TWI500852B - Stator - Google Patents

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Publication number
TWI500852B
TWI500852B TW103110815A TW103110815A TWI500852B TW I500852 B TWI500852 B TW I500852B TW 103110815 A TW103110815 A TW 103110815A TW 103110815 A TW103110815 A TW 103110815A TW I500852 B TWI500852 B TW I500852B
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TW
Taiwan
Prior art keywords
circuit board
space
support member
steel sheet
fan stator
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Application number
TW103110815A
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Chinese (zh)
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TW201537035A (en
Inventor
Yung Sheng Tang
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Adda Corp
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Priority to TW103110815A priority Critical patent/TWI500852B/en
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Publication of TWI500852B publication Critical patent/TWI500852B/en
Publication of TW201537035A publication Critical patent/TW201537035A/en

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  • Motor Or Generator Frames (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)

Description

風扇定子Fan stator

本發明是關於一種風扇定子,特別是關於一種具有氣體通道之風扇定子。The present invention relates to a fan stator, and more particularly to a fan stator having a gas passage.

請參閱第1圖,一種習知的散熱風扇10,其包含一定子11、一扇輪12及一基座13,該定子11用以驅動該扇輪12轉動,該定子11包含一下絕緣架11a、一電路板11b及一矽鋼片組11c,該下絕緣架11a、該電路板11b及該矽鋼片組11c設置於該基座13之一軸柱13a,當該定子11驅動該扇輪12轉動時,該矽鋼片組11c或該電路板11b上的電子元件溫度會升高,且該扇輪12轉動時會相對於該基座13之間產生氣牆,因此在該電路板11b與該下絕緣架11a之間溫度較高的空氣會被局限在該電路板11b與該下絕緣架11a之間,而無法與位於該電路板11b與該基座13之間溫度較低的空氣產生對流,使得該矽鋼片組11c或該電路板11b上的電子元件溫度持續上升無法散熱,因而影響散熱風扇10的轉動效能或造成該電路板11b上的電子元件損壞。Referring to FIG. 1 , a conventional heat dissipation fan 10 includes a stator 11 , a fan wheel 12 and a base 13 for driving the rotation of the fan wheel 12 . The stator 11 includes a lower insulation frame 11 a . a circuit board 11b and a steel sheet group 11c, the lower insulation frame 11a, the circuit board 11b and the silicon steel sheet group 11c are disposed on one of the shafts 13a of the base 13, when the stator 11 drives the fan wheel 12 to rotate The temperature of the electronic component on the silicon steel sheet group 11c or the circuit board 11b is increased, and the fan wheel 12 is rotated to generate a gas wall with respect to the base 13, so that the circuit board 11b is insulated from the lower portion. The air of a higher temperature between the shelves 11a is confined between the circuit board 11b and the lower insulating frame 11a, and cannot convect air with a lower temperature between the circuit board 11b and the susceptor 13, so that The temperature of the electronic component on the silicon steel sheet group 11c or the circuit board 11b continues to rise to prevent heat dissipation, thereby affecting the rotation efficiency of the heat dissipation fan 10 or causing damage to the electronic components on the circuit board 11b.

本發明的主要目的在於提供一種風扇定子,其係藉由設置於驅動單元的氣體通道,使位在驅動單元的電路板下方的第一空間與位在矽鋼片組與該電路板之間的第二空間連通。The main object of the present invention is to provide a fan stator which is disposed in a first space below the circuit board of the driving unit and a portion between the silicon steel sheet group and the circuit board by a gas passage disposed in the driving unit. Two spaces are connected.

本發明之一種風扇定子,包含有一驅動單元、一矽鋼片組及一氣體通道,該驅動單元具有一支持件及一電路板,該電路板包含一上表面、一下表面及一貫穿該上表面與該下表面之接合孔,該接合孔具有一封閉的環壁,該電路板結合於該支持件,在該電路板下方具有一第一空間,該矽鋼片組設置於該電路板上方,該矽鋼片組與該電路板之間具有一間隙,使得該矽鋼片組、該電路板與該支持件之間形成有一第二空間,該氣體通道設置於該驅動單元,該氣體通道是鄰近該支持件及該電路板之該接合孔,該氣體通道連通位於該電路板下方之該第一空間及位於該矽鋼片組與該電路板之間的該第二空間。A fan stator of the present invention comprises a driving unit, a silicon steel sheet set and a gas passage. The driving unit has a supporting member and a circuit board. The circuit board includes an upper surface, a lower surface and a through surface. An engagement hole of the lower surface, the connection hole has a closed ring wall, the circuit board is coupled to the support member, and has a first space under the circuit board, the silicon steel sheet set is disposed above the circuit board, the steel plate a gap is formed between the chip set and the circuit board, so that a second space is formed between the silicon steel sheet set, the circuit board and the support member, and the gas passage is disposed on the driving unit, and the gas passage is adjacent to the support member. And the bonding hole of the circuit board, the gas channel is connected to the first space under the circuit board and the second space between the silicon steel sheet group and the circuit board.

