TWI504627B - 環氧樹脂化合物及使用其之散熱電路板 - Google Patents
環氧樹脂化合物及使用其之散熱電路板 Download PDFInfo
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- TWI504627B TWI504627B TW101127155A TW101127155A TWI504627B TW I504627 B TWI504627 B TW I504627B TW 101127155 A TW101127155 A TW 101127155A TW 101127155 A TW101127155 A TW 101127155A TW I504627 B TWI504627 B TW I504627B
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- epoxy resin
- resin compound
- epoxy
- hardener
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- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
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- 239000003795 chemical substances by application Substances 0.000 description 1
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- 239000010949 copper Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
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- GPAYUJZHTULNBE-UHFFFAOYSA-N diphenylphosphine Chemical compound C=1C=CC=CC=1PC1=CC=CC=C1 GPAYUJZHTULNBE-UHFFFAOYSA-N 0.000 description 1
- DTGKSKDOIYIVQL-UHFFFAOYSA-N dl-isoborneol Natural products C1CC2(C)C(O)CC1C2(C)C DTGKSKDOIYIVQL-UHFFFAOYSA-N 0.000 description 1
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- 150000002148 esters Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- UJNZOIKQAUQOCN-UHFFFAOYSA-N methyl(diphenyl)phosphane Chemical compound C=1C=CC=CC=1P(C)C1=CC=CC=C1 UJNZOIKQAUQOCN-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 235000013872 montan acid ester Nutrition 0.000 description 1
- LSHROXHEILXKHM-UHFFFAOYSA-N n'-[2-[2-[2-(2-aminoethylamino)ethylamino]ethylamino]ethyl]ethane-1,2-diamine Chemical compound NCCNCCNCCNCCNCCN LSHROXHEILXKHM-UHFFFAOYSA-N 0.000 description 1
- ZETYUTMSJWMKNQ-UHFFFAOYSA-N n,n',n'-trimethylhexane-1,6-diamine Chemical compound CNCCCCCCN(C)C ZETYUTMSJWMKNQ-UHFFFAOYSA-N 0.000 description 1
- KMQMXWOIYDHLTF-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound OC1=C(C2=CC=CC=C2C=C1)O.OC1=C(C2=CC=CC=C2C=C1)O KMQMXWOIYDHLTF-UHFFFAOYSA-N 0.000 description 1
- ZUVBIBLYOCVYJU-UHFFFAOYSA-N naphthalene-1,7-diol Chemical compound C1=CC=C(O)C2=CC(O)=CC=C21 ZUVBIBLYOCVYJU-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- RPGWZZNNEUHDAQ-UHFFFAOYSA-N phenylphosphine Chemical compound PC1=CC=CC=C1 RPGWZZNNEUHDAQ-UHFFFAOYSA-N 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- JIYNFFGKZCOPKN-UHFFFAOYSA-N sbb061129 Chemical compound O=C1OC(=O)C2C1C1C=C(C)C2C1 JIYNFFGKZCOPKN-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- BJQWBACJIAKDTJ-UHFFFAOYSA-N tetrabutylphosphanium Chemical compound CCCC[P+](CCCC)(CCCC)CCCC BJQWBACJIAKDTJ-UHFFFAOYSA-N 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- 125000005591 trimellitate group Chemical group 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
