TWI498923B - Plastic body with conductive wiring layer and its making method - Google Patents

Description

Plastic body with conductive circuit layer and manufacturing method thereof

The invention relates to a method for manufacturing a plastic body and a product thereof, in particular to a method for manufacturing a plastic body having a conductive circuit layer and a product thereof.

Generally, plastic materials are widely used in daily necessities due to their low electrical conductivity, light weight, chemical stability, impact resistance, transparency and wear resistance, easy forming and coloring, and low cost. Even engineering plastics can be superior. Reinforced properties are used in the industry, such as PET (polyethylene terephthalate), HDPE (high density polyethylene), PVC (polyvinyl chloride), LDPE (low density polyethylene), PP (polypropylene) , PS (polystyrene), ABS (acrylonitrile butadiene styrene) polymers, etc., the most commonly used are polyethylene (PE), polyvinyl chloride (PVC), polypropylene (PP) or polystyrene (PS), ABS, ABS + PC composite materials. In particular, many electronic products are now available, such as computer cases, mobile phone panels, etc. Because plastics have the aforementioned advantages, they are also widely used as materials. However, due to their internal design and functional considerations, electronic products will be carried out on the surface of plastic casings. Electroplating to form a metal layer such as an electronic circuit or an antenna.

In the process of plastic plating, the steps of surface roughening are performed. It is used to increase the surface roughness and surface area of the plastic, so that the later formed coating layer is easy to adhere to the plastic surface and is not easily peeled off.

However, common plastic surface roughening methods include chemical etching, laser roughening, sand blasting, and die biting. The chemical etching method is applicable to plastics such as ABS, ABS+PC, etc., in which B (butadiene) in the ABS terpolymer is dissolved by chromic acid to produce an undercut cavity on the surface, in addition, Other plastics such as PP (polypropylene), PE (polyethylene), PS (polystyrene), PA (polyamide), PMMA (polymethyl methacrylate), LCP (liquid crystal polymer) can also use chemistry. The etching method performs surface roughening, but it is not common because of the poor surface roughening effect or toxicity problem after etching. When the laser roughening method is applied to various thermoplastic plastics, the roughening method is to use the laser beam to rapidly move on the plastic surface for ablation, to instantly melt and solidify the plastic to produce a sponge-like microstructure and create a barb on the surface. Shaped cavity. The laser roughening method is non-toxic and the applicable material is wider than the chemical etching method, but the relative cost is also relatively time consuming. In addition, sandblasting and die biting can increase the roughness of the plastic surface, but it cannot form a barb-shaped cavity on the surface. Therefore, the surface roughening method in plastic plating is not effective.

According to the above description, although the chemical etching method is economical, it is limited by the fact that a specific plastic must be combined with a specific chemical solvent to produce a barb-shaped recess on the surface, and thus cannot be widely applied to other plastic materials. However, although the laser roughening method can be applied to a variety of plastic materials, the surface ablation in a large area takes too long to cause excessive cost, and the ablation process requires precise control to form an appropriate barb-shaped cavity on the surface. . Therefore, how to economically improve the plastic surface on different kinds of plastic substrates It is an urgent problem to solve the problem that the upper inverted hook hole is formed in proportion to achieve proper plastic surface roughening to facilitate the subsequent plating process.

Accordingly, it is an object of the present invention to provide a method of making a plastic body having a conductive circuit layer.

Another object of the present invention is to provide a plastic body having a conductive wiring layer.

Therefore, the method for fabricating a plastic body having a conductive circuit layer comprises the steps of: providing a plastic body, including a plurality of bubble chambers; performing a surface treatment on the plastic body to form a processing surface such that a portion of the plastic body And forming a plurality of recesses on the processed surface; and forming a conductive circuit layer on the processed surface of the plastic body, the conductive circuit layer having a plurality of filling portions corresponding to the recesses respectively under the surface, The conductive circuit layer is tightly coupled to the corresponding recesses by the filling portions without departing from the plastic body.

The plastic body of the invention has a conductive circuit layer, comprising: a body and a conductive circuit layer.

The body includes a machined surface, a plurality of bubble chambers located below the machined surface, and a plurality of recesses formed in the machined surface.