當散熱風扇作動時,該矽鋼片組或該電路板上的電子元件溫度會升高,因而影響散熱風扇轉動效能,本發明之該風扇定子是以該氣體通道連通位在該電路板下方的第一空間和位在該矽鋼片組與該電路板之間的第二空間,使空氣可在該氣體通道、該第一空間與該第二空間流動,以利流動的氣流對矽鋼片組或電路板上的電子元件散熱。When the cooling fan is actuated, the temperature of the electronic component of the silicon steel sheet group or the circuit board is increased, thereby affecting the rotation performance of the cooling fan. The fan stator of the present invention is the first of the gas passages under the circuit board. a space and a second space between the set of silicon steel sheets and the circuit board, such that air can flow in the gas passage, the first space and the second space, to facilitate flow of air to the silicon steel sheet set or circuit The electronic components on the board dissipate heat.

請參閱第2圖,為本發明之第一實施例,一種風扇定子100,其用以驅動一扇輪200轉動,該風扇定子100包含一驅動單元110及一矽鋼片組120,該矽鋼片組120可由多個矽鋼片堆疊而成,該驅動單元110具有一支持件111及一電路板112,請參閱第3圖,在本實施例中,該支持件111為一下絕緣架X1的一套筒。Referring to FIG. 2, a first embodiment of the present invention is a fan stator 100 for driving a fan wheel 200. The fan stator 100 includes a driving unit 110 and a silicon steel sheet set 120. The driving unit 110 has a supporting member 111 and a circuit board 112. Referring to FIG. 3, in the embodiment, the supporting member 111 is a sleeve of the lower insulating frame X1. .

請參閱第2及4圖,該電路板112結合於該支持件111,在該電路板112下方具有一第一空間A1,該矽鋼片組120設置於該電路板112上方,該矽鋼片組120與該電路板112之間具有一間隙G,使得該矽鋼片組120、該電路板112與該支持件111之間形成有一第二空間A2,在本實施例中,該電路板112具有一接合孔112a,該支持件111穿設於該電路板112的該接合孔112a。Referring to FIGS. 2 and 4 , the circuit board 112 is coupled to the support member 111 , and has a first space A1 under the circuit board 112 . The silicon steel sheet set 120 is disposed above the circuit board 112 . The silicon steel sheet set 120 . A gap G is formed between the circuit board 112 and the support member 111. The second space A2 is formed between the circuit board 112 and the support member 111. In the embodiment, the circuit board 112 has a joint. The support member 111 is bored in the engagement hole 112a of the circuit board 112.

請參閱第4圖,該風扇定子100包含一氣體通道P,該氣體通道P設置於該驅動單元110,該氣體通道P是鄰近該支持件111及該電路板112之該接合孔112a,該氣體通道P連通位於該電路板112下方之該第一空間A1及位於該矽鋼片組120與該電路板112之間的該第二空間A2,以使空氣於該氣體通道P、該第一空間A1與該第二空間A2流動,在本實施例中,該氣體通道P是為一貫穿該電路板112的一上表面112b及一下表面112c的一通孔112d,該接合孔112a具有一封閉的環壁112e,請參閱第2圖,該通孔112d是凹設於該電路板112的該接合孔112a的一環壁112e。Referring to FIG. 4, the fan stator 100 includes a gas passage P disposed in the driving unit 110. The gas passage P is adjacent to the supporting member 111 and the engaging hole 112a of the circuit board 112. The channel P communicates with the first space A1 located under the circuit board 112 and the second space A2 between the silicon steel sheet group 120 and the circuit board 112 to allow air to pass through the gas channel P and the first space A1. Flowing in the second space A2, in the embodiment, the gas passage P is a through hole 112d penetrating through an upper surface 112b and a lower surface 112c of the circuit board 112. The engagement hole 112a has a closed ring wall. 112e, referring to FIG. 2, the through hole 112d is a ring wall 112e recessed in the engaging hole 112a of the circuit board 112.

