CN102448262A - Enclosure structure and manufacturing method for electronic device - Google Patents
Enclosure structure and manufacturing method for electronic device Download PDFInfo
- Publication number
- CN102448262A CN102448262A CN2010105053613A CN201010505361A CN102448262A CN 102448262 A CN102448262 A CN 102448262A CN 2010105053613 A CN2010105053613 A CN 2010105053613A CN 201010505361 A CN201010505361 A CN 201010505361A CN 102448262 A CN102448262 A CN 102448262A
- Authority
- CN
- China
- Prior art keywords
- metalwork
- hole
- those
- casing
- electronic apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The invention discloses an enclosure structure and a manufacturing method for an electronic device. The enclosure structure for the electronic device comprises a metal piece and a plastic piece, wherein a plurality of miniature anchor holes are arranged on the surface of the metal piece, and each miniature anchor hole is provided with an irregular internal wall. The plastic piece is combined on the surface of the miniature anchor holes provided by the metal piece in an injection molding manner, and the plastic piece is filled in the miniature anchor holes and is fully attached to the irregular internal wall.
Description
Technical field
The present invention relates to a kind of casing of electronic apparatus structure and manufacturing approach thereof, particularly relate to the casing of electronic apparatus structure and the manufacturing approach thereof of bond part and plastic parts.
Background technology
Along with developing rapidly of science and technology, electronic installation, for example notebook computer, mobile phone or personal digital assistant (PDA, Personal Digital Assistant) begin to be widely used.At present, on the casing of electronic apparatus with the combination of metalwork and plastic parts mainly contain structure lock screw fashion, plastic cement structure hot melting way, covered with glue is bonding and imbed modes such as metalwork is injected and molded in.
When the metal shell thickness of electronic installation is reduced to a certain degree; Do not have enough spaces and adopt the mechanism of screw, trip engaging and hot melt riveted joint; Simultaneously also cause coming off easily between metalwork and the plastic parts because of insufficient strength easily, influence the quality of product.
Summary of the invention
The object of the present invention is to provide a kind of casing of electronic apparatus structure and manufacturing approach thereof, make treated metalwork and plastic parts integrally formed, must not be coated with any sticker and interfacial agents therebetween, can produce strong adhesion.
For reaching above-mentioned purpose, the present invention provides a kind of manufacturing approach of casing of electronic apparatus structure, comprises that step is following.One metalwork is provided.Anodized is carried out on surface to metalwork, and forms an oxide-film on the surface of metalwork.Oxide-film have a plurality of nanoscale holes (40～50nm), have straight uniform inwall in each nanoscale hole.These a little nanoscale holes are corroded processing,, therefore form a miniature anchor hole hole, and each miniature anchor hole hole has concavo-convex inequality or irregular inwall in order to strengthen the size of each nanoscale hole.Adopt injection molding to be incorporated into the surface of metalwork in the plastics after one fusion, and plastics fill up this slightly during type anchor hole hole, and depend on the inwall in miniature anchor hole hole fully.
In one embodiment of the invention, this is that barrier layer through oxide-film separates slightly between type anchor hole hole, and these a little barrier layers produce reaming or holes causes mutual perforation because of corroding to handle.
In one embodiment of the invention, carry out the step of anodized, comprise anodized is carried out in acid solution contact and the surface that acts on metalwork for metalwork.
In the another embodiment of the present invention; These a little nanoscale holes are corroded processed steps; More comprise the surface that a chemical solution is contacted and acts on metalwork tool nanoscale hole; Make chemical solution infiltrate and corrode this a little nanoscale holes, and enlarge the degree of depth, the bore of these a little nanoscale holes, and the inwall of each nanoscale hole of surface roughening is to produce the inwall of concavo-convex inequality.
Among the embodiment more of the present invention, the step of metalwork is provided, is included in that coining goes out an indenture portion on the metalwork, so can produce miniature anchor hole hole to the specific region.The step of the surface of metalwork being carried out anodized comprises that the inner surface to indenture portion carries out anodized.Nanoscale hole to indenture portion corrodes processing again.
