TWI497976B - Contact image-sensing module - Google Patents
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- TWI497976B TWI497976B TW098143520A TW98143520A TWI497976B TW I497976 B TWI497976 B TW I497976B TW 098143520 A TW098143520 A TW 098143520A TW 98143520 A TW98143520 A TW 98143520A TW I497976 B TWI497976 B TW I497976B
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Description
本發明涉及掃描裝置領域,尤係關於一種接觸式影像感測模組。 The present invention relates to the field of scanning devices, and more particularly to a contact image sensing module.
在掃描器中,常用的影像感測元件分為接觸式影像感測器(Contact Image Sensor,CIS)與電荷耦合元件(Charge-coupled Device,CCD)兩種。相比於電荷耦合元件,接觸式影像感測器由於具有價格低廉及容易製作的優點,已廣泛應用於家用低價的掃描器及傳真機中。 In the scanner, commonly used image sensing components are classified into a contact image sensor (CIS) and a charge-coupled device (CCD). Compared with charge-coupled components, contact image sensors have been widely used in home low-cost scanners and fax machines because of their low cost and ease of fabrication.
掃描器中,通常由一發光二極體(Light Emitting Diode,LED)光源、一玻璃板、一透鏡組及一接觸式影像感測元件構成一接觸式影像感測模組。該玻璃板具有一矩形截面,待掃描物體與發光二極體光源分別位於該玻璃板的上、下兩側,發光二極體光源發出的光經玻璃板斜射向待掃描物體上並產生一反射光,該反射光經玻璃板傳至透鏡元件,藉由該透鏡元件將反射光導向接觸式影像感測元件,並由該接觸式影像感測元件將光信號轉換成電信號。為使發光二極體光源發出的光穿過玻璃板後均勻散佈在待掃描物體上,發光二極體光源與玻璃板之間需間隔一定距離以使光散開,由此導致該影像感測器的結構不緊湊,空間利用率不高。 In the scanner, a contact image sensing module is generally formed by a light emitting diode (LED) light source, a glass plate, a lens group and a contact image sensing component. The glass plate has a rectangular cross section, and the object to be scanned and the light source of the light emitting diode are respectively located on the upper and lower sides of the glass plate, and the light emitted by the light source of the light emitting diode is obliquely incident on the object to be scanned through the glass plate and generates a reflection. The light is transmitted to the lens element through the glass plate, and the reflected light is guided to the contact image sensing element by the lens element, and the optical signal is converted into an electrical signal by the contact image sensing element. In order to make the light emitted by the light-emitting diode light source pass through the glass plate and evenly spread on the object to be scanned, a distance between the light-emitting diode light source and the glass plate is required to spread the light, thereby causing the image sensor. The structure is not compact and the space utilization is not high.
有鑒於此,有必要提供一種結構緊湊且照光均勻的接觸式影像感 測模組。 In view of this, it is necessary to provide a compact and uniform illumination image. Test module.
一種接觸式影像感測模組,包括一接觸式影像感測元件、一透鏡組、一玻璃板及一發光二極體光源,該玻璃板的橫截面為楔形,包括一入光面、一第一出光面及一第二出光面,該發光二極體光源設於該玻璃板的入光面一側,該透鏡組位於該玻璃板的第二出光面與該接觸式影像感測元件之間,該發光二極體光源發出的光線自玻璃板的入光面進入玻璃板,由入光面進入玻璃板的一部分光線直接經玻璃板的第一出光面射出以照射一待掃描物體,由入光面進入玻璃板的另一部分光線經第二出光面反射後再經第一出光面射出以照射該待掃描物體。 A contact image sensing module includes a contact image sensing component, a lens group, a glass plate and a light emitting diode light source, the glass plate has a wedge shape in cross section, and includes a light incident surface, a first a light emitting surface and a second light emitting surface, the light emitting diode light source is disposed on a light incident surface side of the glass plate, the lens group is located between the second light emitting surface of the glass plate and the contact image sensing element The light emitted by the light emitting diode light source enters the glass plate from the light incident surface of the glass plate, and a part of the light entering the glass plate from the light incident surface is directly emitted through the first light emitting surface of the glass plate to illuminate an object to be scanned, and Another portion of the light entering the glass plate is reflected by the second light-emitting surface and then emitted through the first light-emitting surface to illuminate the object to be scanned.