- C08G59/184—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/142—Metallic substrates having insulating layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
Description
本發明申請主張於2011年07月28日所申請之韓國專利申請案號10-2011-0075462的優先權,此全文將併入本案以作為參考。
本發明所揭露關於一種環氧樹脂化合物。更具體地說,本發明所揭露關於一種散熱電路板的絕緣層所使用之環氧樹脂化合物。
電路板包括形成於電性絕緣基板上的電路圖案,與此電路板用於安裝電子零件(electronic parts)於其上。
此電子零件可包括如發光二極體(LED)的發熱裝置(heat emitting device)和此發熱裝置發出大量的熱。從如發熱裝置產生的熱而增加電路板的溫度,導致發熱發光裝置(heat light emitting device)產生故障和發熱裝置可靠性降低。
因此,於電路板中,從電子零件到外面散發熱量的散熱結構是非常重要的,而於電路板中形成絕緣層的導熱係數會大大地影響電路板的散熱。
為了增加絕緣層的導熱係數,高密度填充無機填料於絕緣層
是必要的。為此,建議採用低黏度環氧樹脂。
一般廣泛使用雙酚A環氧樹脂與雙酚F環氧樹脂用作於低黏度環氧樹脂。由於上述的環氧樹脂於室溫下是液相的,上述的環氧樹脂其處理困難且上述的環氧樹脂呈現出弱的耐熱性、機械強度和伸張力。
本發明實施例提供一種具有新組成物(composition)的環氧樹脂化合物。
本發明實施例提供一種具有提高散熱效率的散熱電路板。
根據本發明實施例,環氧樹脂化合物主要包括環氧樹脂、硬化劑、以及無機填料。此環氧樹脂包含結晶環氧樹脂以及硬化劑,此硬化劑包括環氧加成物,並添加到結晶環氧樹脂中。
同時,根據本發明實施例,散熱電路板包括金屬板、絕緣層形成於金屬板上、以及電路圖案形成於絕緣層上。絕緣層是由固化環氧樹脂化合物而成,環氧樹脂化合物主要包括環氧樹脂、硬化劑以及無機填料,與此環氧樹脂包含結晶環氧樹脂以及硬化劑,此硬化劑包括環氧加成物,並添加到結晶環氧樹脂之中。
如上所述,根據本發明實施例,使用包括液晶基(mesogen)結構的環氧樹脂而有利於結晶性(crystalline),而可使散熱電路板的熱
傳導係數增加。此外,使用環氧樹脂作絕緣材料可用於印刷電路板而提供其基板(substrate)具有高散熱特性。此外,環氧加成物形成的硬化劑添加到結晶環氧樹脂,使結晶環氧樹脂的溶解度得以改善。並且減少硬化劑的使用量,而得以改善沉澱現象(settlement)。
結晶環氧樹脂具優異的成型性和可靠性、與高熱傳導係數、低吸水性、低熱膨脹和高耐熱性。
於下文中,現在請參考以細節闡述本發明所揭露的實施例、並以所附的圖示來詳細說明這些範例,藉以充分說明於此方法之本發明,使本領域熟習技藝者能輕易地完成本發明。然而,本發明實施例可做各種的修改。
於以下所描述的,當一個預設的部份”包括(includes)”一預設組成(component),預設的部份不排除其他組成,但當有具體相反的描述時更可包括其他組成。
為了方便或清楚的目的,圖示中所示的每個膜層的厚度和尺寸可以被誇大、省略或示意性地繪製。此外,元件(elements)的尺寸並不完全反映實際尺寸。相同的參考標號將被分配在整個圖示
中相同的元件。
於本發明實施例的描述中,可以被理解地是,當一膜層(layer)、一薄膜(film)、一區域(region)或一平板(plate)被稱為於另一膜層、薄膜、區域或平板”之上(on)”或”之下(under)”,它也可呈現於另一膜層、薄膜、區域或平板“直接(directly)”或”間接(indirectly)”之上,或存在一或更多個中介膜層(intervening layers)。參考圖示可清楚描述膜層的位置。
本發明所揭露提供一種由於高結晶特性而具有良好導熱係數的環氧樹脂化合物。
於下文中,本發明所揭露的環氧樹脂化合物主要包含:環氧樹脂包含結晶環氧樹脂、環氧加成物以及無機填料。
環氧樹脂化合物包含2wt%到50wt%的結晶環氧樹脂。
環氧樹脂可包括至少5wt%的結晶環氧樹脂。最佳的是,環氧樹脂可包含至少50wt%的結晶環氧樹脂。
在這種情況之下,結晶環氧樹脂以下列的化學式來表示。
如果結晶環氧樹脂的使用比例是小於上述比例,當結晶環氧樹脂硬化時,結晶環氧樹脂可能不會結晶,而可能呈現出低的導
熱係數。
除了本發明所揭露的重要組成部分之結晶環氧樹脂外,環氧樹脂通常包含具有至少兩個上述之環氧基團分子的不同非結晶環氧樹脂。