Casing of electronic apparatus structure of the present invention comprises a metalwork and a plastic parts.The surface of metalwork is arranged with a plurality of miniature anchor holes hole.The inwall that each miniature anchor hole hole has concavo-convex inequality.Plastic parts adopts injection molding to be incorporated into the surface of metalwork, and wherein plastic parts is filled in this slightly in the type anchor hole hole, and is attached to this fully slightly on the inwall in type anchor hole hole.
In one embodiment of the invention, the material of metalwork is magnesium, aluminium, titanium or its alloy.
Among the another embodiment of the present invention, plastic parts tool one hollow projection, solid projection, fin, trip or flange.
Among the another embodiment of the present invention, metalwork has an indenture portion, and this is positioned at the surface of indenture portion in type anchor hole hole slightly.
So, through the inwall of the concavo-convex inequality in the present invention miniature anchor hole hole, and barrier layer connects miniature anchor hole hole because of corroding to handle each other.Borrowing the high speed and high pressure injection mo(u)lding that plastics are penetrated filling in miniature anchor hole hole; After treating that plastic cool is shaped to plastic parts; Plastic parts with grasping firmly in miniature anchor hole hole; And then improve plastic parts and bigger to each other pulling force and the adhesion of metalwork, just can reduce the probability that plastic parts breaks away from metalwork.
Description of drawings
For letting above-mentioned and other purposes of the present invention, characteristic, advantage and the embodiment can be more obviously understandable, the detailed description of appended accompanying drawing be following:
Fig. 1 is the flow chart of manufacturing approach under an embodiment of casing of electronic apparatus structure of the present invention;
Fig. 2 A is the sketch map of metalwork after the step 101 of carrying out Fig. 1 of casing of electronic apparatus structure of the present invention;
Fig. 2 B is the sketch map of metalwork after the step 103 of carrying out Fig. 1 of casing of electronic apparatus structure of the present invention;
Fig. 2 C is the sketch map of metalwork after the step 105 of carrying out Fig. 1 of casing of electronic apparatus structure of the present invention;
Fig. 2 D is the sketch map of metalwork after the step 107 of carrying out Fig. 1 of casing of electronic apparatus structure of the present invention;
Fig. 3 has the end view of indenture portion for the metalwork of casing of electronic apparatus structure of the present invention;
Fig. 4 is the sketch map of metalwork under an embodiment of casing of electronic apparatus structure of the present invention;
Fig. 5 A is the sketch map of metalwork under an embodiment of casing of electronic apparatus structure of the present invention;
Fig. 5 B is the 5B-5B cutaway view of Fig. 5 A;
Fig. 6 is the sketch map of metalwork under another variation of casing of electronic apparatus structure of the present invention.
The main element symbol description
100: casing structure 250: indenture portion
200: metalwork 300: diaphragm
210: oxide-film 400: plastic parts
220: nanoscale hole 410: hollow projection
221: inwall 420: extension
230: miniature anchor hole hole 430: fin
231: inwall 440: flange
240: barrier layer 101-107: step
Embodiment
Below will and specify and clearly demonstrate spirit of the present invention, as be familiar with these technological personnel behind the understanding embodiments of the invention with diagram, when can be by the technology of teachings of the present invention, change and modification, it does not break away from spirit of the present invention and scope.
Because the casing of electronic installation penetrates in the manufacturing process imbedding, during the oxide-film of plastic parts injection mo(u)lding to metalwork, because adhesion to each other is not enough; Make plastic parts on metalwork, come off easily and rupture that the present invention further improves its manufacturing approach, mainly before a plastic parts is injected and molded in a metalwork surface; With metalwork through anode treatment to form the nanoscale hole of marshalling; Behind acid etching, the nanoscale hole is enlarged, in plastics inject the hole after enlarging again; Produce active force, avoid plastic parts to break away from the purpose of metalwork to reach like anchor.
See also shown in Figure 1ly, Fig. 1 is the flow chart of manufacturing approach under an embodiment of casing of electronic apparatus structure of the present invention.The manufacturing approach of casing of electronic apparatus structure of the present invention in one embodiment, its step comprises as follows:
Provide in the step of metalwork 200, the metalwork 200 of this casing of electronic apparatus structure can be through the moulding of various metal forming technology such as die casting, extruding or forging institute.The material of metalwork 200 can be aluminium or titanium or its alloy.