請參閱第2及4圖,該風扇定子100另包含一上絕緣架X2,該矽鋼片組120被設置於該下絕緣架X1與該上絕緣架X2之間,一線圈(圖未繪出)繞設該下絕緣架X1、該矽鋼片組120與該上絕緣架X2,並且該線圈電性連接該電路板112,該風扇定子100被裝設於一基座300,且該扇輪200的一輪轂210至少罩蓋該上絕緣架X2及該矽鋼片組120,當該風扇定子100驅動該扇輪200轉動時,該矽鋼片組120或該電路板112上的電子元件(圖未繪出)溫度會升高,由於該氣體通道P(即為通孔112d)連通位在該電路板112下方之該第一空間A1及位於該矽鋼片組120與該電路板112之間的該第二空間A2,使得該第一空間A1之溫度較高的空氣可與該第二空間A2之溫度較低的空氣流動,以對該矽鋼片組120或該電路板112上的電子元件散熱。Referring to Figures 2 and 4, the fan stator 100 further includes an upper insulating frame X2 disposed between the lower insulating frame X1 and the upper insulating frame X2, a coil (not shown). The lower insulating frame X1, the silicon steel sheet set 120 and the upper insulating frame X2 are wound, and the coil is electrically connected to the circuit board 112. The fan stator 100 is mounted on a base 300, and the fan wheel 200 A hub 210 covers at least the upper insulating frame X2 and the silicon steel sheet set 120. When the fan stator 100 drives the fan wheel 200 to rotate, the electronic component on the silicon steel sheet set 120 or the circuit board 112 (not shown) The temperature rises because the gas passage P (that is, the through hole 112d) communicates between the first space A1 below the circuit board 112 and the second portion between the silicon steel sheet group 120 and the circuit board 112. The space A2 is such that the air of the higher temperature of the first space A1 can flow with the air of the lower temperature of the second space A2 to dissipate heat from the electronic components on the silicon steel sheet set 120 or the circuit board 112.

請參閱第5圖,為本發明之第二實施例,一種風扇定子100包含一驅動單元110、一矽鋼片組120及一氣體通道P,第二實施例與第一實施例的差異在於該支持件111接觸該電路板112的該上表面112b,使該第一空間A1之溫度較高的空氣與該第二空間A2之溫度較低的空氣可經由該氣體通道P(即為通孔112d)流動,以對該矽鋼片組120或該電路板112上的電子元件散熱。Referring to FIG. 5, in a second embodiment of the present invention, a fan stator 100 includes a driving unit 110, a silicon steel sheet set 120, and a gas passage P. The second embodiment differs from the first embodiment in the support. The member 111 contacts the upper surface 112b of the circuit board 112 such that air having a higher temperature of the first space A1 and a lower temperature of the second space A2 can pass through the gas passage P (ie, the through hole 112d). Flowing to dissipate heat from the electronic component on the silicon steel sheet set 120 or the circuit board 112.

請參閱第6及8圖,為本發明之第三實施例,一種風扇定子100包含一驅動單元110、一矽鋼片組120及一氣體通道P,該驅動單元110具有一支持件111及一電路板112,該電路板112結合於該支持件111,在本實施例中,該電路板112具有一接合孔112a,該接合孔112a具有一封閉的環壁112e,該支持件111穿設於該電路板112的該接合孔112a。Referring to FIGS. 6 and 8, in a third embodiment of the present invention, a fan stator 100 includes a driving unit 110, a silicon steel sheet set 120, and a gas passage P. The driving unit 110 has a supporting member 111 and a circuit. The board 112 is coupled to the support member 111. In the embodiment, the circuit board 112 has an engagement hole 112a. The engagement hole 112a has a closed annular wall 112e. The support member 111 is disposed in the board. The engagement hole 112a of the circuit board 112.

請參閱第8圖,在該電路板112下方具有一第一空間A1,該矽鋼片組120設置於該電路板112上方,該矽鋼片組120、該電路板112與該支持件111之間形成有一第二空間A2。Referring to FIG. 8 , a first space A1 is disposed under the circuit board 112 . The silicon steel sheet set 120 is disposed above the circuit board 112 . The silicon steel sheet set 120 , the circuit board 112 and the support member 111 are formed. There is a second space A2.