與習知技術相比,該接觸式影像感測模組的結構緊湊,所佔用空間減小,且能夠在較大範圍內對待掃描物體進行均勻照光。 Compared with the prior art, the contact image sensing module has a compact structure, a small occupied space, and can uniformly illuminate an object to be scanned in a wide range.
100‧‧‧接觸式影像感測模組 100‧‧‧Contact Image Sensing Module
10‧‧‧電路板 10‧‧‧ boards
20‧‧‧接觸式影像感測元件 20‧‧‧Contact image sensing components
21‧‧‧接觸式影像感測器 21‧‧‧Contact Image Sensor
30‧‧‧承載座 30‧‧‧Hosting
31‧‧‧通孔 31‧‧‧through hole
40‧‧‧透鏡組 40‧‧‧ lens group
41‧‧‧柱狀透鏡 41‧‧‧ lenticular lens
50‧‧‧玻璃板 50‧‧‧ glass plate
51‧‧‧入光面 51‧‧‧Into the glossy surface
52‧‧‧第一出光面 52‧‧‧The first glazing
53‧‧‧第二出光面 53‧‧‧Second glazing
60‧‧‧發光二極體光源 60‧‧‧Lighting diode source
61‧‧‧導光板 61‧‧‧Light guide plate
62‧‧‧發光二極體 62‧‧‧Lighting diode
611‧‧‧出光側 611‧‧‧light side
612‧‧‧入光側 612‧‧‧ light side
613‧‧‧鋸齒結構 613‧‧‧Sawtooth structure
70‧‧‧待掃描物體 70‧‧‧ objects to be scanned
圖1係本發明接觸式影像感測模組一較佳實施例的組合示意圖。 1 is a schematic diagram of a combination of a preferred embodiment of a contact image sensing module of the present invention.
圖2係圖1所示接觸式影像感測模組的分解圖。 2 is an exploded view of the contact image sensing module of FIG. 1.
圖3係圖1所示接觸式影像感測模組由另一角度所視的分解圖。 3 is an exploded view of the contact image sensing module of FIG. 1 viewed from another angle.
圖4係圖1所示接觸式影像感測模組的截面圖。 4 is a cross-sectional view of the contact image sensing module of FIG. 1.
下面將結合附圖對本發明作一具體介紹。 The present invention will be specifically described below with reference to the accompanying drawings.
如圖1至圖4所示為本發明接觸式影像感測模組100的一較佳實施例。該接觸式影像感測模組100包括一電路板10、一接觸式影像感測元件20、一承載座30、一透鏡組40、一玻璃板50及一發光二極體光源60。該接觸式影像感測模組100的該等元件可共同設置 於一掃描器或者傳真機的殼體(圖未示)內。 FIG. 1 to FIG. 4 show a preferred embodiment of the contact image sensing module 100 of the present invention. The contact image sensing module 100 includes a circuit board 10 , a contact image sensing component 20 , a carrier 30 , a lens assembly 40 , a glass panel 50 , and a light emitting diode source 60 . The components of the contact image sensing module 100 can be set together In a scanner or fax machine housing (not shown).
該電路板10為縱長形且呈水平放置,該接觸式影像感測元件20設於該電路板10上。該接觸式影像感測元件20包括複數接觸式影像感測器21,該等接觸式影像感測器21沿電路板10的縱長方向排成三排。 The circuit board 10 is vertically elongated and horizontally disposed. The contact image sensing component 20 is disposed on the circuit board 10. The contact image sensing device 20 includes a plurality of contact image sensors 21 arranged in three rows along the longitudinal direction of the circuit board 10.