In this step, it is following more to comprise thin portion step.(1) metalwork 200 is soaked in an acetone (Pyruvicacid, CH3COCOOH) solution; (2) to carry out first time ultrasonic waves clean to soaking metalwork 200 behind the acetone soln with pure water; (3) metalwork 200 after ultrasonic waves is cleaned is soaked in a potassium hydroxide (KOH) solution; (4) metalwork 200 is carried out the electrobrightening program; And (5) are carried out second time ultrasonic waves to metalwork 200 and are cleaned.
Anodized (see Fig. 2 B, Fig. 2 B illustrates the sketch map of metalwork after the step 103 of carrying out Fig. 1 of casing of electronic apparatus structure of the present invention) is carried out on the surface of step 103 pair metalwork 200.
In this step, when using acid solution that anodized is carried out on the surface of metalwork 200, the surface of metalwork 200 will produce an oxide-film 210.This oxide-film 210 is covered with in the surface of metalwork 200 is also evenly distributed has the hole array, because bore (for example being 40-50nm) the tool nano-grade size of these a little hole arrays size, so be referred to as nanoscale hole 220.In addition, has straight uniform inwall 221 in each nanoscale hole 220.What need explanation is that these a little nanoscale holes 220 do not run through oxide-film 210.
In this step, treat that metalwork 200 is formed with these a little nanoscale holes 220 after, just can pure water metalwork 200 be comprised these a little nanoscale holes 220 and carries out ultrasonic waves and clean.
The inventor is in testing repeatedly; Find when metalwork 200 is promptly sent into the injection molding mould after step 103 forms nanoscale hole 220; Because it is not enough that plastics inject the degree of depth and the rough degree of nanoscale hole 220; Its pulling force and adhesion still are apparent not enough, and are easy to generate the thing that plastics come off and rupture.
Therefore, in this step 105, the present invention continues these a little nanoscale holes 220 of this metalwork 200 are corroded processing.
In this step, with the surface of a chemical solution contact nanometer level hole 220, make chemical solution corrode these a little nanoscale holes 220, and then strengthen the size of each nanoscale hole 220.The kind of chemical solution and details will be exposed in the back literary composition.Because the bore of each nanoscale hole 220 has been extended to micron-sized size, so the hole after each nanoscale hole 220 suffers erosion is called miniature anchor hole hole 230.
In this step, treat that metalwork 200 forms miniature anchor hole hole 230 after, just can carry out electrobrightening, and with pure water metalwork 200 comprised this and carry out ultrasonic waves and clean in type anchor hole hole 230 slightly, then with metalwork 200 bone dries metalwork 200.
In this step; After metalwork 200 is inserted the injection molding mould; Adopt injection molding to be incorporated into the surface of metalwork 200 in the plastics after one fusion, and plastics fill up this slightly during type anchor hole hole 230, depend on the inwall 231 in miniature anchor hole hole 230 fully; Forming plastic parts 400, and then produce the integrally formed casing of electronic apparatus structure of metalwork 200 and plastic parts 400.
See again shown in Fig. 2 B; In one embodiment of the invention; When anodized is carried out on the surface of carrying out step 103 pair metalwork 200, for example be oxalic acid (C2H2O4, Oxalic acid) or sulfuric acid (H2SO4; Sulfuric acid) acid solution contacts and acts on the surface of metalwork 200, makes the surface of metalwork 200 produce oxide-film 210.
In addition, when the integral surface to metalwork 200 carries out anodized, can metalwork 200 be placed on the electrolysis tank and positive electrode with above-mentioned acid solution.Electrolysis tank is adjustable to a stable temperature, can begin to carry out anodized; After waiting to accomplish and taking out metalwork 200, can washed with de-ionized water metalwork 200 surfaces residual anode treatment solution.
See again shown in Fig. 2 B and Fig. 2 C; In the another embodiment of the present invention, when carrying out step (105), can be with a chemical solution; For example acid solution is (like phosphoric acid (phosphoric acid) or sulfuric acid (H2SO4; Sulfuric acid)) action of soaking makes chemical solution corrode these a little nanoscale holes 220, and then strengthens the size of each nanoscale hole 220 and the inwall 221 of each nanoscale hole 220 of roughening in the surface of metalwork 200 tool nanoscale holes 220.