請參閱第7及8圖,第三實施例與第一實施例的差異在於該支持件111具有一環牆111a、一被該環牆111a圍繞之容置空間111b及一設置於該環牆111a的氣孔111c,該容置空間111b連通該第一空間A1,該氣孔111c連通該容置空間111b及該第二空間A2,該氣體通道P是為該容置空間111b及該氣孔111c所構成,該氣體通道P是鄰近該支持件及111該電路板112之該接合孔112a,在本實施例中,該環牆111a具有一末端緣111d,該氣孔111c是凹設於該末端緣111d,該容置空間111b可設置一軸套130及一軸承140,以供該扇輪200的一轉軸220樞設於該軸承140。Referring to FIGS. 7 and 8, the third embodiment differs from the first embodiment in that the support member 111 has a ring wall 111a, a receiving space 111b surrounded by the ring wall 111a, and a ring wall 111a disposed on the ring wall 111a. a venting space 111b, the accommodating space 111b is connected to the accommodating space 111b and the second space A2. The gas channel P is formed by the accommodating space 111b and the air hole 111c. The gas passage P is adjacent to the support member 111 and the engagement hole 112a of the circuit board 112. In this embodiment, the annular wall 111a has an end edge 111d, and the air hole 111c is recessed in the end edge 111d. The sleeve 111b can be provided with a sleeve 130 and a bearing 140 for pivoting a shaft 220 of the fan wheel 200 to the bearing 140.

請參閱第8圖,當該風扇定子100驅動該扇輪200轉動時,該矽鋼片組120或電路板112上的電子元件(圖未繪出)溫度會升高,由於該氣體通道P(即為該容置空間111b及該氣孔111c所構成)連通位在該電路板112下方之該第一空間A1及位於該矽鋼片組120與該電路板112之間的該第二空間A2,使得該第一空間A1之溫度較高的空氣與該第二空間A2之溫度較低的空氣可經由該容置空間111b及該氣孔111c構成的該氣體通道P產生流動,以對該矽鋼片組120或該電路板112上的電子元件散熱。Referring to FIG. 8, when the fan stator 100 drives the fan wheel 200 to rotate, the temperature of the electronic components (not shown) on the silicon steel sheet set 120 or the circuit board 112 rises due to the gas passage P (ie, The first space A1 connected to the receiving space 111b and the air hole 111c under the circuit board 112 and the second space A2 located between the silicon steel sheet group 120 and the circuit board 112, so that the The air having a higher temperature of the first space A1 and the air having a lower temperature of the second space A2 may flow through the accommodating space 111b and the gas passage P formed by the air hole 111c to the pair of silicon steel sheets 120 or The electronic components on the circuit board 112 dissipate heat.

請參閱第9圖,為本發明之第四實施例,一種風扇定子100包含一驅動單元110、一矽鋼片組120及一氣體通道P,第四實施例與第三實施例的差異在於該支持件111接觸該電路板112的該上表面112b,使該第一空間A1之溫度較高的空氣與該第二空間A2之溫度較低的空氣可經由該氣體通道P(即為該容置空間111b及該氣孔111c所構成)產生流動,以對該矽鋼片組120或該電路板112上的電子元件散熱。Referring to FIG. 9, a fourth embodiment of the present invention, a fan stator 100 includes a driving unit 110, a silicon steel sheet set 120, and a gas passage P. The fourth embodiment differs from the third embodiment in that the support The member 111 contacts the upper surface 112b of the circuit board 112, such that the air having a higher temperature of the first space A1 and the air having a lower temperature of the second space A2 can pass through the gas passage P (ie, the accommodating space) 111b and the air hole 111c are configured to generate a flow to dissipate heat from the electronic component on the silicon steel sheet set 120 or the circuit board 112.

本發明之保護範圍當視後附之申請專利範圍所界定者為準,任何熟知此項技藝者,在不脫離本發明之精神和範圍內所作之任何變化與修改,均屬於本發明之保護範圍。The scope of the present invention is defined by the scope of the appended claims, and any changes and modifications made by those skilled in the art without departing from the spirit and scope of the invention are within the scope of the present invention. .