例如,非結晶的環氧樹脂包含雙酚A(bisphenol A)、3,3',5,5'-四甲基-4,4'-二羥基二苯基甲烷(3,3',5,5'-tetramethyl-4,4'-dihydroxydiphenylmethane)、4,4'-二羥基二苯砜(4,4'-dihydroxydiphenylsulphone)、4,4'-二羥基二苯硫醚(4,4'-dihydroxydiphenyl sulfide)、4,4'-二羥基二苯酮(4,4'-dihydroxydiphenylketone)、芴雙酚(fluorenebisphenol)、4,4'-雙酚,3,3',5,5'-四甲基-4,4'-二羥基聯苯(3,3',5,5'-tetramethyl-4,4'-dihydroxybiphenyl)、2,2'-雙酚(2,2'-biphenol)、間苯二酚(resorcin)、鄰苯二酚(catechol)、第三丁基鄰苯二酚(t-butylcatechol)、氫醌(hydroquinone)、第三丁基氫醌(t-butyl hydroquinone)、1,2-二羥基萘(1,2-dihydroxynaphthalene)、1,3-二羥基萘、1,4-二羥基萘、1,5-二羥基萘、1,6-二羥基萘、1,7-二羥基萘、1,8-二羥基萘、2,3-二羥基萘、2,4-二羥基萘、2,5-二羥基萘、2,6-二羥基萘、2,7-二羥基萘、2,8-二羥基萘、丙烯基(allylide)或二羥基萘的聚丙烯基(allylate)、二價(divalent)酚類(phenols)如丙
烯基(allylated)雙酚A、丙烯基雙酚F、或丙烯基苯酚酚醛(phenol-novolac),三價或更多價的酚(phenols)如線型酚醛(phenol-novolac)、雙酚A酚醛樹脂(bisphenol A novolac)、鄰甲酚酚醛樹脂(o-cresol novolac)、間甲酚酚醛樹脂(m-cresol novolac)、對甲酚酚醛樹脂(p-cresol novolac)、二甲酚酚醛樹脂(xylenol novolac)、聚對羥基苯乙烯(poly-p-hydroxystyrene)、三(4-羥基苯基)甲烷(tris-(4-hydroxyphenyl)methane)、1,1,2,2-四(4-羥基苯基)乙烷(1,1,2,2-tetrakis(4-hydroxypheny)ethane)、氟乙醇胺(fluoroglycinol)、鄰苯三酚(pirogallol)、第三丁基鄰苯三酚(t-butylpirogallol)、丙烯基鄰苯三酚(allylated pirogallol)、聚丙烯基鄰苯三酚(poly allylated pirogallol)、1,2,4-苯三酚(1,2,4-benzenetryol)、2,3,4-三羥基二苯甲酮(2,3,4-trihydroxybenzophenone)、芳烷基酚醛(phenol aralkyl)樹脂、萘芳烷(naphthol aralkyl)樹脂、與雙環戊二烯(dicyclophenadiene)基樹脂、或縮水甘油醚(glycidyletherifide)化合物從鹵代雙酚(halogenated bisphenols)衍生如四溴雙酚A(tetrabromobisphenol A)。可使用上述非結晶環氧樹脂其中一個,或也可將至少二種非結晶環氧樹脂互相混合來使用。
本發明實施例的環氧樹脂化合物包含於環氧樹脂化合物總重
量之0.5wt%到10wt%的硬化劑。
硬化劑包含環氧加成物。
硬化劑包括環氧加成物,並添加到結晶環氧樹脂中,使結晶環氧樹脂的溶解度得以改善。
於此情況下,環氧加成物以下述化學式來表示。
形成化學式2與化學式3的環氧加成物,以便於高溫、5到10小時下攪拌結晶環氧樹脂單體與硬化劑。
化學式2與化學式3的環氧加成物可以為酚類(phenol)基硬化劑,但本發明並不限與此。
環氧加成物佔環氧樹脂化合物總重量之0.5wt%到5wt%。以及硬化劑可添加習知的環氧樹脂硬化劑。
當環氧加成物佔環氧樹脂化合物總重量小於0.5wt%時,樹脂導向不規則,以及硬化劑成為低密度而使環氧樹脂化合物無法表現出高熱傳導係數、低熱膨脹和高耐熱性。
當環氧加成物佔環氧樹脂化合物總重量大於0.5wt%時,樹脂含量影響環氧加成物,所以熱傳導率變低,過硬化(overcuring)而與基板的黏著性下降。
根據本發明揭露之添加到硬化劑的環氧加成物可包含所有習知的環氧樹脂硬化劑。最佳地是,硬化劑可包括酚基硬化劑。
酚類基硬化劑包括酚樹脂以及酚類化合物(phenolic compounds)的單一成分中的酚化合物(phenol compound)。
例如,酚基硬化劑可包含雙酚A(bisphenol A)、雙酚F(bisphenol F)、4,4'-二羥基二苯基甲烷(4,4'-dihydroxydiphenylmethane)、4,4'-二羥基醚(4,4'-dihydroxydiphenylether)、1,4-雙(4-羥苯氧基)苯(1,4-bis(4-hydroxyphenoxy)benzene)、1,3-雙(4-羥基苯氧基)苯(1,3-bis(4-hydroxyphenoxy)benzene)、4,4'-二羥基二苯硫醚(4,4'-dihydroxydiphenyl sulfide)、4,4'-二羥基二苯酮(4,4'-dihydroxydiphenylketone)、4,4'-二羥基二苯碸