該承載座30位於該電路板10的上方,所述承載座30呈長條狀且具有一矩形截面。該承載座30上開設有複數沿豎直方向延伸的通孔31,所述通孔31沿承載座30的長度方向排列成三排。該透鏡組40位於接觸式影像感測元件20的正上方,包括複數柱狀透鏡41。所述柱狀透鏡41呈豎直放置並對應收容於承載座30的通孔31內,每一柱狀透鏡41的下端與該接觸式影像感測元件20的一感測單元相對。 The carrier 30 is located above the circuit board 10. The carrier 30 has an elongated shape and has a rectangular cross section. The carrier 30 is provided with a plurality of through holes 31 extending in the vertical direction, and the through holes 31 are arranged in three rows along the longitudinal direction of the carrier 30. The lens group 40 is located directly above the contact image sensing element 20 and includes a plurality of lenticular lenses 41. The lenticular lens 41 is vertically disposed and correspondingly received in the through hole 31 of the carrier 30. The lower end of each of the lenticular lenses 41 is opposite to a sensing unit of the contact image sensing element 20.
該玻璃板50位於該透鏡組40的上方且呈長條狀。該玻璃板50的橫截面為楔形,包括一入光面51、一第一出光面52及一第二出光面53。該入光面51位於該玻璃板50的一側並向下朝透鏡組40傾斜,該玻璃板50的厚度由該入光面51所在一側向另一相對側逐漸變薄。該第一出光面52位於該玻璃板50的頂部且呈水平設置,第一出光面52與柱狀透鏡41的頂面平行。該第二出光面53位於玻璃板50的底部並與透鏡組40的柱狀透鏡41的頂端相對,該透鏡組40位於該第二出光面53與該接觸式影像感測元件20之間。 The glass plate 50 is located above the lens group 40 and has an elongated shape. The glass plate 50 has a wedge shape in cross section, and includes a light incident surface 51, a first light exit surface 52 and a second light exit surface 53. The light incident surface 51 is located on one side of the glass plate 50 and is inclined downward toward the lens group 40. The thickness of the glass plate 50 is gradually thinned from the side where the light incident surface 51 is located to the other opposite side. The first light-emitting surface 52 is horizontally disposed at the top of the glass plate 50, and the first light-emitting surface 52 is parallel to the top surface of the lenticular lens 41. The second light-emitting surface 53 is located at the bottom of the glass plate 50 and opposite to the top end of the lenticular lens 41 of the lens group 40 . The lens group 40 is located between the second light-emitting surface 53 and the contact image sensing element 20 .
該發光二極體光源60包括一導光板61及兩發光二極體62。該導光板61設於該玻璃板50的入光面51一側,具有與該玻璃板50的入光面51相對的一出光側611及位於兩端的兩入光側612。所述導光板61靠近玻璃板50的入光面51設置,該兩發光二極體62設於該導光 板61的兩端,發光二極體62發出的光線由入光側612進入導光板61並自出光側611均勻地導出該導光板61。該導光板61的出光側611沿導光板61的長度方向形成有複數鋸齒結構613,以使自該導光板61的出光側611出射的光線更加均勻。該發光二極體光源60中,發光二極體62亦可以僅設於導光板61的一端,導光板61的每一端所設發光二極體62的數目亦可以為多個。 The light-emitting diode light source 60 includes a light guide plate 61 and two light-emitting diodes 62. The light guide plate 61 is disposed on the light incident surface 51 side of the glass plate 50, and has a light exiting side 611 opposite to the light incident surface 51 of the glass plate 50 and two light incident sides 612 at both ends. The light guide plate 61 is disposed near the light incident surface 51 of the glass plate 50, and the two light emitting diodes 62 are disposed on the light guide plate At both ends of the plate 61, the light emitted from the light-emitting diode 62 enters the light guide plate 61 from the light-incident side 612 and is uniformly led out from the light-emitting side 611. The light-emitting side 611 of the light guide plate 61 is formed with a plurality of sawtooth structures 613 along the longitudinal direction of the light guide plate 61 to make the light emitted from the light-emitting side 611 of the light guide plate 61 more uniform. In the light-emitting diode light source 60, the light-emitting diode 62 may be provided only at one end of the light guide plate 61, and the number of the light-emitting diodes 62 provided at each end of the light guide plate 61 may be plural.