10‧‧‧散熱風扇
11‧‧‧定子
11a‧‧‧下絕緣架
11b‧‧‧電路板
11c‧‧‧矽鋼片組
12‧‧‧扇輪
13‧‧‧基座
13a‧‧‧軸柱
100‧‧‧風扇定子
110‧‧‧驅動單元
111‧‧‧支持件
111a‧‧‧環牆
111b‧‧‧容置空間
111c‧‧‧氣孔
111d‧‧‧末端緣
112‧‧‧電路板
112a‧‧‧接合孔
112b‧‧‧上表面
112c‧‧‧下表面
112d‧‧‧通孔
112e‧‧‧環壁
120‧‧‧矽鋼片組
130‧‧‧軸套
140‧‧‧軸承
200‧‧‧扇輪
210‧‧‧輪轂
220‧‧‧轉軸
300‧‧‧基座
A1‧‧‧第一空間
A2‧‧‧第二空間
G‧‧‧間隙
P‧‧‧氣體通道
X1‧‧‧下絕緣架
X2‧‧‧上絕緣架
10‧‧‧ cooling fan
11‧‧‧ Stator
11a‧‧‧Insulated frame
11b‧‧‧Circuit board
11c‧‧‧矽Steel sheet group
12‧‧‧fan wheel
13‧‧‧Base
13a‧‧‧ shaft column
100‧‧‧fan stator
110‧‧‧ drive unit
111‧‧‧Support
111a‧‧‧Circle wall
111b‧‧‧ accommodating space
111c‧‧‧ vent
111d‧‧‧End edge
112‧‧‧Circuit board
112a‧‧‧Join hole
112b‧‧‧Upper surface
112c‧‧‧ lower surface
112d‧‧‧through hole
112e‧‧‧Circle
120‧‧‧矽Steel sheet group
130‧‧‧ bushings
140‧‧‧ bearing
200‧‧‧fan wheel
210‧‧·wheels
220‧‧‧ shaft
300‧‧‧Base
A1‧‧‧First space
A2‧‧‧Second space
G‧‧‧ gap
P‧‧‧ gas passage
X1‧‧‧ lower insulation frame
X2‧‧‧Insulation frame

第1圖:一種習知的散熱風扇剖視圖。 第2圖:本發明一種風扇定子的第一實施例的立體分解圖。 第3圖:本發明第一實施例的下絕緣架的立體圖。 第4圖:本發明第一實施例的風扇定子及扇輪組合的剖視圖。 第5圖:本發明第二實施例的風扇定子及扇輪組合的剖視圖。 第6圖:本發明一種風扇定子的第三實施例的立體分解圖。 第7圖:本發明第三實施例的下絕緣架的立體圖。 第8圖:本發明第三實施例的風扇定子及扇輪組合的剖視圖。 第9圖:本發明第四實施例的風扇定子及扇輪組合的剖視圖。Figure 1: A cross-sectional view of a conventional heat dissipating fan. Fig. 2 is an exploded perspective view showing a first embodiment of a fan stator of the present invention. Fig. 3 is a perspective view of the lower insulating frame of the first embodiment of the present invention. Fig. 4 is a cross-sectional view showing the fan stator and the fan wheel combination of the first embodiment of the present invention. Fig. 5 is a cross-sectional view showing a combination of a fan stator and a fan wheel according to a second embodiment of the present invention. Figure 6 is a perspective exploded view of a third embodiment of a fan stator of the present invention. Figure 7 is a perspective view of a lower insulating frame of a third embodiment of the present invention. Figure 8 is a cross-sectional view showing a combination of a fan stator and a fan wheel of a third embodiment of the present invention. Figure 9 is a cross-sectional view showing a combination of a fan stator and a fan wheel according to a fourth embodiment of the present invention.

100‧‧‧風扇定子100‧‧‧fan stator

110‧‧‧驅動單元110‧‧‧ drive unit

111‧‧‧支持件111‧‧‧Support

111a‧‧‧環牆111a‧‧‧Circle wall

111b‧‧‧容置空間111b‧‧‧ accommodating space

111c‧‧‧氣孔111c‧‧‧ vent

111d‧‧‧末端緣111d‧‧‧End edge

112‧‧‧電路板112‧‧‧Circuit board

112a‧‧‧接合孔112a‧‧‧Join hole

120‧‧‧矽鋼片組120‧‧‧矽Steel sheet group

130‧‧‧軸套130‧‧‧ bushings

140‧‧‧軸承140‧‧‧ bearing

200‧‧‧扇輪200‧‧‧fan wheel

210‧‧‧輪轂210‧‧·wheels

220‧‧‧轉軸220‧‧‧ shaft

A1‧‧‧第一空間A1‧‧‧First space

A2‧‧‧第二空間A2‧‧‧Second space

P‧‧‧氣體通道P‧‧‧ gas passage

X1‧‧‧下絕緣架X1‧‧‧ lower insulation frame

X2‧‧‧上絕緣架X2‧‧‧Insulation frame

Claims (9)