(4,4'-dihydroxydiphenylsulphone)、4,4'-二羥基聯苯(4,4'-dihydroxybiphenyl)、2,2'-二羥基聯苯(2,2'-dihydroxybiphenyl)、10-(2,5-二羥苯基)-10H-9-氧雜-10-磷菲-10-氧化物(10-(2,5-dihydroxyphenyl)-10H-9-oxa-10-phosphaphenanthrene-10-o xide)、線型酚醛(phenol-novolac)、雙酚A酚醛樹脂(bisphenol A novolac)、鄰甲酚酚醛樹脂(o-cresol novolac)、間甲酚酚醛樹脂(m-cresol novolac)、對甲酚酚醛樹脂(p-cresol novolac)、二甲酚酚醛樹脂(xylenol novolac)、聚對羥基苯乙烯(poly-p-hydroxystyrene)、氫醌(hydroquinone)、間苯二酚(resorcin)、鄰苯二酚(catechol)、第三丁基鄰苯二酚(t-butylcatechol)、第三丁基氫醌(t-butyl hydroquinone)、氟甘氨醇(fluoroglycinol)、鄰苯三酚(pirogallol)、第三丁基鄰苯三酚(t-butylpirogallol)、丙烯基鄰苯三酚(pirogallol)、聚丙烯基鄰苯三酚(pirogallol)、1,2,4-苯三酚(1,2,4-benzenetryol)、2,3,4-三羥基二苯甲酮(2,3,4-trihydroxybenzophenone)、1,2-二羥基萘(1,2-dihydroxynaphthalene)、1,3-二羥基萘、1,4-二羥基萘、1,5-二羥基萘、1,6-二羥基萘、1,7-二羥基萘、1,8-二羥基萘、2,3-二羥基萘、2,4-二羥基萘、2,5-二羥基萘、2,6-二羥基萘、2,7-二羥基萘、2,8-二羥基萘、丙烯基(allylide)或二羥基萘的聚丙烯基(allylate)、丙烯基(allylated)雙酚A、丙烯基雙酚F、丙烯基線型酚醛、或丙
烯基鄰苯三酚(allylated pirogallol)。
此硬化劑可包含至少兩種硬化劑。
同時,可用除了酚基硬化劑以外,硬化劑可包含習知硬化劑。例如,硬化劑可包含胺基(amine-based)硬化劑、酸酐基(acid anhydride-based)硬化劑、酚基(phenol-based)硬化劑、聚硫醇基(polymercaptan-based)硬化劑、聚氨基醯胺基(polyaminoamide-based)硬化劑、異氰酸酯基(isocyanate-based)硬化劑、與封閉型異氰酸酯(blocked isocyanate)硬化劑。上述硬化劑之混合量可根據硬化劑類型而適當地選擇混合之或以導熱環氧樹脂產品的物理性質而適當地決定之。
例如,胺基硬化劑可包含脂族胺(aliphatic amines)、聚醚聚胺(polyether polyamines)、脂環胺(alicyclic amines)、或芳香胺(aromatic amines)。脂族胺(aliphatic amines)可包含乙二胺(ethylenediamine)、1,3-丙二胺(1,3-diaminopropane)、1,4-丙二胺(1,4-diaminopropane)、己二胺(hexamethylenediamine)、2,5-二甲基己二胺(2,5-dimethyl hexamethylene diamine)、三甲基己二胺(trimethyl-hexamethylenediamine)、二乙烯三胺(diethylene triamine)、亞氨基二丙胺(iminobispropylamine)、二(六亞甲基)三胺(bis(hexamethylene)triamine)、三乙烯四胺
(triethylenetetramine)、四乙烯五胺(tetraethylenephentamine)、五乙烯六胺(pentaethylenehexamine)、N-羥乙基乙二胺(N-hydroxyethylethylenediamine)、或四(羥乙基)乙二胺(tetra(hydroxyethyl)ethylenediamine)。聚醚多胺(polyether polyamines)可包含三乙二醇二胺(triethylene glycol diamine)、四甘醇二胺(tetraethylene glycol diamine)、二甘醇雙(丙胺)(diethylene glycol bis(propylamine))、聚氧丙烯二胺(polyoxy-propylene diamine)、或聚氧丙烯三胺(polyoxypropylenetriamines)。脂環族胺(alicyclic amines)可包含異佛爾酮二胺(isophoronediamine)、亞甲基二胺(methenediamine)、N-乙基哌嗪(N-aminoethylpiperazine)、二(4-氨基-3-甲基二環己基甲烷)(bis(4-amino-3-methyldicyclohexyl)methane)、二(氨甲基)環己烷(bis(aminomethyl)cyclohexane)、3,9-二(3-氨丙基)2,4,8,10-四氧(5,5)十一烷(3,9-bis(3-aminopropyl)2,4,8,10-tetraoxaspiro(5,5)undecane)、或冰片烯二胺(norbornendiamine)。芳香胺(aromatic amines)可包含四氯對二甲苯二胺(tetrachloro-p-xylenediamine)、間二甲苯二胺(m-xylenediamine)、對二甲苯二胺(p-xylenediamine)、間苯二胺(m-phenylenediamine)、鄰苯二胺(o-phenylenediamine)、對苯二胺
(p-phenylenediamine)、2,4-二氨基苯甲醚(2,4-diaminoanisole)、2,4-甲苯二胺(2,4-toluenediamine)、2,4-二氨基二苯甲烷(2,4-diaminodiphenylmethane)、4,4'-二氨基二苯基甲烷(4,4'-diaminodiphenylmethane)、4,4'-二氨基-1,2-二苯基乙烷(4,4'-diamino-1,2-diphenylethane)、2,4-二氨基二苯碸(2,4-diaminodiphenylsulfone)、4,4'-二氨基二苯碸(4,4'-diaminodiphenylsulfone)、間氨基酚(m-aminophenol)、間氨基苯甲胺(m-aminobenzylamine)、苯甲基二甲胺(benzyldimethylamine)、2-二甲氨基甲基苯酚(2-dimethylaminomethyl)phenol)、三乙醇胺(triethanolamine)、甲基苯甲胺(methylbenzylamine)、α-(間氨基苯)乙胺(α-(m-aminophenyl)ethylamine)、α-(對氨基苯)乙胺(α-(p-aminophenyl)ethylamine)、氨基二乙基二甲基二苯(diaminodiethyldimethyldiphenylmethane)、或α,α'-及(4-氨基苯基)-對-二異丙苯(α,α'-bis(4-aminophenyl)-p-diisopropylbenzene)。