The conductive circuit layer is formed on the processing surface of the body, and the conductive circuit layer has a plurality of fillings corresponding to the recesses respectively corresponding to the holes And the conductive circuit layer is tightly coupled to the corresponding recesses by the filling portions without departing from the body. The method for manufacturing a plastic body having a conductive circuit layer comprises a surface treatment of the plastic body, so that some internal bubbles are exposed on the surface to form a plurality of concave holes to achieve surface roughening effect, and the above method not only costs Low cost, low pollution, and a wide range of suitable plastic materials. However, the plastic body having the conductive circuit layer obtained by the above method is not only lightweight, has high structural strength, and has the ability to absorb impact strength.

1‧‧‧ plastic body

11‧‧‧ bubble room

13‧‧‧Machining surface

2‧‧‧ Conductive circuit layer

20‧‧‧Filling Department

1’‧‧‧ Ontology

11’‧‧‧ bubble room

13’‧‧‧Processed surface

14‧‧‧Deep

140‧‧‧ openings

141‧‧‧ neck

142‧‧‧ bottom

14’‧‧‧Deep

140"‧‧‧ openings

141’‧‧‧ neck

142"‧‧‧ bottom

2'‧‧‧ Conductive circuit layer

20’‧‧‧Filling Department

21‧‧‧Metal media layer

22‧‧‧First metal layer

221‧‧‧Electrical circuit area

222‧‧‧ Non-conductive line area

23‧‧‧Second metal layer

510‧‧‧Plastic body formation steps

520‧‧‧ plastic body surface treatment steps

530‧‧‧ Conductive circuit layer formation steps

531‧‧‧Metal media layer formation steps

532‧‧‧First metal layer formation step

533‧‧‧Drawing steps

534‧‧‧Second metal layer forming step

535‧‧‧ Non-conductive line area removal steps

Other features and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments of the present invention, wherein: Figure 1 is a preferred embodiment of a method of making a plastic body having a conductive circuit layer of the present invention. Figure 2 is a schematic view showing a plastic body formed by one of the steps of the preferred embodiment; Figure 3 is a partial cross-sectional view of Figure 2; Figure 4 is a partial cross-sectional view showing the preferred embodiment of the present invention. In one embodiment, the plastic body is subjected to a surface treatment to form a processed surface; FIG. 5 is a schematic flow chart of forming the conductive circuit layer in the plastic body in the preferred embodiment; and FIG. 6 is a conductive line A partial cross-sectional view of the plastic body of the layer.

Referring to Figure 1, the invention has a plastic body with a conductive circuit layer. A preferred embodiment of the method includes the following steps: Referring to FIG. 2 and FIG. 3, a plastic body forming step 510 is provided with a plastic body 1 having a plurality of bubble chambers 11 therein. The plastic body 1 is a foamed plastic body and is mainly formed by an injection foaming method. Among them, the plastic foaming method can be classified into two types: a chemical foaming method and a physical foaming method depending on the foaming agent used. The chemical foaming method is mainly for mixing a foaming agent and a plastic material, and then heating the plastic mixture to decompose the foaming agent and release a gas to achieve a plastic foaming effect, and a widely used inorganic foaming agent such as sodium hydrogencarbonate. And ammonium carbonate, the organic foaming agent is azoformamide and azobisisobutyronitrile; in addition, it is also possible to foam by using a gas which is chemically reacted with each other in the composition of each plastic material. The physical foaming method is mainly: dissolving the inert gas in a plastic melt or a plastic paste under a pressure, and releasing the gas under reduced pressure, thereby forming pores in the plastic to foam. The inert gas may be one of air, nitrogen and carbon dioxide; or it may be vaporized by heating a low-boiling liquid dissolved in the plastic melt; or a hollow ball may be added to the plastic material to form Foam.

