TWI496167B - A conductive plate having a plurity of conductive films - Google Patents

Description

Conductive plate with multiple conductive films

The present invention relates to a conductive plate, and more particularly to a conductive plate having a plurality of conductive films.

Carbon nanotube (CNT) is a hollow tube composed of carbon atoms and having a diameter of nanometer. With the change of the length, diameter and spiral mode of the carbon nanotubes, the carbon nanotubes can be presented. Metallic or semiconducting properties are expected to play an important role in many different technical fields due to their excellent properties.

Since CNTs are electrically conductive, attempts have been made to fabricate conductive films from CNTs. In the conductive film produced by CNT, the production conditions are relatively easy to produce a transparent conductive film such as indium tin oxide (ITO), and the production cost is lower than that of other transparent conductive films. Because of the optical grade penetration requirement of the transparent conductive film, the transparent conductive film made of CNT needs to reduce the density of the CNT itself to achieve higher penetration.

The current method is to use a CNT cluster grown on a wafer (or other substrate) to mechanically force the CNT clusters on the wafer (or other substrate) to be suspended into a transparent conductive film. Finally, the CNT transparent conductive film is carefully attached to the sized substrate at a slight speed to fix the CNT transparent conductive film on the substrate to form a conductive plate having a conductive function.

With the development of liquid crystal displays and the like, the demand for large-area conductive plates is becoming more and more important, but the CNTs are stretched from wafers (or other substrates). The conductive film is limited by the size of the wafer (or other substrate) so that the width is limited, and a large-area conductive plate cannot be fabricated.

The present invention provides a conductive plate having a plurality of conductive films to solve the conventional problems.

Other objects and advantages of the present invention will become apparent from the technical features disclosed herein.

In order to achieve the above object, a preferred embodiment of the present invention discloses a conductive plate having a plurality of conductive films. The conductive plate with the plurality of conductive films comprises a substrate, a plurality of conductive films and a colloid. Each of the conductive films has a plurality of nano cells, and the colloid is used to carry the conductive film on the substrate.

The plurality of conductive films may be disposed side by side on the substrate, may be stacked on the substrate, or may be partially overlapped on the substrate.

A conductive plate with a plurality of conductive films according to the present invention places a plurality of conductive films on a substrate by side by side or stacking, etc., thereby forming a large-area conductive plate, and reducing impedance to increase maximum Transmit current value.

The features and implementations of the present invention are described in detail below with reference to the preferred embodiments.

Please refer to FIG. 1 and FIG. 1 is a schematic view showing a first embodiment of a conductive plate having a plurality of conductive films according to the present invention.

In the present embodiment, the conductive plate 100 having a plurality of conductive films includes a substrate 10, a colloid 20, and a plurality of conductive films 30. The plurality of conductive films 30 are disposed side by side on the substrate 10, and the colloid 20 is used to carry the plurality of conductive films 30 on the substrate 10. on.

The substrate 10 can be a transparent substrate. The transparent material substrate may include a glass substrate or a polymer transparent material substrate. The polymer transparent material substrate may be a substrate comprising polymethylmethacrylate (PMMA), polyethylene terephthalate (PET) or polycarbonate resin (P C). However, in the case where the substrate of the present invention is a polymer transparent material substrate, the polymer transparent material is not limited to the above examples, and may be other polymer transparent materials.

The substrate 10 may also be an opaque substrate such as a metal substrate, a semiconductor substrate, a printed circuit board, a plastic substrate, or the like. The plastic substrate can be formed by a plastic substrate having a color or a color applied outside the transparent substrate.

The conductive film 30 can be formed by growing a cluster of nano-cells on a wafer (or other substrate), and then mechanically stretching the nano-cell clusters on the wafer (or other substrate) into a transparent Conductive film. The manner in which the nanocell clusters are grown on the wafer (or other substrate) can be transmitted by an arc discharge, a laser vaporization, or a chemical vapor deposition. The above substrate may be a wafer, graphite or the like. The nano unit described above may be a nano unit of an anisotropic shape, and the nano unit having a length and a width different in the shape of the nano unit of the anisotropic shape is, for example, a carbon nanotube or the like. The nano unit of the upper number may also be a substantially isotropic shape-forming nano unit, such as a nano particle.

In detail, when one of the above-mentioned nano-cells is subjected to external pulling force to leave the wafer (or other substrate), another nano-cell adjacent to the nano-unit may be between the nano-unit and the nano-unit The van der Waals force is taken away from the wafer (or other substrate). Here, when a plurality of nano cells on a wafer (or other substrate) are subjected to When the external tension pulls away from the wafer (or other substrate), each of the nano-units subjected to the external tensile force will cascade a plurality of nano-units to form a nano-unit bundle (not shown), so The plurality of nano cells on the wafer (or other substrate) form a conductive film 30 having a plurality of nano cell bundles in a stretching process, and the plurality of nano cell bundles in the conductive film 30 are in a specific direction The X array arrangement, that is, the plurality of nano cell units in the conductive film 30 are arranged substantially in a specific direction X.