例如,酸酐(acid anhydride)基硬化劑可包含十二烯酸酐丁二酸(dodesenil anhydride succinate)、聚己二酸酐(polyadipicacidanhydride)、聚壬二酸酐(polyazellainc acid anhydride)、聚癸二酸酐(polysebacic acid anhydride)、聚(乙基十八烷酸)酐
(poly(ethyloctadecanoic acid)anhydride)、聚(苯十六烷酸)酐(poly(phenylhexadecanoic acid)anhydride)、甲基四氫鄰苯二甲酸酐(methyl tetra-hydrophthalic anhydride)、甲基六氫苯酐(methylhexahydrophthalic anhydride)、六氫鄰苯二甲酸酐(hexahydrophthalic anhydride)、無水甲基hymic酸(anhydrousmethylhymic acid)、四氫鄰苯二甲酸酐(tetrahydrophthalic anhydride)、四氫鄰苯二甲酸三烷基酐(trialkyltetrahydrophthalic anhydride)、甲基環己烯二羧酸酐(methylcyclohexenedicarboxyic acid anhydride)、甲基環己烯四甲酸酐(methylcyclohexenetetracarboxyic acid anhydride)、鄰苯二甲酸酐(phthalic anhydride)、偏苯三酸酐(trimellitic anhydride)、均苯四甲酸酐(pyromellitic acid)、二苯酮四甲酸酐(benzophenonetetracarboxyic acid anhydride)、ethyleneglycolbistry trimellitate、hetic酸酐(hetic acid anhydride)、內次甲基鄰苯二甲酸酐(nadic acid anhydride)、甲基降冰片烯酸酐(methyl nadic acid anhydride)、5-(2,5-二氧四氫-3-呋喃)-3-甲基-3-環己烷-1,2-二羧酸酸酐(5-(2,5-dioxotetrahydro-3-furanyl)-3-methyl-3-cyclohexane-1,2-dicar boxyic acid anhydride)、3,4-二羧基-1,2,3,4-四氫-1-萘琥珀酸二酐
(3,4-dicarboxy-1,2,3,4-tetrahydro-1-naphthalenesuccinate dianhydride)、或1-甲基-二羧基-1,2,3,4-四氫-1-萘琥珀酸二酐(1-methyl-dicarboxylic-1,2,3,4-tetrahydro-1-aphthalenesuccinate dianhydride)。
此環氧樹脂化合物包含於環氧樹脂化合物總重量之40wt%至95wt%的無機填料。
如果填料(filler)的含量小於上述範圍內時,可能會無法達到本發明所揭露之高導熱係數、低熱膨脹性或高耐熱性的目的。增加無機填料的含量會使效果跟著提高。於本案中,並沒有依無機填料體積分量(volume fraction)的比例而使效果跟著提高,但無機填料從某個特定的含量後效果才會明顯地提高。物理特性所呈現的效果是由於在聚合物態(polymer state)中的受控(control)的高次結構(hyper-structure)。似乎因為高次結構主要是存在於無機填料的表面上,所以需要特定含量的無機填料。同時,如果無機填料的含量大於上述範圍時,黏度會增加,而使成型性(moldability)會發生不符所期望的降低。
最佳地是,無機填料具有球形。球形無機填料包含具有橢圓截面的無機填料。因此,無機填料可包括具有類似球體形狀的各種無機填料。然而,無機填料最好幾乎完整的球形而可改善流動
性。
無機填料可包含氧化鋁、氮化鋁、氮化矽、氮化硼或結晶矽。無機填料可包括由至少兩個不同的無機填料的混合物。
無機填料的平均粒徑最好為30微米或者更小。如果無機填料的平均粒徑大於30微米時,環氧樹脂化合物的流動性與強度都會發生不符所期望的降低。
習知硬化促進劑(curing accelerator)可與本發明所揭露之環氧樹脂化合物相混合。硬化促進劑可包括胺類(amines)、咪唑類(imidazoles)、有機磷(organic phosphines)、或路易斯(lewis)酸。詳細地說,硬化促進劑可包括三級胺(tertiary amines)如1,8-二氮雜雙環(5,4,0)十一烯-7(1,8-diazabicyclo(5,4,0)undecene-7)、三乙烯二胺(triethylenediamine)、苯甲基二甲胺(benzyl dimethylamine)、三乙醇胺(triethanol amine)、二乙醇胺(dimethylaminoethanol)或三(二甲氨基甲基)苯酚(tris(dimethylaminomethyl)phenol),咪唑(imidazoles)如2-甲基咪唑(2-methylimidazole)、2-苯基咪唑(2-phenylimidazole)、2-苯基-4-甲基咪唑(2-phenyl-4-methylimidazole)與2-十七烷基咪唑(2-heptadecylimidazole),有機膦(organic phosphines)如三丁膦(tributylphosphine)、甲二苯膦(methyldiphenylphosphine)、三苯膦