In detail, the size that strengthens nanoscale hole 220 comprises the degree of depth of deepening these a little nanoscale holes 220 and the caliber size that enlarges these a little nanoscale holes 220, and the degree of depth of each nanoscale hole 220, bore differ.In addition, through the erosion of chemical solution, the inwall 231 in each miniature anchor hole hole 230 forms irregular dendroid and distributes simultaneously, and demonstrates the rough surface of concavo-convex inequality.In addition, in a preferred embodiment, this slightly the pore size in type anchor hole hole 230 in the scope below 5～6 microns.
In the process of corrode handling, the many factors that will note are arranged, as concentration of pickling solution temperature and pickling solution or the like (for example percentage by weight be 5% and the parameter condition of 20 ℃ of temperature), temperature is high more, erosive velocity is fast more; And chemical solution (being attack solution) concentration is high more, and erosive velocity is also fast more; So long as strong acid solution or strong base solution can reach etched effect.
This is that 240 of barrier layers through oxide-film 210 separate slightly between type anchor hole hole 230.Barrier layer 240 can make barrier layer 240 particle separation and the big or small homogeneous of oxide-film 210 via under the anode manufacture craft parameter control, and barrier layer 240 is after handling through erosion; The particle of barrier layer 240 begins to form damaged, reaming, causes communicate with each other (Fig. 2 C), so; When carrying out step (107); Plastics fill up this slightly behind the type anchor hole hole 230, produce as the pulling force of anchor, more can increase plastic parts 400 and the bigger to each other adhesion of metalwork 200.
See also shown in Figure 3ly, the metalwork 200 that Fig. 3 illustrates casing of electronic apparatus structure of the present invention has the sketch map of indenture portion 250.Among the another embodiment of the present invention; When metalwork 200 only needs its local surfaces to produce miniature anchor hole hole 230; Metalwork 200 can go out an indenture portion 250 at the local surfaces coining of metalwork 200 when various metal forming technology such as die casting, extruding or the forging institute moulding of step 101.
When the metalwork with indenture portion 250 200 when carrying out step 103, at first carry out anodized, and then the interior table in indenture portion 250 forms oxide-film 210, and nanoscale hole 220 (Fig. 2 B).
When the metalwork with indenture portion 250 200 when carrying out step (105); Can above-mentioned chemical solution be poured in the indenture portion 250; Make above-mentioned chemical solution only contact the inner surface in the indenture portion 250; And the nanoscale hole 220 of the inner surface of indenture portion 250 corroded processing, and then form miniature anchor hole hole 230 (Fig. 2 C and Fig. 2 D).In addition, indenture portion 250 can make the chemical solution set wherein, and limits chemical solution in the good indenture portion 250 of planning, because step (105) is in neat indenture, to carry out, so the miniature anchor hole hole 230 of institute's moulding has the effect of marshalling.So also can save and in large tracts of land, form the required expense in miniature anchor hole hole 230.
See also again shown in Fig. 2 D, the present invention discloses a kind of casing of electronic apparatus structure 100.Casing of electronic apparatus structure 100 comprises a metalwork 200 and a plastic parts 400.The surface of metalwork 200 is arranged with a plurality of miniature anchor holes hole 230.Each miniature anchor hole hole 230 has the inwall 231 of concavo-convex inequality.Plastic parts 400 adopts injection moldings to be incorporated into the surface of metalwork 200, and wherein plastic parts 400 is filled in this slightly in the type anchor hole hole 230, and depends on this fully slightly on the inwall 231 in type anchor hole hole 230.
In one embodiment of the invention, metalwork 200 is tabular.The external form variation of plastic parts 400 can be hollow projection, solid projection, fin, trip or flange.
See also shown in Figure 4ly, Fig. 4 illustrates casing of electronic apparatus structure of the present invention, the sketch map of its metalwork under an embodiment.During one of plastic parts 400 changed, metalwork 200 had a cut.Plastic parts 400 comprises a hollow projection 410 and an extension 420, and hollow projection 410 passes cut and is incorporated on the metalwork 200, and extension 420 and hollow projection 410 are one-body molded and be covered on the one side of metalwork 200.