Each of the nanocell bundles has a plurality of tentacles extending to connect the other nanocell bundles. Therefore, when a current flows through the conductive film 30, a large current can flow in a direction along a specific direction X, and when a current flows in a direction different from a specific direction X, only a small current can flow, so that a current is formed. The conductive film 200 has electrical anisotropy. Here, the so-called electrical anisotropy, also known as conductive anisotropy or electrical anisotropy, has different conductive properties or electrical impedance properties in different directions.

The colloid 20 can be selected from a photocurable adhesive, a thermosetting adhesive or a photo-thermosetting adhesive depending on the curing method. The so-called photocurable gel refers to a colloid that is cured by irradiation of light of a specific wavelength band, such as an ultraviolet curing glue, and a so-called thermosetting gel refers to a colloid that solidifies in an environment above a certain temperature range. The so-called photo-thermosetting glue refers to a colloid that needs to be cured in a certain temperature range and is irradiated by light of a specific wavelength. In addition, the colloid 20 may also be provided with a conductive colloid, such as a conductive polymer glue.

In the present embodiment, a substrate 10, a colloid 20, and a plurality of conductive films 30 are provided first. Next, the colloid 20 is formed on the substrate 10, and the method of forming the colloid 20 on the substrate 10 can form the colloid 20 on the substrate 10 by means of printing coating, spin coating or titration. Finally, the plurality of conductive films 30 are carried on the substrate 10 by the colloid 20. In detail, the plurality of conductive films 30 are arranged side by side in the glue The body 20 is disposed opposite to the side surface of the substrate 10, and a large-area conductive plate can be obtained by arranging the plurality of conductive films 30 side by side on the substrate 10. Therefore, when the plurality of conductive films 30 are carried on the substrate 10, the colloid 20 is present between the conductive film 30 and the substrate 10. The plurality of conductive films 30 are arranged side by side along a substantially parallel specific direction X and are serially connected to the substrate 10.

In the present embodiment, after the plurality of conductive films 30 are disposed side by side and in series on the substrate 10, the plurality of conductive films 30 may be subjected to laser treatment. The method of performing laser processing on the plurality of conductive films 30 may utilize a laser to process the plurality of conductive films 30 back and forth substantially parallel to a specific direction for increasing electrical anisotropy and transparency, and may also utilize lasers to be substantially perpendicular to a specific The plurality of conductive films 30 are processed back and forth to increase their transparency. The colloid 20 is then cured. In detail, when the colloid 20 is a photocurable adhesive, the colloid 20 is cured by irradiation with light of a specific wavelength band; when the colloid 20 is a thermosetting adhesive, the colloid 20 is placed in an environment above a certain temperature range to make the colloid 20 When the colloid 20 is a photo-thermosetting glue, the colloid 20 is placed in an environment above a certain temperature range and irradiated with light of a specific wavelength band to cure the colloid 20.

A conductive plate 100 having a plurality of conductive films according to the present embodiment is provided on the substrate 10 by placing the plurality of conductive films 30 side by side and in series, whereby a large-area conductive plate can be fabricated.

Fig. 2 is a schematic view showing a second embodiment of the conductive plate having a plurality of conductive films of the present invention.

Please refer to "Fig. 2" and refer to the foregoing embodiment in combination. The difference between this embodiment and the foregoing embodiment is that the plurality of conductive films 30 are partially overlapped and arranged on the substrate 10 along a second specific direction Y different from the specific direction X. Each of the conductive films 30 has a first end portion 31 spaced apart along the second specific direction Y And a second end portion 32, and the first end portion 32 of each of the conductive films 30 overlaps with the second end portion 32 of the adjacent conductive film 30.

In order to prevent the CNT cluster on the wafer (or other substrate) from being suspended and stretched into a transparent conductive film, the edge of the edge of the conductive film is more than the two ends of the edge of the conductive film due to the cohesive force or the like at the edge of the conductive film. The site is indented. Therefore, if the plurality of conductive films 30 are disposed side by side and in series on the substrate 10, the intermediate portion of the edge of the conductive film may be rejoined between the conductive film 30 and the conductive film 30 to form a mutual connection. Gap.

Therefore, the preferred embodiment of the present invention partially overlaps the plurality of conductive films 30 in the vicinity of one side surface of the colloid 20 facing the substrate 10, and the conductive film 30 can be avoided by partially overlapping the plurality of conductive films 30 on the substrate 10. Between the conductive film 30 and the conductive film 30, the intermediate portion of the edge of the conductive film is retracted and cannot be connected to each other to form a void, and a large-area conductive plate can be obtained. The plurality of conductive films 30 are partially on the substrate 10 along a substantially parallel specific direction X.

In the present embodiment, after the plurality of conductive films 30 are partially overlapped and connected in series to the substrate 10, the plurality of conductive films 30 may be subjected to a laser treatment. The manner in which the plurality of conductive films 30 are subjected to laser processing can be referred to the foregoing embodiments without further reference. Since the conductive film 30 and the conductive film 30 are connected in series in a partially overlapping manner, the overlapping portions may be inferior in transparency to other non-overlapping portions, so that the overlapping portions may be compared with other non-overlapping portions. More laser processing so that the transparency of the overlapping portions can be approximately similar to the transparency of other non-overlapping portions. The colloid 20 is then cured. The manner in which the plurality of conductive films 30 are subjected to the curing treatment can be referred to the foregoing embodiments without further reference.