(triphenylphosphine)、二苯膦(diphenylphosphine)與苯膦(phenylphosphine),四取代膦‧四取代硼酸(tetra subphosphonium.tetra subborate)如四苯磷‧四苯硼(tetraphenylphosphonium.tetraphenylborate)、四苯磷‧乙三苯基硼(tetraphenylphosphonium.ethyltryphenyl borate)或四丁磷‧四丁硼(tetrabutylphosphonium.tetrabutyl borate),或四苯硼鹽(tetraphenylboronsalts)如2-乙基-4-甲基咪唑‧四苯基硼(2-ethyl-4-methyl imidazole.tetraphenylborate)或N-甲基嗎啉‧四苯硼(N-methylmorphorlin.tetraphenylborate)。
根據本發明所揭露的環氧樹脂化合物可包含蠟(wax)可作為用於本發明所揭露的環氧樹脂化合物的典型脫模劑(release agent)。例如,蠟可包含硬脂酸(stearic acid)、蒙旦酸(montanic acid)、蒙旦酯(montanic acid ester)或磷酸酯(phosphoric ester)。
本發明所揭露環氧樹脂化合物可包含用於環氧樹脂化合物的典型偶合劑(coupling agent)而提高無機填料和樹脂成分(component)之間的黏著強度。例如,偶合劑可包含環氧矽烷。
當根據本發明所揭露之環氧樹脂化合物主要包括環氧樹脂、硬化劑以及無機填料。環氧樹脂化合物包括其總重量3wt%到60wt%的環氧樹脂(較佳為5wt%到50wt%的環氧樹脂)、40wt%到
95wt%的無機填料與0.5wt%到10wt%的硬化劑。
環氧樹脂、硬化劑與橡膠添加劑溶解(melted)於諸如丙酮、甲乙酮(MEK)、甲基異丁基酮(MIBK)、異丙醇(IPA)、丁醇或甲苯的溶劑中之後,然後同時加熱與攪拌。然後,再加入無機填料於上述攪拌的結果並用攪拌機均勻地混合之。此後,添加偶合劑於此混合物中與使用加熱輥(heating roller)或捏合機(needer)揉捏合此混合物,而製備成環氧樹脂化合物。有多種混合的順序以混合上述成分。
此時,可使用溶劑的量大約為10wt%至20wt%的環氧樹脂化合物總重量。
本發明所揭露的環氧樹脂化合物可應用於圖1所示的散熱電路板。
請參考圖1所示,根據本發明所揭露的散熱電路板100包含金屬板110,形成於金屬板110上之絕緣層120,與形成於絕緣層120上之電路圖案130。
金屬板110可包含銅、鋁、鎳、金或鉑之合金中的一個而具有良好導熱係數。
金屬板110可包含金屬凸塊(metallic protrusion)(未繪示)構成安裝墊(mounting pad)而裝設在發熱裝置150(heat emitting device)
上。
金屬凸塊可從金屬板110而垂直延伸。發熱裝置150裝設於作為安裝墊之金屬凸塊上表面的部分,與金屬凸塊上表面的部分上有一為了裝設焊球(solder)而預先設置的寬度。
絕緣層120設置於金屬板110上。
絕緣層120可包含複數個絕緣層,與絕緣層120設置於金屬板110與電路圖案130間而絕緣之。
絕緣層120可藉由固化本發明所揭露之環氧樹脂化合物而形成,且無機填料125均勻分佈於絕緣層120中。
複數個電路圖案130形成於絕緣層120上。
由於本發明所揭露之絕緣層120使用環氧樹脂化合物而形成,從而使導熱係數得以提高。因此,從發熱裝置150所產生的熱傳導到於散熱電路板100下部的金屬板110。
<實施例>
於下文中,本發明所揭露的範圍與精神將參考實施例而詳細介紹之。
使用耐馳(NETZSCH)公司的LFA447型熱傳導分析儀透過異常熱傳導法(abnormal heat conduction scheme)來量測導熱係數。
鋁的剝離特性(peel property)以環氧樹脂化合物的脫層度
(delmaination degree)來表示,也就是當環氧樹脂化合物塗覆於鋁基板(Al substrate)並固化時,然後將鋁基板彎曲180度再恢復成原來的位置。如果脫層度小於0.2厘米,被標記為“○”。如果脫層度於0.2厘米至1厘米的範圍內,被標記為“△”。如果脫層度為1厘米或以上,被標記為“X。
(實施例1)
將3wt%的雙酚F、3wt%的鄰甲酚酚醛樹脂、2wt%的4,4氧代雙(N-(4-(環氧乙烷-2-基甲氧基)亞芐基)苯胺)(4,4'oxybis(N-(4-(oxiran-2-ylmethoxy)benzylidene)aniline))、2wt%的NC-3000H環氧樹脂(日本化藥股份有限公司(Nippon Kayaku co.,Ltd))、2wt%的二丙烯基硫化物(DAS)硬化劑、2wt%的二丙烯基硫化物硬化促進劑、0.5wt%的BYK-W980與2.5wt%的化學式2環氧加成物全部混合,於40℃、10分鐘攪拌之。然後,添加85wt%的氧化鋁無機填料於此混合物中,在室溫下攪拌20分鐘至30分鐘而得到實施例1之環氧樹脂化合物,其中該環氧加成物亦可先被加入至該硬化劑中,然後再將含有該環氧加成物的硬化劑添加到該結晶環氧樹脂。
(實施例2)
將3wt%的雙酚F、2wt%的4,4氧代雙(N-(4-(環氧乙烷-2-