In addition, a supercritical fluid can also be used to form a foamed plastic, which is characterized in that when the temperature and pressure of a substance reach a certain point, the density of the gas-liquid two phases will tend to be uniform, so that the two phases are combined into one uniformity. Phase, this specific point is defined as the critical point of the substance. If it exceeds this point, it will not be liquefied regardless of the increase in pressure. If the temperature rises, it cannot return to the gas phase. The phase region above the critical temperature and the critical pressure is the supercritical region, and is in this phase region. The substance inside is called supercritical fluid. At this time, the gas and the integral nature will tend to be similar. Finally, it is a homogeneous phase fluid with gas compressibility and liquid mobility. Since the process of forming a foamed plastic by a supercritical fluid is well known to those skilled in the art, it will not be repeated here. It is worth mentioning that a plastic body 1 is prepared by mixing the above-mentioned supercritical fluid with a plastic melt, and has a bubble chamber 11 which is extremely small and evenly distributed, compared with the plastic body 1 made by the above method. Therefore, it has better characteristics such as impact resistance, fatigue resistance and shock absorption. Preferably, the plastic body 1 has a specific gravity of less than 10%, and has a low foaming state and a high structural strength. Preferably, the plastic body 1 has a specific gravity reduction of between 10% and 40% or more, and is in a foamed state or a high foaming state to help improve the opening ratio after the subsequent surface treatment.

Referring to FIG. 4, a plastic body surface treatment step 520: performing a surface treatment on the plastic body 1 to form a processing surface 13 such that the bubble chamber 11 of the plastic body 1 is exposed and a plurality of recesses 14 are formed in the processing surface 13. . A portion of the recesses 14 respectively have a neck portion 141 and a bottom portion 142. The width of the neck portion 141 on a longitudinal section is smaller than the maximum width of the longitudinal section below the neck portion 141 to the bottom portion 142. The recesses 14 are tapered by the width of the opening 140 from the processing surface 13 to the bottom 142 at either longitudinal section. The surface treatment method is to dissolve the surface of the plastic body 1 by a strong acid or an organic solvent to form the processed surface 13, the strong acid may be sulfuric acid, hydrochloric acid, and nitric acid, and the organic solvent may be selected to dissolve the corresponding plastic body 1 material. Organic solvent. In addition, the bubble chamber 11 of the plastic body 1 can be physically exposed to form the concave surface. Hole 14, the physical means comprising perforations, slices, or a combination thereof, the perforations comprising piercing the plastic body 1 with one or more sharp objects, suitable sharps including needles, pins, nails, etc., in addition, the slices may include the use of thunder The plastic body 1 is sliced by a jet or high pressure fluid to form the machined surface 13, and the bubble chambers 11 are exposed to the machined surface to form the recesses 14.

Referring to FIG. 5 and FIG. 6, a conductive circuit layer forming step 530 is formed on the processed surface 13 of the plastic body 1 to form a conductive circuit layer 2 having a plurality of the corresponding holes respectively corresponding to the lower surface thereof. In the filling portion 20 of the 14th, the conductive circuit layer 2 is tightly coupled to the corresponding recesses 14 by the filling portions 20 without departing from the plastic body 1. In addition, a metal dielectric layer 21 may be formed on the processed surface 13 of the plastic body 1 and the recesses 14 , and the conductive traces may be formed on the processed surface 13 of the plastic body 1 through the metal dielectric layer 21 . Layer 2. More specifically, the conductive circuit layer forming step 530 has the following five steps; a metal dielectric layer forming step 531: immersing the plastic body 1 in a group of active materials including a metal ion to adsorb the metal ions The processed surface 13 of the plastic body 1 is formed to form a metal dielectric layer 21 selected from the group consisting of palladium, rhodium, iridium, platinum, rhodium, iridium, iridium, or a combination thereof. a first metal layer forming step 532: forming the first metal layer 22 on the metal dielectric layer 21 by electroless plating, and the process conditions for electroless plating are those skilled in the art. As is well known, therefore, no further details are provided here. a patterning step 533: simultaneously removing a portion of the first metal layer 22 and the metal dielectric layer 21 on the processed surface 13 of the plastic body 1 by laser to the first metal layer on the processed surface 22 is divided into a conductive a line area 221 and a non-conductive line area 222 outside the conductive line area 221, the laser including but not limited to infrared laser pulse and green pulse laser, the power can be between 6.0 and 13.0W, pulse The frequency can be between 5.0 and 30.0 kHz. a second metal layer forming step 534: forming a second metal layer 23 on the first metal layer 22 of the conductive line region 221 by electrolytic plating, and the process parameter selection for the metal type selection and electrolytic plating suitable for electrolytic plating is The industry is well known, so I won't go into details here. a non-conductive line region removing step 535: removing the first metal layer 22 located at the portion of the non-conductive line region 222 and the metal dielectric layer 21 located thereunder from the processed surface 13 of the plastic body 1, the remaining The first metal layer 22 of the conductive line region 221 and the second metal layer 23 thereon and the underlying metal layer dielectric layer 21 constitute the conductive circuit layer 2. Since the electroless plating method does not have the problem of uneven current distribution in the electrolytic plating method, a uniform thickness can be obtained, so that the first metal layer 22 can be uniformly attached to the inner surface of the cavities 14 as a subsequent electrolysis. An electrolytic plating starting layer for electroplating. However, the electrolytic plating method can selectively form the second metal layer 23 only in the conductive line region 221 through which the first metal layer 22 is supplied with current, and can change the second by adjusting parameters such as current density and electrolytic plating time. The rate of formation (structural density) and thickness of the metal layer 23 is such that the conductive circuit layer 2 of any shape and having specific physical properties such as resistance is formed on the surface of the plastic body 1.