一種風扇定子,其包含:一驅動單元,具有一支持件及一電路板,該電路板包含一上表面、一下表面及一貫穿該上表面與該下表面之接合孔,該接合孔具有一封閉的環壁,該電路板結合於該支持件,在該電路板下方具有一第一空間,該支持件具有一環牆、一被該環牆圍繞之容置空間及一設置於該環牆的氣孔,該容置空間連通該第一空間;一矽鋼片組,設置於該電路板上方,該矽鋼片組與該電路板之間具有一間隙,使得該矽鋼片組、該電路板與該支持件之間形成有一第二空間,該支持件的該氣孔連通該容置空間及該第二空間;以及一氣體通道,設置於該驅動單元,該氣體通道是鄰近該支持件及該電路板之該接合孔,該氣體通道連通位於該電路板下方之該第一空間及位於該矽鋼片組與該電路板之間的該第二空間,該氣體通道是由該容置空間及該氣孔所構成。 A fan stator includes: a driving unit having a supporting member and a circuit board, the circuit board including an upper surface, a lower surface, and an engaging hole extending through the upper surface and the lower surface, the engaging hole having a closed a circuit board, the circuit board is coupled to the support member, and has a first space under the circuit board, the support member has a ring wall, a receiving space surrounded by the ring wall, and a vent hole disposed in the ring wall The accommodating space is connected to the first space; a steel sheet group is disposed above the circuit board, and a gap is formed between the silicon steel sheet group and the circuit board, so that the silicon steel sheet group, the circuit board and the supporting member Forming a second space therebetween, the air hole of the support member communicates with the accommodating space and the second space; and a gas passage is disposed at the driving unit, the gas passage is adjacent to the support member and the circuit board An engagement hole, the gas passage is connected to the first space below the circuit board and the second space between the steel sheet group and the circuit board, the gas passage is formed by the accommodation space and the air hole to make. 如申請專利範圍第1項所述之風扇定子,其中該氣體通道是為一貫穿該電路板之該上表面及該下表面的通孔。 The fan stator of claim 1, wherein the gas passage is a through hole penetrating the upper surface and the lower surface of the circuit board. 如申請專利範圍第2項所述之風扇定子,該通孔是凹設於該電路板之該接合孔的該環壁。 The fan stator according to claim 2, wherein the through hole is a ring wall recessed in the engaging hole of the circuit board. 如申請專利範圍第2或3項所述之風扇定子,該支持件穿設於該電路板的該接合孔。 The fan stator of claim 2, wherein the support member is disposed through the engagement hole of the circuit board. 如申請專利範圍第2或3項所述之風扇定子,該支持件接觸該電路板的該上表面。 The fan stator of claim 2, wherein the support member contacts the upper surface of the circuit board. 如申請專利範圍第1項所述之風扇定子,其中該環牆具有一末端 緣,該氣孔是凹設於該末端緣。 The fan stator of claim 1, wherein the ring wall has an end The rim is recessed in the end edge. 如申請專利範圍第1項所述之風扇定子,其中該支持件穿設於該電路板的該接合孔。 The fan stator of claim 1, wherein the support member is disposed through the engagement hole of the circuit board. 如申請專利範圍第1項所述之風扇定子,其中該支持件接觸該電路板的該上表面。 The fan stator of claim 1, wherein the support member contacts the upper surface of the circuit board. 如申請專利範圍第1項所述之風扇定子,其中該支持件為一下絕緣架之一套筒。 The fan stator of claim 1, wherein the support member is a sleeve of a lower insulation frame.
TW103110815A 2014-03-24 2014-03-24 Stator TWI500852B (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6318976B1 (en) * 2000-04-10 2001-11-20 Hsieh Hsin-Mao Heat dissipation fan
TWI270615B (en) * 2004-10-18 2007-01-11 Asia Vital Components Co Ltd Heat-dissipation mechanism of fan
TWI287344B (en) * 2004-07-30 2007-09-21 Hon Hai Prec Ind Co Ltd Motor stator

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6318976B1 (en) * 2000-04-10 2001-11-20 Hsieh Hsin-Mao Heat dissipation fan
TWI287344B (en) * 2004-07-30 2007-09-21 Hon Hai Prec Ind Co Ltd Motor stator
TWI270615B (en) * 2004-10-18 2007-01-11 Asia Vital Components Co Ltd Heat-dissipation mechanism of fan

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