影像擷取器
402‧‧‧第二影像擷取器
500‧‧‧檢測結果產生裝置
C1‧‧‧影像擷取寬度
C2‧‧‧影像擷取寬度
D‧‧‧間隔
W‧‧‧預定寬度
PCB‧‧‧具有預定寬度W之待測電路板
PCB1‧‧‧第一堆待測電路板
PW1‧‧‧第一堆堆疊之待測電路板的寬度
PCB2‧‧‧第二堆待測電路板
PW2‧‧‧第二堆堆疊之待測電路板的寬度
PCB3‧‧‧待測電路板
PW3‧‧‧PCB3待測電路板的寬度
PCB4‧‧‧待測電路板
PW4‧‧‧PCB4待測電路板的寬度
PD‧‧‧預定距離
S101~S107‧‧‧步驟100‧‧‧feeding area stacking unit
102‧‧‧ positioning edge board
200‧‧‧Feed extraction device
300‧‧‧ conveyor belt
400‧‧‧Image capture device
401‧‧‧First image capture device
402‧‧‧Second image capturer
500‧‧‧Detection result generating device
C1‧‧‧Image capture width
C2‧‧‧Image capture width
D‧‧‧ interval
W‧‧‧Predetermined width
PCB‧‧‧Down board with predetermined width W
PCB1‧‧‧First stack of boards to be tested
PW1‧‧‧The width of the first stack of boards to be tested
PCB2‧‧‧Second stack of boards to be tested
PW2‧‧‧The width of the second stack of boards to be tested
PCB3‧‧‧Device board to be tested
PW3‧‧‧PCB3 width of the board to be tested
PCB4‧‧‧Test board
PW4‧‧‧PCB4 width of the board to be tested
PD‧‧‧Predetermined distance
S101~S107‧‧‧Steps
第1圖係為本發明一實施例中之電路板檢測方法的流程圖。 第2圖係為本發明一實施例中之電路板檢測系統的系統示意圖。 第3圖係為本發明另一實施例中具二影像擷取器之電路板檢測系統的系統示意圖。 第4A-4C圖係為第3圖所示之電路板檢測系統於各種待測電路板尺寸下的使用示意圖。1 is a flow chart showing a method of detecting a circuit board in an embodiment of the present invention. 2 is a system diagram of a circuit board detecting system in an embodiment of the present invention. FIG. 3 is a schematic diagram of a system for detecting a circuit board with two image capture devices according to another embodiment of the present invention. 4A-4C is a schematic diagram of the use of the circuit board detection system shown in FIG. 3 under various circuit board sizes to be tested.
S101~S107‧‧‧步驟S101~S107‧‧‧Steps
Claims (12)
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| US20090323084A1 (en) * | 2008-06-25 | 2009-12-31 | Joseph Christen Dunn | Package dimensioner and reader |
| CN102577659A (en) * | 2009-10-14 | 2012-07-11 | 松下电器产业株式会社 | Component mounting device and electronic component mounting method |
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