It is worth mentioning that in the plastic body forming step 510, a part of the bubble chamber 11 can be directly exposed on the surface to form the plastic body 1 of the plurality of recesses 14 under the control of appropriate foaming parameters. The subsequent plastic body surface treatment step 520 is omitted, and the conductive circuit layer forming step 530 is directly performed to form the conductive circuit layer 2 on the surface of the plastic body 1.

Referring to Figure 6, a preferred embodiment of a plastic body having a conductive circuit layer of the present invention comprises: a body 1' and a conductive circuit layer 2'.

The body 1' includes a machined surface 13' and a plurality of bubble chambers 11' located below the machined surface 13', and a plurality of recesses 14' formed from the machined surface 13'.

The conductive circuit layer 2' is formed on the processing surface 13' of the body 1', and the conductive circuit layer 2' has a plurality of filling portions 20' respectively filled in the recesses 14' below the conductive lines The layers 2' are intimately joined to the corresponding recesses 14' by the filling portions 20' without departing from the body 1'.

A portion of the recesses 14' respectively have a neck portion 141' and a bottom portion 142'. The width of the neck portion 141' at a longitudinal section is smaller than the maximum width of the longitudinal section below the neck portion 141'. A portion of the recesses 14' are tapered from the opening 140' of the machined surface 13' to the width of the bottom portion 142' at either longitudinal section.

Preferably, the body 1' has a specific gravity lower than 10%, and has a low foaming state and a high structural strength. Preferably, the bulk 1' has a specific gravity reduction of between 10% and 40% or more, which is in a foamed state or a high foaming state to help improve the open porosity after subsequent surface treatment.

In summary, the manufacturing method of the plastic body having the conductive circuit layer of the present invention is performed by subjecting the plastic body 1 to a surface treatment to make the interior The bubble chamber 11 is exposed on the surface to form a plurality of recesses 14. The partial recesses 14 respectively have a neck portion 141 and a bottom portion 142. The neck portion 141 has a width on a longitudinal section smaller than the neck portion 141 to the bottom portion. The maximum width of the longitudinal section is 142 or less. However, the conductive layer 2 is not separated from the plastic body 1 by being filled and tightly bonded to the corresponding filling portions 20 of the recesses 14, and the above method is not only Low cost, low pollution, and a wide range of suitable plastic materials. The foamed plastic body having the conductive circuit layer obtained by the above method is not only lightweight, has high structural strength, and has the ability to absorb impact strength, so that the object of the present invention can be achieved.

The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the simple equivalent changes and modifications made by the patent application scope and patent specification content of the present invention, All remain within the scope of the invention patent.

510‧‧‧Plastic body formation steps

520‧‧‧ plastic body surface treatment steps

530‧‧‧ Conductive circuit layer formation steps

531‧‧‧Metal media layer formation steps

532‧‧‧First metal layer formation step

533‧‧‧Drawing steps

534‧‧‧Second metal layer forming step

535‧‧‧ Non-conductive line area removal steps

Claims (14)