基甲氧基)亞芐基)苯胺)(4,4'oxybis(N-(4-(oxiran-2-ylmethoxy)benzylidene)aniline))、1.5wt%的NC-3000H環氧樹脂(日本化藥股份有限公司(Nippon Kayaku co.,Ltd))、1wt%的二丙烯基硫化物(DAS)硬化劑、1.5wt%的化學式2環氧加成物與0.5wt%的BYK-W980全部混合,於40℃、10分鐘攪拌之。然後,添加88wt%的氧化鋁無機填料於此混合物中,在室溫下攪拌20分鐘至30分鐘而得到實施例2之環氧樹脂化合物,其中該環氧加成物亦可先被加入至該硬化劑中,然後再將含有該環氧加成物的硬化劑添加到該結晶環氧樹脂。
(實施例3)
將2wt%的雙酚F、2wt%的鄰甲酚酚醛樹脂、1wt%的4,4氧代雙(N-(4-(環氧乙烷-2-基甲氧基)亞芐基)苯胺)(4,4'oxybis(N-(4-(oxiran-2-ylmethoxy)benzylidene)aniline))、2wt%的NC-3000H環氧樹脂(日本化藥股份有限公司(Nippon Kayaku co.,Ltd))、1wt%的二丙烯基硫化物(DAS)硬化劑、1.5wt%的化學式2環氧加成物、0.5wt%的BYK-W980全部混合,於40℃、10分鐘攪拌之。然後,添加90wt%的氧化鋁無機填料於此混合物中,在室溫下攪拌20分鐘至30分鐘而得到實施例3之環氧樹脂化合物,其中該環氧加成物亦可先被加入至該硬化劑中,然後再將含
有該環氧加成物的硬化劑添加到該結晶環氧樹脂。
(實施例4)
將2wt%的雙酚F、1wt%的鄰甲酚酚醛樹脂、1wt%的4,4氧代雙(N-(4-(環氧乙烷-2-基甲氧基)亞芐基)苯胺)(4,4'oxybis(N-(4-(oxiran-2-ylmethoxy)benzylidene)aniline))、1wt%的NC-3000H環氧樹脂(日本化藥股份有限公司(Nippon Kayaku co.,Ltd))、1wt%的二丙烯基硫化物(DAS)硬化劑、0.5wt%的BYK-W980、1.5wt%的化學式2環氧加成物全部混合,於40℃、10分鐘攪拌之。然後,添加92wt%的氧化鋁無機填料於此混合物中,在室溫下攪拌20分鐘至30分鐘而得到實施例4之環氧樹脂化合物,其中該環氧加成物亦可先被加入至該硬化劑中,然後再將含有該環氧加成物的硬化劑添加到該結晶環氧樹脂。
(實施例5)
將3wt%的雙酚F、3wt%的鄰甲酚酚醛樹脂、2wt%的4,4氧代雙(N-(4-(環氧乙烷-2-基甲氧基)亞芐基)苯胺)(4,4'oxybis(N-(4-(oxiran-2-ylmethoxy)benzylidene)aniline))、2wt%的NC-3000H環氧樹脂(日本化藥股份有限公司(Nippon Kayaku co.,Ltd))、2wt%的二丙烯基硫化物(DAS)硬化劑、0.5wt%的BYK-W980、2.5wt%的化學式3環氧加成物全部混合,於40℃、
10分鐘攪拌之。然後,添加85wt%的氧化鋁無機填料於此混合物中,在室溫下攪拌20分鐘至30分鐘而得到實施例5之環氧樹脂化合物,其中該環氧加成物亦可先被加入至該硬化劑中,然後再將含有該環氧加成物的硬化劑添加到該結晶環氧樹脂。
(實施例6)
將3wt%的雙酚F、2wt%的鄰甲酚酚醛樹脂、1.5wt%的4,4氧代雙(N-(4-(環氧乙烷-2-基甲氧基)亞芐基)苯胺)(4,4'oxybis(N-(4-(oxiran-2-ylmethoxy)benzylidene)aniline))、2wt%的NC-3000H環氧樹脂(日本化藥股份有限公司(Nippon Kayaku co.,Ltd))、1wt%的二丙烯基硫化物(DAS)硬化劑、0.5wt%的BYK-W980、2wt%的化學式3環氧加成物全部混合,於40℃、10分鐘攪拌之。然後,添加88wt%的氧化鋁無機填料於此混合物中,在室溫下攪拌20分鐘至30分鐘而得到實施例6之環氧樹脂化合物,其中該環氧加成物亦可先被加入至該硬化劑中,然後再將含有該環氧加成物的硬化劑添加到該結晶環氧樹脂。
(實施例7)
將2wt%的雙酚F、2wt%的鄰甲酚酚醛樹脂、1wt%的4,4氧代雙(N-(4-(環氧乙烷-2-基甲氧基)亞芐基)苯胺)(4,4'oxybis(N-(4-(oxiran-2-ylmethoxy)benzylidene)aniline))、2wt%的
NC-3000H環氧樹脂(日本化藥股份有限公司(Nippon Kayaku co.,Ltd))、1wt%的二丙烯基硫化物(DAS)硬化劑、0.5wt%的BYK-W980、1.5wt%的化學式3環氧加成物全部混合,於40℃、10分鐘攪拌之。然後,添加90wt%的氧化鋁無機填料於此混合物中,在室溫下攪拌20分鐘至30分鐘而得到實施例7之環氧樹脂化合物,其中該環氧加成物亦可先被加入至該硬化劑中,然後再將含有該環氧加成物的硬化劑添加到該結晶環氧樹脂。
(實施例8)
將2wt%的雙酚F、1wt%的鄰甲酚酚醛樹脂、1wt%的4,4氧代雙(N-(4-(環氧乙烷-2-基甲氧基)亞芐基)苯胺)(4,4'oxybis(N-(4-(oxiran-2-ylmethoxy)benzylidene)aniline))、1wt%的NC-3000H環氧樹脂(日本化藥股份有限公司(Nippon Kayaku co.,Ltd))、1wt%的二丙烯基硫化物(DAS)硬化劑、0.5wt%的BYK-W980、1.5wt%的化學式3環氧加成物全部混合,於40℃、10分鐘攪拌之。然後,添加92wt%的氧化鋁無機填料於此混合物中,在室溫下攪拌20分鐘至30分鐘而得到實施例8之環氧樹脂化合物,其中該環氧加成物亦可先被加入至該硬化劑中,然後再將含有該環氧加成物的硬化劑添加到該結晶環氧樹脂。
(比較範例1)