See also shown in Fig. 5 A and Fig. 5 B, Fig. 5 A illustrates the sketch map of metalwork under a variation of casing of electronic apparatus structure of the present invention.Fig. 5 B illustrates the 5B-5B cutaway view of Fig. 5 A.During another of plastic parts 400 changed, plastic parts 400 was a fin 430, and fin 430 is around the edge of metalwork 200, and was incorporated into the surface of metalwork 200.
See also shown in Figure 6ly, Fig. 6 illustrates the sketch map of metalwork 200 under another variation of casing of electronic apparatus structure 100 of the present invention.In the another variation of plastic parts 400, plastic parts 400 is a flange 440, and flange 440 is positioned at the edge of metalwork 200, and is incorporated into the surface of metalwork 200.
In sum; So, through the inwall of the concavo-convex inequality in miniature anchor hole hole, plastics just can be filled in the miniature anchor hole hole; And the shape of the miniature anchor hole of foundation hole inwall depends on the inwall in miniature anchor hole hole fully; After treating that plastic cool is shaped to plastic parts, plastic parts in miniature anchor hole hole, is made that the plastic parts part corresponding with the inner wall shape in miniature anchor hole hole just can't be by being pulled out in the miniature anchor hole hole by grasping firmly; And then improve plastic parts and bigger to each other pulling force and the adhesion of metalwork, just can reduce the probability that plastic parts breaks away from metalwork.
The present invention discloses among each embodiment as above; Be not in order to limiting the present invention, anyly be familiar with this operator, do not breaking away from the spirit and scope of the present invention; Can do various changes and retouching, thus protection scope of the present invention should with enclose claim was defined is as the criterion.
Claims (12)
1. the manufacturing approach of a casing of electronic apparatus structure, it comprises:
One metalwork is provided;
This metalwork is carried out anodized, and form an oxide-film on the surface of this metalwork, wherein this oxide-film has a plurality of holes, has an inwall in each those hole;
Those holes are corroded processing, strengthen the size of each those hole, and those inwalls are formed the inwall with concavo-convex inequality so that it forms a miniature anchor hole hole; And
Adopt injection molding to be incorporated into the surface of this metalwork one molten plastic, wherein this molten plastic fills up those miniature anchor hole holes, and depends on the inwall in this miniature anchor hole hole fully.
2. the manufacturing approach of casing of electronic apparatus structure as claimed in claim 1, wherein the pore size of each those hole is between 40 nanometer to 50 nanometers; The pore size in each those miniature anchor hole hole is below 5 microns.
3. the manufacturing approach of casing of electronic apparatus structure as claimed in claim 1 wherein is that the barrier layer through this oxide-film separates between those miniature anchor hole holes, and those barrier layers produce reaming or holes causes mutual perforation because of corroding to handle.
4. the manufacturing approach of casing of electronic apparatus structure as claimed in claim 1 wherein comprises the step that this metalwork carries out anodized:
With acid solution contact and this surface of acting on this metalwork to carry out anodized.
5. the manufacturing approach of casing of electronic apparatus structure as claimed in claim 4, wherein corrode processed steps to those holes and comprise:
With chemical solution contact and act on the surface of these those holes of metalwork tool, make this chemical solution infiltrate and corrode those holes, and enlarge the degree of depth, the bore of those holes, and the inwall of each those hole of roughening.
6. the manufacturing approach of casing of electronic apparatus structure as claimed in claim 5 wherein provides the step of this metalwork to be included in that coining goes out an indenture portion on this metalwork.
7. the manufacturing approach of casing of electronic apparatus structure as claimed in claim 6 wherein comprises that to the step that anodized is carried out on the surface of this metalwork the inner surface to this indenture portion carries out anodized.
8. the manufacturing approach of casing of electronic apparatus structure as claimed in claim 7 wherein corrodes processed steps to those holes and comprises that those holes to the inner surface of this indenture portion corrode processing.