A manufacturing method of a plastic body having a conductive circuit layer, comprising the steps of: providing a plastic body, including a plurality of bubble chambers; performing a surface treatment on the plastic body to form a processing surface, such that a portion of the plastic body is such a bubble chamber Forming a plurality of recesses on the processed surface; and forming a conductive circuit layer on the processed surface of the plastic body, the conductive circuit layer having a plurality of filling portions respectively corresponding to the recesses below the conductive line The layers are joined to the corresponding plastic bodies by the filling portions without departing from the plastic body. The method of manufacturing a plastic body having a conductive circuit layer according to claim 1, wherein the plastic body is a foamed plastic body. The method for manufacturing a plastic body having a conductive circuit layer according to claim 1, wherein the manufacturing of the plastic body comprises the steps of: mixing a foaming agent with a plastic material, and then heating and foaming and solidifying. The method for manufacturing a plastic body having a conductive circuit layer according to claim 1, wherein the manufacturing of the plastic body comprises the steps of: mixing a supercritical fluid with a plastic melt into a single-phase fluid, and then decompressing the pressure. Curing molding. The manufacturing method of the plastic body having the conductive circuit layer according to claim 1, wherein the partial recesses respectively have a neck portion, and the width of the neck portion to the bottom portion on a longitudinal section is smaller than that at the neck portion. The bottom range is below the maximum width of the longitudinal section, and the rest of the The cavities are tapered by the opening at the machined surface to the width of the bottom at either longitudinal section. The method of manufacturing a plastic body having a conductive circuit layer according to claim 1, wherein the surface treatment dissolves a surface of the plastic body with one of a strong acid and an organic solvent to form the processed surface. The method of fabricating a plastic body having a conductive circuit layer according to claim 1, wherein the surface treatment is one of physically performing punching, slicing, and a combination thereof. The method of manufacturing a plastic body having a conductive circuit layer according to claim 1, wherein a metal medium layer is formed on the processed surface of the plastic body and the recesses, and the metal medium layer is passed through the plastic medium layer. The machined surface of the body forms the conductive circuit layer. The method of manufacturing a plastic body having a conductive circuit layer according to claim 8, further comprising: forming a first metal layer by electroless plating on the metal medium layer and electrolytic plating on the surface of the first metal layer; Forming a second metal layer, the metal dielectric layer, the first metal layer and the second metal layer forming the conductive circuit layer on the processed surface of the plastic body. The method for fabricating a plastic body having a conductive circuit layer according to claim 1, wherein the conductive circuit layer forming step has the following five steps: a metal dielectric layer forming step: immersing the plastic body in a group of components a metal ion active solution, the metal ion is adsorbed to the processed surface of the plastic body to form the metal medium layer; a first metal layer forming step: the plastic body is electrolessly plated on the metal Forming the first metal layer on the dielectric layer; a patterning Step: simultaneously removing a portion of the first metal layer and the metal dielectric layer on the processed surface of the plastic body by laser to distinguish the first metal layer on the processed surface into a conductive line region and a a non-conductive circuit region outside the conductive line; a second metal layer forming step: forming the second metal layer on the first metal layer of the conductive line region by electrolytic plating; and removing a non-conductive circuit region Disposing the first metal layer on the non-conductive line region outside the conductive line region and the metal dielectric layer under the conductive line region from the processed surface of the plastic body, and retaining the first portion located in the conductive line region A metal layer and the second metal layer thereon and the underlying metal layer dielectric layer constitute the conductive circuit layer. A plastic body having a conductive circuit layer, comprising: a body, a processing surface, a plurality of bubble chambers located below the processing surface, and a plurality of recesses formed on the processing surface; and a conductive circuit layer formed on The processing surface of the body, the conductive circuit layer has a plurality of filling portions respectively corresponding to the recesses below, and the conductive circuit layer is combined with the corresponding recesses by the filling portions without being separated The body. The plastic body having a conductive circuit layer according to claim 11, wherein the body is a foamed plastic body. The plastic body having a conductive circuit layer according to claim 11, wherein the partial recesses respectively have a neck portion, and the width of the neck portion to the bottom portion on a longitudinal section is smaller than the neck portion to the bottom portion. The maximum width of the longitudinal section is such that the remaining portions of the recess are tapered by the opening at the machined surface to the width of the bottom at either longitudinal section. A manufacturing method of a plastic body having a conductive circuit layer, comprising the steps of: forming a plastic body having a plurality of bubble chambers, wherein some of the bubbles are exposed on a surface of the plastic body; and the surface of the plastic body and the exposed body A metal dielectric layer is formed in the space of the bubble chamber; and a conductive circuit layer is formed on the surface of the plastic body through the metal dielectric layer.