將3wt%的雙酚F、2wt%的鄰甲酚酚醛樹脂、2wt%的環氧樹脂之4,4氧代雙(N-(4-(環氧乙烷-2-基甲氧基)亞芐基)苯胺)(4,4'oxybis(N-(4-(oxiran-2-ylmethoxy)benzylidene)aniline)of epoxy resin)、1wt%的咪唑硬化劑、1.5wt%的咪唑硬化促進劑與0.5wt%的BYK-W980(添加劑)全部混合,於40℃、10分鐘攪拌之。然後,添加90wt%的氧化鋁無機填料於此混合物中,在室溫下攪拌20分鐘至30分鐘而得到實施例3與比較範例1之環氧樹脂化合物。
(比較範例2)
將10.3wt%的雙酚F、2wt%的鄰甲酚酚醛樹脂、1wt%的4,4氧代雙(N-(4-(環氧乙烷-2-基甲氧基)亞芐基)苯胺)(4,4'oxybis(N-(4-(oxiran-2-ylmethoxy)benzylidene)aniline))、1wt%的NC-3000H環氧樹脂(日本化藥股份有限公司(Nippon Kayaku co.,Ltd))、1wt%的咪唑硬化劑、1.5wt%的咪唑硬化促進劑與0.5wt%的BYK-W980(添加劑)全部混合,於40℃、10分鐘攪拌之。然後,添加90wt%的氧化鋁無機填料於此混合物中,在室溫下攪拌20分鐘至30分鐘而得到實施例3與比較範例2之環氧樹脂化合物。
<實驗範例>
導熱係數測量
使用耐馳(NETZSCH)公司的LFA447型熱傳導分析儀透過異常熱傳導法(abnormal heat conduction scheme)分別測定每個實施例和比較範例的導熱係數及其測量結果揭示於表1。
鋁的剝離特性
鋁的剝離特性以環氧樹脂化合物的脫層度來表示,也就是當環氧樹脂化合物塗覆於鋁基板並固化時,然後將鋁基板彎曲180度再恢復成原來的位置。如果脫層度小於0.2厘米,被標記為“○”。如果脫層度於0.2厘米至1厘米的範圍內,被標記為“△”。如果脫層度為1厘米或以上,被標記為“X。鋁的剝離特性揭示於表1。
請參照表1所示,皆具有相同含量氧化鋁的實施例7之導熱係數高於比較範例1之導熱係數。
在本說明書中所提到的〝一(one)實施例〞、〝一(an)實施例〞、〝範例實施例〞等任何的引用,是與該實施例所描述有關特定的功能、結構或特徵特性,是有關於該實施例包含至少一本發明之實施例中。此類說法出現在本文多處並不需要都參考相同的實施例。此外,當一個特定的功能、結構或特性的描述關於任何實施例,認為它是在一熟習技藝者之智識範圍內去影響其他功能、結構或特徵的眾多實施例。
雖然實施例已說明提及其數個說明實施例,應可被推斷由那些熟習技藝者等效推知,而許多其他的更動潤飾和實施例,其屬於本發明之精神和揭露原理範疇內。尤其是各種的變化與修改是可能的組成部分和/或排列組合皆為的本發明所披露的範圍、圖示和所附申請專利範圍。除了變化和修改的組成部分和/或排列組合,各種替代的使用對於那些熟習技藝者也將是顯而易見的選用之。
100‧‧‧散熱電路板
110‧‧‧金屬板
120‧‧‧絕緣層
125‧‧‧無機填料
130‧‧‧電路圖案
150‧‧‧發熱裝置
圖1為說明根據本發明揭露之散熱電路板剖視圖。
100‧‧‧散熱電路板
110‧‧‧金屬板
120‧‧‧絕緣層
125‧‧‧無機填料
130‧‧‧電路圖案
150‧‧‧發熱裝置
Claims (16)
- 一種環氧樹脂化合物,包含:一環氧樹脂包含一結晶環氧樹脂;一硬化劑;以及一無機填料,其中該硬化劑包含環氧加成物,並添加到該結晶環氧樹脂,其中該結晶環氧樹脂以下述化學式來表示,
- 如申請專利範圍第1項所述之環氧樹脂化合物,其中該結晶環氧樹脂佔具該上述化學式之該環氧樹脂總重量之至少50wt%。
- 如申請專利範圍第1項所述之環氧樹脂化合物,其中該環氧樹脂化合物包含該無機填料於該環氧樹脂化合物總重量之40wt%至95wt%。
- 如申請專利範圍第1項所述之環氧樹脂化合物,其中該無機填料包括係選自由氧化鋁、氮化硼、氮化鋁、結晶矽與氮化矽所組成的群組中的至少一個。
- 如申請專利範圍第1項所述之環氧樹脂化合物,其中該環氧 樹脂化合物包含其總重量之3wt%到60wt%的該環氧樹脂。
- 如申請專利範圍第1項所述之環氧樹脂化合物,其中該環氧樹脂化合物包含於該環氧樹脂化合物總重量之0.5wt%到10wt%的該硬化劑。
- 如申請專利範圍第1項所述之環氧樹脂化合物,其中該環氧樹脂化合物包含於該環氧樹脂化合物總重量之0.5wt%到5wt%的該環氧加成物。
- 如申請專利範圍第1項所述之環氧樹脂化合物,其中該環氧加成物以下述化學式來表示,
- 如申請專利範圍第1項所述之環氧樹脂化合物,其中該環氧加成物以下述化學式來表示,化學式
- 如申請專利範圍第1項所述之環氧樹脂化合物,其中該環氧樹脂包含非結晶環氧樹脂。
- 如申請專利範圍第1項所述之環氧樹脂化合物,其中更包含硬化促進劑與交聯劑。
- 一種散熱電路板,包含:一金屬板;一絕緣層形成於該金屬板上;以及一電路圖案形成於該絕緣層上,其中該絕緣層是由固化一環氧樹脂化合物而成,該環氧樹脂化合物包含一環氧樹脂,該環氧樹脂包含一結晶環氧樹脂、一硬化劑、以及一無機填料以及該硬化劑包含環氧加成物並添加到該結晶環氧樹脂,其中該環氧樹脂化合物包含於該環氧樹脂化合物總重量之40wt%至95wt%的該無機填料。
- 如申請專利範圍第12項所述之散熱電路板,其中該無機填料包括係選自由氧化鋁、氮化硼、氮化鋁、結晶矽與氮化矽所組成的群組中的至少一個。
- 如申請專利範圍第12項所述之散熱電路板,其中該環氧樹脂化合物包含於該環氧樹脂化合物總重量之0.5wt%到5wt%的該環氧加成物。
- 如申請專利範圍第12項所述之散熱電路板,其中該環氧加成物以下述化學式來表示,
- 如申請專利範圍第12項所述之散熱電路板,其中該環氧加成物以下述化學式來表示,
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