9. casing of electronic apparatus structure, it comprises:
Metalwork, its surface are arranged with a plurality of miniature anchor holes hole, wherein the inwall of each those miniature anchor hole hole with concavo-convex inequality; And
Plastic parts adopts injection molding to be incorporated into this surface of this metalwork, and wherein this plastic parts is filled in those miniature anchor hole holes, and depends on fully on the inwall of this concavo-convex inequality.
10. casing of electronic apparatus structure as claimed in claim 9, wherein the material of this metalwork is to be selected from the group that is made up of aluminium alloy or titanium alloy.
11. casing of electronic apparatus structure as claimed in claim 9, wherein this plastic parts tool one hollow projection, solid projection, fin, trip or flange.
12. casing of electronic apparatus structure as claimed in claim 9, wherein this metalwork has an indenture portion, and those miniature anchor hole holes are positioned at the surface of this indenture portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105053613A CN102448262A (en) | 2010-10-09 | 2010-10-09 | Enclosure structure and manufacturing method for electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105053613A CN102448262A (en) | 2010-10-09 | 2010-10-09 | Enclosure structure and manufacturing method for electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102448262A true CN102448262A (en) | 2012-05-09 |
Family
ID=46010178
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105053613A Pending CN102448262A (en) | 2010-10-09 | 2010-10-09 | Enclosure structure and manufacturing method for electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102448262A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103582329A (en) * | 2012-07-24 | 2014-02-12 | 富泰华工业（深圳）有限公司 | Shell and manufacturing method thereof |
| CN103963214A (en) * | 2013-02-05 | 2014-08-06 | 台北科技大学 | Method for bonding aluminum-containing base material and plastic |
| CN105530789A (en) * | 2014-12-26 | 2016-04-27 | 比亚迪股份有限公司 | Communication equipment metal shell and preparation method thereof |
| CN105658008A (en) * | 2014-11-12 | 2016-06-08 | 比亚迪股份有限公司 | Metal housing and preparation method thereof, and communication device |
| CN105960131A (en) * | 2016-06-23 | 2016-09-21 | 东莞劲胜精密组件股份有限公司 | 3C (Computer, Communication, Consumer Electronics) product shell and preparation method thereof |
| CN106816687A (en) * | 2017-01-17 | 2017-06-09 | 广东欧珀移动通信有限公司 | Method for producing shell and mobile terminal |
| WO2017114294A1 (en) * | 2015-12-30 | 2017-07-06 | 比亚迪股份有限公司 | Aluminum alloy housing and preparation method therefor |
| CN107992161A (en) * | 2017-11-13 | 2018-05-04 | 广东欧珀移动通信有限公司 | Housing and preparation method thereof, mobile terminal |
| CN108284562A (en) * | 2017-01-10 | 2018-07-17 | 优尔材料工业（深圳）有限公司 | Zirconium-based amorphous alloy part and plastic part composite and preparation method thereof |
| CN109986742A (en) * | 2017-12-29 | 2019-07-09 | 比亚迪股份有限公司 | Waterproof dyes mobile phone shell and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101623933A (en) * | 2008-07-10 | 2010-01-13 | 晟铭电子科技股份有限公司 | Method for embedding thermoplastic material into metal material |
| CN101670647A (en) * | 2008-09-10 | 2010-03-17 | 晟铭电子科技股份有限公司 | Method for embedding thermoplastic or thermoset material in metal material |
-
2010
- 2010-10-09 CN CN2010105053613A patent/CN102448262A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101623933A (en) * | 2008-07-10 | 2010-01-13 | 晟铭电子科技股份有限公司 | Method for embedding thermoplastic material into metal material |
| CN101670647A (en) * | 2008-09-10 | 2010-03-17 | 晟铭电子科技股份有限公司 | Method for embedding thermoplastic or thermoset material in metal material |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103582329B (en) * | 2012-07-24 | 2016-08-03 | 富泰华工业（深圳）有限公司 | Housing and manufacture method thereof |
| CN103582329A (en) * | 2012-07-24 | 2014-02-12 | 富泰华工业（深圳）有限公司 | Shell and manufacturing method thereof |