如圖4所示,當使用該接觸式影像感測模組100對一待掃描物體70進行掃描時,該待掃描物體70設置於玻璃板50的頂端並與玻璃板50的第一出光面52相對。由發光二極體光源60的導光板61出射的光線自玻璃板50的入光面51進入玻璃板50,由於玻璃板50的橫截面為楔形,由入光面51進入玻璃板50的一部分光線直接經玻璃板50的第一出光面52射出以照射待掃描物體70,由入光面51進入玻璃板50的另一部分光線則經第二出光面53反射後再經第一出光面52射出以照射該待掃描物體70,使得由玻璃板50射出的光線可在較大範圍內對待掃描物體70進行均勻照光。經第一出光面52射向待掃描物體70的光線會被該待掃描物體70反射回玻璃板50,並由玻璃板50的第二出光面53出射後射向透鏡組40的柱狀透鏡41。該柱狀透鏡41將經玻璃板50的第二出光面53射出的光線導向接觸式影像感測元件20的接觸式影像感測器21,該接觸式影像感測元件20將透鏡組40所採集的線狀光學影像轉換成數位影像信號,並由電路板10將該數位影像信號傳至接觸式影像感測模組100的外部。 As shown in FIG. 4 , when the object to be scanned 70 is scanned by using the contact image sensing module 100 , the object to be scanned 70 is disposed at the top end of the glass plate 50 and the first light emitting surface 52 of the glass plate 50 . relatively. The light emitted from the light guide plate 61 of the light-emitting diode light source 60 enters the glass plate 50 from the light-incident surface 51 of the glass plate 50. Since the cross-section of the glass plate 50 is wedge-shaped, a part of the light entering the glass plate 50 from the light-incident surface 51 is obtained. Directly passing through the first light-emitting surface 52 of the glass plate 50 to illuminate the object 70 to be scanned, and another portion of the light entering the glass plate 50 from the light-incident surface 51 is reflected by the second light-emitting surface 53 and then emitted through the first light-emitting surface 52. The object to be scanned 70 is irradiated so that the light emitted from the glass plate 50 can uniformly illuminate the object 70 to be scanned over a wide range. The light that is incident on the object to be scanned 70 through the first light-emitting surface 52 is reflected by the object 70 to be scanned back to the glass plate 50, and is emitted by the second light-emitting surface 53 of the glass plate 50 to be incident on the lenticular lens 41 of the lens group 40. . The lenticular lens 41 guides the light emitted from the second light-emitting surface 53 of the glass plate 50 to the contact image sensor 21 of the contact image sensing device 20, and the contact image sensing device 20 collects the lens group 40. The linear optical image is converted into a digital image signal, and the digital image signal is transmitted from the circuit board 10 to the outside of the contact image sensing module 100.