According to the conductive plate 100 with a plurality of conductive films disclosed in this embodiment The plurality of conductive films 30 are partially overlapped and connected in series to the substrate 10, whereby a large-area conductive plate can be produced.

Fig. 3 is a schematic view showing a third embodiment of the conductive plate having a plurality of conductive films of the present invention.

Please refer to "FIG. 3" and refer to the foregoing embodiment in combination. The difference between this embodiment and the foregoing embodiment is that the plurality of conductive films 30 are stacked on the substrate 10.

In this embodiment, the plurality of conductive films 30 are stacked in the vicinity of one side surface of the colloid 20 facing the substrate 10. Since the conductive film 30 is composed of a plurality of nano cell bundles, the colloid 20 can be infiltrated between the plurality of nano cell bundles. The plurality of conductive films 30 are fixed to the vicinity of one side surface of the colloid 20 facing the substrate 10. In this embodiment, a colloid 20 may be further formed between the conductive film 30 and the conductive film 30 to fix the stacking relationship between the conductive film 30 and the conductive film 30 by the colloid 20 to avoid colloid formed on the substrate 10. 20 The multilayer laminated conductive film cannot be fixed by osmosis. By stacking the plurality of conductive films 30 on the substrate 10, the impedance can be lowered to increase the maximum transfer current value. The plurality of conductive films 30 are oriented substantially in the same specific direction X.

In the present embodiment, after the plurality of conductive films 30 are stacked on the substrate 10, the plurality of conductive films 30 may be subjected to a laser treatment. The manner in which the plurality of conductive films 30 are subjected to laser processing can be referred to the foregoing embodiments without further reference. The colloid 20 is then cured. The manner in which the plurality of conductive films 30 are subjected to the curing treatment can be referred to the foregoing embodiments without further reference.

The conductive plate 100 having a plurality of conductive films according to the present embodiment can reduce the impedance to increase the maximum transfer current value by stacking the plurality of conductive films 30 on the substrate 10 in a stacked manner.

A conductive plate system having a plurality of conductive films according to the present invention will have plural The conductive film is placed on the substrate by side by side, partially overlapping or stacked, whereby a large-area conductive plate can be fabricated, and the impedance can be lowered to increase the maximum transfer current value.

According to the method for fabricating a conductive plate and the preparation system thereof, the conductive film is first placed on a substrate, and then the conductive film placed on the substrate is subjected to laser and other post-treatment, thereby improving the process. The production speed and yield, and the process parameters are easier to control, and the conductive film can be introduced in a large area without interruption.

The present invention has been disclosed in the above embodiments, and is not intended to limit the present invention. Any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims. In addition, any of the objects or advantages or features of the present invention are not required to be achieved by any embodiment or application of the invention. In addition, the abstract sections and headings are only used to assist in the search of patent documents and are not intended to limit the scope of the invention.

10‧‧‧Substrate

20‧‧‧ colloid

30‧‧‧Electrical film

31‧‧‧ first end

32‧‧‧second end

100‧‧‧conductive plates with multiple conductive films

X‧‧‧Special direction

Y‧‧‧ second specific direction

1 is a schematic view of a first embodiment of a conductive plate having a plurality of conductive films according to the present invention; and FIG. 2 is a schematic view showing a second embodiment of a conductive plate having a plurality of conductive films according to the present invention; and FIG. A schematic diagram of a third embodiment of a conductive plate having a plurality of conductive films of the present invention.

10‧‧‧Substrate

20‧‧‧ colloid

30‧‧‧Electrical film

31‧‧‧ first end

32‧‧‧second end

100‧‧‧conductive plates with multiple conductive films

X‧‧‧Special direction

Y‧‧‧ second specific direction

Claims (6)

A conductive plate having a plurality of conductive films, comprising: a substrate; and a plurality of conductive films respectively formed by forming a cluster of nano cells composed of a plurality of nano units on a substrate, and stretching the nano The cell clusters are arranged such that the nano cell units are connected in series with each other along a specific direction X to form a plurality of nano cell bundles, each of the conductive films having a first interval disposed along a second specific direction Y different from the specific direction X And the first conductive portion is disposed on the substrate, The first end of each of the conductive films overlaps the second end of the adjacent conductive film. The conductive plate having a plurality of conductive films according to claim 1, wherein each of the conductive films has electrical anisotropy. The conductive plate having a plurality of conductive films according to claim 1, wherein the nano cells comprise nano units having a substantially isotropic shape. The conductive plate having a plurality of conductive films according to claim 1, wherein the nano cells comprise carbon nanotubes. The conductive plate having a plurality of conductive films according to claim 1, wherein the conductive films are serially connected to the substrate along substantially parallel to the specific direction X. A conductive plate having a plurality of conductive films as described in claim 2, wherein the conductive films are subjected to laser treatment.