| CN103963214A (en) * | 2013-02-05 | 2014-08-06 | 台北科技大学 | Method for bonding aluminum-containing base material and plastic |
| CN105658008A (en) * | 2014-11-12 | 2016-06-08 | 比亚迪股份有限公司 | Metal housing and preparation method thereof, and communication device |
| CN105658008B (en) * | 2014-11-12 | 2019-01-29 | 比亚迪股份有限公司 | A kind of metal shell and preparation method thereof, communication apparatus |
| CN105530789A (en) * | 2014-12-26 | 2016-04-27 | 比亚迪股份有限公司 | Communication equipment metal shell and preparation method thereof |
| WO2016101877A1 (en) * | 2014-12-26 | 2016-06-30 | 比亚迪股份有限公司 | Communication device metal housing and manufacturing method thereof |
| WO2017114294A1 (en) * | 2015-12-30 | 2017-07-06 | 比亚迪股份有限公司 | Aluminum alloy housing and preparation method therefor |
| CN105960131A (en) * | 2016-06-23 | 2016-09-21 | 东莞劲胜精密组件股份有限公司 | 3C (Computer, Communication, Consumer Electronics) product shell and preparation method thereof |
| CN108284562A (en) * | 2017-01-10 | 2018-07-17 | 优尔材料工业（深圳）有限公司 | Zirconium-based amorphous alloy part and plastic part composite and preparation method thereof |
| CN106816687A (en) * | 2017-01-17 | 2017-06-09 | 广东欧珀移动通信有限公司 | Method for producing shell and mobile terminal |
| CN106816687B (en) * | 2017-01-17 | 2019-12-06 | Oppo广东移动通信有限公司 | Shell manufacturing method and mobile terminal |
| CN107992161A (en) * | 2017-11-13 | 2018-05-04 | 广东欧珀移动通信有限公司 | Housing and preparation method thereof, mobile terminal |
| CN109986742A (en) * | 2017-12-29 | 2019-07-09 | 比亚迪股份有限公司 | Waterproof dyes mobile phone shell and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102448262A (en) | Enclosure structure and manufacturing method for electronic device | |
| CN102441962B (en) | Method for manufacturing electronic device shell | |
| CN103582329B (en) | Housing and manufacture method thereof | |
| JP5425111B2 (en) | Method for producing a three-dimensional structure having a hydrophobic surface using an immersion method | |
| EP3435748A1 (en) | Metallic shell having ceramic panel and preparation method and use thereof | |
| CN106217754B (en) | The metal and its surface treatment method and metal-resin composite of surface treatment | |
| EP2835450B1 (en) | Micro-nano processing method for aluminum or aluminum alloy surface | |
| CN103158226B (en) | The preparation method of the complex of metal and plastics and complex | |
| TW201212780A (en) | Shell of electronic device and method for manufacturing the same | |
| CN102786230A (en) | Glass-plastic complex and preparation method thereof | |
| CN106637376B (en) | The preparation method of glassy metal nano-porous structure | |
| KR101043456B1 (en) | Electrolytic machining apparatus | |
| US8540919B2 (en) | Manufacturing method of housing of electronic device | |
| CN106811785A (en) | The processing method and aluminum metal housing of aluminium gold metal surface | |
| CN110191409B (en) | Manufacturing method of waterproof breathable film | |
| Yoon et al. | Facile and clean release of vertical Si nanowires by wet chemical etching based on alkali hydroxides | |
| CN106884193B (en) | The preparation method of alloy-plastic combined case | |
| CN105132985A (en) | Metal element and resin compound body and manufacturing method of metal element and resin compound body | |
| CN103129027B (en) | The preparation method of the complex of metal and plastics and this complex | |
| CA2538322A1 (en) | Process for chemical etching of parts fabricated by sterolithography | |
| CN110271119B (en) | Method for manufacturing waterproof breathable film by using mold | |
| TW561089B (en) | Method for manufacturing mold inserts of light guide plates | |
| CN210112262U (en) | Waterproof ventilated membrane, mold thereof and loudspeaker | |
| CN115110139B (en) | Titanium alloy workpiece, shell, preparation method of titanium alloy workpiece and etching liquid | |
| JP2007284767A (en) | Porous metal material and manufacturing method therefor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120509 |