該接觸式影像感測模組100中,玻璃板50的橫截面為楔形,由入光面51進入玻璃板50的一部分光線直接經玻璃板50的第一出光面 52射出以照射待掃描物體70,由入光面51進入玻璃板50的另一部分光線則經第二出光面53反射後再經第一出光面52射出以照射該待掃描物體70,因此發光二極體光源60的導光板61可以盡可能地靠近玻璃板50的入光面51設置,甚至貼合於玻璃板50的入光面51,由玻璃板50的第一出光面52射出的光線仍能夠對待掃描物體70進行均勻照光,從而使得該接觸式影像感測模組100的結構緊湊,接觸式影像感測模組100所佔用空間減小。又由於該接觸式影像感測模組100可在較大範圍內對待掃描物體70進行均勻照光,從而可相應地增加透鏡組40之柱狀透鏡41的數目及接觸式影像感測元件20的接觸式影像感測器21的數目,進而提高掃描速度。例如本實施例中,透鏡組40的柱狀透鏡41及接觸式影像感測元件20的接觸式影像感測器21均設置有三排。 In the contact image sensing module 100, the cross section of the glass plate 50 is wedge-shaped, and a part of the light entering the glass plate 50 from the light incident surface 51 directly passes through the first light emitting surface of the glass plate 50. 52 is emitted to illuminate the object 70 to be scanned, and another portion of the light entering the glass plate 50 from the light incident surface 51 is reflected by the second light exit surface 53 and then emitted through the first light exit surface 52 to illuminate the object 70 to be scanned, thereby emitting light The light guide plate 61 of the polar body light source 60 can be disposed as close as possible to the light incident surface 51 of the glass plate 50, even to the light incident surface 51 of the glass plate 50, and the light emitted by the first light exit surface 52 of the glass plate 50 is still The object to be scanned 70 can be uniformly illuminated, so that the structure of the contact image sensing module 100 is compact, and the space occupied by the contact image sensing module 100 is reduced. Moreover, since the contact image sensing module 100 can uniformly illuminate the object to be scanned 70 in a wide range, the number of the lenticular lenses 41 of the lens group 40 and the contact of the contact image sensing element 20 can be correspondingly increased. The number of image sensors 21, which in turn increases the scanning speed. For example, in the present embodiment, the lenticular lens 41 of the lens group 40 and the contact image sensor 21 of the contact image sensing element 20 are each provided in three rows.
綜上所述,本發明符合發明專利要件,爰依法提出專利申請。惟,以上所述者僅為本發明之較佳實施例,舉凡熟悉本案技藝之人士,在爰依本發明精神所作之等效修飾或變化,皆應涵蓋於以下之申請專利範圍內。 In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.
100‧‧‧接觸式影像感測模組 100‧‧‧Contact Image Sensing Module
10‧‧‧電路板 10‧‧‧ boards
20‧‧‧接觸式影像感測元件 20‧‧‧Contact image sensing components
30‧‧‧承載座 30‧‧‧Hosting
40‧‧‧透鏡組 40‧‧‧ lens group
50‧‧‧玻璃板 50‧‧‧ glass plate
60‧‧‧發光二極體光源 60‧‧‧Lighting diode source
61‧‧‧導光板 61‧‧‧Light guide plate
62‧‧‧發光二極體 62‧‧‧Lighting diode
Claims (7)
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TW098143520A TWI497976B (en) | 2009-12-18 | 2009-12-18 | Contact image-sensing module |
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TWI497976B true TWI497976B (en) | 2015-08-21 |
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TWI507011B (en) * | 2012-02-10 | 2015-11-01 | Creative Sensor Inc | Contact image sensing device |
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JPH10257247A (en) * | 1997-03-14 | 1998-09-25 | Omron Corp | Image reader and scanner |
US20080029691A1 (en) * | 2006-08-03 | 2008-02-07 | Han Jefferson Y | Multi-touch sensing display through frustrated total internal reflection |
US20080121787A1 (en) * | 2006-11-24 | 2008-05-29 | Sun-Hyoung Pyo | Input apparatus and touch screen using the same |
US20090122226A1 (en) * | 2005-04-12 | 2009-05-14 | Hyun Ha Hwang | Liquid Crystal Display Device and Mobile Station Having the Same |
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2009
- 2009-12-18 TW TW098143520A patent/TWI497976B/en not_active IP Right Cessation
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JPH10257247A (en) * | 1997-03-14 | 1998-09-25 | Omron Corp | Image reader and scanner |
US20090122226A1 (en) * | 2005-04-12 | 2009-05-14 | Hyun Ha Hwang | Liquid Crystal Display Device and Mobile Station Having the Same |
US20080029691A1 (en) * | 2006-08-03 | 2008-02-07 | Han Jefferson Y | Multi-touch sensing display through frustrated total internal reflection |
US20080121787A1 (en) * | 2006-11-24 | 2008-05-29 | Sun-Hyoung Pyo | Input apparatus and touch screen using the same |
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